CN210725843U - Heat radiation structure and electronic equipment - Google Patents
Heat radiation structure and electronic equipment Download PDFInfo
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- CN210725843U CN210725843U CN201921773967.8U CN201921773967U CN210725843U CN 210725843 U CN210725843 U CN 210725843U CN 201921773967 U CN201921773967 U CN 201921773967U CN 210725843 U CN210725843 U CN 210725843U
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- heat dissipation
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Abstract
The utility model provides a heat radiation structure and electronic equipment for integrated circuit chip to on the circuit board dispels the heat. Wherein, heat radiation structure includes heat radiation panel, first connecting plate and second connecting plate, heat radiation panel is including the first connecting surface and the first cooling surface of setting up back to back, first connecting surface be used for with integrated circuit chip connects, a side of first connecting plate with heat radiation panel's a side is connected, first connecting plate with heat radiation panel is the contained angle setting, a side of second connecting plate with heat radiation panel's another side is connected, the second connecting plate with heat radiation panel is the contained angle setting, just first connecting plate the second connecting plate with heat radiation panel encloses to close and forms first wind channel, first cooling surface towards first wind channel setting. The technical scheme of the utility model the radiating efficiency of integrated circuit chip has been improved.
Description
Technical Field
The utility model relates to a circuit board heat dissipation technical field, in particular to heat radiation structure and should this heat radiation structure's electronic equipment.
Background
The circuit board generally includes one or more integrated circuit chips (IC chips), and the IC chips are required to dissipate heat because the IC chips consume more power and dissipate more heat. At present, a corresponding heat sink is generally arranged on an IC chip, and the heat sink dissipates heat of the IC chip, but the heat dissipation mode of the IC chip using the heat sink can only rely on the heat dissipation effect of the heat sink itself to dissipate heat, and the heat dissipation efficiency of the IC chip is low.
SUMMERY OF THE UTILITY MODEL
The main object of the present invention is to provide a heat dissipation structure, which aims to improve the heat dissipation efficiency of an integrated circuit chip.
In order to achieve the above object, the utility model provides a heat radiation structure for dispel the heat to the integrated circuit chip on the circuit board, include:
the heat dissipation panel comprises a first connecting surface and a first heat dissipation surface which are arranged oppositely, and the first connecting surface is used for being connected with the integrated circuit chip;
one side edge of the first connecting plate is connected with one side edge of the heat dissipation panel, and the first connecting plate and the heat dissipation panel are arranged at an included angle; and
the second connecting plate, a side of second connecting plate with cooling panel's opposite side is connected, the second connecting plate with cooling panel is the contained angle setting, just first connecting plate the second connecting plate with cooling panel encloses to close and forms first wind channel, first cooling surface towards first wind channel setting.
In an embodiment of the present invention, the heat dissipation panel, the first connection plate and the second connection plate form a heat dissipation unit, the heat dissipation unit is provided with a plurality of heat dissipation units, and a plurality of heat dissipation units are arranged side by side, and a plurality of first connection surfaces of the heat dissipation units are all arranged toward the same direction, each of the heat dissipation units is adjacent to the adjacent heat dissipation unit, and a connection member is connected between the heat dissipation units.
The utility model discloses an in an embodiment, the connecting piece includes relative both sides limit, a side of connecting piece with the radiating unit first connecting plate deviates from a side of radiating panel is connected, another side and another of connecting piece the radiating unit the second connecting plate deviates from a side of radiating panel is connected, the connecting piece first connecting plate with the second connecting plate encloses to close and forms the second wind channel.
In an embodiment of the present invention, the connecting member includes a second connecting surface and a second heat dissipating surface which are opposite to each other, the second connecting surface is used for connecting the integrated circuit chip, and the second heat dissipating surface faces the second air duct.
In an embodiment of the present invention, a first fixing plate is connected to a side of the first connecting plate located at the outermost side, which side is away from the heat dissipation panel;
and one side of the second connecting plate positioned at the outermost side and departing from the heat dissipation panel is connected with a second fixing plate.
In an embodiment of the present invention, the first fixing plate and/or the second fixing plate is provided with a fixing hole for fixedly connecting the heat dissipation structure and the circuit board.
In an embodiment of the present invention, a surface of at least one of the heat dissipation panel, the first connection plate, and the second connection plate facing the first air duct is formed with a first rough structure having unevenness.
In an embodiment of the present invention, at least one of the heat dissipation panel, the first connection plate and the second connection plate has a protruding heat conduction fin facing the surface of the first air duct.
In an embodiment of the present invention, the surface of the heat conducting fin is formed with a second rough structure having an uneven surface.
The utility model discloses still provide an electronic equipment, as above heat radiation structure be applied to electronic equipment.
The utility model provides a pair of heat radiation structure for integrated circuit chip to the circuit board dispels the heat, this heat radiation structure is by the heat dissipation panel, first connecting plate and second connecting plate are constituteed, and the three encloses to close and is formed with first wind channel, the integrated circuit chip of circuit board is connected with the first connection face of heat dissipation panel, thus, integrated circuit chip on the circuit board is except dispelling the heat through heat radiation structure, still can be through the gas flow in the first wind channel heat radiation structure's heat dissipation process with higher speed, thereby improve heat radiation structure to the integrated circuit chip's of circuit board radiating efficiency greatly. Meanwhile, the heat dissipation structure is not a simple plate structure any more, and the heat dissipation area of the heat dissipation structure is effectively increased, so that the heat dissipation efficiency of the heat dissipation structure can be further improved, and the heat dissipation efficiency of the integrated circuit chip is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a top view of an embodiment of the heat dissipation structure of the present invention;
fig. 2 is a front view of an embodiment of the heat dissipation structure of the present invention;
fig. 3 is a schematic structural view of the heat dissipation structure of the present invention applied to a single integrated circuit chip;
fig. 4 is a schematic structural view of the heat dissipation structure of the present invention applied to a dual integrated circuit chip;
description of the reference numerals
| Reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
52 | Second |
| 10 | |
60 | |
| 11 | |
70 | |
| 12 | First |
80 | |
| 20 | First connecting |
90 | |
| 30 | Second connecting |
91 | |
| 40 | |
200 | |
| 50 | Connecting |
210 | |
| 51 | Second connecting surface |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a heat radiation structure 100 for dispel the heat to integrated circuit chip 210 on circuit board 200, aim at improving integrated circuit chip 210's radiating efficiency.
Referring to fig. 1 to fig. 4, in an embodiment of the heat dissipation structure 100 of the present invention, the heat dissipation structure 100 includes:
a heat dissipation panel 10, wherein the heat dissipation panel 10 includes a first connection surface 11 and a first heat dissipation surface 12, which are oppositely disposed, and the first connection surface 11 is used for connecting with the integrated circuit chip 210;
a first connecting plate 20, one side of the first connecting plate 20 is connected with one side of the heat dissipation panel 10, and the first connecting plate 20 and the heat dissipation panel 10 form an included angle; and
second connecting plate 30, a side of second connecting plate 30 with cooling panel 10's opposite side is connected, second connecting plate 30 with cooling panel 10 is the contained angle setting, just first connecting plate 20 second connecting plate 30 with cooling panel 10 encloses to close and forms first wind channel 40, first cooling surface 12 towards first wind channel 40 sets up.
