CN203478680U - Chilling plate structure of refrigerating equipment - Google Patents
Chilling plate structure of refrigerating equipment Download PDFInfo
- Publication number
- CN203478680U CN203478680U CN201320401998.7U CN201320401998U CN203478680U CN 203478680 U CN203478680 U CN 203478680U CN 201320401998 U CN201320401998 U CN 201320401998U CN 203478680 U CN203478680 U CN 203478680U
- Authority
- CN
- China
- Prior art keywords
- chilling plate
- semiconductor chilling
- radiator
- heat
- cooler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a semiconductor chilling plate structure, which has the advantage that the structure is simple, compact and firm. The chilling plate structure of refrigerating equipment comprises a semiconductor chilling plate, wherein the upper part of the semiconductor chilling plate is provided with a hot end, the lower part of the semiconductor chilling plate is provided with a cold end, the bottom end of the semiconductor chilling plate is provided with a cold radiator, the top end of the semiconductor chilling plate is provided with a heat radiator, heat isolation blocks are arranged around the semiconductor chilling plate as well as between the heat radiator and the cold radiator, the heat radiator and the cold radiator are respectively fastened and arranged on the heat isolation blocks through fastening screws, and heat-conducting silicone grease is coated between the heat radiator as well as the cold radiator and the semiconductor chilling plate. Furthermore, the heat radiator and the cold radiator respectively comprise an aluminum base and aluminum fins.
Description
Technical field
The utility model relates to art of refrigeration units, is specifically related to a kind of cooling piece structure that adopts semiconductor refrigerating technology.
Background technology
In semiconductor refrigerating technology, adopt semiconductor chilling plate to freeze, it has noiselessness, pollution-free, and the advantage that power consumption is low, along with the attention of people to healthy and environmental protection, adopts the equipment that semiconductor chilling plate freezes to popularize gradually; Therefore design a kind of simple in structure, compactness, firm semiconductor refrigerating chip architecture is extremely important
Utility model content
Technical problem to be solved in the utility model is, for above-mentioned deficiency of the prior art, to provide a kind of simple in structure, compactness, firm semiconductor refrigerating chip architecture.
The utility model solves the technical scheme that its technical problem adopts: a kind of cooling piece structure of refrigeration plant, comprise semiconductor chilling plate, the top of semiconductor chilling plate is hot junction, bottom is cold junction, the bottom of semiconductor chilling plate is provided with cooler, and the top of semiconductor chilling plate is provided with radiator, the surrounding of semiconductor chilling plate, between radiator and cooler, heat insulation is installed, trip bolt is respectively by cooler with radiator is fastening is arranged on heat insulation;
Between above-mentioned radiator and cooler and semiconductor chilling plate, be coated with heat-conducting silicone grease.
Further: above-mentioned radiator and cooler all include the pedestal of aluminum and the fin of aluminum.
The utility model compared with prior art has the following advantages:
The cooling piece structure of the utility model refrigeration plant, installs respectively cooler and radiator by the cold and hot end at cooling piece, has guaranteed the refrigeration of semiconductor chilling plate; Meanwhile, semiconductor chilling plate surrounding is provided with heat insulation, has reduced the energy loss of cooling piece, and radiator and cooler are by firm being fixed on heat insulation of trip bolt, and whole cooling piece is simple in structure, and compactness is reliable.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Description of reference numerals:
1-semiconductor chilling plate, 2-cooler, 3-heat insulation, 4-radiator, 5-trip bolt, 6-heat-conducting silicone grease.
The specific embodiment
Below in conjunction with drawings and Examples, the utility model specific embodiment is described:
Fig. 1 shows a kind of concrete structure of the related cotton-wadded quilt body of the utility model, as shown in the figure, a kind of cooling piece structure of refrigeration plant, comprise semiconductor chilling plate 1, the top of semiconductor chilling plate is hot junction, bottom is cold junction, the bottom of semiconductor chilling plate is provided with cooler 2, the top of semiconductor chilling plate is provided with radiator 4, the surrounding of semiconductor chilling plate 1, between radiator 4 and cooler 2, heat insulation 3 is installed, trip bolt 5 is respectively by cooler with radiator is fastening is arranged on heat insulation 3;
Between above-mentioned radiator and cooler and semiconductor chilling plate, be coated with heat-conducting silicone grease 6.
Further: above-mentioned radiator and cooler all include the pedestal of aluminum and the fin of aluminum.
By reference to the accompanying drawings the utility model preferred embodiment is explained in detail above, but the utility model is not limited to above-mentioned embodiment, in the ken possessing those of ordinary skills, can also under the prerequisite that does not depart from the utility model aim, make a variety of changes.
Do not depart from design of the present utility model and scope and can make many other changes and remodeling.Should be appreciated that the utility model is not limited to specific embodiment, scope of the present utility model is defined by the following claims.
Claims (2)
1. the cooling piece structure of a refrigeration plant, comprise semiconductor chilling plate (1), the top of semiconductor chilling plate is hot junction, bottom is cold junction, it is characterized in that: the bottom of semiconductor chilling plate is provided with cooler (2), the top of semiconductor chilling plate is provided with radiator (4), the surrounding of semiconductor chilling plate (1), between radiator (4) and cooler (2), heat insulation (3) is installed, trip bolt (5) is respectively by cooler with radiator is fastening is arranged on heat insulation (3);
Between above-mentioned radiator and cooler and semiconductor chilling plate, be coated with heat-conducting silicone grease (6).
2. the cooling piece structure of a kind of refrigeration plant as claimed in claim 1, is characterized in that: described radiator and cooler all include the pedestal of aluminum and the fin of aluminum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320401998.7U CN203478680U (en) | 2013-07-05 | 2013-07-05 | Chilling plate structure of refrigerating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320401998.7U CN203478680U (en) | 2013-07-05 | 2013-07-05 | Chilling plate structure of refrigerating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203478680U true CN203478680U (en) | 2014-03-12 |
Family
ID=50226999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320401998.7U Expired - Fee Related CN203478680U (en) | 2013-07-05 | 2013-07-05 | Chilling plate structure of refrigerating equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203478680U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104372863A (en) * | 2014-10-30 | 2015-02-25 | 辽宁省石油化工规划设计院有限公司 | Combination body for completely blocking building structural steel cold bridge |
| CN107599913A (en) * | 2017-09-22 | 2018-01-19 | 比赫电气（太仓）有限公司 | A kind of semiconductor temperature module for automotive seat |
| CN107732359A (en) * | 2017-09-05 | 2018-02-23 | 北京普莱德新能源电池科技有限公司 | Electric automobile power battery heat management device based on semiconductor refrigerating technology |
-
2013
- 2013-07-05 CN CN201320401998.7U patent/CN203478680U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104372863A (en) * | 2014-10-30 | 2015-02-25 | 辽宁省石油化工规划设计院有限公司 | Combination body for completely blocking building structural steel cold bridge |
| CN107732359A (en) * | 2017-09-05 | 2018-02-23 | 北京普莱德新能源电池科技有限公司 | Electric automobile power battery heat management device based on semiconductor refrigerating technology |
| CN107599913A (en) * | 2017-09-22 | 2018-01-19 | 比赫电气（太仓）有限公司 | A kind of semiconductor temperature module for automotive seat |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140312 Termination date: 20140705 |
|
| EXPY | Termination of patent right or utility model |