CN201601935U

CN201601935U - Electronic component heat radiating device

Info

Publication number: CN201601935U
Application number: CN2009202551982U
Authority: CN
Inventors: 张志强
Original assignee: Individual
Current assignee: Individual
Priority date: 2009-12-22
Filing date: 2009-12-22
Publication date: 2010-10-06
Anticipated expiration: 2019-12-22

Abstract

The utility model belongs to the heat radiating device technical field, in particular to an electronic component heat radiating device which is technically characterized in that: the heat radiating device comprises a heat radiating substrate and a heat radiating fin which are tightly contacted with an electronic component, the heat radiating fin comprises a plurality of heat radiating channels perpendicular to the heat radiating substrate, and heating radiating walls enclosed to form the heat radiating channels, and each heat radiating wall is fabricated by an aluminum foil plate with section thickness less than 0.4 mm. The further improvement of the utility model includes that a plurality of vent holes are arranged on the heat radiating walls perpendicular to the heat radiating channels; a plurality of air channels communicated with the heat radiating channels are arranged on the heat radiating substrate. The electronic component heat radiating device solves the problem that the electronic component in prior art has short service life due to inefficient heat dissipation, is widely applicable to LED lighting light sources, computer chips and the heat radiating field of other electronic components, greatly improves the heat radiating effect and the service life of the electronic components.

Description

A kind of heat-radiating device of electric component

Technical field

The utility model belongs to the heat abstractor technical field, relates in particular to a kind of heat-radiating device of electric component.

Background technology

The application of electronic devices and components is more and more wider, but the cooling electronic component problem is troubling the development of technology all the time.Mainly adopt heat radiation type for cooling electronic component at present, promptly directly heating panel is closely contacted with the high-power electronic component substrate, the heat that electronic devices and components produce distributes by the thermal radiation mode through heating panel, like this, cause the heat abstractor heaviness, the waste aluminium, and radiating effect is undesirable.

Especially for the semiconductor LED lighting source, the semiconductor LED lighting source has advantages such as life-span length, energy-saving and environmental protection, rich color, at present extremely people's favor.But for the fatal shortcoming of semiconductor LED lighting source is raising along with power, the heat energy that chip produces increases sharply, this chip reduces useful life at high temperature greatly, experiment shows, below 30 ℃, can reach 100,000 hours the useful life of semiconductor LED lighting source, and below 90, the semiconductor LED lighting source can reach 5000 hours useful life, and this also is the main cause that present semiconductor LED lighting source can not be applied.And for street lamp or home lighting LED lamp, the heat abstractor heaviness is not only wasted aluminium, increases its cost price, but also causes potential safety hazard, therefore is difficult to promote.

The utility model content

The technical problem of solution of the present utility model just provide a kind of good heat dissipation effect, in light weight, save aluminium, easy to process, a kind of heat-radiating device of electric component of being convenient to promote.

The technical solution adopted in the utility model is: comprise the heat-radiating substrate and the fin that closely contact with electronic devices and components, described fin comprises several heat dissipation channels vertical with described heat-radiating substrate and surrounds the heat radiation wall composition of this heat dissipation channel that described heat radiation wall is that section thickness is made less than 0.4 millimeter aluminium foil plate.

Its additional technical feature is:

Described heat radiation wall is that section thickness is made less than 0.4 millimeter aluminium foil plate;

Be provided with a plurality of air-vents with the aluminium foil plate of described heat dissipation channel vertical direction;

Described heat-radiating substrate is provided with a plurality of gas passages that communicate with described heat dissipation channel;

The cross section of described heat dissipation channel is a triangle;

The cross section of described heat dissipation channel is a parallelogram;

The cross section of described heat dissipation channel is a regular hexagon, and the cross section of described fin is cellular.

Compared with prior art provided by the utility model, have the following advantages: one, owing to comprise heat-radiating substrate and the fin that closely contacts with electronic devices and components, described fin comprises several heat dissipation channels vertical with described heat-radiating substrate and surrounds the heat radiation wall composition of this heat dissipation channel, described heat radiation wall is that section thickness is made less than 0.4 millimeter aluminium foil plate, the heat that electronic devices and components produce forms heat dissipation channel between the aluminium foil plate and the heat radiation wall scatters rapidly, saved aluminium, reduced production cost, alleviated the weight of heat abstractor, and process conveniently, area of dissipation increases, and has improved radiating effect; Its two owing to be provided with a plurality of air-vents with the aluminium foil plate of described heat dissipation channel vertical direction, make with the same plane of described heat dissipation channel vertical direction in temperature almost equal, help scattering and disappearing of heat more; Its three because described heat-radiating substrate is provided with a plurality of gas passages that communicate with described heat dissipation channel, make heat dissipation channel form penetrating passage up and down, help the convection current of gas, help scattering and disappearing of heat; They are four years old, because the cross section of described heat dissipation channel is a regular hexagon, the cross section of described fin is cellular, adopt said structure, make the thermal impedance of heat dissipation channel reduce, cross-ventilation is more unobstructed, heat for the electronic devices and components generation, can lose rapidly, thereby reduce the temperature of electronic devices and components, prolong the useful life of electronic devices and components.

