CN203413871U - Semiconductor refrigeration device - Google Patents

Semiconductor refrigeration device Download PDF

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Publication number
CN203413871U
CN203413871U CN201320401975.6U CN201320401975U CN203413871U CN 203413871 U CN203413871 U CN 203413871U CN 201320401975 U CN201320401975 U CN 201320401975U CN 203413871 U CN203413871 U CN 203413871U
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CN
China
Prior art keywords
water
cabinet
semiconductor refrigeration
cold
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320401975.6U
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Chinese (zh)
Inventor
赖耀华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to CN201320401975.6U priority Critical patent/CN203413871U/en
Application granted granted Critical
Publication of CN203413871U publication Critical patent/CN203413871U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a semiconductor refrigeration device for replacing a traditional compressor refrigeration system. The temperature difference between the hot and cold ends of the semiconductor refrigeration device is stable, so that the refrigeration effect is good. The semiconductor refrigeration device disclosed by the utility model comprises a cabinet body, the cabinet body is provided with a cabinet door, a semiconductor refrigeration plate is arranged on the side wall of the cabinet body, the semiconductor refrigeration plate comprises a clod end and a hot end, the cold end extends to the inside of the cabinet body, a cold-conducting aluminum sheet is arranged at the cold end, a water drum is arranged at the hot end, and the water drum is sequentially connected with a spray tower, a solenoid valve and a water tank through a water circulating pipeline and finally connected to the water drum so as to form a loop. Furthermore, a water pump is also arranged on the water circulating pipeline.

Description

A kind of semiconductor cooling device
Technical field
The utility model relates to art of refrigeration units, is specifically related to a kind of novel refrigerating plant.
Background technology
It is little that semiconductor refrigerating technology possesses volume, pollution-free, noiselessness, and feature simple in structure, can be in refrigeration plant, for solving the heat radiation of the refrigeration plant that comprises compressor, the problems such as environmental protection; The core of semiconductor refrigerating technology is semiconductor chilling plate, and semiconductor chilling plate is its best refrigeration of temperature difference competence exertion of guaranteed cold and hot end only.
Utility model content
Technical problem to be solved in the utility model is for above-mentioned deficiency of the prior art, is provided for substituting the semiconductor cooling device of conventional compression machine cooling system, and the cold warm end temperature difference of this semiconductor cooling device is stable, and refrigeration is good.
The utility model solves the technical scheme that its technical problem adopts: a kind of semiconductor cooling device, comprise cabinet, cabinet door is installed on cabinet, on the sidewall of cabinet, semiconductor chilling plate is installed, semiconductor chilling plate comprises cold junction and hot junction, cold junction stretches to cabinet inside, and conduction cooling aluminium flake is installed on cold junction, and water bag is installed on hot junction, water bag connects spray column successively by water circulating pipe, magnetic valve, water tank, is finally connected to water bag and forms loop.
Further: water pump is also installed on above-mentioned water circulating pipe.
The utility model compared with prior art has the following advantages:
The utility model semiconductor cooling device, by conduction cooling aluminium flake being installed at cooling piece cold junction, has increased the refrigeration area of cold junction, has improved refrigeration; Meanwhile, dispel the heat in real time by cold water circulating system in cooling piece hot junction, guaranteed the temperature difference stability of cold and hot section of cooling piece, increased to greatest extent the refrigeration of cooling piece; The mode that this cold water circulating system adopts water bag to wrap up additional spray column cooling water, good cooling results.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Description of reference numerals:
1-cabinet, 2-conduction cooling aluminium flake, 3-semiconductor chilling plate, 4-water bag, 5-spray column, 6-magnetic valve, 7-water tank, 8-cabinet door.
The specific embodiment
Below in conjunction with drawings and Examples, the utility model specific embodiment is described:
Fig. 1 shows a kind of concrete structure of the related cotton-wadded quilt body of the utility model, as shown in the figure, and a kind of semiconductor cooling device, comprise cabinet 1, cabinet door 8 is installed on cabinet 1, semiconductor chilling plate 3 is installed on the sidewall of cabinet 1, semiconductor chilling plate 3 comprises cold junction and hot junction, cold junction stretches to cabinet 1 inside, and conduction cooling aluminium flake 2 is installed on cold junction, and water bag 4 is installed on hot junction, water bag 4 connects spray column 5 successively by water circulating pipe, magnetic valve 6, water tank 7, is finally connected to water bag 4 and forms loop.
Further, on above-mentioned water circulating pipe, water pump is also installed.
By reference to the accompanying drawings the utility model preferred embodiment is explained in detail above, but the utility model is not limited to above-mentioned embodiment, in the ken possessing those of ordinary skills, can also under the prerequisite that does not depart from the utility model aim, make a variety of changes.
Do not depart from design of the present utility model and scope and can make many other changes and remodeling.Should be appreciated that the utility model is not limited to specific embodiment, scope of the present utility model is defined by the following claims.

Claims (2)

1. a semiconductor cooling device, comprise cabinet (1), cabinet door (8) is installed on cabinet (1), it is characterized in that: semiconductor chilling plate (3) is installed on the sidewall of cabinet (1), semiconductor chilling plate (3) comprises cold junction and hot junction, cold junction stretches to cabinet (1) inside, conduction cooling aluminium flake (2) is installed on cold junction, water bag (4) is installed on hot junction, water bag (4) connects spray column (5) successively by water circulating pipe, magnetic valve (6), water tank (7), is finally connected to water bag (4) and forms loop.
2. a kind of semiconductor cooling device as claimed in claim 1, is characterized in that: water pump is also installed on described water circulating pipe.
CN201320401975.6U 2013-07-05 2013-07-05 Semiconductor refrigeration device Expired - Fee Related CN203413871U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320401975.6U CN203413871U (en) 2013-07-05 2013-07-05 Semiconductor refrigeration device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320401975.6U CN203413871U (en) 2013-07-05 2013-07-05 Semiconductor refrigeration device

Publications (1)

Publication Number Publication Date
CN203413871U true CN203413871U (en) 2014-01-29

Family

ID=49976757

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320401975.6U Expired - Fee Related CN203413871U (en) 2013-07-05 2013-07-05 Semiconductor refrigeration device

Country Status (1)

Country Link
CN (1) CN203413871U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104019577A (en) * 2014-06-25 2014-09-03 玉林师范学院 Speed-control semiconductor refrigerator
CN106196706A (en) * 2016-08-05 2016-12-07 吴小峰 Quasiconductor overlay cryogenic energy storage refrigerating plant and method of work thereof
CN113099667A (en) * 2021-04-12 2021-07-09 铜陵市精方圆机械有限公司 New energy automobile is with filling electric pile rack

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104019577A (en) * 2014-06-25 2014-09-03 玉林师范学院 Speed-control semiconductor refrigerator
CN106196706A (en) * 2016-08-05 2016-12-07 吴小峰 Quasiconductor overlay cryogenic energy storage refrigerating plant and method of work thereof
CN106196706B (en) * 2016-08-05 2019-02-12 吴小峰 Semiconductor overlay cryogenic energy stores refrigerating plant and its working method
CN113099667A (en) * 2021-04-12 2021-07-09 铜陵市精方圆机械有限公司 New energy automobile is with filling electric pile rack
CN113099667B (en) * 2021-04-12 2022-08-09 铜陵市精方圆机械股份有限公司 New energy automobile is with filling electric pile rack

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140129

Termination date: 20140705

EXPY Termination of patent right or utility model