CN107599913A - A kind of semiconductor temperature module for automotive seat - Google Patents
A kind of semiconductor temperature module for automotive seat Download PDFInfo
- Publication number
- CN107599913A CN107599913A CN201710868412.0A CN201710868412A CN107599913A CN 107599913 A CN107599913 A CN 107599913A CN 201710868412 A CN201710868412 A CN 201710868412A CN 107599913 A CN107599913 A CN 107599913A
- Authority
- CN
- China
- Prior art keywords
- radiator
- air
- semiconductor
- temperature module
- automotive seat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 55
- 239000002937 thermal insulation foam Substances 0.000 claims abstract description 15
- 238000001816 cooling Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 11
- 239000003292 glue Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229920002943 EPDM rubber Polymers 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 229920000742 Cotton Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract description 7
- 238000005057 refrigeration Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920000459 Nitrile rubber Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 206010020843 Hyperthermia Diseases 0.000 description 1
- 206010053615 Thermal burn Diseases 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000036031 hyperthermia Effects 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Chair Legs, Seat Parts, And Backrests (AREA)
Abstract
The invention discloses a kind of semiconductor temperature module for automotive seat, including air blower, air-out spiral case, semiconductor temperature module, ripple airduct, close hole exhausting plate, described air-out spiral case to be connected to the head end air outlet of air blower；The semiconductor temperature module includes shell, the first radiator, semiconductor chilling plate, middle heat insulation foam, the second radiator, the semiconductor chilling plate is arranged between the first radiator and the second radiator, is slotted among the middle heat insulation foam to place semiconductor chilling plate；First radiator, semiconductor chilling plate, middle heat insulation foam, the second radiator are arranged in shell, and the shell is provided with two air channels, connect close hole exhausting plate and ripple airduct respectively.The present invention uses modularized design, can realize refrigeration and heating simultaneously, refrigerating/heating speed is fast, can the temperature adjustment within the extremely short time；Using active cooling, seat surface temperature can be effectively reduced, improves comfort level.
Description
Technical field
The present invention relates to technical field of refrigeration equipment, more particularly to a kind of semiconductor temperature module for automotive seat.
Background technology
With the development of society, automobile turns into this epoch indispensable vehicles, nowadays, people spend and got over
Come more time and money on automobile, therefore the also more and more higher of the requirement to environment inside car.Human body is to ambient temperature
Change it is extremely sensitive, especially automotive seat, automotive seat as consumer in actual use contact area it is maximum and
The most close part of contact, its comfort level will directly affect the direct feel of driver and crew.Sweltering heat summer, automotive seat by
Direct sunlight and in-car hyperthermia radiation, which influence temperature, to be steeply risen, when people drive a car, people that the high temperature of seat can scald
It can not endure, simultaneously because the close contact of human body and seat, causing heat can not distribute in time so that contact site is extremely
Humid.In the winter of cold, similarly in this way, seat temperature can reduce because of the low temperature of surrounding environment, due to both
Between close contact so that temperature can not rise rapidly.In order to avoid cold, current most superior automobile is provided with seat
Chair electric heating function, but seat freezes because technological constraint is really seldom applied.
The content of the invention
The present invention provides a kind of semiconductor temperature module for automotive seat, realizes the temperature control of automotive seat, allows driving
Personnel obtain comfortable riding experience, to solve problems of the prior art.
To reach above-mentioned purpose, the technical solution adopted by the present invention is：
The content of the invention：A kind of semiconductor temperature module for automotive seat, including air blower, air-out spiral case, semiconductor temperature
Module, ripple airduct, close hole exhausting plate, described air-out spiral case are connected to the head end air outlet of air blower；The semiconductor control
Warm module includes shell, the first radiator, semiconductor chilling plate, middle heat insulation foam, the second radiator, the semiconductor chilling plate
It is arranged between the first radiator and the second radiator, is slotted among the middle heat insulation foam to place semiconductor chilling plate, and
It is arranged between the first radiator and the second radiator；
First radiator, semiconductor chilling plate, middle heat insulation foam, the second radiator are arranged in shell, and the shell is opened
There are two air channels, one of air channel connects close hole exhausting plate, another air channel connection ripple airduct.
Preferably, the air blower is band volute casing centrifugal blower fan, its air intake direction is vertical with air-out direction, air blower
Air inlet sets screen pack.The vertical automotive compounded structure design of air blower air intake and air-out direction, and effectively water conservancy diversion and keep out
Cavitation erosion, the purifying gas of screen pack is to bring more comfortable experience.
Preferably, air-out spiral case is plastic material, its air inlet diameter is less than air outlet, and the head end air-out of air blower
The air inlet of mouth and air-out spiral case is fastened and connected by detaining point.Button point fastening and plastic material are convenient, low cost, air inlet diameter
The effect of expanding gas is can obtain less than air outlet, obtains low velocity gas so as to increase heat transfer time, beneficial to uniformly transfer heat.
Preferably, the material of first radiator, the second radiator is copper or aluminium.Copper, aluminium material heat transfer coefficient are high,
Heat transfer efficiency is good.
Preferably, the semiconductor chilling plate thickness is 2.0-3.0mm, rectangle is shaped as, surrounding is close using RTV silica gel
Envelope, semiconductor chilling plate are arranged at the first radiator, among the second radiator, by way of heat conduction glue sticking or solder welding
The end face of semiconductor chilling plate is connected on the substrate of the first radiator, the second radiator.The specification of semiconductor chilling plate is set
Put makes the cold amount of its heat production, production reasonable with the connected mode of heat conduction glue sticking or solder welding, and fitting intimate heat transfer resistance is small,
Beneficial to making full use of resulting cold or heat.
Preferably, one, two air channels that the shell is provided be vertical direction, one be horizontal direction, the close hole
Exhausting plate is arranged at the air channel of vertical direction, and the ripple airduct is arranged at the air channel of horizontal direction.Both vertically as well as horizontally
The conventional design of the automotive compounded seat in air channel, structure is coincide therewith, and close hole exhausting plate is the cold heat wind that seat obtains, comfortably just
Victory, ripple airduct is the hot/cold wind of discharge, convenient.
Further, described close hole exhausting plate inner hollow, the intensive perforate in surface, the hole opened are circular or square opening,
Air channel thickness is 3-5mm.The structure design of close hole exhausting plate makes its air-out comfortable.
Further, described ripple airduct is quad flat bellows, can free bend or stretching.The structure of ripple airduct
Design makes its exhaust and convenient.
Preferably, the material of described middle heat insulation foam is one kind in CR, EPDM or NBR.The material of middle heat insulation foam
Matter heat-proof quality is splendid, greatly reduces the heat exchange between two radiators.
Compared to the prior art, the beneficial effects of the present invention are：Air blower air intake and air-out direction are vertically automotive compounded
Structure design, and effectively water conservancy diversion and keep out cavitation erosion；The purifying gas of screen pack, the structure design of close hole exhausting plate, to driving
Personnel bring comfortable experience；The specification of semiconductor chilling plate sets the connected mode welded with heat conduction glue sticking or solder to make its production
Heat, the cold amount of production are reasonable, and it is small to be bonded intimate heat transfer resistance, beneficial to making full use of resulting cold or heat.The present invention adopts
With modularized design, automobile original chair is integrated in, aesthetic property is good；Refrigeration and heating can be realized simultaneously, it is not necessary to extra increase electricity
Heating system；Refrigerating/heating speed is fast, and seat temperature is reduced or raised by can within the extremely short time；Using active
Cooling, seat surface temperature can be effectively reduced, improve comfort level.
Brief description of the drawings
Fig. 1 is the overall structure diagram of the embodiment of the present invention.
Fig. 2 is the semiconductor temperature modular structure schematic diagram of the embodiment of the present invention.
In figure：1- air blowers, 11- head end air outlets, 2- air-out spiral cases, 3- semiconductor temperature modules, 31- shells, 310-
Air channel, 311- main air ducts, 312- air channel, the radiators of 32- first, 33- semiconductor chilling plates, 34- centres heat insulation foam.35-
Second radiator, 4- ripple airducts, the close hole exhausting plates of 5-.
Embodiment
In order to illustrate more clearly of the embodiment of the present application or technical scheme of the prior art, letter will be made to embodiment below
Single introduction.
