CN102931331A - Light-emitting device with heat pipe - Google Patents
Light-emitting device with heat pipe Download PDFInfo
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- CN102931331A CN102931331A CN2011102871569A CN201110287156A CN102931331A CN 102931331 A CN102931331 A CN 102931331A CN 2011102871569 A CN2011102871569 A CN 2011102871569A CN 201110287156 A CN201110287156 A CN 201110287156A CN 102931331 A CN102931331 A CN 102931331A
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- heat pipe
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- emitting device
- hole
- substrate
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- 239000000758 substrate Substances 0.000 claims abstract description 70
- 230000004308 accommodation Effects 0.000 claims description 28
- 239000012809 cooling fluid Substances 0.000 claims description 26
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 15
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 15
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 8
- 239000002826 coolant Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910021529 ammonia Inorganic materials 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 2
- 239000000110 cooling liquid Substances 0.000 abstract 2
- 238000001704 evaporation Methods 0.000 abstract 1
- 230000008020 evaporation Effects 0.000 abstract 1
- 239000000498 cooling water Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000005494 condensation Effects 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000019771 cognition Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The invention relates to a light-emitting device with a heat pipe, which comprises at least one light-emitting diode element, at least one first substrate, the heat pipe and cooling liquid. The first substrate has a first surface, a second surface and at least one hole. The at least one light emitting diode element is positioned on the first surface of the at least one first substrate. The at least one hole is opened on the second surface of the at least one first substrate and opposite to the at least one light emitting diode element. The heat pipe is provided with at least one heat pipe opening or a protruded column, so that the cooling liquid is positioned in the at least one hole, and the heat of the at least one light-emitting diode element is absorbed to form evaporation gas to flow in the heat pipe. Therefore, the invention can effectively reduce the working temperature of the light-emitting diode element.
Description
Technical field
The present invention relates to a kind of light-emitting device, in detail, relate to a kind of light-emitting device with heat pipe.
Background technology
Along with environmental protection and energy-conservation subject under discussion day by day come into one's own, the light-emitting device with light-emitting diode (LED) replaces traditional bulb gradually.Yet light-emitting diode is usually arranged together with many, and therefore how effectively heat radiation is a large problem.
With reference to figure 1, show the cross-sectional schematic of existing light-emitting device.This light-emitting device 1 comprises a light-emitting diode (LED) element 10, a substrate 12, a container 16 and a cooling water 14.This substrate 12 is a base plate for packaging, and has a first surface 121, a second surface 122.This light-emitting diode 10 is positioned at the first surface 121 of this substrate 12.The second surface 122 of this substrate 12 is positioned on this container 16.This cooling water 14 is these container 16 interior flowing, to take away this light-emitting diode 10 luminous heat that produced.
The shortcoming that should have light-emitting device 1 now is as follows.The heat of this light-emitting diode 10 just can enter this cooling water 14 after the sidewall by this substrate 12 and this container 16 first, and is taken away by this cooling water 14.Because this substrate 12 and this container 16 are not the good conductor of heat usually, therefore, the heat of this light-emitting diode 10 also can't be transmitted to this cooling water 14 rapidly, causes the radiating efficiency of this existing light-emitting device 1 not high.In other words, the thermal resistance of prior art is excessive.When an actual measurement, the thermal resistance of this light-emitting diode 10 is 7.7 ℃/W.In addition, another kind of existing light-emitting device installs an aluminum cooling substrates additional between this substrate 12 and this container 16, and its measured thermal resistance is 8.1 ℃/W.
Summary of the invention
The object of the invention is to solve the not high problem of LED heat radiating efficient in the existing light-emitting device.
The invention provides a kind of light-emitting device with heat pipe, it comprises: at least one light-emitting diode; At least one first substrate, have a first surface, a second surface and at least one hole, this at least one light-emitting diode is positioned at this first surface of this at least one first substrate, this at least one hole is opened on this second surface of this at least one first substrate, and with respect to this at least one light-emitting diode; One heat pipe has at least one heat pipe opening, this this at least one hole of at least one heat pipe open communication; And a cooling fluid, be positioned at this at least one hole, thereby the heat that absorbs this at least one light-emitting diode flows in this heat pipe to form a boil-off gas.
Preferably, this at least one hole is blind hole.
Preferably, this at least one hole also is opened on this first surface of this at least one first substrate, so that this cooling fluid can contact this at least one light-emitting diode.
Preferably, this cooling fluid is water, methyl alcohol, ethanol, ammonia, acetone or its combination in any.
Preferably, described light-emitting device with heat pipe also comprises a second substrate, be positioned at this second surface of this at least one first substrate, this second substrate has at least one through hole, this at least one through hole is communicated with this at least one hole and this at least one heat pipe opening of this at least one first substrate, so that this cooling fluid can enter this at least one hole via this at least one through hole.
Preferably, this at least one hole is blind hole.
