CN203659935U - Liquid cooling heat radiating device for high-power LED (light emitting diode) - Google Patents
Liquid cooling heat radiating device for high-power LED (light emitting diode) Download PDFInfo
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- CN203659935U CN203659935U CN201320722267.2U CN201320722267U CN203659935U CN 203659935 U CN203659935 U CN 203659935U CN 201320722267 U CN201320722267 U CN 201320722267U CN 203659935 U CN203659935 U CN 203659935U
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- led
- heat radiating
- power led
- cooling heat
- liquid cooling
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Abstract
The utility model relates to a liquid cooling heat radiating device for a high-power LED (light emitting diode). The technical scheme is that a package substrate of the high-power LED is used to act as a heat radiating body of the liquid cooling radiator, a heat radiating liquid flows through a fluid channel on the surface of the package substrate of the LED and takes away heat produced by the LED directly. The heat radiating technology reduces heat resistance because the heat radiating path is shortened to be the shortest, thereby achieving an effect of reducing the LED chip junction temperature.
Description
Technical field
The utility model relates to a kind of liquid-cooling heat radiator of great power LED, specifically, relates to the liquid-cooling heat radiator of great power LED, belongs to LED field.
Background technology
The liquid-cooling heat radiator of existing great power LED as shown in Figure 1, mainly by LED chip group (1), solder layer (2), LED base plate for packaging (3), Heat Conduction Material (4), the parts compositions such as liquid cooling heat radiator (5), its heat dissipation path is LED chip group (1) >> solder layer (2) >>LED base plate for packaging (3) >> Heat Conduction Material (4) >> liquid cooling heat radiator (5) >> cooling fluid (6), wherein the conductive coefficient of Heat Conduction Material is little, base plate for packaging also has certain thickness simultaneously, therefore the thermal resistance of introducing is larger, the simultaneously application of Heat Conduction Material whether evenly and the fineness on base plate for packaging and liquid cooling heat radiator surface and the technological level of application Heat Conduction Material also can affect the heat-conducting effect after Heat Conduction Material application, this just makes the radiating effect consistency of current heat dissipation technology not good, the problems such as poor reliability and thermal resistance are large are never solved well.
Summary of the invention
The purpose of this utility model is exactly the defects such as, poor reliability not good for the consistency of existing high-power LED heat radiating device and thermal resistance are large, provides a kind of simple in structure, high conformity, dependable performance, the great power LED liquid cooling apparatus that thermal resistance is little.
Its technical scheme is: comprise high-power LED chip group (1), solder layer (2), LED base plate for packaging (7) and cooling fluid (6), it is characterized in that: it is upper that described high-power LED chip group (1) is encapsulated in LED base plate for packaging (7) by solder layer, and described LED base plate for packaging (7) is provided with fluid conduit (8).
The beneficial effects of the utility model are:
1. compared with existing great power LED liquid-cooling heat radiator, there is no thermal conductive material layer and LED base plate for packaging layer, thermally conductive pathways obviously shortens, and thermal resistance diminishes, and LED chip junction temperature obviously reduces.
2. owing to not needing application Heat Conduction Material, heat radiation high conformity, reliability is high.
Brief description of the drawings
Fig. 1 is existing great power LED liquid-cooling heat radiator schematic diagram;
Fig. 2 is the utility model great power LED liquid-cooling heat radiator schematic diagram;
Embodiment
Below in conjunction with accompanying drawing 2, the utility model is described in further detail, LED chip group (1) is encapsulated on LED base plate for packaging (7) by solder layer (2), be provided with fluid conduit (8) at the heat-delivery surface of LED base plate for packaging (7), the fluid heat that the fluid conduit (8) of LED base plate for packaging (7) produces LED of flowing through is taken away, and realizes cooling to LED chip.Wherein, the cross sectional shape of fluid conduit (8) can be the shape that circle, semicircle, Long Circle, polygon or other can machine-shapings, the number needs of fluid conduit designs according to the required heat radiation power of great power LED after actual encapsulation, and the larger radiating effect of product of the perimeter of section of unit sizes inner fluid conduit and conduit quantity is better.The length of fluid conduit need cover all LED chip packaging areas, and the longer radiating effect of fluid conduit is better.
Claims (2)
1. the liquid-cooling heat radiator of a great power LED, comprise high-power LED chip group (1), solder layer (2), LED base plate for packaging (7) and cooling fluid (6), it is characterized in that: it is upper that described high-power LED chip group (1) is encapsulated in LED base plate for packaging (7) by solder layer, and described LED base plate for packaging (7) is provided with fluid conduit (8).
2. the liquid-cooling heat radiator of a kind of great power LED according to claim 1, is characterized in that: the cross sectional shape of described fluid conduit (8) is circle, semicircle or polygon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320722267.2U CN203659935U (en) | 2013-11-17 | 2013-11-17 | Liquid cooling heat radiating device for high-power LED (light emitting diode) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320722267.2U CN203659935U (en) | 2013-11-17 | 2013-11-17 | Liquid cooling heat radiating device for high-power LED (light emitting diode) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203659935U true CN203659935U (en) | 2014-06-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320722267.2U Expired - Fee Related CN203659935U (en) | 2013-11-17 | 2013-11-17 | Liquid cooling heat radiating device for high-power LED (light emitting diode) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203659935U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107660314A (en) * | 2015-05-13 | 2018-02-02 | 松下知识产权经营株式会社 | The manufacture device of solar cell module and the manufacture method of solar cell module |
-
2013
- 2013-11-17 CN CN201320722267.2U patent/CN203659935U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107660314A (en) * | 2015-05-13 | 2018-02-02 | 松下知识产权经营株式会社 | The manufacture device of solar cell module and the manufacture method of solar cell module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140618 Termination date: 20181117 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |