CN204578345U - Semiconductor refrigeration type switch power module - Google Patents
Semiconductor refrigeration type switch power module Download PDFInfo
- Publication number
- CN204578345U CN204578345U CN201520313731.1U CN201520313731U CN204578345U CN 204578345 U CN204578345 U CN 204578345U CN 201520313731 U CN201520313731 U CN 201520313731U CN 204578345 U CN204578345 U CN 204578345U
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- Prior art keywords
- power module
- switch power
- chilling plate
- semiconductor
- semiconductor chilling
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- Expired - Fee Related
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model relates to a kind of semiconductor refrigeration type switch power module, comprise switch power module, it is characterized in that: also comprise semiconductor chilling plate and radiating fin, multiple semiconductor chilling plate composition semiconductor refrigerating chip arrays, switch power module upper surface is close to by the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate, the hot side of semiconductor chilling plate is close to radiating fin lower surface, and described radiating fin is fixed on switch power module.The utility model adopts semiconductor refrigeration chip array to dispel the heat to switch power module, good heat dissipation effect, and temperature is relatively stable, improves useful life, for the stable operation of switch power module provides safeguard.
Description
Technical field
The utility model relates to a kind of Switching Power Supply, specifically a kind of semiconductor refrigeration type switch power module.
Background technology
Along with the whole world is to the attention of energy problem, the energy consumption issues of electronic product will be more and more outstanding, in order to improve power supplying efficiency, people have developed Switching Power Supply, its power supplying efficiency is high, and voltage stabilized range is wide, in addition, also have the precision of voltage regulation high, do not use the features such as power transformer, therefore Switching Power Supply has been widely used in various electronic equipment.For the heat dissipation problem of Switching Power Supply, traditional mode arranges many louvres on the shell of mains switch, internal circuit arranges fin, but louvre easily makes the dust in surrounding environment, steam etc. enter in Switching Power Supply, affects the life-span of Switching Power Supply, and adopts copper or aluminum thermal fin to dispel the heat with heat transfer form, because heat is in the transmission of in-plane, copper and aluminothermy hinder all too large, and make heat be delivered to far-end and require great effort very much, radiating efficiency is low.
Utility model content
Not enough for above-mentioned prior art, the utility model provides a kind of semiconductor refrigeration type switch power module.
The semiconductor refrigeration type switch power module that the utility model provides is achieved through the following technical solutions:
A kind of semiconductor refrigeration type switch power module, comprise switch power module, it is characterized in that: also comprise semiconductor chilling plate and radiating fin, multiple semiconductor chilling plate composition semiconductor refrigerating chip arrays, switch power module upper surface is close to by the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate, and the hot side of semiconductor chilling plate is close to radiating fin lower surface.
Described radiating fin is fixed on switch power module.
The beneficial effects of the utility model are: adopt semiconductor refrigeration chip array to dispel the heat to switch power module, good heat dissipation effect, temperature is relatively stable, improves useful life, for the stable operation of switch power module provides safeguard.
Accompanying drawing explanation
Fig. 1 is STRUCTURE DECOMPOSITION schematic diagram of the present utility model;
Fig. 2 is structural representation of the present utility model;
Mark in figure: 1 is switch power module, and 2 is semiconductor chilling plate, and 3 is radiating fin.
Embodiment
For making the object of the application, technical scheme and advantage clearly, below in conjunction with drawings and the specific embodiments, the application is described in further detail.
A kind of semiconductor refrigeration type switch power module as depicted in figs. 1 and 2, comprise switch power module 1, it is characterized in that: also comprise semiconductor chilling plate 2 and radiating fin 3, multiple semiconductor chilling plate 2 forms semiconductor refrigerating chip arrays, switch power module 1 upper surface is close to by the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate 2, and the hot side of semiconductor chilling plate 2 is close to radiating fin 3 lower surface.
Described radiating fin 3 is fixed on switch power module 1.
During switch power module work, the heat that switch power module produces is passed to radiating fin by semiconductor chilling plate group, and heat is drained into the external world by radiating fin.
The above embodiment only represents execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not be interpreted as the restriction to the utility model scope.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to the utility model protection range.
Claims (2)
1. a semiconductor refrigeration type switch power module, comprise switch power module, it is characterized in that: also comprise semiconductor chilling plate and radiating fin, multiple semiconductor chilling plate composition semiconductor refrigerating chip arrays, switch power module upper surface is close to by the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate, and the hot side of semiconductor chilling plate is close to radiating fin lower surface.
2. a kind of semiconductor refrigeration type switch power module according to claim 1, is characterized in that: described radiating fin is fixed on switch power module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520313731.1U CN204578345U (en) | 2015-05-15 | 2015-05-15 | Semiconductor refrigeration type switch power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520313731.1U CN204578345U (en) | 2015-05-15 | 2015-05-15 | Semiconductor refrigeration type switch power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204578345U true CN204578345U (en) | 2015-08-19 |
Family
ID=53870936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520313731.1U Expired - Fee Related CN204578345U (en) | 2015-05-15 | 2015-05-15 | Semiconductor refrigeration type switch power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204578345U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109392291A (en) * | 2018-11-05 | 2019-02-26 | 四川九洲电器集团有限责任公司 | A kind of closed module of piezoelectric fan heat dissipation |
-
2015
- 2015-05-15 CN CN201520313731.1U patent/CN204578345U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109392291A (en) * | 2018-11-05 | 2019-02-26 | 四川九洲电器集团有限责任公司 | A kind of closed module of piezoelectric fan heat dissipation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150819 Termination date: 20170515 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |