CN203407137U - Heat radiation system for radio frequency microwave power devices - Google Patents
Heat radiation system for radio frequency microwave power devices Download PDFInfo
- Publication number
- CN203407137U CN203407137U CN201320367540.4U CN201320367540U CN203407137U CN 203407137 U CN203407137 U CN 203407137U CN 201320367540 U CN201320367540 U CN 201320367540U CN 203407137 U CN203407137 U CN 203407137U
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- Prior art keywords
- cooling system
- heat radiation
- microwave power
- frequency microwave
- power device
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Abstract
The utility model discloses a heat radiation system for radio frequency microwave power devices, which comprises a main heat radiation system and auxiliary heat radiation systems. The heat radiation system is characterized in that the two sides of the main heat radiation system can be both provided with the auxiliary heat radiation system in a detachable way. The heat radiation system provided by the utility model has a detachable structure and great heat radiation performance. Furthermore, the heat radiation system which can well solve the heating problem of transistor devices during a testing process has the characteristics of simple structure, low cost, convenient use and convenient maintenance.
Description
Technical field
The utility model relates to a kind of cooling system, in particular for the cooling system of test high frequency power transistor device.
Background technology
High frequency (RF and microwave) power transistor device is widely used in communication system and radar system.Transistor device can be through multiple test before dispatching from the factory, and under the test condition of continuous direct current, transistor device can produce a large amount of heats, and the result of impact test, even burns transistor device.Therefore, in its test process, must dispel the heat, guarantee the accuracy of safety and test.
Utility model content
In order to overcome the problems referred to above, the utility model provides a kind of cooling system of simple in structure, good heat dissipation effect.
The technical solution of the utility model is to provide a kind of frequency microwave power device cooling system, and it comprises main cooling system and secondary cooling system, and described main cooling system both sides are all removably provided with secondary cooling system.
Preferably, described in one, secondary cooling system is provided with at least two screwed holes, described in another, secondary cooling system is provided with the through hole corresponding to described screwed hole, and a screw thread through described through hole is connected in described screwed hole, is provided with the groove passing for described screw on described main cooling system.
Preferably, described in two, on the sidewall of secondary cooling system, be removably provided with radio frequency connector.
Preferably, described secondary cooling system bottom or side are provided with several evenly distributed radiating groove or air channels.
Preferably, described main cooling system both sides are provided with radiator fan.
Preferably, on described main cooling system, be provided with heat dissipation copper pipe or heat radiation water circuit system.
Preferably, on described secondary cooling system, be provided with heat dissipation copper pipe or heat radiation water circuit system.
Preferably, the material of described main cooling system and secondary cooling system is the material of conduction.
Preferably, high conductivity material is all processed or is electroplated on the surface of described main cooling system and secondary cooling system through electric conductive oxidation.
Cooling system of the present utility model has dismountable structure and good heat dispersion, can solve well the heating problem of transistor device in test process, and simple in structure, cost is low, easy to use and safeguard.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of cooling system of the utility model most preferred embodiment;
Fig. 2 is the structural representation of the secondary cooling system 12 in Fig. 1;
Fig. 3 is the structural representation of the secondary cooling system 14 in Fig. 1;
Fig. 4 is the structural representation of the main cooling system in Fig. 1.
Embodiment
Below embodiment of the present utility model is described in further detail.
As shown in Figures 1 to 4, a kind of cooling system of the present utility model comprises main cooling system 10.Main cooling system 10 both sides are respectively provided with a secondary cooling system 12 and secondary cooling system 14, one of them secondary cooling system 12 side is provided with two screwed holes 16, another secondary cooling system 14 sides are provided with the through hole 18 corresponding to screwed hole, by a screw (not shown) through through hole 18, be fixed in screwed hole 16, thereby fix main cooling system 10 and secondary cooling system 12 and 14.On main cooling system 10, be also provided with the groove 20 passing for screw.The material of main cooling system 10 and secondary cooling system is aluminum, and all process through electric conductive oxidation on its surface, not affect under the prerequisite of cooling system electric conductivity, prevents its oxidation.
