CN204129646U - The efficient computer CPU heat sink of a kind of sound insulation - Google Patents
The efficient computer CPU heat sink of a kind of sound insulation Download PDFInfo
- Publication number
- CN204129646U CN204129646U CN201420695055.4U CN201420695055U CN204129646U CN 204129646 U CN204129646 U CN 204129646U CN 201420695055 U CN201420695055 U CN 201420695055U CN 204129646 U CN204129646 U CN 204129646U
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- CN
- China
- Prior art keywords
- fan
- heat absorption
- temperature sensor
- sound insulation
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses the efficient computer CPU heat sink of a kind of sound insulation, comprise CPU and sound panel, described CPU upper surface has closely bonded heat absorption base plate by heat-conducting silicone grease, described heat absorption base plate offers the equally distributed heat absorption hole of ordered series of numbers, described heat absorption plate upper surface is fixed with two row's heating columns, described heating column is socketed with radiating fin, louvre is left between the every sheet of described radiating fin, described sound panel to be coordinated with screw by screw and is fixedly mounted on radiating fin side, and common formation half closed interval, this interval internal fixtion is provided with fan, and fan is arranged on sound panel inwall, described fan is connected with temperature sensor by wire, and temperature sensor is fixed on heat absorption base plate side, described temperature sensor and fan are in series with plug.The efficient computer CPU heat sink of this sound insulation, fan and temperature sensor cooperating, power consumption is little, intelligent temperature control, effectively intercepts the propagation of noise, is applicable to using widely and promoting.
Description
Technical field
The utility model relates to field of computer technology, is specially the efficient computer CPU heat sink of a kind of sound insulation.
Background technology
Cpu heat is the vitals ensureing CPU steady operation, and the quality of its heat dispersion, directly affects duty and the multinomial performance index thereof of CPU.The CPU heating radiator of current use, the heat radiator of its outside surface is all that knot structure together pressed successively by the aluminium flake after punching press.Its radiating effect difference and radiator fan one start will operate immediately.This structure not only consumes energy high but also noise is also large, and radiating effect is not fine.
Utility model content
The purpose of this utility model is to provide a kind of sound insulation efficient computer CPU heat sink, to solve the problem proposed in above-mentioned background technology.
For achieving the above object, the utility model provides following technical scheme: the efficient computer CPU heat sink of a kind of sound insulation, comprise CPU and sound panel, described CPU upper surface has closely bonded heat absorption base plate by heat-conducting silicone grease, described heat absorption base plate offers the equally distributed heat absorption hole of ordered series of numbers, described heat absorption plate upper surface is fixed with two row's heating columns, described heating column is socketed with radiating fin, louvre is left between the every sheet of described radiating fin, described sound panel to be coordinated with screw by screw and is fixedly mounted on radiating fin side, and common formation half closed interval, this interval internal fixtion is provided with fan, and fan is arranged on sound panel inwall, described fan is connected with temperature sensor by wire, and temperature sensor is fixed on heat absorption base plate side, described temperature sensor and fan are in series with plug.
Preferably, described heating column is cylindrical, and is formed by copper sheet compacting.
Preferably, described heat absorption hole is vertical with louvre, and described fan wind, to along louvre direction, makes top, heat absorption hole form negative pressure.
Preferably, described plug is connected with the supply socket of computer motherboard fan.
Compared with prior art, the beneficial effects of the utility model are: the efficient computer CPU heat sink of this sound insulation, fan and temperature sensor cooperating, power consumption is little, intelligentized control method temperature, fan is arranged in the inner chamber of sound panel, the propagation of effective obstruct noise, sound panel can also effectively prevent dust from falling into fan simultaneously, solves Long-Time Service and power consumption can be caused large, the problems such as radiating effect is bad, heat absorption hole and louvre cooperating, improve radiating efficiency, this heat spreader structures is simple, reasonable in design, be applicable to using widely and promoting.
Accompanying drawing explanation
Fig. 1 is the utility model structural representation.