Description of drawings

Fig. 1 is the structural representation of a kind of heat-radiating device of electric component of the utility model;

Fig. 2 is the cross-sectional view of fin;

Fig. 3 is the cross-sectional view of another kind of fin;

Fig. 4 is the cross-sectional view of the third fin;

Fig. 5 is the structural representation of heat-radiating substrate.

Embodiment

Be described in further details below in conjunction with the structure and the use principle of accompanying drawing a kind of heat-radiating device of electric component of the utility model.

As depicted in figs. 1 and 2, a kind of heat-radiating device of electric component of the utility model, comprise heat-radiating substrate 2 and fin 3, heat-radiating substrate 2 closely bonds together by heat-conducting glue with electronic devices and components 1, the heat radiation wall 32 that fin 3 comprises several heat dissipation channels vertical with heat-radiating substrate 2 31 and surrounds this heat dissipation channel 31 is formed, heat radiation wall 32 is made less than 0.4 millimeter aluminium foil plate for section thickness, the heat that electronic devices and components 1 produce forms heat dissipation channel 31 between heat radiation wall 32 and the heat radiation wall scatters rapidly, saved aluminium, reduced production cost, alleviated the weight of heat abstractor, and processed convenient, area of dissipation increases, and has improved radiating effect.

In order further to alleviate the weight of the simple and easy heat abstractor of electronic devices and components, heat radiation wall 32 is made less than 0.2 millimeter aluminium foil plate for section thickness.

For make with the same plane of heat dissipation channel 31 vertical direction in temperature almost equal, help scattering and disappearing of heat more, be provided with a plurality of air-vents 33 with the aluminium foil plate of heat dissipation channel vertical direction.Like this, in the vertical plane of same and heat dissipation channel 31, air can form effective convection current, so better heat-radiation effect.

As shown in Figure 5, heat-radiating substrate 2 is provided with a plurality of gas passages 21 that communicate with heat dissipation channel 31, like this, makes heat dissipation channel 3 form penetrating passage up and down, helps the convection current of gas, helps scattering and disappearing of heat.

The cross sectional shape of heat dissipation channel 31 can be as shown in Figure 2 triangle, also can be square as shown in Figure 3; Can also be regular hexagon as shown in Figure 4, the cross section of fin 3 is cellular.Adopt regular hexagon as shown in Figure 4, the cross section of fin 3 is cellular structure, make the thermal impedance of heat dissipation channel reduce, cross-ventilation is more unobstructed, heat for the electronic devices and components generation, can lose rapidly, thereby reduce the temperature of electronic devices and components, prolong the useful life of electronic devices and components.

Certainly, a kind of heat-radiating device of electric component of the utility model not only is confined to above cooling mechanism, as long as adopt a kind of heat-radiating device of electric component of said structure, all falls into the scope of a kind of heat-radiating device of electric component protection of the utility model.

Claims

1. heat-radiating device of electric component, comprise the heat-radiating substrate and the fin that closely contact with electronic devices and components, it is characterized in that: described fin comprises several heat dissipation channels vertical with described heat-radiating substrate and surrounds the heat radiation wall composition of this heat dissipation channel that described heat radiation wall is that section thickness is made less than 0.4 millimeter aluminium foil plate.

2. a kind of heat-radiating device of electric component according to claim 1 is characterized in that: described heat radiation wall is that section thickness is made less than 0.2 millimeter aluminium foil plate.

3. a kind of heat-radiating device of electric component according to claim 1 is characterized in that: be provided with a plurality of air-vents with the aluminium foil plate of described heat dissipation channel vertical direction.

4. according to claim 1,2 or 3 described a kind of heat-radiating device of electric component, it is characterized in that: described heat-radiating substrate is provided with a plurality of gas passages that communicate with described heat dissipation channel.

5. according to claim 1,2 or 3 described a kind of heat-radiating device of electric component, it is characterized in that: the cross section of described heat dissipation channel is a triangle.

6. according to claim 1,2 or 3 described a kind of heat-radiating device of electric component, it is characterized in that: the cross section of described heat dissipation channel is a parallelogram.

7. according to claim 1,2 or 3 described a kind of heat-radiating device of electric component, it is characterized in that: the cross section of described heat dissipation channel is a regular hexagon, and the cross section of described fin is cellular.