CN103196057A - High-power liquid heat dissipating LED (light emitting diode) lamp - Google Patents
High-power liquid heat dissipating LED (light emitting diode) lamp Download PDFInfo
- Publication number
- CN103196057A CN103196057A CN2013101110362A CN201310111036A CN103196057A CN 103196057 A CN103196057 A CN 103196057A CN 2013101110362 A CN2013101110362 A CN 2013101110362A CN 201310111036 A CN201310111036 A CN 201310111036A CN 103196057 A CN103196057 A CN 103196057A
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- heat
- heat sink
- led
- copper
- clad
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/064—Fluid cooling, e.g. by integral pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
A high-power liquid heat dissipating LED lamp is provided with a heat dissipating column and heat conduction oil, the heat dissipating column and the heat conduction oil are directly in contact with a copper-clad layer and a heat-dissipating plate of the LED, most of the heat of a PN junction is directly transferred to the heat dissipating plate through the copper-clad layer, the heat dissipating column, the heat conduction oil of the heat dissipating column, and due to the fact most of the heat of the PN junction is not transferred to the heat dissipating plate through an insulating layer, and the heat conductivity coefficient of the heat dissipating column and the heat conduction oil are larger than that of the insulating layer, the heat dissipating effect of the LED is improved. Besides, the insulation resistance of the heat dissipating column and the heat conduction oil are larger than or equal to that of the insulating layer so that the insulation requirement of a copper-clad plate and an aluminum substrate is guaranteed.
Description
Technical field
The present invention relates to a kind of LED lamp, particularly a kind of high-power liquid heat radiating LED lamp.
Background technology
Existing high-powered LED lamp is provided with a layer insulating between the copper-clad of LED lamp and the aluminium base, because the thermal conductivity factor of insulating barrier is lower, hindered distributing of LED lamp PN junction heat, has reduced the radiating effect of LED lamp, has influenced the service life of LED lamp.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, a kind of high-power liquid heat radiating LED lamp is provided, be used for improving the thermal conductivity factor of LED lamp insulating barrier, improve the radiating effect of LED lamp.
The technical solution adopted in the present invention is: high-power liquid heat radiating LED lamp, include support, LED and heat sink, LED is installed on support, LED is connected with heat sink, be provided with the thermal column of insulation between LED and the heat sink, thermal column contacts with heat source position and the heat sink of LED, thermal column is provided with delivery hole, delivery hole is provided with the conduction oil of insulation, conduction oil contacts with heat source position and the heat sink of LED, the heat of LED heat source position is delivered to heat sink through thermal column and conduction oil, and heat is distributed in the space by heat sink, improves the radiating efficiency of LED; The insulaion resistance of thermal column and conduction oil is greater than or equal to the insulaion resistance of insulating barrier.
LED includes PN junction, base, electrode, silica-gel sphere, solder mask, copper-clad, insulating barrier and aluminium base, is provided with the thermal conductive silicon rubber cushion between the aluminium base of LED and the heat sink; PN junction is connected with base, and base is connected with copper-clad, and copper-clad is connected with insulating barrier, and insulating barrier is connected with aluminium base, and copper-clad, insulating barrier and aluminium base are connected in one; Be provided with the heat conduction die cavity between copper-clad and the heat sink, the heat conduction die cavity enters heat sink through insulating barrier, aluminium base and thermal conductive silicon rubber cushion; Heat sink is provided with heat dissipation channel, and delivery hole is communicated with heat dissipation channel, and thermal column is located in the heat conduction die cavity, the heat dissipation channel falling heat-transfer oil of the delivery hole of thermal column and heat sink, and conduction oil contacts with copper-clad; The heat of the PN junction heat source position of LED is delivered to heat sink by base through copper-clad, thermal column and conduction oil, and heat is distributed in the space by the heat sink that aluminium alloy constitutes.
