CN204578470U - Semiconductor refrigeration type microwave power amplifier - Google Patents
Semiconductor refrigeration type microwave power amplifier Download PDFInfo
- Publication number
- CN204578470U CN204578470U CN201520312592.0U CN201520312592U CN204578470U CN 204578470 U CN204578470 U CN 204578470U CN 201520312592 U CN201520312592 U CN 201520312592U CN 204578470 U CN204578470 U CN 204578470U
- Authority
- CN
- China
- Prior art keywords
- power amplifier
- chilling plate
- semiconductor
- radiating fin
- microwave power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relate to a kind of semiconductor refrigeration type microwave power amplifier, comprise amplifier body, it is characterized in that: also comprise radiating fin and semiconductor chilling plate, multiple semiconductor chilling plate composition semiconductor refrigerating chip arrays, the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate is close to amplifier body upper surface, the hot side of semiconductor chilling plate is close to radiating fin lower surface, and described radiating fin is fixed on amplifier body.The utility model adopts semiconductor refrigeration chip array to dispel the heat to microwave power amplifier, and radiating efficiency is high, and temperature is relatively stable, for the stable operation of power amplifier provides safeguard.
Description
Technical field
The utility model relates to microwave power amplifier field, specifically a kind of semiconductor refrigeration type microwave power amplifier.
Background technology
Power amplifier is the important component part of microwave equipment, and during power amplifier work, power consumption is large, frequency is high, so high to the efficiency requirements of heat radiation.Microwave circuit fault also normally because radiating efficiency is low, causes temperature too high, damages integrated circuit, and causes letter signal to interrupt, affect the reliability of microwave communication.Traditional amplifier radiator adopts wind-cooling heat dissipating usually, mainly that fan and copper, aluminium radiating fin are combined, adopt the heat radiation of heat transfer form, but heat is in the transmission of in-plane, copper and aluminothermy hinder all too large, make heat be delivered to far-end and require great effort very much, make radiating fin utilance not high, radiating efficiency is low, have impact on the stability of power amplifier.
Utility model content
Not enough for above-mentioned prior art, the utility model provides a kind of semiconductor refrigeration type microwave power amplifier.
The semiconductor refrigeration type microwave power amplifier that the utility model provides is achieved through the following technical solutions:
A kind of semiconductor refrigeration type microwave power amplifier, comprise amplifier body, it is characterized in that: also comprise radiating fin and semiconductor chilling plate, multiple semiconductor chilling plate composition semiconductor refrigerating chip arrays, the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate is close to amplifier body upper surface, and the hot side of semiconductor chilling plate is close to radiating fin lower surface.
Described radiating fin is fixed on amplifier body.
The beneficial effects of the utility model are: adopt semiconductor refrigeration chip array to dispel the heat to microwave power amplifier, radiating efficiency is high, and temperature is relatively stable, for the stable operation of power amplifier provides safeguard.
Accompanying drawing explanation
Fig. 1 is STRUCTURE DECOMPOSITION schematic diagram of the present utility model;
Fig. 2 is structural representation of the present utility model;
Mark in figure: 1 is amplifier body, and 2 is semiconductor chilling plate, and 3 is radiating fin.
Embodiment
For making the object of the application, technical scheme and advantage clearly, below in conjunction with drawings and the specific embodiments, the application is described in further detail.
A kind of semiconductor refrigeration type microwave power amplifier as shown in Figure 1, comprise amplifier body 1, multiple semiconductor chilling plate 2 and radiating fin 3, multiple semiconductor chilling plate 2 forms semiconductor refrigerating chip arrays, the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate 2 is close to amplifier body 1 upper surface, and the hot side of semiconductor chilling plate 3 is close to radiating fin 3 lower surface.
Further, described radiating fin 3 is fixed on amplifier body 1.
The above embodiment only represents execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not be interpreted as the restriction to the utility model scope.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to the utility model protection range.
Claims (2)
1. a semiconductor refrigeration type microwave power amplifier, comprise amplifier body, it is characterized in that: also comprise radiating fin and semiconductor chilling plate, multiple semiconductor chilling plate composition semiconductor refrigerating chip arrays, the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate is close to amplifier body upper surface, and the hot side of semiconductor chilling plate is close to radiating fin lower surface.
2. a kind of semiconductor refrigeration type microwave power amplifier according to claim 1, is characterized in that: described radiating fin is fixed on amplifier body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520312592.0U CN204578470U (en) | 2015-05-15 | 2015-05-15 | Semiconductor refrigeration type microwave power amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520312592.0U CN204578470U (en) | 2015-05-15 | 2015-05-15 | Semiconductor refrigeration type microwave power amplifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204578470U true CN204578470U (en) | 2015-08-19 |
Family
ID=53871059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520312592.0U Expired - Fee Related CN204578470U (en) | 2015-05-15 | 2015-05-15 | Semiconductor refrigeration type microwave power amplifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204578470U (en) |
-
2015
- 2015-05-15 CN CN201520312592.0U patent/CN204578470U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150819 Termination date: 20170515 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |