CN204994202U - Heat pipe heat dissipation device - Google Patents

Heat pipe heat dissipation device Download PDF

Info

Publication number
CN204994202U
CN204994202U CN201520756331.8U CN201520756331U CN204994202U CN 204994202 U CN204994202 U CN 204994202U CN 201520756331 U CN201520756331 U CN 201520756331U CN 204994202 U CN204994202 U CN 204994202U
Authority
CN
China
Prior art keywords
heat
heat pipe
radiating fin
pipe
fin arrays
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520756331.8U
Other languages
Chinese (zh)
Inventor
赵凯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Kayon Mechatronics Co Ltd
Original Assignee
Dongguan Kayon Mechatronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Kayon Mechatronics Co Ltd filed Critical Dongguan Kayon Mechatronics Co Ltd
Priority to CN201520756331.8U priority Critical patent/CN204994202U/en
Application granted granted Critical
Publication of CN204994202U publication Critical patent/CN204994202U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model belongs to the radiator field, specifically speaking is a heat pipe heat dissipation device, include base plate and four dissipation fin array s of setting in the base plate top with the heat source contact, be connected through the heat pipe between base plate and four dissipation fin array, dissipation fin array comprises a plurality of rectangle heat radiation fins that are the even upper and lower range of level setting and interval, four dissipation fin array just arrange respectively in four quadrants of horizontal plane in four dissipation fin array's horizontal cross section for the cuboid that the size is the same, the beneficial effects of the hand and wrist rehabilitation evaluation monitoring device are that, the utility model discloses a set up the dissipation fin array of four cuboids forms and interconnect's heat pipe above the base plate, make heat radiating area greatly increased, obviously improve heat transfer efficiency.

Description

A kind of heat-pipe radiator
Technical field
The utility model belongs to radiator field, specifically refers to a kind of heat-pipe radiator.
Background technology
At present, radiator is widely used in dispelling the heat to electronic device, to reduce the temperature of electronic device, keep the normal operation of electronic device, therefore the quality of its heat radiation is related to the quality of life of product and computing, and normally used radiator, be mainly provided with a metal (being aluminium mostly) heat-radiating substrate, its top (with extruding or casting) is provided with several grooves and column fin, makes columnar structures have preferably cooling surface area; A fan is folded with again above this fin, make fan can brush heat radiation facing to radiating fin, be provided with the heat pipe of connection between current heat radiator body and radiating fin more, current heat pipe entirety is in three sections, and wherein end section is arranged in heat-radiating substrate, horizontally set, stage casing passes from radiator, expose in atmosphere, top section is arranged in radiating fin, and this structural design heat transfer efficiency is lower.
Utility model content
The utility model, in order to overcome the deficiency of prior art, proposes the heat-pipe radiator that a kind of heat transfer efficiency is high.
The utility model solves above-mentioned technical problem by following technical proposals.
A kind of heat-pipe radiator, comprise the substrate contacted with thermal source and four radiating fin arrays being arranged on surface, be connected by heat pipe between described substrate with four radiating fin arrays, described radiating fin array by multiple in be horizontally disposed with and the rectangular heat dissipation fin that interval is evenly arranged above and below forms, identical cuboid sized by described four radiating fin arrays and the horizontal cross section of four radiating fin arrays is arranged in four quadrants of horizontal plane respectively, any two X-axis about four quadrants in described four radiating fin arrays or Y-axis or central point, connected by heat pipe between two radiating fin arrays in adjacent quadrants, the heat pipe being positioned at X-axis both sides quadrant is that heat pipe closed by first of common contiguous base substrate, the heat pipe being positioned at Y-axis both sides quadrant is that second of common connection substrate closes heat pipe, described first closed heat pipe and second is closed heat pipe and is had orthogonal endotherm section in substrate inside, described first closed heat pipe and second is closed heat pipe and is had the heat release section wearing four radiating fin arrays, described first closes heat pipe and second closes heat pipe and includes two and be parallel to each other and the respective U-shaped heat pipe that is connected of heat release section top.
More specifically, equal spacing is left between described any two adjacent radiating fin arrays.
More specifically, the single rectangular heat dissipation fin of described formation four radiating fin arrays is square.
More specifically, the described square length of side is 1 ~ 10cm.
More specifically, the diameter of described heat pipe is 0.3 ~ 1cm.
The beneficial effects of the utility model are, the utility model, by arranging four rectangular-shaped radiating fin arrays and interconnective heat pipe in surface, makes area of dissipation greatly increase, significantly improves heat transfer efficiency.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is front view of the present utility model.
Embodiment
The utility model preferred embodiment is provided, to describe the technical solution of the utility model in detail below in conjunction with accompanying drawing.
As Fig. 1 to Fig. 2, the present embodiment comprises the substrate 1 contacted with thermal source and four radiating fin arrays 2 be arranged on above substrate 1, be connected by heat pipe 3 between described substrate 1 with four radiating fin arrays 2, described radiating fin array 2 by multiple in be horizontally disposed with and the rectangular heat dissipation fin that interval is evenly arranged above and below forms, identical cuboid sized by described four radiating fin arrays 2 and horizontal cross section of four radiating fin arrays 2 is arranged in four quadrants of horizontal plane respectively, any two X-axis about four quadrants in described four radiating fin arrays 2 or Y-axis or central point O symmetrical, connected by heat pipe 3 between two radiating fin arrays 2 in adjacent quadrants, be positioned at the heat pipe (32 of X-axis both sides quadrant, 32 ') for heat pipe closed by first of common contiguous base substrate 1, be positioned at the heat pipe (31 of Y-axis both sides quadrant, 31 ') for second of common connection substrate 1 closes heat pipe, described first closes heat pipe (32, 32 ') heat pipe (31 is closed with second, 31 ') in substrate 1 inside, there is orthogonal endotherm section, described first closes heat pipe (32, 32 ') heat pipe (31 is closed with second, 31 ') there is the heat release section wearing four radiating fin arrays 2, described first closes heat pipe (32, 32 ') heat pipe (31 is closed with second, 31 ') include two to be parallel to each other and the U-shaped heat pipe that heat release section top is connected separately.
Equal spacing is left between described any two adjacent radiating fin arrays 2.
The single rectangular heat dissipation fin of described composition four radiating fin arrays 2 is square.
The described square length of side is 5cm.
The diameter of described heat pipe is 0.5cm
Due to substrate 1 be provided with four in hard Nogata to arrange radiating fin array 2 and heat pipe 3, considerably increase area of dissipation, improve heat transfer efficiency.
Although the foregoing describe embodiment of the present utility model, it will be understood by those of skill in the art that these only illustrate, protection range of the present utility model is defined by the appended claims.Those skilled in the art, under the prerequisite not deviating from principle of the present utility model and essence, can make various changes or modifications to these execution modes, but these change and amendment all falls into protection range of the present utility model.

