CN204578471U - Microwave power amplifier semiconductor refrigeration type cooling system - Google Patents

Microwave power amplifier semiconductor refrigeration type cooling system Download PDF

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Publication number
CN204578471U
CN204578471U CN201520313561.7U CN201520313561U CN204578471U CN 204578471 U CN204578471 U CN 204578471U CN 201520313561 U CN201520313561 U CN 201520313561U CN 204578471 U CN204578471 U CN 204578471U
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CN
China
Prior art keywords
power amplifier
microwave power
chilling plate
plate group
semiconductor chilling
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Expired - Fee Related
Application number
CN201520313561.7U
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Chinese (zh)
Inventor
何激扬
戈建利
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RISELINK TECHNOLOGY Co Ltd
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RISELINK TECHNOLOGY Co Ltd
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Priority to CN201520313561.7U priority Critical patent/CN204578471U/en
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Publication of CN204578471U publication Critical patent/CN204578471U/en
Anticipated expiration legal-status Critical
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Abstract

The utility model relate to a kind of microwave power amplifier semiconductor refrigeration type cooling system, comprise microwave power amplifier, semiconductor chilling plate group, radiating fin, temperature sensor, radiator fan, controller, microwave power amplifier is close to by the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate group, the hot side of semiconductor chilling plate group is close to radiating fin, set temperature transducer in described microwave power amplifier, described temperature sensor is connected with controller by optical fiber, arrange radiator fan in described radiating fin, described radiator fan is electrically connected with controller.The utility model adopts semiconductor chilling plate group to dispel the heat to microwave power amplifier, good heat dissipation effect, and temperature is relatively stable, for the stable operation of power amplifier provides safeguard, temperature is monitored in real time, thus control the rotating speed of radiator fan, power saving more, decreases the loss of fan.

Description

Microwave power amplifier semiconductor refrigeration type cooling system
Technical field
The utility model relates to microwave power amplifier field, specifically a kind of microwave power amplifier semiconductor refrigeration type cooling system.
Background technology
Power amplifier is the important component part of microwave equipment, and high merit amplifier is because power consumption is large, frequency is high, high to the efficiency requirements of heat radiation.Microwave circuit fault also normally because temperature is too high, is damaged integrated circuit, and is caused letter signal to interrupt, affect the reliability of microwave communication.Traditional amplifier radiator adopts wind-cooling heat dissipating usually, mainly that fan and copper, aluminium radiating fin are combined, adopt the heat radiation of heat transfer form, but heat is in the transmission of in-plane, copper and aluminothermy hinder all too large, make heat be delivered to far-end and require great effort very much, make radiating fin utilance not high, radiating efficiency is low, have impact on the stability of power amplifier.
Utility model content
Not enough for above-mentioned prior art, the utility model provides a kind of microwave power amplifier semiconductor refrigeration type cooling system.
A kind of microwave power amplifier semiconductor refrigeration type cooling system that the utility model provides is achieved through the following technical solutions:
A kind of microwave power amplifier semiconductor refrigeration type cooling system, it is characterized in that: comprise microwave power amplifier, semiconductor chilling plate group, radiating fin, temperature sensor, radiator fan, controller, microwave power amplifier is close to by the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate group, the hot side of semiconductor chilling plate group is close to radiating fin, set temperature transducer in described microwave power amplifier, described temperature sensor is connected with controller by optical fiber, arrange radiator fan in described radiating fin, described radiator fan is electrically connected with controller.
Described semiconductor chilling plate group is made up of multiple semiconductor chilling plate.
Described temperature sensor is fiber-optical grating temperature sensor.
The beneficial effects of the utility model are:
1, adopt semiconductor chilling plate group to dispel the heat to microwave power amplifier, good heat dissipation effect, temperature is relatively stable, for the stable operation of power amplifier provides safeguard.
2, monitor in real time temperature, thus control the rotating speed of radiator fan, power saving more, decreases the loss of fan.
3, adopt fiber-optical grating temperature sensor, fiber-optical grating temperature sensor itself is without the need to power supply, more energy-conservation, and fiber-optical grating temperature sensor long service life, is quick on the draw.
Accompanying drawing explanation
Fig. 1 is structured flowchart of the present utility model.
Embodiment
For making the object of the application, technical scheme and advantage clearly, below in conjunction with drawings and the specific embodiments, the application is described in further detail.
A kind of microwave power amplifier semiconductor refrigeration type cooling system as shown in Figure 1, it is characterized in that: comprise microwave power amplifier, semiconductor chilling plate group, radiating fin, temperature sensor, radiator fan, controller, microwave power amplifier is close to by the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate group, the hot side of semiconductor chilling plate group is close to radiating fin, set temperature transducer in described microwave power amplifier, described temperature sensor is connected with controller by optical fiber, arrange radiator fan in described radiating fin, described radiator fan is electrically connected with controller.
Further, described semiconductor chilling plate group is made up of multiple semiconductor chilling plate.
Further, described temperature sensor is fiber-optical grating temperature sensor.
During microwave power amplifier work, the heat that microwave power amplifier produces is passed to radiating fin by semiconductor chilling plate group, and radiating fin coordinates with radiator fan heat is drained into the external world.Temperature sensor is responded in real time to microwave power amplifier temperature, and light signal is passed to controller, controller by the process of signal and analysis, and controls the rotating speed of radiator fan, microwave power amplifier temperature height then strengthens rotating speed, and microwave power amplifier temperature is low, reduces rotating speed.
The above embodiment only represents execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not be interpreted as the restriction to the utility model scope.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to the utility model protection range.