In this embodiment, the heat dissipation panel 10, the first connection plate 20 and the second connection plate 30 are an integral injection molding structure. One or more heat dissipation panels 10, first connection plates 20, and second connection plates 30 may be provided. When the heat dissipation panel 10, the first connection plate 20 and the second connection plate 30 are all one, two opposite side edges of the heat dissipation panel 10 are respectively connected with the first connection plate 20 and the second connection plate 30, and form a first air duct 40 with the first connection plate 20 and the second connection plate 30, at this time, the heat dissipation structure 100 is used for heat dissipation of a single integrated circuit chip 210; when the heat dissipation panel 10, the first connection plate 20, and the second connection plate 30 are provided in plural, for example, a first connection plate 20, a second connection plate 30, and a heat dissipation panel 10 form a heat dissipation unit, when there are two heat dissipation units, a connection member 50 is provided between a heat dissipation unit and an adjacent heat dissipation unit, the connection member 50 and the first connection plate 20 and the second connection plate 30 form a second air duct 60, and the connection member 50 can also be used for dissipating heat of the integrated circuit chip 210, at this time, the heat dissipation structure 100 can be used for dissipating heat of a single integrated circuit chip 210 or multiple integrated circuit chips 210, and the heat dissipation structure 100 includes a plurality of heat dissipation panels 10 or connection members 50 with different sizes, and can be used for dissipating heat of the integrated circuit chips 210 with different types, so as to reduce the number of dies used in processing and reduce the processing cost. In the present embodiment, the connector 50 has a heat conduction function.
There may be a plurality of connection methods between the first connection surface 11 of the heat dissipation panel 10 and the integrated circuit chip 210 of the circuit board 200, for example, an adhesive layer 70 is disposed between the first connection surface 11 of the heat dissipation panel 10 and the integrated circuit chip 210, and the integrated circuit chip 210 is fixedly connected to the first connection surface 11 of the heat dissipation panel 10 through the adhesive layer 70; or fixedly connected by means of buckles, welding and the like.
In order to make the structure of the heat dissipation structure 100 more compact, the first connection plate 20 and the second connection plate 30 are disposed perpendicular to the heat dissipation panel 10. The first connecting plate 20 and the second connecting plate 30 are disposed in parallel on two opposite sides of the heat dissipating panel 10.
Since the aluminum alloy or copper material has high thermal conductivity, the aluminum alloy or copper material is preferably used to prepare the heat dissipation structure 100.
It can be understood, the technical scheme of the utility model, this heat radiation structure 100 is by cooling panel 10, first connecting plate 20 and second connecting plate 30 are constituteed, and the three encloses to close and is formed with first wind channel 40, the integrated circuit chip 210 of circuit board 200 is connected with cooling panel 10's first connecting surface 11, thus, integrated circuit chip 210 on the circuit board 200 is except dispelling the heat through cooling structure 100, still can accelerate cooling structure 100's radiating process through the gas flow in the first wind channel 40, thereby improve cooling structure 100 greatly to circuit board 200's integrated circuit chip 210's radiating efficiency. Meanwhile, the heat dissipation structure 100 is not a simple plate structure, and the heat dissipation area of the heat dissipation structure 100 is effectively increased, so that the heat dissipation efficiency of the heat dissipation structure 100 can be further improved, and the heat dissipation efficiency of the integrated circuit chip 210 can be further improved.
Referring to fig. 1 to 4 in combination, in an embodiment of the heat dissipation structure 100 of the present invention, the heat dissipation panel 10, the first connection plate 20 and the second connection plate 30 form a heat dissipation unit, the heat dissipation unit is provided with a plurality of, the heat dissipation unit is disposed side by side, and a plurality of, the first connection surface 11 of the heat dissipation unit is disposed towards the same direction, each of the heat dissipation unit and the adjacent heat dissipation unit is connected with the connection member 50, two opposite side edges of the connection member 50 are connected to the first connection plate 20 and the second connection plate 30, respectively.
In this embodiment, the plurality of heat dissipation units are arranged side by side at intervals, and each heat dissipation unit is connected to an adjacent heat dissipation unit through a connection member 50. The connecting member 50 can be connected to one side of the first connecting plate 20 and the second connecting plate 30 connected to the heat dissipation panel 10, and at this time, the heat dissipation structure 100 can dissipate heat from a plurality of integrated circuit chips 210 simultaneously on one side; the opposite two sides of the connecting element 50 can also be connected to a side of the first connecting plate 20 away from the heat sink panel 10 and a side of the second connecting plate 30 away from the heat sink panel 10, respectively, and in this case, the heat sink structure 100 can dissipate heat from multiple or single ic chips 210 simultaneously on both sides.
