CN107255264A - Heat dissipation structure of an LED lamp - Google Patents
Heat dissipation structure of an LED lamp Download PDFInfo
- Publication number
- CN107255264A CN107255264A CN201710496325.7A CN201710496325A CN107255264A CN 107255264 A CN107255264 A CN 107255264A CN 201710496325 A CN201710496325 A CN 201710496325A CN 107255264 A CN107255264 A CN 107255264A
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- CN
- China
- Prior art keywords
- heat dissipation
- aluminum plate
- led lamp
- lampshade
- round table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 98
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 45
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 45
- 125000006850 spacer group Chemical group 0.000 claims description 4
- 238000001816 cooling Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Description
技术领域:Technical field:
本发明涉及LED灯的技术领域,更具体地说涉及一种LED灯具的散热结构。The present invention relates to the technical field of LED lamps, and more specifically relates to a heat dissipation structure of LED lamps.
背景技术:Background technique:
LED灯由于具有外形灵活、亮度大、节约电能、对环境友好及应用范围广等特点,使得其在照明市场上所占有的市场份额越来越大。但是,在伴随着LED灯的使用过程中,LED灯具的散热问题,暨LED光衰,成为了一个制约LED灯使用寿命和LED推广应用的关键因素。尤其是在大功率LED灯中,输入功率仅有15%~20%的电能转化为光能输出,其余则转换成热能,若这些热量未能适时排出外界,不但会使灯具的发光效率降低,而且可能导致LED芯片因温度过高而迅速失效。Due to the characteristics of flexible shape, high brightness, energy saving, environmental friendliness and wide application range, LED lamps occupy an increasing market share in the lighting market. However, during the use of LED lamps, the heat dissipation problem of LED lamps, that is, LED light decay, has become a key factor restricting the service life of LED lamps and the promotion and application of LEDs. Especially in high-power LED lamps, only 15% to 20% of the input power is converted into light energy output, and the rest is converted into heat energy. If the heat is not discharged to the outside in a timely manner, it will not only reduce the luminous efficiency of the lamp, And it may cause the LED chip to fail rapidly due to excessive temperature.
目前,用于LED灯具散热的方法有很多,主要都是应用热传导或热对流的方式改善LED基板或与基板相连接的LED散热器的导热或散热性能。例如,在LED基板内部设有供热量交换流质(水、氟化物制冷剂)流通的通道;或在LED基板上安装额外的散热风扇,这种散热装置在改善基板散热的同时,大幅度增加了LED灯具的总体重量和尺寸,继而使得LED灯具生产成本升高、实用性降低、安装使用的风险增加。另外,从现有技术中总体分析LED灯具的散热问题,我们发现大部分解决LED灯具的散热问题都集中在了LED灯源的安装基板和外部散热器上。At present, there are many methods for dissipating heat from LED lamps, mainly using heat conduction or heat convection to improve the heat conduction or heat dissipation performance of the LED substrate or the LED radiator connected to the substrate. For example, there are passages for heat exchange fluid (water, fluoride refrigerant) to circulate inside the LED substrate; or an additional cooling fan is installed on the LED substrate. The overall weight and size of LED lamps are reduced, which in turn increases the production cost of LED lamps, reduces practicability, and increases the risk of installation and use. In addition, from the overall analysis of the heat dissipation problem of LED lamps from the prior art, we found that most of the solutions to the heat dissipation problem of LED lamps are concentrated on the mounting substrate of the LED light source and the external heat sink.
发明内容:Invention content:
本发明的目的就是针对现有技术之不足,而提供了一种LED灯具的散热结构,其能提高LED灯具的散热效率。The object of the present invention is to provide a heat dissipation structure for LED lamps, which can improve the heat dissipation efficiency of LED lamps, in view of the deficiencies in the prior art.