Preferably, this at least one hole also is opened on this first surface of this at least one first substrate, so that this cooling fluid can contact this at least one light-emitting diode.
Preferably, this second substrate is heat-radiating substrate or circuit board.
Preferably, this heat pipe comprises a shell body and a capillary structure, this capillary structure is positioned at the madial wall of this shell body to define a hollow accommodation space, this at least one heat pipe opening runs through this shell body and this capillary structure, and be communicated to this hollow accommodation space, so that this boil-off gas can flow, and then form heat exchange across this shell body and external environment in this hollow accommodation space, finally be condensed into liquid coolant.
Preferably, this heat pipe also comprises at least one protuberance, corresponding each this first substrate of each this protuberance, and have at least one heat pipe opening, this capillary structure and this hollow accommodation space extend to this at least one protuberance.
Preferably, this heat pipe also comprises a plurality of fin section, and this capillary structure and this hollow accommodation space extend to described fin section.
Preferably, also comprise a plurality of radiating fins, be connected to the lateral wall of the shell body of this heat pipe.
Preferably, the material of this shell body is metal, and this capillary structure is that copper mesh, copper powder burn solution or groove.
The present invention also provides a kind of light-emitting device with heat pipe, and it comprises: at least one light-emitting diode; At least one first substrate, have a first surface, a second surface and at least one hole, this at least one light-emitting diode is positioned at this first surface of this at least one first substrate, this at least one hole is opened on this second surface of this at least one first substrate, and with respect to this at least one light-emitting diode; One heat pipe has at least one protruded stigma, and this at least one protruded stigma is inserted in this at least one hole; And a cooling fluid, be positioned at this at least one protruded stigma, thereby the heat that absorbs this at least one light-emitting diode flows in this heat pipe to form a boil-off gas.
Preferably, this at least one hole is blind hole.
Preferably, this at least one hole also is opened on this first surface of this at least one first substrate, so that this at least one protruded stigma can contact this at least one light-emitting diode.
Preferably, this cooling fluid is water, methyl alcohol, ethanol, ammonia, acetone or its combination in any.
Preferably, this heat pipe comprises a shell body and a capillary structure, this capillary structure is positioned at the madial wall of this shell body to define a hollow accommodation space, this capillary structure and this hollow accommodation space extend to this at least one protruded stigma, so that this boil-off gas can flow in this hollow accommodation space, and then across this shell body and external environment formation heat exchange, finally be condensed into liquid coolant.
Preferably, this heat pipe also comprises at least one protuberance, corresponding each this first substrate of each this protuberance, and have at least one protruded stigma, this capillary structure and this hollow accommodation space extend to this at least one protuberance.
Preferably, this heat pipe also comprises a plurality of fin section, and this capillary structure and this hollow accommodation space extend to described fin section.
Preferably, described light-emitting device with heat pipe also comprises a plurality of radiating fins, is connected to the lateral wall of the shell body of this heat pipe.
Preferably, the material of this shell body is metal, and this capillary structure is that copper mesh, copper powder burn solution or groove.
Thus, can effectively reduce the working temperature of this light-emitting diode.
Description of drawings
Fig. 1 shows the cross-sectional schematic of existing light-emitting device;
Fig. 2 shows that the present invention has the schematic perspective view of an embodiment of the light-emitting device of heat pipe;
Fig. 3 shows the cross-sectional schematic of Fig. 2;
Fig. 4 shows the enlarged diagram of regional A among Fig. 3;
Fig. 5 shows that the present invention has the cross-sectional schematic of another embodiment of the light-emitting device of heat pipe;
Fig. 6 shows that the present invention has the cross-sectional schematic of another embodiment of the light-emitting device of heat pipe;
Fig. 7 shows that the present invention has the cross-sectional schematic of another embodiment of the light-emitting device of heat pipe;
Fig. 8 shows that the present invention has the cross-sectional schematic of another embodiment of the light-emitting device of heat pipe;
Fig. 9 shows that the present invention has the cross-sectional schematic of another embodiment of the light-emitting device of heat pipe; And
Figure 10 shows that the present invention has the cross-sectional schematic of another embodiment of the light-emitting device of heat pipe.
[main element symbol description]
1 existing light-emitting device
2 the present invention have an embodiment of the light-emitting device of heat pipe
2a the present invention has another embodiment of the light-emitting device of heat pipe
2b the present invention has another embodiment of the light-emitting device of heat pipe
2c the present invention has another embodiment of the light-emitting device of heat pipe
2d the present invention has another embodiment of the light-emitting device of heat pipe
2e the present invention has another embodiment of the light-emitting device of heat pipe
2f the present invention has another embodiment of the light-emitting device of heat pipe
10 light-emitting diodes (LED) element
12 substrates
14 cooling waters
16 containers
20 light-emitting diodes (LED) element
22 first substrates
24 cooling fluids
26 heat pipes
28 second substrates
121 first surfaces
122 second surfaces
221 first surfaces
222 second surfaces
223 holes
261 heat pipe openings
262 shell bodies
263 capillary structures
264 hollow accommodation spaces
265 protuberances
266 radiating fins
267 fin sections
268 protruded stigmas
281 through holes.
