CN204578345U - Semiconductor refrigeration type switch power module - Google Patents

Semiconductor refrigeration type switch power module Download PDF

Info

Publication number
CN204578345U
CN204578345U CN201520313731.1U CN201520313731U CN204578345U CN 204578345 U CN204578345 U CN 204578345U CN 201520313731 U CN201520313731 U CN 201520313731U CN 204578345 U CN204578345 U CN 204578345U
Authority
CN
China
Prior art keywords
power module
switch power
chilling plate
semiconductor
semiconductor chilling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520313731.1U
Other languages
Chinese (zh)
Inventor
何激扬
戈建利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RISELINK TECHNOLOGY Co Ltd
Original Assignee
RISELINK TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RISELINK TECHNOLOGY Co Ltd filed Critical RISELINK TECHNOLOGY Co Ltd
Priority to CN201520313731.1U priority Critical patent/CN204578345U/en
Application granted granted Critical
Publication of CN204578345U publication Critical patent/CN204578345U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

The utility model relates to a kind of semiconductor refrigeration type switch power module, comprise switch power module, it is characterized in that: also comprise semiconductor chilling plate and radiating fin, multiple semiconductor chilling plate composition semiconductor refrigerating chip arrays, switch power module upper surface is close to by the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate, the hot side of semiconductor chilling plate is close to radiating fin lower surface, and described radiating fin is fixed on switch power module.The utility model adopts semiconductor refrigeration chip array to dispel the heat to switch power module, good heat dissipation effect, and temperature is relatively stable, improves useful life, for the stable operation of switch power module provides safeguard.

Description

Semiconductor refrigeration type switch power module
Technical field
The utility model relates to a kind of Switching Power Supply, specifically a kind of semiconductor refrigeration type switch power module.
Background technology
Along with the whole world is to the attention of energy problem, the energy consumption issues of electronic product will be more and more outstanding, in order to improve power supplying efficiency, people have developed Switching Power Supply, its power supplying efficiency is high, and voltage stabilized range is wide, in addition, also have the precision of voltage regulation high, do not use the features such as power transformer, therefore Switching Power Supply has been widely used in various electronic equipment.For the heat dissipation problem of Switching Power Supply, traditional mode arranges many louvres on the shell of mains switch, internal circuit arranges fin, but louvre easily makes the dust in surrounding environment, steam etc. enter in Switching Power Supply, affects the life-span of Switching Power Supply, and adopts copper or aluminum thermal fin to dispel the heat with heat transfer form, because heat is in the transmission of in-plane, copper and aluminothermy hinder all too large, and make heat be delivered to far-end and require great effort very much, radiating efficiency is low.
Utility model content
Not enough for above-mentioned prior art, the utility model provides a kind of semiconductor refrigeration type switch power module.
The semiconductor refrigeration type switch power module that the utility model provides is achieved through the following technical solutions:
A kind of semiconductor refrigeration type switch power module, comprise switch power module, it is characterized in that: also comprise semiconductor chilling plate and radiating fin, multiple semiconductor chilling plate composition semiconductor refrigerating chip arrays, switch power module upper surface is close to by the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate, and the hot side of semiconductor chilling plate is close to radiating fin lower surface.
Described radiating fin is fixed on switch power module.
The beneficial effects of the utility model are: adopt semiconductor refrigeration chip array to dispel the heat to switch power module, good heat dissipation effect, temperature is relatively stable, improves useful life, for the stable operation of switch power module provides safeguard.
Accompanying drawing explanation
Fig. 1 is STRUCTURE DECOMPOSITION schematic diagram of the present utility model;
Fig. 2 is structural representation of the present utility model;
Mark in figure: 1 is switch power module, and 2 is semiconductor chilling plate, and 3 is radiating fin.
Embodiment
For making the object of the application, technical scheme and advantage clearly, below in conjunction with drawings and the specific embodiments, the application is described in further detail.
A kind of semiconductor refrigeration type switch power module as depicted in figs. 1 and 2, comprise switch power module 1, it is characterized in that: also comprise semiconductor chilling plate 2 and radiating fin 3, multiple semiconductor chilling plate 2 forms semiconductor refrigerating chip arrays, switch power module 1 upper surface is close to by the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate 2, and the hot side of semiconductor chilling plate 2 is close to radiating fin 3 lower surface.
Described radiating fin 3 is fixed on switch power module 1.
During switch power module work, the heat that switch power module produces is passed to radiating fin by semiconductor chilling plate group, and heat is drained into the external world by radiating fin.
The above embodiment only represents execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not be interpreted as the restriction to the utility model scope.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to the utility model protection range.

