CN202583998U - Radiator of computer central processing unit (CPU) - Google Patents
Radiator of computer central processing unit (CPU) Download PDFInfo
- Publication number
- CN202583998U CN202583998U CN201220235903.4U CN201220235903U CN202583998U CN 202583998 U CN202583998 U CN 202583998U CN 201220235903 U CN201220235903 U CN 201220235903U CN 202583998 U CN202583998 U CN 202583998U
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- Prior art keywords
- heat
- dissipating
- absorbing
- bottom plate
- cpu
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- 238000010521 absorption reaction Methods 0.000 claims 6
- 238000001816 cooling Methods 0.000 abstract description 18
- 230000017525 heat dissipation Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本实用新型公开了一种计算机CPU散热器,包括风扇、散热鳍片和吸热底板,风扇安装在散热鳍片的顶端,散热鳍片的下端连接有吸热底板,吸热底板的下表面与CPU紧密贴合,吸热底板上开设有数列与散热鳍片均匀交错分布的吸热孔,散热鳍片上开有数个均匀分布的散热孔。本实用新型结构简单,设计新颖,吸热孔和散热孔形成散热通道,能够起到很好的散热效果,同时温度传感器可以实时采集环境温度,进一步调节风扇的转速,达到更好的散热的效果。
The utility model discloses a computer CPU radiator, which comprises a fan, cooling fins and a heat-absorbing bottom plate, the fan is installed on the top of the cooling fin, the lower end of the cooling fin is connected with a heat-absorbing bottom plate, and the lower surface of the heat-absorbing bottom plate is connected with the heat-absorbing bottom plate. The CPU is closely attached, and the heat-absorbing bottom plate is provided with several rows of heat-absorbing holes evenly interlaced with the heat-dissipating fins, and the heat-dissipating fins are provided with several uniformly distributed heat-dissipating holes. The utility model has simple structure and novel design. The heat-absorbing hole and the heat-dissipating hole form a heat-dissipating channel, which can have a good heat-dissipating effect. At the same time, the temperature sensor can collect the ambient temperature in real time, and further adjust the fan speed to achieve a better heat-dissipating effect. .
Description
技术领域 technical field
本实用新型涉及一种计算机散热装置,尤其涉及一种计算机CPU散热器。 The utility model relates to a computer cooling device, in particular to a computer CPU radiator.
背景技术 Background technique
CPU是微机中的核心部件,其散热的好坏,直接影响它的工作状态及其多项性能指标。目前使用的CPU散热器,其外表面的散热片都是经冲压后的铝片依次压结在一起。由于压结后的散热片相互之间连接不十分牢固,中间的传热元件采用纯紫铜圆柱体,难以达到令人满意的散热效果。 The CPU is the core component in the microcomputer, and its heat dissipation directly affects its working state and its multiple performance indicators. Currently used CPU heat sinks have heat sinks on their outer surfaces that are pressed together sequentially through stamped aluminum sheets. Since the heat sinks after bonding are not very firmly connected to each other, and the heat transfer element in the middle is made of pure copper cylinder, it is difficult to achieve a satisfactory heat dissipation effect.
发明内容 Contents of the invention
针对上述现有技术存在的问题,本实用新型提供一种计算机CPU散热器。 Aiming at the problems existing in the above-mentioned prior art, the utility model provides a computer CPU radiator.
为了实现上述目的,本实用新型采用的技术方案是:一种计算机CPU散热器,包括风扇、散热鳍片和吸热底板,风扇安装在散热鳍片的顶端,散热鳍片的下端连接有吸热底板,吸热底板的下表面与CPU紧密贴合,吸热底板上开设有数列与散热鳍片均匀交错分布的吸热孔,散热鳍片上开有数个均匀分布的散热孔。 In order to achieve the above object, the technical solution adopted by the utility model is: a computer CPU radiator, including a fan, cooling fins and a heat-absorbing bottom plate, the fan is installed on the top of the cooling fins, and the lower end of the cooling fins is connected with a heat-absorbing The base plate, the lower surface of the heat-absorbing base plate is closely attached to the CPU, and the heat-absorbing base plate is provided with several rows of heat-absorbing holes evenly interlaced with the cooling fins, and the cooling fins are provided with several evenly distributed cooling holes.
作为优选,吸热底板的外侧靠近CPU处设有温度传感器,温度传感器与风扇电连接。 Preferably, a temperature sensor is provided on the outer side of the heat-absorbing bottom plate close to the CPU, and the temperature sensor is electrically connected to the fan.
与现有技术相比,本实用新型的优点在于:结构简单,设计新颖,吸热孔和散热孔形成散热通道,能够起到很好的散热效果,同时温度传感器可以实时采集环境温度,进一步调节风扇的转速,达到更好的散热的效果。 Compared with the prior art, the utility model has the advantages of simple structure, novel design, heat-absorbing holes and heat-dissipating holes form a heat-dissipating channel, which can have a good heat-dissipating effect, and the temperature sensor can collect the ambient temperature in real time and further adjust The speed of the fan can achieve better cooling effect.
附图说明 Description of drawings
图1为本实用新型的结构示意图。 Fig. 1 is the structural representation of the utility model.
图中:11、吸热底板;12、散热鳍片;21、吸热孔;22、散热孔;3、CPU;4、风扇;5、温度传感器。 In the figure: 11, heat-absorbing bottom plate; 12, cooling fins; 21, heat-absorbing holes; 22, cooling holes; 3, CPU; 4, fan; 5, temperature sensor.
具体实施方式 Detailed ways
下面将结合附图对本实用新型作进一步说明。 The utility model will be further described below in conjunction with accompanying drawing.
作为本实用新型的一种实施方式,参阅图1,本实用新型包括风扇4、散热鳍片12和吸热底板11,风扇4安装在散热鳍片12的顶端,散热鳍片12的下端连接有吸热底板11,吸热底板11的下表面与CPU3紧密贴合,吸热底板11上开设有数列与散热鳍片12均匀交错分布的吸热孔21,散热鳍片12上开有数个均匀分布的散热孔22。吸热底板11的外侧靠近CPU3处设有温度传感器5,温度传感器5与风扇4电连接。
As a kind of embodiment of the present utility model, referring to Fig. 1, the utility model comprises fan 4,
本实用新型结构简单,设计新颖,吸热孔21和散热孔22形成散热通道,能够起到很好的散热效果,同时温度传感器5可以实时采集环境温度,进一步调节风扇4的转速,达到更好的散热的效果。
The utility model is simple in structure and novel in design. The heat-absorbing
尽管已经结合当前认作是一个最为实用和优选的实施例来描述了本实用新型,但应当理解,本实用新型不限于所公开的实施例,而相反是旨在涵盖包括在所附权利要求的精神和范围内的多种修改和同等布置。 While the invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it should be understood that the invention is not limited to the disclosed embodiment, but is instead intended to cover the invention contained in the appended claims. Various modifications and equivalent arrangements in spirit and scope.
Claims (2)
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CN201220235903.4U CN202583998U (en) | 2012-05-24 | 2012-05-24 | Radiator of computer central processing unit (CPU) |
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CN201220235903.4U CN202583998U (en) | 2012-05-24 | 2012-05-24 | Radiator of computer central processing unit (CPU) |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104039120A (en) * | 2014-06-30 | 2014-09-10 | 吴文武 | Cooling device |
CN104571424A (en) * | 2015-01-27 | 2015-04-29 | 周玉萍 | CPU (central processing unit) heat sink |
CN105589537A (en) * | 2015-12-16 | 2016-05-18 | 齐齐哈尔大学 | Computer thermal dissipation apparatus |
CN105627198A (en) * | 2016-02-29 | 2016-06-01 | 柳州格瑞斯光电科技有限公司 | Heat radiator of LED mining lamp |
-
2012
- 2012-05-24 CN CN201220235903.4U patent/CN202583998U/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104039120A (en) * | 2014-06-30 | 2014-09-10 | 吴文武 | Cooling device |
CN104571424A (en) * | 2015-01-27 | 2015-04-29 | 周玉萍 | CPU (central processing unit) heat sink |
CN105589537A (en) * | 2015-12-16 | 2016-05-18 | 齐齐哈尔大学 | Computer thermal dissipation apparatus |
CN105589537B (en) * | 2015-12-16 | 2019-06-07 | 齐齐哈尔大学 | A kind of computer heat radiating device |
CN105627198A (en) * | 2016-02-29 | 2016-06-01 | 柳州格瑞斯光电科技有限公司 | Heat radiator of LED mining lamp |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121205 Termination date: 20130524 |