为实现上述目的,本发明采用的技术方案如下:To achieve the above object, the technical scheme adopted in the present invention is as follows:
一种LED灯具的散热结构,包括LED灯的灯罩,灯罩内插接有散热铝板,散热铝板的中部冲压成型有向上凸起的圆台,圆台四周的散热铝板上冲压成型有若干道向上凸起的散热通道,散热通道和圆台的内腔相连通,灯罩的侧壁上成型有与散热铝板上散热通道相连通的散热孔,相邻散热通道之间的散热铝板底面抵靠有垫块,螺钉穿过散热铝板螺接在垫块上,垫块固定在挡板上,挡板插接固定在灯罩内,所述的挡板上插接有导管,导管的上端固定在圆台的底面上,圆台上成型有导线过孔,圆台的顶面上固定有PCB板,PCB板上固定LED灯芯片。A heat dissipation structure of an LED lamp, including a lampshade of an LED lamp, in which a heat dissipation aluminum plate is inserted and connected, the middle part of the heat dissipation aluminum plate is stamped and formed with an upwardly protruding round table, and the heat dissipation aluminum plate around the round table is stamped and formed with several upwardly protruding lines The heat dissipation channel, the heat dissipation channel is connected with the inner cavity of the round platform, the side wall of the lampshade is formed with a heat dissipation hole connected with the heat dissipation channel on the heat dissipation aluminum plate, and the bottom surface of the heat dissipation aluminum plate between adjacent heat dissipation channels is against the cushion block, and the screw penetrates The overheating aluminum plate is screwed on the block, the block is fixed on the baffle, and the baffle is plugged and fixed in the lampshade. A conduit is inserted on the baffle, and the upper end of the conduit is fixed on the bottom surface of the round table. Wire via holes are formed, a PCB board is fixed on the top surface of the round platform, and LED lamp chips are fixed on the PCB board.
优选的,所述的散热通道绕散热铝板的中心呈环形均匀分布在散热铝板上。Preferably, the heat dissipation channels are evenly distributed on the heat dissipation aluminum plate in a circular shape around the center of the heat dissipation aluminum plate.
优选的,所述散热铝板的底面上成型有若干道圆弧形的散热片,散热片的高度小于垫块的厚度。Preferably, several arc-shaped cooling fins are formed on the bottom surface of the heat dissipation aluminum plate, and the height of the cooling fins is smaller than the thickness of the spacer.
优选的,所述灯罩的上端成型有扩口。Preferably, the upper end of the lampshade is formed with a flaring opening.
优选的,所述的灯罩采用铝材,灯罩内的导管采用绝缘管,导管分布在灯罩的中心。Preferably, the lampshade is made of aluminum, the conduits in the lampshade are made of insulating tubes, and the conduits are distributed in the center of the lampshade.
优选的,所述散热铝板上散热通道的上端面高于圆台的上端面。Preferably, the upper end surface of the heat dissipation channel on the heat dissipation aluminum plate is higher than the upper end surface of the circular platform.
本发明的有益效果在于:其结构简单,只对LED灯具的散热结构进行优化改进,增加散热面积和提高热传导的速度,从而在不改变LED灯具大小的情况下,提高LED灯具的散热效率。The beneficial effects of the present invention are: the structure is simple, only the heat dissipation structure of the LED lamp is optimized and improved, the heat dissipation area is increased and the heat conduction speed is increased, thereby improving the heat dissipation efficiency of the LED lamp without changing the size of the LED lamp.
附图说明:Description of drawings:
图1为本发明立体的结构示意图;Fig. 1 is the three-dimensional structural representation of the present invention;
图2为本发明剖视的结构示意图;Fig. 2 is the structural representation of cross section of the present invention;
图3为本发明散热铝板的结构示意图。Fig. 3 is a schematic structural view of the heat dissipation aluminum plate of the present invention.
图中:1、灯罩;11、散热孔;12、扩口;2、散热铝板;21、圆台;22、散热通道;23、散热片;24、导线过孔;3、挡板;4、垫块;5、螺钉;6、导管;7、PCB板;8、LED灯芯片;a、散热腔。In the figure: 1. lampshade; 11. heat dissipation hole; 12. flare; 2. heat dissipation aluminum plate; 21. round platform; 22. heat dissipation channel; 23. heat sink; 24. wire via hole; block; 5, screw; 6, conduit; 7, PCB board; 8, LED light chip; a, cooling chamber.
具体实施方式:detailed description:
实施例:见图1至3所示,一种LED灯具的散热结构,包括LED灯的灯罩1,灯罩1内插接有散热铝板2,散热铝板2的中部冲压成型有向上凸起的圆台21,圆台21四周的散热铝板2上冲压成型有若干道向上凸起的散热通道22,散热通道22和圆台21的内腔相连通,灯罩1的侧壁上成型有与散热铝板2上散热通道22相连通的散热孔11,相邻散热通道22之间的散热铝板2底面抵靠有垫块4,螺钉5穿过散热铝板2螺接在垫块4上,垫块4固定在挡板3上,挡板3插接固定在灯罩1内,所述的挡板3上插接有导管6,导管6的上端固定在圆台21的底面上,圆台21上成型有导线过孔24,圆台21的顶面上固定有PCB板7,PCB板7上固定LED灯芯片8。Embodiment: As shown in Figures 1 to 3, a heat dissipation structure of an LED lamp includes a lampshade 1 of the LED lamp, and a heat dissipation aluminum plate 2 is inserted into the lampshade 1, and the middle part of the heat dissipation aluminum plate 2 is stamped and formed with an upwardly protruding round platform 21 The heat dissipation aluminum plate 2 around the round table 21 is stamped with several upwardly protruding heat dissipation channels 22. The heat dissipation channels 22 communicate with the inner cavity of the round table 21. The side wall of the lampshade 1 is formed with heat dissipation channels 22 on the heat dissipation aluminum plate 2. Connected heat dissipation holes 11, the bottom surface of the heat dissipation aluminum plate 2 between adjacent heat dissipation channels 22 is against the cushion block 4, the screw 5 passes through the heat dissipation aluminum plate 2 and is screwed on the cushion block 4, and the cushion block 4 is fixed on the baffle plate 3 , the baffle plate 3 is plugged and fixed in the lampshade 1, a conduit 6 is inserted on the baffle plate 3, the upper end of the conduit 6 is fixed on the bottom surface of the round table 21, and the round table 21 is formed with a wire through hole 24, and the round table 21 A PCB board 7 is fixed on the top surface, and an LED light chip 8 is fixed on the PCB board 7 .