The operation principle of high-power liquid heat radiating LED lamp is: the thermal column that is provided with insulation between the LED of high-power liquid heat radiating LED lamp and the heat sink, the delivery hole of thermal column and the heat dissipation channel of heat sink are full of conduction oil are arranged, and thermal column directly contacts with copper-clad and the heat sink of LED; The copper-clad heat that is delivered to of the PN junction of LED directly is delivered to heat sink by thermal column, simultaneously, utilizes conduction oil to contact with copper-clad and heat sink, and the heat of LED is delivered to heat sink through the conduction oil of thermal column delivery hole and heat sink heat dissipation channel; Utilize thermal column and the conduction oil of insulation to replace insulating barrier, copper-clad and aluminium base insulation are isolated, and utilize the thermal column of insulation and conduction oil to replace the thermal conductive silicon rubber cushion that aluminium base and radiating plate insulation are isolated, solved the problem of the low and radiating effect difference of insulating barrier thermal conductivity factor, and the insulating properties that do not reduce insulating barrier.
High-power liquid heat radiating LED lamp heat dissipation path has three the tunnel: the heat that the PN junction of one: LED sends is through base → copper-clad → thermal column → heat sink → atmosphere; Its two: the heat that the PN junction of LED sends is through base → copper-clad → conduction oil → heat sink → atmosphere; Its three: the heat that the PN junction of LED sends is through base → copper-clad → insulating barrier → aluminium base → thermal conductive silicon rubber cushion → heat sink → atmosphere.
The invention has the beneficial effects as follows: high-power liquid heat radiating LED lamp is provided with thermal column and conduction oil, thermal column and conduction oil directly contact with copper-clad and the heat sink of LED, most of heat of PN junction is directly delivered to heat sink through the conduction oil of copper-clad, thermal column and thermal column, because most of heat of PN junction is not to be delivered to heat sink through insulating barrier, the thermal conductivity factor of thermal column and conduction oil is greater than the thermal conductivity factor of insulating barrier, therefore, improved LED radiating effect; Simultaneously, the insulaion resistance of thermal column and conduction oil is greater than or equal to the insulaion resistance of insulating barrier, has guaranteed the insulating requirements between copper clad plate and the aluminium base.
Description of drawings
Fig. 1 is the structural representation of high-power liquid heat radiating LED lamp.
The specific embodiment
Below in conjunction with accompanying drawing the present invention is further detailed:
The structural representation of high-power liquid heat radiating LED lamp shown in Figure 1, high-power liquid heat radiating LED lamp, include support 1, LED2 and heat sink 3, LED2 is installed on support 1, LED2 is connected with heat sink 3, be provided with the thermal column 4 of insulation between LED2 and the heat sink 3, thermal column 4 contacts with heat source position 5 and the heat sink 3 of LED2, thermal column 4 is provided with delivery hole 6, delivery hole 6 is provided with the conduction oil 8 of insulation, and conduction oil 8 contacts with heat source position 5 and the heat sink 3 of LED2, and the heat of LED2 heat source position 5 is delivered to heat sink 3 through thermal column 4 and conduction oil 8, heat is distributed in the space by heat sink 3, improves the radiating efficiency of LED2.
In order to implement the radiating effect by the LED lamp, LED2 includes PN junction 9, base 10, electrode 11, silica-gel sphere 12, solder mask 13, copper-clad 14, insulating barrier 15 and aluminium base 16, is provided with thermal conductive silicon rubber cushion 17 between the aluminium base 16 of LED2 and the heat sink 3; PN junction 9 is connected with base 10, and base 10 is connected with copper-clad 14, and copper-clad 14 is connected with insulating barrier 15, and insulating barrier 15 is connected with aluminium base 16, and copper-clad 14, insulating barrier 15 and aluminium base 16 are connected in one; Be provided with heat conduction die cavity 18 between copper-clad 14 and the heat sink 3, heat conduction die cavity 18 enters heat sink 3 through insulating barrier 15, aluminium base 16 and thermal conductive silicon rubber cushion 17; Heat sink 3 is provided with heat dissipation channel 7, and delivery hole 6 is communicated with heat dissipation channel 7, and thermal column 4 is located in the heat conduction die cavity 18, the delivery hole 6 of thermal column 4 and the heat dissipation channel of heat sink 37 falling heat-transfer oil 8, and conduction oil 8 contacts with copper-clad 14; The heat of PN junction 9 heat source positions 5 of LED2 is delivered to heat sink 3 by base 10 through copper-clad 14, thermal column 4 and conduction oil 8, and heat is distributed in the space by the heat sink 3 that aluminium alloy constitutes.
In order to implement being tightly connected of thermal column 4 and heat conduction die cavity 18, thermal column 4 is clamped in the heat conduction die cavity 18 with heat sink 3 by the copper-clad 14 of LED2, thermal column 4 is tightly connected with copper-clad 14 and the heat sink 3 of LED2, conduction oil 8 is sealed in delivery hole 6 and the heat dissipation channel 7, prevents that the conduction oil 8 of delivery hole 6 and heat dissipation channel 7 from overflowing; The height of thermal column 4 is fixing greater than heat conduction die cavity 18, and the external diameter of thermal column 4 is greater than the internal diameter of heat conduction die cavity 18, and thermal column 4 is sealedly attached in the heat conduction die cavity 18.
In order to improve the LED2 radiating effect, guarantee that also the insulaion resistance of insulating barrier 15 can not reduce simultaneously, the thermal conductivity factor of thermal column 4 is greater than insulating barrier 15 thermal conductivity factors, and the thermal conductivity factor of conduction oil 8 is greater than insulating barrier 15 thermal conductivity factors; The insulaion resistance of conduction oil 8 is greater than or equal to the insulaion resistance of insulating barrier 15, and thermal column 4 is made of the heat conductive silica gel of insulation, and conduction oil 8 includes heat conduction oil plant or the transformer oil of insulation.
In order to make delivery hole 6 falling heat-transfer oil 8, heat sink 3 is provided with fluid infusion chamber 19, fluid infusion chamber 19 is logical with heat dissipation channel 7, fluid infusion chamber 19 is communicated with heat dissipation channel 7, the liquid level in fluid infusion chamber 19 is higher than the liquid level of thermal column 4 delivery holes 6, keep contacting with copper-clad 14 with the conduction oil 8 that guarantees thermal column 4 delivery holes 6, simultaneously also as replenishing that conduction oil 8 reduces.
For convenience of producing heat dissipation channel 7 in heat sink 3 and conveniently injecting and additional conduction oils 8 to heat dissipation channel 7, heat dissipation channel 7 is provided with process seal mouth 20, and process seal mouth 20 is provided with process seal plug 21; Fluid infusion chamber 19 is provided with fluid infusion mouth 22, and fluid infusion mouth 22 is provided with fluid infusion sealing-plug 23, is used for to heat dissipation channel 7 filling heat-conductive oil 8.
Claims (9)
1. high-power liquid heat radiating LED lamp, include support (1), LED (2) and heat sink (3), LED (2) is installed on support (1), LED (2) is connected with heat sink (3), it is characterized in that: the thermal column (4) that is provided with insulation between described LED (2) and the heat sink (3), thermal column (4) contacts with heat source position (5) and the heat sink (3) of LED (2), thermal column (4) is provided with delivery hole (6), delivery hole (6) is provided with the conduction oil (8) of insulation, conduction oil (8) contacts with heat source position (5) and the heat sink (3) of LED (2), the heat of LED (2) heat source position (5) is delivered to heat sink (3) through thermal column (4) and conduction oil (8), and heat is distributed in the space by heat sink (3).
2. high-power liquid heat radiating LED lamp according to claim 1, it is characterized in that: described LED (2) includes PN junction (9), base (10), electrode (11), silica-gel sphere (12), solder mask (13), copper-clad (14), insulating barrier (15) and aluminium base (16), is provided with thermal conductive silicon rubber cushion (17) between the aluminium base (16) of LED (2) and the heat sink (3); PN junction (9) is connected with base (10), base (10) is connected with copper-clad (14), copper-clad (14) is connected with insulating barrier (15), and insulating barrier (15) is connected with aluminium base (16), and copper-clad (14), insulating barrier (15) and aluminium base (16) are connected in one; Be provided with heat conduction die cavity (18) between copper-clad (14) and the heat sink (3), heat conduction die cavity (18) enters heat sink (3) through insulating barrier (15), aluminium base (16) and thermal conductive silicon rubber cushion (17); Heat sink (3) is provided with heat dissipation channel (7), delivery hole (6) is communicated with heat dissipation channel (7), thermal column (4) is located in the heat conduction die cavity (18), the delivery hole (6) of thermal column (4) and heat dissipation channel (7) the falling heat-transfer oil (8) of heat sink (3), conduction oil (8) contacts with copper-clad (14); The heat of PN junction (9) heat source position (5) of LED (2) is delivered to heat sink (3) by base (10) through copper-clad (14), thermal column (4) and conduction oil (8), and the heat sink that heat is made of aluminium alloy (3) distributes in the space.
3. high-power liquid heat radiating LED lamp according to claim 2, it is characterized in that: described thermal column (4) is clamped in the heat conduction die cavity (18) by the copper-clad of LED (2) (14) and heat sink (3), thermal column (4) is tightly connected with copper-clad (14) and the heat sink (3) of LED (2), and conduction oil (8) is sealed in delivery hole (6) and the heat dissipation channel (7).
4. high-power liquid heat radiating LED lamp according to claim 3, it is characterized in that: the height of described thermal column (4) is fixing greater than heat conduction die cavity (18), the external diameter of thermal column (4) is greater than the internal diameter of heat conduction die cavity (18), and thermal column (4) is sealedly attached in the heat conduction die cavity (18).
5. high-power liquid heat radiating LED lamp according to claim 4, it is characterized in that: the thermal conductivity factor of described thermal column (4) is greater than insulating barrier (15) thermal conductivity factor, and the thermal conductivity factor of conduction oil (8) is greater than insulating barrier (15) thermal conductivity factor; The insulaion resistance of conduction oil (8) is greater than or equal to the insulaion resistance of insulating barrier (15), and thermal column (4) is made of the heat conductive silica gel of insulation, and conduction oil (8) includes heat conduction oil plant or the transformer oil of insulation.
6. high-power liquid heat radiating LED lamp according to claim 5, it is characterized in that: described heat sink (3) is provided with fluid infusion chamber (19), fluid infusion chamber (19) is logical with heat dissipation channel (7), fluid infusion chamber (19) is communicated with heat dissipation channel (7), and the liquid level of fluid infusion chamber (19) is higher than the liquid level of thermal column (4) delivery hole (6).
7. high-power liquid heat radiating LED lamp according to claim 6, it is characterized in that: described heat dissipation channel (7) is provided with process seal mouth (20), and process seal mouth (20) is provided with process seal plug (21); Fluid infusion chamber (19) is provided with fluid infusion mouth (22), and fluid infusion mouth (22) is provided with fluid infusion sealing-plug (23).
8. the radiating principle of a high-power liquid heat radiating LED lamp according to claim 7, it is characterized in that: the radiating principle of described high-power liquid heat radiating LED lamp is: the thermal column that is provided with insulation between the LED of high-power liquid heat radiating LED lamp and the heat sink, the delivery hole of thermal column and the heat dissipation channel of heat sink are full of conduction oil are arranged, and thermal column directly contacts with copper-clad and the heat sink of LED; The copper-clad heat that is delivered to of the PN junction of LED directly is delivered to heat sink by thermal column, simultaneously, utilizes conduction oil to contact with copper-clad and heat sink, and the heat of LED is delivered to heat sink through the conduction oil of thermal column delivery hole and heat sink heat dissipation channel; Utilize thermal column and the conduction oil of insulation to replace insulating barrier, copper-clad and aluminium base insulation are isolated, and utilize the thermal column of insulation and conduction oil to replace the thermal conductive silicon rubber cushion that aluminium base and radiating plate insulation are isolated, solved the problem of the low and radiating effect difference of insulating barrier thermal conductivity factor, and the insulating properties that do not reduce insulating barrier.