Claims (2)

1. a semiconductor refrigeration type switch power module, comprise switch power module, it is characterized in that: also comprise semiconductor chilling plate and radiating fin, multiple semiconductor chilling plate composition semiconductor refrigerating chip arrays, switch power module upper surface is close to by the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate, and the hot side of semiconductor chilling plate is close to radiating fin lower surface.
2. a kind of semiconductor refrigeration type switch power module according to claim 1, is characterized in that: described radiating fin is fixed on switch power module.
CN201520313731.1U 2015-05-15 2015-05-15 Semiconductor refrigeration type switch power module Expired - Fee Related CN204578345U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520313731.1U CN204578345U (en) 2015-05-15 2015-05-15 Semiconductor refrigeration type switch power module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520313731.1U CN204578345U (en) 2015-05-15 2015-05-15 Semiconductor refrigeration type switch power module

Publications (1)

Publication Number Publication Date
CN204578345U true CN204578345U (en) 2015-08-19

Family

ID=53870936

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520313731.1U Expired - Fee Related CN204578345U (en) 2015-05-15 2015-05-15 Semiconductor refrigeration type switch power module

Country Status (1)

Country Link
CN (1) CN204578345U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109392291A (en) * 2018-11-05 2019-02-26 四川九洲电器集团有限责任公司 A kind of closed module of piezoelectric fan heat dissipation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109392291A (en) * 2018-11-05 2019-02-26 四川九洲电器集团有限责任公司 A kind of closed module of piezoelectric fan heat dissipation

Similar Documents

Publication Publication Date Title
CN201449196U (en) Radiator with heat storage capacity
CN107219907A (en) A kind of air-cooled water-filled radiator for electronic equipment
CN204578960U (en) A kind of optical fiber temperature-measurement formula high power switching power supply cooling system
CN201680648U (en) Refrigerator
CN209693331U (en) A kind of liquid cooling immersion supercomputing center cooling system
CN204578345U (en) Semiconductor refrigeration type switch power module
CN204029870U (en) A kind of semiconductor cooling device
CN209326136U (en) A kind of semiconductor cooler
CN205230713U (en) Solar energy transformer cooling device
CN203478680U (en) Chilling plate structure of refrigerating equipment
CN204578472U (en) Temperature-control semiconductor refrigerating High-Power Microwave power amplifier
CN2932237Y (en) Semiconductor thermoelectricity cooled heat pump
CN204578471U (en) Microwave power amplifier semiconductor refrigeration type cooling system
CN205105450U (en) Durable PCB board
CN205911641U (en) Static synchronous compensation arrangement of liquid cooling
CN201623152U (en) Heat radiator
CN204305546U (en) A kind of high-power heater members group cooling device
CN203298081U (en) Led street lamp
CN204578470U (en) Semiconductor refrigeration type microwave power amplifier
CN207474205U (en) A kind of radiating fin of transformer radiating and cooling structure
CN201634775U (en) Generating device utilizing waste heat of heat dissipation hole of aluminum electrolysis cell
CN204216850U (en) The special phase-change heat sink of a kind of microwave power amplifier
CN207441727U (en) A kind of photovoltaic module
CN203478682U (en) Chilling plate structure of refrigerating equipment
CN203788620U (en) Novel electronic component radiation structure

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150819

Termination date: 20170515

CF01 Termination of patent right due to non-payment of annual fee