CN207252126U - A kind of radiator for communication equipment - Google Patents
A kind of radiator for communication equipment Download PDFInfo
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- CN207252126U CN207252126U CN201721126780.XU CN201721126780U CN207252126U CN 207252126 U CN207252126 U CN 207252126U CN 201721126780 U CN201721126780 U CN 201721126780U CN 207252126 U CN207252126 U CN 207252126U
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- radiator
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- semiconductor chilling
- temperature
- chilling plate
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Abstract
The utility model provides a kind of radiator for communication equipment, including housing, radiator in housing, fan and semiconductor chilling plate, semiconductor chilling plate includes chill surface and radiating surface, semiconductor chilling plate is embedded on housing and chill surface is set towards hull outside, radiator is arranged on semiconductor refrigerating on piece, the lower face of radiator is bonded setting with radiating surface, fan is arranged on the upper surface of radiator and is connected with the inside of radiator, the end face that housing is equipped with semiconductor chilling plate is equipped with water conservancy diversion wind-tunnel, the construction for heat radiating device is simple, it is small, it is low in energy consumption, good heat dissipation effect and using reliable, it is very suitable for being installed on some narrow spaces, the occasion of bad environments, so as to ensure that the normal use of communication equipment, ensure that network service is unimpeded in time.
Description
Technical field
It the utility model is related to heat abstractor technical field, more particularly to a kind of radiator for communication equipment.
Background technology
Most electric substation of electric company, the communication equipment of business office are equipped with powerful automatic cooling heat friendship at present
Exchange device is to ensure the normal operation of communication equipment, but in some particular surroundings, such as：Small of the loft of narrow space, street
Unattended switching station in the greenery patches of side, these places are limited by space environment can not install common powerful radiating and cooling dress
Put, but these base station operation environment are more severe, are particularly the summer of high temperature, and up to 40 °~50 °, communication is set temperature in base station
The standby long-play under this kind of rugged environment is very easy to error code, communication disruption occur, shortens service life of equipment even
High temperature and damage, and then influence the normal operation of whole power grid, therefore it is non-to develop a kind of radiator for communication equipment
Often it is necessary.
The content of the invention
The purpose of this utility model is to provide a kind of radiator for communication equipment.
In order to achieve the above object, the utility model adopts the following technical solution：A kind of heat dissipation for communication equipment fills
Put, including housing, the radiator in housing, fan and semiconductor chilling plate, semiconductor chilling plate include chill surface and dissipate
Hot face, semiconductor chilling plate is embedded on housing and chill surface is set towards hull outside, and radiator is arranged on semiconductor chilling plate
On, the lower face of radiator is bonded setting with radiating surface, and fan is arranged on the upper surface of radiator and is connected with the inside of radiator,
The end face that housing is equipped with semiconductor chilling plate is equipped with water conservancy diversion wind-tunnel.
Further, the water conservancy diversion wind-tunnel is located at the surrounding of semiconductor chilling plate.
Further, the chill surface of the semiconductor chilling plate is flushed with the outer end face of housing.
Further, the housing includes main side face and the first end face and second end face arranged on main side face both ends, main side
Face and first end face, second end face are wholely set and are in " Π " type, and semiconductor chilling plate is embedded on the face of main side.
Further, the radiator further includes temperature controller, and semiconductor chilling plate is electrically connected with temperature controller.
Further, the temperature controller includes the temperature probe for measuring communication equipment surface temperature and is surveyed for handling
The MCU of amount temperature, temperature probe are electrically connected with MCU.
Further, the semiconductor chilling plate is electrically connected with MCU, and preset temperature is equipped with MCU, and measurement temperature is more than pre-
If during temperature, MCU control semiconductor chilling plates are started to work, when measurement temperature is less than preset temperature, MCU control semiconductor refrigeratings
Piece is stopped.
Further, the temperature controller is equipped with the setting button for being used for setting preset temperature, and setting button is electrically connected with MCU
Connect.
Further, the radiator further includes the light-emitting diode display for showing communication equipment surface real time temperature,
Light-emitting diode display is electrically connected with MCU.
Further, the radiator is the heat sink of aluminum.
In the utility model, " upper surface of radiator " is end face of the radiator away from communication equipment, " radiator
Lower face " is radiator close to the end face of communication equipment.
After adopting the above technical scheme, the utility model has the following advantages that：
1st, semiconductor chilling plate is low in energy consumption, and noise is small, using reliable, is highly suitable for narrow space, by semiconductor
Cooling piece is embedded on housing, and the chill surface of semiconductor chilling plate leads to towards the outside of housing, radiating surface towards the inside of housing
Cross and lie in a horizontal plane in radiator on the communication equipment for needing to radiate, the chill surface of semiconductor chilling plate is set towards communication
Standby, semiconductor chilling plate work, reduces the temperature near the chill surface of semiconductor chilling plate, realizes cooling down, dissipating for communication equipment
Heat, the good heat dissipation effect of radiator；The radiating surface of semiconductor chilling plate is equipped with radiator, makes semiconductor chilling plate radiating surface
On heat can effectively dissipate, ensureing the chill surface of semiconductor chilling plate can constantly be cooled, and make radiator
Heat dissipation it is relatively reliable；Radiator is equipped with the fan with being connected inside radiator, and fan provides sufficient air-flow to radiator
Make to form cross-ventilation around radiator, maximize the heat exchanger effectiveness of radiator, ensure the production of semiconductor chilling plate radiating surface
Raw heat can be dissipated in time, further improve the reliability of radiator heat dissipation；The chill surface of semiconductor chilling plate
High-temperature gas during refrigeration near chill surface easily condenses into condensed water since temperature reduces, by being provided with semiconductor in housing
The end face of cooling piece sets water conservancy diversion wind-tunnel, chill surface of the air-flow that fan work produces by water conservancy diversion wind-tunnel to semiconductor chilling plate
Cross-ventilation heat dissipation is carried out, reduces the generation of condensed water, and the evaporation of condensed water can be accelerated, avoids condensed water to communication
Equipment impacts, and improves the service life of communication equipment, makes the use of radiator relatively reliable.The construction for heat radiating device
Simply, small, low in energy consumption, good heat dissipation effect and using reliable, is very suitable for being installed on some narrow spaces, bad environments
Occasion, so as to ensure that the normal use of communication equipment, ensures that network service is unimpeded in time.
2nd, by the way that water conservancy diversion wind-tunnel to be arranged on to the surrounding of semiconductor chilling plate, the air-flow that fan produces is made to concentrate on semiconductor
The surrounding of cooling piece, makes cross-ventilated region more concentrate, and farthest reduces the generation of condensed water, accelerates condensation
The evaporation of water, avoids influence of the condensed water to communication equipment, improves the service life of communication equipment, makes making for radiator
With relatively reliable.
3rd, by setting the chill surface of semiconductor chilling plate to be flushed with the outer end face of housing, the refrigeration of semiconductor chilling plate is made
Face can be bonded completely with communication equipment, semiconductor chilling plate is reached optimum state to the refrigeration effect of communication equipment, lifting
The heat dissipation effect of radiator.
4th, main side face and first end face, second end face are wholely set and are in " Π " type, and semiconductor chilling plate is embedded in main side
On face, the component of radiator is arranged between first end face and second end face, the component of radiator is being carried and is being used
During be not easy impaired because colliding with, make the use of radiator more safe and reliable；Housing is not closed so that radiator can
Farthest to touch extraneous air, maximize the heat dissipation effect of radiator, the heat dissipation effect of heat radiation device.
5th, by setting temperature controller, semiconductor chilling plate and temperature controller, which are electrically connected, allows temperature controller to control semiconductor refrigerating
The work of piece, semiconductor chilling plate need not be constantly in working status, reduce the energy consumption of radiator, are applicable in radiator
In bad environments, the occasion of higher levels of electrical power can not be provided.
6th, by setting temperature probe, temperature probe is electrically connected with MCU, in use, temperature probe measurement communication equipment
Surface temperature, and the temperature measured is passed into MCU processing, MCU is received the real-time temperature on communication equipment surface
Degree, makes corresponding adjustment according to the real time temperature on communication equipment surface easy to radiator, makes the use of radiator more
It is intelligent.
7th, by setting semiconductor chilling plate to be electrically connected with MCU, preset temperature is provided with MCU, measurement temperature is more than pre-
If during temperature, MCU control semiconductor chilling plates are started to work, when measurement temperature is less than preset temperature, MCU control semiconductor refrigeratings
Piece is stopped, and the surface temperature of communication equipment is maintained near preset temperature, controls the operating temperature of communication equipment
In rational scope, meet the work requirements of communication equipment, and semiconductor chilling plate need not be constantly in working status, reduce
The energy consumption of radiator, has saved the energy, radiator is suitable for bad environments, can not be provided the occasion of higher levels of electrical power.
8th, button is set by setting, setting button is electrically connected with MCU and can set preset temperature, makes radiator can
According to setting preset temperature is actually needed, to add the scope of application of radiator.
9th, by setting light-emitting diode display, light-emitting diode display is electrically connected with MCU and the temperature on real-time display communication equipment surface,
Staff is set easily to observe the temperature on communication equipment surface, easy to judge that the heat sinking function of radiator is
The no normal use that can ensure communicator.
10th, radiator be aluminum heat sink, aluminium it is cheap while light-weight, both reduced the life of radiator
Cost is produced, and radiator is suitable for some bad environments, communication equipment is unable to the too many occasion of load-bearing, and heat sink is multi-disc
Shape, adds the contact area with air, makes the heat dissipation effect of radiator more preferable, ensures the reliability that radiator uses.
Brief description of the drawings
The utility model is described in further detail below in conjunction with the accompanying drawings：
Fig. 1 is the structure diagram of radiator described in the utility model embodiment one.
Fig. 2 is the structure diagram of another angle of radiator described in the utility model embodiment one.
Fig. 3 is the structure diagram of radiator described in the utility model embodiment two.
Fig. 4 is the structure diagram of another angle of radiator described in the utility model embodiment two.
Fig. 5 is the structure diagram of radiator described in the utility model embodiment three.
It is as follows that the names of the parts is marked in figure：
1st, housing；11st, main side face；12nd, first end face；13rd, second end face；2nd, radiator；3rd, semiconductor chilling plate；31、
Chill surface；4th, fan；5th, water conservancy diversion wind-tunnel；6th, temperature controller；61st, temperature probe；62nd, button is set；7th, light-emitting diode display；8th, magnet.
Embodiment
Embodiment one：
As shown in Fig. 1 to 2, the utility model provides a kind of radiator for communication equipment, including housing 1, heat dissipation
Device 2, semiconductor chilling plate 3 and fan 4, semiconductor chilling plate 3 it is low in energy consumption, noise is small, using reliable, is highly suitable for narrow and small
Space, semiconductor chilling plate 3 includes chill surface 31 and radiating surface, and chill surface 31 and radiating surface scribble heat-conducting silicone grease, partly lead
Body cooling piece 3 is embedded on housing 1 and chill surface 31 is towards the outside of housing 1, and radiating surface is towards the inside of housing 1, radiator 2
It is arranged on semiconductor chilling plate 3, the lower face of radiator 2 is bonded with radiating surface by heat conductive silica gel, and fan 4 is installed on heat dissipation
On the upper surface of device 2, fan 4 is connected with the inside of radiator 2, and housing 1 is inlaid with the end face of semiconductor chilling plate 3 and is provided with
Water conservancy diversion wind-tunnel 5.In use, radiator is lain in a horizontal plane on the communication equipment for needing to radiate, make the system of semiconductor chilling plate 3
Towards communication equipment, radiator 2 works and distributes the heat that communication equipment passes over huyashi-chuuka (cold chinese-style noodles) 31, realizes the preliminary of communication equipment
Heat dissipation；Fan 4 works and providing sufficient air-flow to radiator 2 makes 2 surrounding of radiator form cross-ventilation, accelerates radiator 2
Heat dissipation；Semiconductor chilling plate 3 works so that the temperature near chill surface 31 reduces, and realizes the fast cooling of communication equipment, dissipates
Heat, and good heat dissipation effect；While the chill surface 31 of semiconductor chilling plate 3 cools down, radiating surface produces substantial amounts of heat, radiator
2 and fan 4 work at the same time so that radiator 2 heat exchanger effectiveness maximize so as to semiconductor chilling plate 3 radiating surface on heat
Amount can be dissipated quickly and efficiently, ensured the chill surface 31 of semiconductor chilling plate 3 and can be constantly cooled, fill heat dissipation
The heat dissipation put is relatively reliable；The high-temperature gas when chill surface 31 of semiconductor chilling plate 3 freezes near chill surface 31 is due to temperature
Reduce and easily condense into condensed water, chill surface of the air-flow that the work of fan 4 produces by water conservancy diversion wind-tunnel 5 to semiconductor chilling plate 3
31 carry out cross-ventilation heat dissipation, reduce the generation of condensed water, and can accelerate the evaporation of condensed water, avoid condensed water to logical
Letter equipment impacts, and improves the service life of communication equipment, makes the use of radiator relatively reliable.The radiator knot
Structure is simple, small, low in energy consumption, good heat dissipation effect and use are reliable, is very suitable for being installed on some narrow spaces, bad environments
Occasion, so as to ensure that the normal use of communication equipment, ensure that network service is unimpeded in time.
In the present embodiment, water conservancy diversion wind-tunnel 5 is located at the surrounding of semiconductor chilling plate 3, the air-flow that fan 4 produces is concentrated on half
The surrounding of conductor cooling piece 3, makes cross-ventilated region more concentrate, and farthest reduces the generation of condensed water, accelerates
The evaporation of condensed water, avoids influence of the condensed water to communication equipment, improves the service life of communication equipment, fill heat dissipation
The use put is relatively reliable.
The chill surface 31 of semiconductor chilling plate 3 is flushed with the outer end face of housing 1, makes the chill surface 31 of semiconductor chilling plate 3
It can be completely bonded with communication equipment, semiconductor chilling plate 3 is reached optimum state to the refrigeration effect of communication equipment, lifting dissipates
The heat dissipation effect of thermal.
Housing 1 includes main side face 11, first end face 12 and second end face 13, and first end face 12 and second end face 13 are set respectively
In the both ends in main side face 11, main side face 11 and first end face 12, second end face 13 are wholely set and are in " Π " type, semiconductor refrigerating
Piece 3 is embedded on main side face 11, and the component of radiator is arranged between first end face 12 and second end face 13, makes radiator
Component be not easy during carrying and use impaired because colliding with, make the use of radiator more safe and reliable；Housing 1
Do not close so that radiator 2 can farthest touch extraneous air, maximize the heat dissipation effect of radiator 2, lifting
The heat dissipation effect of radiator.
Radiator 2 be aluminum heat sink, aluminium it is cheap while light-weight, both reduced the production of radiator
Cost, and radiator is suitable for some bad environments, communication equipment is unable to the too many occasion of load-bearing, and heat sink is multi-disc
Shape, adds the contact area with air, makes the heat dissipation effect of radiator more preferable, ensures the reliability that radiator uses.
Magnet 8 is installed, in the present embodiment, magnet 8 is provided with 4 and installed in four of main side face 11 on main side face 11
On angle, 4 magnet can meet the needs of fixed radiator, and will not set and excessively cause to bear to installation.Radiator
By setting magnet adsorption on communication equipment made of iron, space is saved, and it is easy to disassemble.
It should be understood that the number of magnet can also be 2,3,5,6,7 etc., can be made choice according to actual needs.
Embodiment two：
As shown in Figs. 3-4, the present embodiment and the main distinction of embodiment one are, the present embodiment is equipped with temperature controller.
Radiator further includes temperature controller 6, and semiconductor chilling plate 3 is connected with temperature controller 6 by conducting wire.What is so set is good
It is in by setting temperature controller 6, semiconductor chilling plate 3 and temperature controller 6, which are electrically connected, allows temperature controller 6 to control semiconductor system
The work of cold 3, semiconductor chilling plate 3 need not be constantly in working status, reduce the energy consumption of radiator, make radiator
Suitable for bad environments, the occasion of higher levels of electrical power can not be provided.
In the present embodiment, temperature controller 6 includes temperature probe 61 and MCU, and temperature probe 61 can measure the table of communication equipment
Face temperature, temperature probe 61 are connected with MCU by conducting wire, in use, temperature probe 61 measures the surface temperature of communication equipment, and
The temperature measured is passed into MCU processing, MCU is received the real time temperature on communication equipment surface, easy to radiate
Device makes corresponding adjustment according to the real time temperature on communication equipment surface, makes the use of radiator more intelligent.
Semiconductor chilling plate 3 is connected with MCU by conducting wire, preset temperature is equipped with MCU, when the temperature that temperature probe 61 measures
When degree is more than preset temperature, MCU control semiconductor chilling plates 3 are started to work, and are preset when the temperature that temperature probe 61 measures is less than
During temperature, MCU control semiconductor chilling plates are stopped, and the surface temperature of communication equipment is maintained near preset temperature, from
And the operating temperature of communication equipment is controlled in rational scope, meet the work requirements of communication equipment, and semiconductor chilling plate
Working status need not be constantly in, the energy consumption of radiator is reduced, has saved the energy, radiator is disliked suitable for environment
Occasion bad, that higher levels of electrical power can not be provided.
