CN201601936U

CN201601936U - Electronic component simple heat radiating device

Info

Publication number: CN201601936U
Application number: CN2009202551997U
Authority: CN
Inventors: 张丽; 张翔; 张志强
Original assignee: 张志强
Priority date: 2009-12-22
Filing date: 2009-12-22
Publication date: 2010-10-06
Anticipated expiration: 2019-12-22

Abstract

The utility model belongs to the heat radiating device technical field, in particular to an electronic component simple heat radiating device which is technically characterized in that: the electronic component simple heat radiating device comprises a heat radiating substrate and a heat radiating fin which are tightly contacted with an electronic component, the heat radiating fin is formed by a coiled aluminum foil plate with support projections, wherein the section thickness of the aluminum foil plate is less than 0.4mm, and the space between adjacent aluminum foil plates forms a heat radiating channel. The further improvement of the utility model includes that a plurality of vent holes are arranged on the aluminum foil plates perpendicular to the heat radiating channels; a plurality of air channels communicated with the heat radiating channels are arranged on the heat radiating substrate. The heat electronic component simple heat radiating device solves the problem that the electronic component in prior art has short service life due to inefficient heat dissipation, is widely applicable to LED lighting light sources, computer chips and the heat radiating field of other electronic components, greatly improves the heat radiating effect and the service life of the electronic components.

Description

The simple and easy heat abstractor of a kind of electronic devices and components

Technical field

The utility model belongs to the heat abstractor technical field, relates in particular to the simple and easy heat abstractor of a kind of electronic devices and components.

Background technology

The application of electronic devices and components is more and more wider, but the cooling electronic component problem is troubling the development of technology all the time.Mainly adopt heat radiation type for cooling electronic component at present, promptly directly heating panel is closely contacted with the high-power electronic component substrate, the heat that electronic devices and components produce distributes by the thermal radiation mode through heating panel, like this, cause the heat abstractor heaviness, the waste aluminium, and radiating effect is undesirable.

Especially for the semiconductor LED lighting source, the semiconductor LED lighting source has advantages such as life-span length, energy-saving and environmental protection, rich color, at present extremely people's favor.But for the fatal shortcoming of semiconductor LED lighting source is raising along with power, the heat energy that chip produces increases sharply, this chip reduces useful life at high temperature greatly, experiment shows, below 30 ℃, can reach 100,000 hours the useful life of semiconductor LED lighting source, and below 90, the semiconductor LED lighting source can reach 5000 hours useful life, and this also is the main cause that present semiconductor LED lighting source can not be applied.And for street lamp or home lighting LED lamp, the heat abstractor heaviness is not only wasted aluminium, increases its cost price, but also causes potential safety hazard, therefore is difficult to promote.

The utility model content

The technical problem of solution of the present utility model just provide a kind of good heat dissipation effect, in light weight, save aluminium, easy to process, the simple and easy heat abstractor of a kind of electronic devices and components being convenient to promote.

The technical solution adopted in the utility model is: comprise the heat-radiating substrate and the fin that closely contact with electronic devices and components, described fin twines and forms by having supporting projections, the section thickness aluminium foil plate less than 0.2 millimeter, forms heat dissipation channel between the adjacent aluminium foil plate.

Its additional technical feature is:

The section thickness of described aluminium foil plate is less than 0.2 millimeter;

Described supporting projections is the fin parallel with the heat dissipation channel direction;

Described supporting projections is several independently projections;

Be provided with a plurality of air-vents with the aluminium foil plate of described heat dissipation channel vertical direction;

Described projection is on the aluminium foil plate of described air-vent periphery;

Described heat-radiating substrate is provided with a plurality of gas passages that communicate with described heat dissipation channel.

Compared with prior art provided by the utility model, have the following advantages: one, owing to comprise heat-radiating substrate and the fin that closely contacts with electronic devices and components, described fin is by having supporting projections, section thickness twines formation less than 0.4 millimeter aluminium foil plate, form heat dissipation channel between the adjacent aluminium foil plate, the heat that electronic devices and components spare produces forms heat dissipation channel between the aluminium foil plate and the heat dissipation channel wall scatters rapidly, saved aluminium, reduced production cost, alleviated the weight of heat abstractor, and process conveniently, area of dissipation increases, and has improved radiating effect; Its two because described supporting projections is the fin parallel with the heat dissipation channel direction, process convenient; Its three because described supporting projections be several independently projections, not only be beneficial to heat dissipation, and the saving aluminium; Its four owing to be provided with a plurality of air-vents with the aluminium foil plate of described heat dissipation channel vertical direction, make with the same plane of described heat dissipation channel vertical direction in temperature almost equal, help scattering and disappearing of heat more; Its five because described projection is on the aluminium foil plate of described air-vent periphery, add man-hour, only need directly on the aluminium foil plate, prick air-vent, the list edge on limit, hole promptly forms projection, it is extremely convenient to process; Its six because described heat-radiating substrate is provided with a plurality of gas passages that communicate with described heat dissipation channel, make heat dissipation channel form penetrating passage up and down, help the convection current of gas, help scattering and disappearing of heat.

Description of drawings

Fig. 1 is the structural representation of the simple and easy heat abstractor of a kind of electronic devices and components of the utility model;

Fig. 2 is the cross-sectional view of fin;

Fig. 3 launches the structural representation of back aluminium foil plate for fin;

Fig. 4 is the structural representation that another kind of fin launches back aluminium foil plate;

Fig. 5 launches the structural representation of back aluminium foil plate for the third fin;

Fig. 6 is the structural representation of heat-radiating substrate.

Embodiment

Be described in further details below in conjunction with the structure and the use principle of accompanying drawing the simple and easy heat abstractor of a kind of electronic devices and components of the utility model.

As depicted in figs. 1 and 2, the simple and easy heat abstractor of a kind of electronic devices and components of the utility model, comprise the heat-radiating substrate 1 and the fin 2 that closely contact with electronic devices and components, fin 2 is by having supporting projections 21, section thickness twines formation less than 0.4 millimeter aluminium foil plate 22, form heat dissipation channel 3 between the adjacent aluminium foil plate 22, the heat that electronic devices and components spare produces forms heat dissipation channel 3 between aluminium foil plate 22 and aluminium foil plate 22 scatters rapidly, saved aluminium, reduced production cost, alleviated the weight of heat abstractor, and process conveniently, area of dissipation increases, and has improved radiating effect.In order further to alleviate the weight of the simple and easy heat abstractor of electronic devices and components, the section thickness of aluminium foil plate 22 is preferably less than 0.2 millimeter.

For make with the same plane of heat dissipation channel 3 vertical direction in temperature almost equal, help scattering and disappearing of heat more; Be provided with a plurality of air-vents 24 with the aluminium foil plate 22 of heat dissipation channel 3 vertical direction, like this, the air in each heat dissipation channel 3 each other can conducting, more helps heat dissipation.

After fin 2 launches, supporting projections 21 can be as shown in Figure 3, be the fin 25 parallel with heat dissipation channel 3 directions, also can be as shown in Figure 4, be several or plurality of rows projection 23 of opposition each other, supporting projections 21 can also be as shown in Figure 5, be positioned at the periphery of air-vent 24, add man-hour, only need directly to prick air-vent 24 on the aluminium foil plate, the list edge on limit, hole promptly forms supporting projections 21.

As shown in Figure 6, heat-radiating substrate 1 is provided with a plurality of gas passages 5 that communicate with heat dissipation channel 3, makes heat dissipation channel 3 form penetrating passage up and down, helps the convection current of gas, helps scattering and disappearing of heat.

Certainly; the simple and easy heat abstractor of a kind of electronic devices and components of the utility model; not only be confined to above cooling mechanism,, all fall into the scope of the simple and easy heat abstractor protection of a kind of electronic devices and components of the utility model as long as adopt the simple and easy heat abstractor of a kind of electronic devices and components of said structure.

Claims

1. simple and easy heat abstractor of electronic devices and components, comprise the heat-radiating substrate and the fin that closely contact with electronic devices and components, it is characterized in that: described fin twines and forms by having supporting projections, the section thickness aluminium foil plate less than 0.4 millimeter, forms heat dissipation channel between the adjacent aluminium foil plate.

2. the simple and easy heat abstractor of electronic devices and components according to claim 1, it is characterized in that: the section thickness of described aluminium foil plate is less than 0.2 millimeter.

3. the simple and easy heat abstractor of a kind of electronic devices and components according to claim 1 is characterized in that: described supporting projections is the fin parallel with the heat dissipation channel direction.

4. the simple and easy heat abstractor of a kind of electronic devices and components according to claim 1 is characterized in that: described supporting projections is several independently projections.

5. the simple and easy heat abstractor of a kind of electronic devices and components according to claim 1 is characterized in that: be provided with a plurality of air-vents with the aluminium foil plate of described heat dissipation channel vertical direction.

6. the simple and easy heat abstractor of a kind of electronic devices and components according to claim 5 is characterized in that: described projection is on the aluminium foil plate of described air-vent periphery.

7. the simple and easy heat abstractor of a kind of electronic devices and components according to claim 1 is characterized in that: described heat-radiating substrate is provided with a plurality of gas passages that communicate with described heat dissipation channel.