In figure: 1 sound panel, 2 plugs, 3 fans, 4 temperature sensors, 5 CPU, 6 heat absorption holes, 7 heat absorption base plate, 8 radiating fins, 9 louvres, 10 heating columns.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Refer to Fig. 1, the utility model provides a kind of technical scheme: the efficient computer CPU heat sink of a kind of sound insulation, comprise CPU 5 and sound panel 1, described CPU 5 upper surface has closely bonded heat absorption base plate 7 by heat-conducting silicone grease, described heat absorption base plate 7 offers the equally distributed heat absorption hole 6 of ordered series of numbers, described heat absorption base plate 7 upper surface is fixed with two row's heating columns 10, described heating column 10 is cylindrical, and formed by copper sheet compacting, described heating column 10 is socketed with radiating fin 8, louvre 9 is left between the every sheet of described radiating fin 8, described heat absorption hole 6 is vertical with louvre 9, described fan 3 wind direction is along louvre 9 direction, top, heat absorption hole 6 is made to form negative pressure, better raising radiating efficiency, described sound panel 1 to be coordinated with screw by screw and is fixedly mounted on radiating fin 8 side, and common formation half closed interval, this interval internal fixtion is provided with fan 3, and fan 3 is arranged on sound panel 1 inwall, described fan 3 is connected with temperature sensor 4 by wire, and temperature sensor 4 is fixed on heat absorption base plate 7 side, described temperature sensor 4 and fan 3 are in series with plug 2, described plug 2 is connected with the supply socket of computer motherboard fan.
Although indicated and described embodiment of the present utility model, for the ordinary skill in the art, be appreciated that and can carry out multiple change, amendment, replacement and modification to these embodiments when not departing from principle of the present utility model and spirit, scope of the present utility model is by claims and equivalents thereof.
Claims (4)
1. the efficient computer CPU heat sink of sound insulation, comprise CPU and sound panel, it is characterized in that: described CPU upper surface has closely bonded heat absorption base plate by heat-conducting silicone grease, described heat absorption base plate offers the equally distributed heat absorption hole of ordered series of numbers, described heat absorption plate upper surface is fixed with two row's heating columns, described heating column is socketed with radiating fin, louvre is left between the every sheet of described radiating fin, described sound panel to be coordinated with screw by screw and is fixedly mounted on radiating fin side, and common formation half closed interval, this interval internal fixtion is provided with fan, and fan is arranged on sound panel inwall, described fan is connected with temperature sensor by wire, and temperature sensor is fixed on heat absorption base plate side, described temperature sensor and fan are in series with plug.
2. the efficient computer CPU heat sink of a kind of sound insulation according to claim 1, is characterized in that: described heating column is cylindrical, and is formed by copper sheet compacting.
3. the efficient computer CPU heat sink of a kind of sound insulation according to claim 1, is characterized in that: described heat absorption hole is vertical with louvre, and described fan wind, to along louvre direction, makes top, heat absorption hole form negative pressure.
4. the efficient computer CPU heat sink of a kind of sound insulation according to claim 1, is characterized in that: described plug is connected with the supply socket of computer motherboard fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420695055.4U CN204129646U (en) | 2014-11-19 | 2014-11-19 | The efficient computer CPU heat sink of a kind of sound insulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420695055.4U CN204129646U (en) | 2014-11-19 | 2014-11-19 | The efficient computer CPU heat sink of a kind of sound insulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204129646U true CN204129646U (en) | 2015-01-28 |
Family
ID=52385985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420695055.4U Expired - Fee Related CN204129646U (en) | 2014-11-19 | 2014-11-19 | The efficient computer CPU heat sink of a kind of sound insulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204129646U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106445032A (en) * | 2016-10-14 | 2017-02-22 | 柳州译海网络科技有限公司 | Heat-balancing heat dissipation device for computer |
| CN108089680A (en) * | 2018-01-03 | 2018-05-29 | 联想(北京)有限公司 | A kind of heat dissipating method and device |
| US11222830B2 (en) | 2018-01-03 | 2022-01-11 | Lenovo (Beijing) Co., Ltd. | Heat dissipation structure and electronic device |
-
2014
- 2014-11-19 CN CN201420695055.4U patent/CN204129646U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106445032A (en) * | 2016-10-14 | 2017-02-22 | 柳州译海网络科技有限公司 | Heat-balancing heat dissipation device for computer |
| CN108089680A (en) * | 2018-01-03 | 2018-05-29 | 联想(北京)有限公司 | A kind of heat dissipating method and device |
| US11222830B2 (en) | 2018-01-03 | 2022-01-11 | Lenovo (Beijing) Co., Ltd. | Heat dissipation structure and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150128 Termination date: 20151119 |