Claims (5)

1. a heat-pipe radiator, it is characterized in that, comprise the substrate contacted with thermal source and four radiating fin arrays being arranged on surface, be connected by heat pipe between described substrate with four radiating fin arrays, described radiating fin array by multiple in be horizontally disposed with and the rectangular heat dissipation fin that interval is evenly arranged above and below forms, identical cuboid sized by described four radiating fin arrays and the horizontal cross section of four radiating fin arrays is arranged in four quadrants of horizontal plane respectively, any two X-axis about four quadrants in described four radiating fin arrays or Y-axis or central point, connected by heat pipe between two radiating fin arrays in adjacent quadrants, the heat pipe being positioned at X-axis both sides quadrant is that heat pipe closed by first of common contiguous base substrate, the heat pipe being positioned at Y-axis both sides quadrant is that second of common connection substrate closes heat pipe, described first closed heat pipe and second is closed heat pipe and is had orthogonal endotherm section in substrate inside, described first closed heat pipe and second is closed heat pipe and is had the heat release section wearing four radiating fin arrays, described first closes heat pipe and second closes heat pipe and includes two and be parallel to each other and the respective U-shaped heat pipe that is connected of heat release section top.
2. heat-pipe radiator according to claim 1, is characterized in that, leaves equal spacing between described any two adjacent radiating fin arrays.
3. heat-pipe radiator according to claim 1, is characterized in that, the single rectangular heat dissipation fin of described formation four radiating fin arrays is square.
4. heat-pipe radiator according to claim 3, is characterized in that, the described square length of side is 1 ~ 10cm.
5. heat-pipe radiator according to claim 1, is characterized in that, the diameter of described heat pipe is 0.3 ~ 1cm.
CN201520756331.8U 2015-09-28 2015-09-28 Heat pipe heat dissipation device Expired - Fee Related CN204994202U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520756331.8U CN204994202U (en) 2015-09-28 2015-09-28 Heat pipe heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520756331.8U CN204994202U (en) 2015-09-28 2015-09-28 Heat pipe heat dissipation device

Publications (1)

Publication Number Publication Date
CN204994202U true CN204994202U (en) 2016-01-20

Family

ID=55128514

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520756331.8U Expired - Fee Related CN204994202U (en) 2015-09-28 2015-09-28 Heat pipe heat dissipation device

Country Status (1)

Country Link
CN (1) CN204994202U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107172854A (en) * 2017-05-17 2017-09-15 南京林业大学 Vehicle-mounted integrated controller cooling system based on plate-fin heat pipe radiator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107172854A (en) * 2017-05-17 2017-09-15 南京林业大学 Vehicle-mounted integrated controller cooling system based on plate-fin heat pipe radiator

Similar Documents

Publication Publication Date Title
JP2011181882A5 (en)
CN203708744U (en) Enclosed circular heat radiation module
CN204929523U (en) Aluminium base board with novel heat radiation structure
CN201629328U (en) Heat radiator structure
CN202948389U (en) Semiconductor central processing unit (CPU) radiator
CN204994202U (en) Heat pipe heat dissipation device
CN205161003U (en) Efficient radiator
CN202583998U (en) Radiator of computer central processing unit (CPU)
CN204129646U (en) The efficient computer CPU heat sink of a kind of sound insulation
CN203574876U (en) Rapid heat dissipation electric heater of aluminium plate type
CN205670907U (en) A kind of double baseplate heat sink
CN204994203U (en) Reverse pyramid describes radiator
CN204205011U (en) A kind of steady type filter heat-dissipating cavity
CN203686956U (en) Radiator
CN104180350B (en) LED (Light Emitting Diode) lamp with flat type radiator
CN204994206U (en) Disc radiator
CN204029791U (en) A kind of polygon radiator
CN202551588U (en) Multi-tooth-peak cooling fin
CN204991691U (en) CPU radiator
CN204350531U (en) A kind of shaped material of radiator
CN204990163U (en) Enhancement mode CPU radiator
CN104660886A (en) Fisheye camera
CN203814114U (en) Heat dissipator for large-capacity reactive compensation device
CN103953903A (en) Anti-overloading device for expressway strobe warning lamp
CN204119706U (en) Radiating module

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160120

Termination date: 20180928