Setting button 62 is installed, setting button 62 is connected by conducting wire with MCU and can set default temperature on temperature controller 6
Degree, allows radiator to add the scope of application of radiator according to setting preset temperature is actually needed.
Embodiment three：
As shown in figure 5, the present embodiment and the main distinction of embodiment two are, the present embodiment is equipped with light-emitting diode display.
Radiator further includes light-emitting diode display 7, and light-emitting diode display 7 is connected by conducting wire with MCU and can be with real-time display temperature
The surface temperature for the communication equipment that control probe 61 measures.The advantages of this arrangement are as follows light-emitting diode display allows staff very
Easily it was observed that the temperature on communication equipment surface, fills easy to judge whether the heat sinking function of radiator can ensure to communicate
The normal use put.
In addition to above preferred embodiment, the utility model also has other embodiments, and those skilled in the art can root
Made various changes and modifications according to the utility model, without departing from the spirit of the utility model, the utility model should all be belonged to
Scope defined in appended claims.
Claims (10)
1. a kind of radiator for communication equipment, including housing, the radiator in housing, fan and semiconductor refrigerating
Piece, semiconductor chilling plate include chill surface and radiating surface, it is characterised in that the semiconductor chilling plate is embedded on housing and makes
Huyashi-chuuka (cold chinese-style noodles) is set towards hull outside, and radiator is arranged on semiconductor refrigerating on piece, and the lower face of radiator is bonded setting with radiating surface,
Fan is arranged on the upper surface of radiator and is connected with the inside of radiator, and the end face that housing is equipped with semiconductor chilling plate is equipped with water conservancy diversion
Wind-tunnel.
2. radiator according to claim 1, it is characterised in that the water conservancy diversion wind-tunnel is located at the four of semiconductor chilling plate
Week.
3. radiator according to claim 1, it is characterised in that the chill surface of the semiconductor chilling plate and housing
Outer end face flushes.
4. radiator according to claim 1, it is characterised in that the housing includes main side face and arranged on main side face two
The first end face and second end face at end, main side face and first end face, second end face are wholely set and are in " Π " type, semiconductor refrigerating
Piece is embedded on the face of main side.
5. radiator according to claim 1, it is characterised in that the radiator further includes temperature controller, semiconductor
Cooling piece is electrically connected with temperature controller.
6. radiator according to claim 5, it is characterised in that the temperature controller includes being used to measure communication equipment table
The temperature probe of face temperature and the MCU for handling measurement temperature, temperature probe are electrically connected with MCU.
7. radiator according to claim 6, it is characterised in that the semiconductor chilling plate is electrically connected with MCU, MCU
Interior to be equipped with preset temperature, when measurement temperature is more than preset temperature, MCU control semiconductor chilling plates are started to work, and measurement temperature is small
When preset temperature, MCU control semiconductor chilling plates are stopped.
8. radiator according to claim 7, it is characterised in that the temperature controller, which is equipped with, to be used to set preset temperature
Setting button, setting button be electrically connected with MCU.
9. radiator according to claim 6, it is characterised in that the radiator is further included for showing that communication is set
The light-emitting diode display of standby surface real time temperature, light-emitting diode display are electrically connected with MCU.
10. radiator according to claim 1, it is characterised in that the radiator is the heat sink of aluminum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721126780.XU CN207252126U (en) | 2017-09-04 | 2017-09-04 | A kind of radiator for communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721126780.XU CN207252126U (en) | 2017-09-04 | 2017-09-04 | A kind of radiator for communication equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207252126U true CN207252126U (en) | 2018-04-17 |
Family
ID=61884158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721126780.XU Active CN207252126U (en) | 2017-09-04 | 2017-09-04 | A kind of radiator for communication equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207252126U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109725590A (en) * | 2018-12-24 | 2019-05-07 | 许昌学院 | A kind of computer information management accident warning device |
-
2017
- 2017-09-04 CN CN201721126780.XU patent/CN207252126U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109725590A (en) * | 2018-12-24 | 2019-05-07 | 许昌学院 | A kind of computer information management accident warning device |
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