所述的散热通道22绕散热铝板2的中心呈环形均匀分布在散热铝板2上。The heat dissipation channels 22 are evenly distributed on the heat dissipation aluminum plate 2 in a circular shape around the center of the heat dissipation aluminum plate 2 .
所述散热铝板2的底面上成型有若干道圆弧形的散热片23,散热片23的高度小于垫块4的厚度。Several arc-shaped cooling fins 23 are formed on the bottom surface of the heat dissipation aluminum plate 2 , and the height of the cooling fins 23 is smaller than the thickness of the spacer 4 .
所述灯罩1的上端成型有扩口12。A flaring opening 12 is formed on the upper end of the lampshade 1 .
所述的灯罩1采用铝材,灯罩1内的导管6采用绝缘管,导管6分布在灯罩1的中心。The lampshade 1 is made of aluminum, and the conduits 6 in the lampshade 1 are made of insulating tubes, and the conduits 6 are distributed in the center of the lampshade 1 .
所述散热铝板2上散热通道22的上端面高于圆台21的上端面。The upper end surface of the heat dissipation channel 22 on the heat dissipation aluminum plate 2 is higher than the upper end surface of the round platform 21 .
工作原理:本发明为LED灯具的散热结构,其将LED灯芯片8设置在散热铝板2上便于散热,同时散热铝板2上成型圆台21、散热通道22即增大散热面积,除了通过与灯罩1热传递,同时也能通过散热孔11便于与外界空气对流散热,加速热传导的速度;而散热铝板2通过螺钉5固定方式固定在挡板3上,便于散热铝板2更换维修,同时挡板3和散热铝板2之间设有较大的散热腔a,便于与外界空气对流。Working principle: The present invention is a heat dissipation structure for LED lamps. It arranges the LED lamp chip 8 on the heat dissipation aluminum plate 2 to facilitate heat dissipation. Heat transfer can also facilitate convection heat dissipation with the outside air through the heat dissipation holes 11 at the same time, and accelerate the speed of heat conduction; and the heat dissipation aluminum plate 2 is fixed on the baffle 3 by means of screws 5, which is convenient for the replacement and maintenance of the heat dissipation aluminum plate 2. At the same time, the baffle 3 and A larger heat dissipation chamber a is provided between the heat dissipation aluminum plates 2 to facilitate convection with the outside air.
所述实施例用以例示性说明本发明,而非用于限制本发明。任何本领域技术人员均可在不违背本发明的精神及范畴下,对所述实施例进行修改,因此本发明的权利保护范围,应如本发明的权利要求所列。The examples are used to illustrate the present invention, but not to limit the present invention. Any person skilled in the art can modify the embodiments without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be listed in the claims of the present invention.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710496325.7A CN107255264A (en) | 2017-06-26 | 2017-06-26 | Heat dissipation structure of an LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710496325.7A CN107255264A (en) | 2017-06-26 | 2017-06-26 | Heat dissipation structure of an LED lamp |
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| Publication Number | Publication Date |
|---|---|
| CN107255264A true CN107255264A (en) | 2017-10-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710496325.7A Withdrawn CN107255264A (en) | 2017-06-26 | 2017-06-26 | Heat dissipation structure of an LED lamp |
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| Country | Link |
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| CN (1) | CN107255264A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108488771A (en) * | 2018-03-15 | 2018-09-04 | 东莞市闻誉实业有限公司 | Radiator |
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2017
- 2017-06-26 CN CN201710496325.7A patent/CN107255264A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108488771A (en) * | 2018-03-15 | 2018-09-04 | 东莞市闻誉实业有限公司 | Radiator |
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Application publication date: 20171017 |