It can be understood that, in order to improve the heat dissipation effect of the heat dissipation structure 100 on the integrated circuit chip 210, a plurality of heat dissipation panels 10 with different sizes are provided to fit the integrated circuit chips 210 with different sizes, so that a plurality of heat dissipation units are provided.
Referring to fig. 1 to 4, in an embodiment of the heat dissipation structure 100 of the present invention, the connecting member 50 includes two opposite side edges, one side edge of the connecting member 50 is connected to a side edge of the heat dissipation unit, which is deviated from the first connecting plate 20 of the heat dissipation panel 10, the other side edge of the connecting member 50 is connected to a side edge of the heat dissipation unit, which is deviated from the heat dissipation panel 10, which is deviated from the second connecting plate 30 of the heat dissipation unit, and the connecting member 50, the first connecting plate 20 and the second connecting plate 30 enclose and form the second air duct 60.
In this embodiment, one side of the connecting member 50 is connected to one side of the first connecting plate 20 away from the heat dissipating panel 10, and the other side of the connecting member 50 is connected to one side of the second connecting plate 30 away from the heat dissipating panel 10, that is, the opening of the second air duct 60 formed by the connecting member 50, the first connecting plate 20 and the second connecting plate 30 faces the opposite direction to the opening of the first air duct 40.
It can be understood that, in order to increase the convection heat dissipation area of the heat dissipation structure 100, so as to further increase the heat dissipation effect of the heat dissipation structure 100 on the integrated circuit chip 210, and at the same time, the heat dissipation structure can dissipate heat for a plurality of chips at the same time, so as to reduce the usage of manufacturing dies, therefore, one side of the connecting member 50 is connected to one side of the first connecting plate 20 away from the heat dissipation panel 10, and the other side of the connecting member 50 is connected to one side of the second connecting plate 30 away from the heat dissipation panel 10, so that the connecting member 50 and the heat dissipation panel 10 are located at two opposite sides of the first connecting plate 20 and the second connecting plate 30, and a plurality of air.
Referring to fig. 1 to 4, in an embodiment of the heat dissipation structure 100 of the present invention, the connecting member 50 includes a second connecting surface 51 and a second heat dissipation surface 52, which are opposite to each other, the second connecting surface 51 is used for connecting with the integrated circuit chip 210, and the second heat dissipation surface 52 faces the second air duct 60.
In this embodiment, the heat dissipating structure 100 is composed of two heat dissipating units and a connecting member 50. When the integrated circuit chip 210 is connected with the second connection face 51 of the connector 50, it can be used for heat dissipation of the single integrated circuit chip 210; when the integrated circuit chip 210 is connected to the first connection surface 11 of the heat dissipation panel 10, it can be used for heat dissipation of the dual integrated circuit chips 210.
It is understood that, in order to make the heat dissipation structure 100 usable on both sides, the connecting member 50 is also configured as a heat dissipation panel, and the integrated circuit chip 210 can be connected to the connecting member 50 or the heat dissipation panel 10 according to actual use conditions, so as to improve the adaptability between the heat dissipation structure 100 and the integrated circuit chip 210.
Referring to fig. 1 to 4, in an embodiment of the heat dissipation structure 100 of the present invention, a first fixing plate 80 is connected to a side of the first connecting plate 20 located at the outermost side, which is away from the heat dissipation panel 10;
a second fixing plate 90 is connected to a side of the second connecting plate 30 located at the outermost side, which side faces away from the heat dissipation panel 10.
In this embodiment, the first fixing plate 80 and the second fixing plate 90 are disposed parallel to the heat dissipation panel 10, or are located on the same horizontal plane as the heat dissipation panel 10. A first fixing plate 80 or a second fixing plate 90 may be provided; or both the first fixing plate 80 and the second fixing plate 90 are provided, at this time, the connection strength of the heat dissipation structure 100 and the circuit board 200 is stronger.