9. the radiating principle of high-power liquid heat radiating LED lamp according to claim 8, it is characterized in that: the heat dissipation path of described high-power liquid heat radiating LED lamp has three the tunnel: one: the heat that the PN junction of LED sends is through base → copper-clad → thermal column → heat sink → atmosphere; Its two: the heat that the PN junction of LED sends is through base → copper-clad → conduction oil → heat sink → atmosphere; Its three: the heat that the PN junction of LED sends is through base → copper-clad → insulating barrier → aluminium base → thermal conductive silicon rubber cushion → heat sink → atmosphere.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101110362A CN103196057A (en) | 2013-03-18 | 2013-03-18 | High-power liquid heat dissipating LED (light emitting diode) lamp |
| PCT/CN2013/086966 WO2014146437A1 (en) | 2013-03-18 | 2013-11-12 | High-power liquid radiating led lamp |
| CN201380005909.XA CN105283708B (en) | 2013-03-18 | 2013-11-12 | High-power liquid radiating LED light |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101110362A CN103196057A (en) | 2013-03-18 | 2013-03-18 | High-power liquid heat dissipating LED (light emitting diode) lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103196057A true CN103196057A (en) | 2013-07-10 |
Family
ID=48718780
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013101110362A Pending CN103196057A (en) | 2013-03-18 | 2013-03-18 | High-power liquid heat dissipating LED (light emitting diode) lamp |
| CN201380005909.XA Active CN105283708B (en) | 2013-03-18 | 2013-11-12 | High-power liquid radiating LED light |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380005909.XA Active CN105283708B (en) | 2013-03-18 | 2013-11-12 | High-power liquid radiating LED light |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN103196057A (en) |
| WO (1) | WO2014146437A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014146437A1 (en) * | 2013-03-18 | 2014-09-25 | Feng Lin | High-power liquid radiating led lamp |
| CN109210514A (en) * | 2018-08-31 | 2019-01-15 | 安徽蓝锐电子科技有限公司 | A kind of manufacture craft of Homogeneouslly-radiating mould group |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111023057A (en) * | 2019-11-19 | 2020-04-17 | 施学伍 | Quick heat dissipation device for lighting lamp |
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2013
- 2013-03-18 CN CN2013101110362A patent/CN103196057A/en active Pending
- 2013-11-12 CN CN201380005909.XA patent/CN105283708B/en active Active
- 2013-11-12 WO PCT/CN2013/086966 patent/WO2014146437A1/en active Application Filing
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| CN1680749A (en) * | 2004-04-08 | 2005-10-12 | 吴裕朝 | Light diode device, radiating system of light diode and illuminator containing it |
| CN2741193Y (en) * | 2004-04-08 | 2005-11-16 | 吴裕朝 | Light-emitting diode device, radiating system of light-emitting diode and illuminator therewith |
| CN102931331A (en) * | 2011-08-08 | 2013-02-13 | 乐利士实业股份有限公司 | Light-emitting device with heat pipe |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014146437A1 (en) * | 2013-03-18 | 2014-09-25 | Feng Lin | High-power liquid radiating led lamp |
| CN109210514A (en) * | 2018-08-31 | 2019-01-15 | 安徽蓝锐电子科技有限公司 | A kind of manufacture craft of Homogeneouslly-radiating mould group |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105283708A (en) | 2016-01-27 |
| CN105283708B (en) | 2018-05-08 |
| WO2014146437A1 (en) | 2014-09-25 |
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Application publication date: 20130710 |