Claims (3)

1. a microwave power amplifier semiconductor refrigeration type cooling system, it is characterized in that: comprise microwave power amplifier, semiconductor chilling plate group, radiating fin, temperature sensor, radiator fan, controller, microwave power amplifier is close to by the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate group, the hot side of semiconductor chilling plate group is close to radiating fin, set temperature transducer in described microwave power amplifier, described temperature sensor is connected with controller by optical fiber, arrange radiator fan in described radiating fin, described radiator fan is electrically connected with controller.
2. a kind of microwave power amplifier semiconductor refrigeration type cooling system according to claim 1, is characterized in that: described semiconductor chilling plate group is made up of multiple semiconductor chilling plate.
3. a kind of microwave power amplifier semiconductor refrigeration type cooling system according to claim 1, is characterized in that: described temperature sensor is fiber-optical grating temperature sensor.
CN201520313561.7U 2015-05-15 2015-05-15 Microwave power amplifier semiconductor refrigeration type cooling system Expired - Fee Related CN204578471U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520313561.7U CN204578471U (en) 2015-05-15 2015-05-15 Microwave power amplifier semiconductor refrigeration type cooling system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520313561.7U CN204578471U (en) 2015-05-15 2015-05-15 Microwave power amplifier semiconductor refrigeration type cooling system

Publications (1)

Publication Number Publication Date
CN204578471U true CN204578471U (en) 2015-08-19

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520313561.7U Expired - Fee Related CN204578471U (en) 2015-05-15 2015-05-15 Microwave power amplifier semiconductor refrigeration type cooling system

Country Status (1)

Country Link
CN (1) CN204578471U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108539926A (en) * 2018-05-16 2018-09-14 芜湖市艾德森自动化设备有限公司 A kind of high effect forced radiator of versatility motor apparatus
CN111385933A (en) * 2018-12-27 2020-07-07 广东美的厨房电器制造有限公司 Microwave heating equipment
CN114415089A (en) * 2021-12-22 2022-04-29 深圳航天科技创新研究院 Semiconductor cooling system for mobile magnetic resonance equipment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108539926A (en) * 2018-05-16 2018-09-14 芜湖市艾德森自动化设备有限公司 A kind of high effect forced radiator of versatility motor apparatus
CN111385933A (en) * 2018-12-27 2020-07-07 广东美的厨房电器制造有限公司 Microwave heating equipment
CN111385933B (en) * 2018-12-27 2022-08-02 广东美的厨房电器制造有限公司 microwave heating equipment
CN114415089A (en) * 2021-12-22 2022-04-29 深圳航天科技创新研究院 Semiconductor cooling system for mobile magnetic resonance equipment

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150819

Termination date: 20170515

CF01 Termination of patent right due to non-payment of annual fee