It can be understood that, in order to fixedly connect the heat dissipation structure 100 to the circuit board 200, and prevent the heat dissipation structure 100 from being separated from the circuit board 200 during the use process, and thus the heat dissipation effect of the heat dissipation structure 100 on the integrated circuit chip 210 is affected, therefore, the first fixing plate 80 is connected to the side of the first connection plate 20 located at the outermost side away from the heat dissipation panel 10, the second fixing plate 90 is connected to the side of the second connection plate 30 located at the outermost side away from the heat dissipation panel 10, and the heat dissipation structure 100 is fixedly connected to the circuit board 200 through the first fixing plate 80 and the second fixing plate 90.
Referring to fig. 1, in an embodiment of the heat dissipation structure 100 of the present invention, the first fixing plate 80 and/or the second fixing plate 90 are provided with fixing holes 91 for fixedly connecting the heat dissipation structure 100 and the circuit board 200.
In this embodiment, two fixing holes 91 are formed along the length direction of the first fixing plate 80, two fixing holes 91 are formed along the length direction of the second fixing plate 90, a connecting hole is correspondingly formed in the circuit board 200, and the heat dissipation structure 100 is fixedly connected to the circuit board 200 through the fixing holes 91 and the connecting hole by screws.
It can be understood that, in order to further improve the connection strength between the heat dissipation structure 100 and the circuit board 200, fixing holes 91 are formed in the first fixing plate 80 and/or the second fixing plate 90, and the heat dissipation structure 100 and the circuit board 200 are fixedly connected through the fixing holes 61 using screws.
Referring to fig. 1 to 4, in an embodiment of the heat dissipation structure 100 of the present invention, a surface of at least one of the heat dissipation panel 10, the first connection plate 20, and the second connection plate 30 facing the first air duct 40 is formed with a first rough structure having an uneven portion.
In this embodiment, the first rough structure may be a bump, a recess, a projection, or the like.
It can be understood that, in order to increase the heat dissipation area of the heat dissipation structure 100 to enhance the heat dissipation effect of the heat dissipation structure 100, a first rough structure is provided on the surface of at least one of the heat dissipation panel 10, the first connection plate 20 and the second connection plate 30.
Referring to fig. 1 to 4, in an embodiment of the heat dissipation structure 100 of the present invention, at least one of the heat dissipation panel 10, the first connection plate 20, and the second connection plate 30 has a surface facing the first air duct 40 and a protruding heat conduction fin.
In this embodiment, along the length direction of the first air duct, a plurality of heat conducting fins are convexly disposed on a surface of at least one of the heat dissipation panel, the first connecting plate, and the second connecting plate, the surface facing the first air duct. The plurality of heat conductive fins are integrally formed with the heat dissipation panel 10 or the first connection plate 20 or the second connection plate 30, and the plurality of heat conductive fins are arranged side by side at intervals along the length direction of the heat dissipation panel 10 or the first connection plate 20 or the second connection plate 30.
It can be understood that, in order to further enhance the heat dissipation effect of the heat dissipation structure 100, a heat conduction fin is disposed on a surface of at least one of the heat dissipation panel 10, the first connection plate 20, and the second connection plate 30 facing the first air duct 40, so that the heat of the integrated circuit chip 210 is transferred to the heat conduction fin through the heat dissipation panel 10, the first connection plate 20, or the second connection plate 30, and then the heat is transferred out through the heat conduction fin, thereby increasing the heat dissipation area of the heat dissipation structure 100, and further enhancing the heat dissipation effect.
Referring to fig. 1 to 4, in an embodiment of the heat dissipation structure 100 of the present invention, the surface of the heat conductive fin is formed with a second rough structure having an uneven surface.
In this embodiment, the heat-conducting fins may be in the form of bumps, recesses, or bosses.