A kind of cooling system of the present utility model in use, is placed on transistor device to be tested (not shown) on main cooling system 10, and two secondary cooling systems are used for placing testing host (not shown).The heat of transistor device is delivered on main heating panel 10, then by secondary cooling system, dispels the heat.
On the sidewall of two secondary cooling systems, be removably provided with radio frequency connector 22, radio frequency connector 22 is connected with testing host, to test.
For the huge transistor device of some caloric value, can also be further, at bottom or the side of secondary cooling system, several evenly distributed radiating grooves and air channel (not shown) are set, to form radiating fin, improve radiating effect.
Or main cooling system and/or secondary cooling system both sides arrange radiator fan (not shown), to increase heat radiation air quantity, improve cross-ventilation, enhance heat effect.
Or, on main cooling system and/or secondary cooling system, be provided with heat dissipation copper pipe (not shown) or heat dissipation pipe (not shown), for the huge product of caloric value, can also increase heat dissipation copper pipe or water and freeze and carry out enhance heat effect.
Above embodiment is only the utility model a kind of execution mode wherein, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (8)
1. a frequency microwave power device cooling system, it comprises main cooling system and secondary cooling system, it is characterized in that: described main cooling system both sides are all removably provided with secondary cooling system; Described in one, secondary cooling system is provided with at least two screwed holes, described in another, secondary cooling system is provided with the through hole corresponding to described screwed hole, one screw thread through described through hole is connected in described screwed hole, is provided with the groove passing for described screw on described main cooling system.
2. frequency microwave power device cooling system according to claim 1, is characterized in that: described in two, on the sidewall of secondary cooling system, be removably provided with radio frequency connector.
3. frequency microwave power device cooling system according to claim 2, is characterized in that: described secondary cooling system bottom or side are provided with several evenly distributed radiating groove or air channels.
4. frequency microwave power device cooling system according to claim 3, is characterized in that: described main cooling system both sides are provided with radiator fan.
5. frequency microwave power device cooling system according to claim 4, is characterized in that: on described main cooling system, be provided with heat dissipation copper pipe or heat radiation water circuit system.
6. frequency microwave power device cooling system according to claim 5, is characterized in that: on described secondary cooling system, be provided with heat dissipation copper pipe or heat radiation water circuit system.
7. the frequency microwave power device cooling system described in one of them according to claim 1-6, is characterized in that: the material of described main cooling system and secondary cooling system is the material of conduction.
8. frequency microwave power device cooling system according to claim 7, is characterized in that: high conductivity material is all processed or electroplated on the surface of described main cooling system and secondary cooling system through electric conductive oxidation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320367540.4U CN203407137U (en) | 2013-06-25 | 2013-06-25 | Heat radiation system for radio frequency microwave power devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320367540.4U CN203407137U (en) | 2013-06-25 | 2013-06-25 | Heat radiation system for radio frequency microwave power devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203407137U true CN203407137U (en) | 2014-01-22 |
Family
ID=49943054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320367540.4U Expired - Fee Related CN203407137U (en) | 2013-06-25 | 2013-06-25 | Heat radiation system for radio frequency microwave power devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203407137U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103313582A (en) * | 2013-06-25 | 2013-09-18 | 江苏博普电子科技有限责任公司 | Cooling system for radio-frequency microwave power devices |
-
2013
- 2013-06-25 CN CN201320367540.4U patent/CN203407137U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103313582A (en) * | 2013-06-25 | 2013-09-18 | 江苏博普电子科技有限责任公司 | Cooling system for radio-frequency microwave power devices |
| CN103313582B (en) * | 2013-06-25 | 2016-08-17 | 江苏博普电子科技有限责任公司 | Frequency microwave power device cooling system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140122 Termination date: 20210625 |