Such as Fig. 1 ~ 2, a kind of semiconductor temperature module for automotive seat, a kind of semiconductor temperature for automotive seat
Module, including air blower 1, air-out spiral case 2, semiconductor temperature module 3, ripple airduct 4, close hole exhausting plate 5, the air blower 1
For band volute casing centrifugal blower fan, its air intake direction is vertical with air-out direction, and the air inlet of air blower 1 sets screen pack, the air-out
Spiral case 2 is connected to the head end air outlet 11 of air blower 1；
The semiconductor temperature module 3 includes shell 31, the first radiator 32, semiconductor chilling plate 33, middle heat insulation foam 34, the
Second radiator 35, first radiator 32, the material of the second radiator 35 are copper or aluminium, are opened among the middle heat insulation foam 34
Groove is arranged between the first radiator 32 and the second radiator 35 with placing semiconductor chilling plate 33, described middle spaced heat
The material of cotton 34 is CR（Neoprene）、EPDM（Ethylene propylene diene rubber）Or NBR（Nitrile rubber）In one kind；The semiconductor
The thickness of cooling piece 33 is 2.0-3.0mm, is shaped as rectangle, and surrounding uses RTV silica gel sealings, and semiconductor chilling plate 33 is arranged at
Among one radiator 32, the second radiator 35, by way of heat conduction glue sticking or solder welding, by semiconductor chilling plate 33
Cold heat（Hot/cold）End face is connected on the substrate of the first radiator 32, the second radiator 35；
First radiator 32, semiconductor chilling plate 33, middle heat insulation foam 34, the second radiator 35 are arranged in shell 31,
The shell 31 has an air channel 310 in vertical direction, horizontal direction, and vertical direction is main air duct 311, horizontal direction
For secondary air channel 312, the close hole exhausting plate 5 is arranged at main air duct 311, and the ripple airduct 4 is arranged at time air channel 312, described
The close inner hollow of hole exhausting plate 5, the intensive perforate in surface, the hole opened is circular or square opening, and the air channel of close hole exhausting plate 5 is thick
It is quad flat bellows to spend for 3-5mm, described ripple airduct 4, can free bend or stretching.
Application method：When needing refrigeration, control system exports forward dc electricity to semiconductor chilling plate 33, main air duct 311
Wind through the first radiator 32 cool down after-blow to Chain cushion and backrest, driver and crew felt comfortably cool, felt nice and cool, secondary air channel 312
Wind through the second radiator 35 heating after be immediately discharged to interior, cooled down by compartment compressor air-conditioning；
When needing heating, control system exports reverse direct current to semiconductor chilling plate 33, you can.
Finally, it is to be noted that, term " comprising ", "comprising" or its any other variant be intended to it is non-exclusive
Property includes, so that process, method, article or equipment including a series of elements not only include those key elements, and
Also include the other element that is not expressly set out, or also include for this process, method, article or equipment inherently
Key element.
Claims (9)
1. a kind of semiconductor temperature module for automotive seat, it is characterised in that including air blower（1）, air-out spiral case（2）、
Semiconductor temperature module（3）, ripple airduct（4）, close hole exhausting plate（5）, described air-out spiral case（2）It is connected to air blower（1）
Head end air outlet（11）；The semiconductor temperature module（3）Including shell（31）, the first radiator（32）, semiconductor refrigerating
Piece（33）, middle heat insulation foam（34）, the second radiator（35）, the semiconductor chilling plate（33）It is arranged at the first radiator（32）
With the second radiator（35）Between, the middle heat insulation foam（34）Slot to place semiconductor chilling plate centre（33）, and set
In the first radiator（32）With the second radiator（35）Between；
First radiator（32）, semiconductor chilling plate（33）, middle heat insulation foam（34）, the second radiator（35）It is arranged at outer
Shell（31）It is interior, the shell（31）It is provided with two air channels（310）, one of air channel（310）Connect close hole exhausting plate（5）, separately
One air channel（310）Connect ripple airduct（4）.
A kind of 2. semiconductor temperature module for automotive seat according to claim 1, it is characterised in that the air blast
Machine（1）For band volute casing centrifugal blower fan, its air intake direction is vertical with air-out direction, air blower（1）Air inlet set screen pack.
A kind of 3. semiconductor temperature module for automotive seat according to claim 1, it is characterised in that air-out spiral case
（2）For plastic material, its air inlet diameter is less than air outlet, and air blower（1）Head end air outlet（11）With air-out spiral case（2）
Air inlet by detain point be fastened and connected.
4. a kind of semiconductor temperature module for automotive seat according to claim 1, it is characterised in that described first
Radiator（32）, the second radiator（35）Material be copper or aluminium.
5. a kind of semiconductor temperature module for automotive seat according to claim 1, it is characterised in that described partly to lead
Body cooling piece（33）Thickness is 2.0-3.0mm, is shaped as rectangle, and surrounding uses RTV silica gel sealings, semiconductor chilling plate（33）If
It is placed in the first radiator（32）, the second radiator（35）Centre, by semiconductor by way of heat conduction glue sticking or solder welding
Cooling piece（33）End face be connected to the first radiator（32）, the second radiator（35）Substrate on.
A kind of 6. semiconductor temperature module for automotive seat according to claim 1, it is characterised in that the shell
（31）Two air channels being provided with（310）One be vertical direction, one be horizontal direction, the close hole exhausting plate（5）It is arranged at
The air channel of vertical direction（310）, the ripple airduct（4）It is arranged at the air channel of horizontal direction（310）.
7. a kind of semiconductor temperature module for automotive seat according to claim 1 or 6, it is characterised in that described
Close hole exhausting plate（5）Inner hollow, the intensive perforate in surface, the hole opened are 3-5mm for circular or square opening, air channel thickness.
8. a kind of semiconductor temperature module for automotive seat according to claim 1 or 6, it is characterised in that described
Ripple airduct（4）, can free bend or stretching for quad flat bellows.
9. a kind of semiconductor temperature module for automotive seat according to claim 1, it is characterised in that in described
Spaced heat cotton（34）Material be CR, EPDM or NBR in one kind.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710868412.0A CN107599913A (en) | 2017-09-22 | 2017-09-22 | A kind of semiconductor temperature module for automotive seat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710868412.0A CN107599913A (en) | 2017-09-22 | 2017-09-22 | A kind of semiconductor temperature module for automotive seat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107599913A true CN107599913A (en) | 2018-01-19 |
Family
ID=61057762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710868412.0A Pending CN107599913A (en) | 2017-09-22 | 2017-09-22 | A kind of semiconductor temperature module for automotive seat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107599913A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111609502A (en) * | 2020-04-17 | 2020-09-01 | 广东美的白色家电技术创新中心有限公司 | Fresh air refrigerating equipment for kitchen |
| CN113619457A (en) * | 2021-07-19 | 2021-11-09 | 杭州大和热磁电子有限公司 | Semiconductor refrigeration type vehicle-mounted air conditioner back cushion |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004106614A (en) * | 2002-09-17 | 2004-04-08 | Calsonic Kansei Corp | Air conditioner for vehicle and power module for air conditioner |
| US20080143152A1 (en) * | 2006-12-14 | 2008-06-19 | Wolas Scott R | Insert duct piece for thermal electric module |
| US20110031786A1 (en) * | 2009-04-03 | 2011-02-10 | Panasonic Corporation | Centrifugal air blower and automobile seat |
| CN201930693U (en) * | 2011-01-10 | 2011-08-17 | 常州捷安达科技开发有限公司 | Dehumidifier |
| CN202806462U (en) * | 2012-08-21 | 2013-03-20 | 姜大伟 | Seat temperature control module device |
| CN103419696A (en) * | 2013-09-02 | 2013-12-04 | 明道煌 | Cold air seat cushion |
| CN203478680U (en) * | 2013-07-05 | 2014-03-12 | 赖耀华 | Chilling plate structure of refrigerating equipment |
| CN207311208U (en) * | 2017-09-22 | 2018-05-04 | 比赫电气（太仓）有限公司 | A kind of active semiconductor temp.-regulating module of automotive seat |
-
2017
- 2017-09-22 CN CN201710868412.0A patent/CN107599913A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004106614A (en) * | 2002-09-17 | 2004-04-08 | Calsonic Kansei Corp | Air conditioner for vehicle and power module for air conditioner |
| US20080143152A1 (en) * | 2006-12-14 | 2008-06-19 | Wolas Scott R | Insert duct piece for thermal electric module |
| US20110031786A1 (en) * | 2009-04-03 | 2011-02-10 | Panasonic Corporation | Centrifugal air blower and automobile seat |
| CN102066772A (en) * | 2009-04-03 | 2011-05-18 | 松下电器产业株式会社 | Centrifugal blower and automobile seat |
| CN201930693U (en) * | 2011-01-10 | 2011-08-17 | 常州捷安达科技开发有限公司 | Dehumidifier |
| CN202806462U (en) * | 2012-08-21 | 2013-03-20 | 姜大伟 | Seat temperature control module device |
| CN203478680U (en) * | 2013-07-05 | 2014-03-12 | 赖耀华 | Chilling plate structure of refrigerating equipment |
| CN103419696A (en) * | 2013-09-02 | 2013-12-04 | 明道煌 | Cold air seat cushion |
| CN207311208U (en) * | 2017-09-22 | 2018-05-04 | 比赫电气（太仓）有限公司 | A kind of active semiconductor temp.-regulating module of automotive seat |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111609502A (en) * | 2020-04-17 | 2020-09-01 | 广东美的白色家电技术创新中心有限公司 | Fresh air refrigerating equipment for kitchen |
| CN113619457A (en) * | 2021-07-19 | 2021-11-09 | 杭州大和热磁电子有限公司 | Semiconductor refrigeration type vehicle-mounted air conditioner back cushion |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180119 |
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| RJ01 | Rejection of invention patent application after publication |