It can be understood that, in order to further increase the heat dissipation area of the heat dissipation structure 100 to enhance the heat dissipation effect of the heat dissipation structure 100, the surface of the heat conduction fin is provided with a second rough structure.
The utility model discloses still provide an electronic equipment, this electronic equipment includes heat radiation structure 100 as before, and the concrete structure of this heat radiation structure 100 sees in detail the aforementioned embodiment. Since the electronic device adopts all the technical solutions of the foregoing embodiments, at least all the beneficial effects brought by all the technical solutions of the foregoing embodiments are achieved, and no further description is given here.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (10)
1. A heat dissipation structure for dissipating heat from an integrated circuit chip on a circuit board, comprising:
the heat dissipation panel comprises a first connecting surface and a first heat dissipation surface which are arranged oppositely, and the first connecting surface is used for being connected with the integrated circuit chip;
one side edge of the first connecting plate is connected with one side edge of the heat dissipation panel, and the first connecting plate and the heat dissipation panel are arranged at an included angle; and
the second connecting plate, a side of second connecting plate with cooling panel's opposite side is connected, the second connecting plate with cooling panel is the contained angle setting, just first connecting plate the second connecting plate with cooling panel encloses to close and forms first wind channel, first cooling surface towards first wind channel setting.
2. The heat dissipating structure of claim 1, wherein the heat dissipating panel, the first connecting plate and the second connecting plate form a plurality of heat dissipating units, the plurality of heat dissipating units are arranged side by side, the first connecting surfaces of the plurality of heat dissipating units are all arranged in the same direction, and a connecting member is connected between each heat dissipating unit and the adjacent heat dissipating unit.
3. The heat dissipation structure of claim 2, wherein the connecting member includes two opposite sides, one side of the connecting member is connected to a side of the first connecting plate of the heat dissipation unit away from the heat dissipation panel, the other side of the connecting member is connected to a side of the second connecting plate of another heat dissipation unit away from the heat dissipation panel, and the connecting member, the first connecting plate and the second connecting plate enclose a second air duct.
4. The heat dissipating structure of claim 3, wherein the connecting member includes a second connecting surface and a second heat dissipating surface disposed opposite to each other, the second connecting surface being configured to connect to the integrated circuit chip, the second heat dissipating surface being disposed facing the second air duct.
5. The heat dissipation structure of claim 2, wherein a first fixing plate is connected to a side of the first connection plate located at the outermost side, which side faces away from the heat dissipation panel;
and one side of the second connecting plate positioned at the outermost side and departing from the heat dissipation panel is connected with a second fixing plate.
6. The heat dissipation structure of claim 5, wherein the first fixing plate and/or the second fixing plate is provided with a fixing hole for fixedly connecting the heat dissipation structure with the circuit board.
7. The heat dissipation structure according to claim 1, wherein a surface of at least one of the heat dissipation panel, the first connection plate, and the second connection plate, which faces the first air passage, is formed with a first uneven structure.
8. The heat dissipation structure of claim 1, wherein a surface of at least one of the heat dissipation panel, the first connection plate, and the second connection plate facing the first air duct is convexly provided with heat conductive fins.
9. The heat dissipation structure according to claim 8, wherein the surface of the heat conductive fin is formed with a rugged second roughness structure.
10. An electronic device, characterized in that the heat dissipation structure according to any one of claims 1 to 9 is applied to the electronic device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921773967.8U CN210725843U (en) | 2019-10-21 | 2019-10-21 | Heat radiation structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921773967.8U CN210725843U (en) | 2019-10-21 | 2019-10-21 | Heat radiation structure and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210725843U true CN210725843U (en) | 2020-06-09 |
Family
ID=70936072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921773967.8U Active CN210725843U (en) | 2019-10-21 | 2019-10-21 | Heat radiation structure and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210725843U (en) |
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2019
- 2019-10-21 CN CN201921773967.8U patent/CN210725843U/en active Active
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