Embodiment
Please refer to Fig. 2, show that the present invention has the schematic perspective view of an embodiment of the light-emitting device of heat pipe.Please refer to Fig. 3, show the cross-sectional schematic of Fig. 2.Please refer to Fig. 4, show the enlarged diagram of regional A among Fig. 3.This light-emitting device 2 with heat pipe comprises at least one light-emitting diode (LED) element 20, at least one first substrate 22, a heat pipe 26 and a cooling fluid 24.This light-emitting diode 20 comprises a crystal grain (among the figure not label) and a camera lens (Lens) (among the figure not label) at least.This first substrate 22 has a first surface 221, a second surface 222 and at least one hole 223.This light-emitting diode 20 is positioned at this first surface 221 of this first substrate 22.This hole 223 is opened on this second surface 222 of this first substrate 22, and the position of this hole 223 is with respect to this light-emitting diode 20.
This heat pipe 26 has at least one heat pipe opening 261, and this heat pipe opening 261 is communicated with this hole 223.This cooling fluid 24 is positioned at this hole 223, thereby the heat that absorbs this light-emitting diode 20 is interior mobile at this heat pipe 26 to form a boil-off gas.
In the present embodiment, this first substrate 22 has three holes 223, and this heat pipe 26 has three heat pipe openings 261; Yet in other embodiments, this first substrate 22 also can only have a hole 223, and this heat pipe 26 only has a heat pipe opening 261.Described hole 223 also is opened on this first surface 221 of this first substrate 22.That is, described hole 223 runs through this first substrate 22, so that this cooling fluid 24 after entering described hole 223, can contact this light-emitting diode 20 via this second surface 222 of described heat pipe opening 261 and this first substrate 22, directly to take away the heat of this light-emitting diode 20.Comprehensively described, technical characteristics of the present invention namely is to remove the thermal resistance between this cooling fluid 24 and this light-emitting diode 20 in this heat pipe 26, so that the radiating effect of this cooling fluid 24 can maximize in this heat pipe 26.
In the present embodiment, this first substrate 22 is a base plate for packaging, and its material is resin.This cooling fluid 24 is water, methyl alcohol, ethanol, ammonia, acetone or its combination in any.This heat pipe 26 comprises a shell body 262 and a capillary structure 263.This capillary structure 263 is positioned at the madial wall of this shell body 262 to define a hollow accommodation space 264.This heat pipe opening 261 runs through this shell body 262 and this capillary structure 263, and be communicated to this hollow accommodation space 264, so that these cooling fluid 24 formed boil-off gas can be these hollow accommodation space 264 interior flowing, and then across this shell body 262 and external environment formation heat exchange, finally be condensed into liquid coolant 24.The liquid coolant 24 that this condensation forms flows back in the described hole 223 via this capillary structure 263.Preferably, the material of this shell body 262 is metal (for example: brass, nickel, stainless steel, tungsten or other alloys), and this capillary structure 263 is that copper mesh, copper powder burn solution or groove.
In the present embodiment, this heat pipe 26 also comprises at least one protuberance 265 and a plurality of radiating fin 266.Each this protuberance 265 protrudes from this heat pipe 26 belows, and corresponding each this first substrate 22.Described heat pipe opening 261 is positioned at this protuberance 265 downsides, and this capillary structure 263 and this hollow accommodation space 264 extend to this protuberance 265.Described radiating fin 266 is connected to the upper outer wall of the shell body 262 of this heat pipe 26, to increase radiating efficiency.
This mode of operation of light-emitting device 2 with heat pipe is as follows.When these light-emitting diode 20 generations were hot, the protuberance 265 of this heat pipe 26 was the higher temperatures place, and the top of this heat pipe 26 is the lower temperature place.This cooling fluid 24 absorbed the heat of this light-emitting diode 20 and formed a boil-off gas this moment.This boil-off gas know from experience in this hollow accommodation space 264, flow to this heat pipe 26 above.Because the top of this heat pipe 26 is to touch the lower temperature place, so when this boil-off gas arrives this end, just begin to produce condensation, this moment, heat was exactly heat pipe 26 outsides of being passed to lower temperature by this boil-off gas by this shell body 262.Simultaneously, this boil-off gas cognition condenses into liquid, and these liquid coolant 24 that produce after because of condensation flow back to this protuberance 265 via the effect of the capillarity (Capillary Pumping) of this capillary structure 263, enter in the described hole 223 afterwards again.So thereby circulation can continue to carry out improving radiating effect.
In the present embodiment, the thermal resistance of this light-emitting diode 20 is 3.992 ℃/W, and compared with prior art, the present invention can effectively reduce the thermal resistance of this light-emitting diode 20.In other words, thermal resistance descends and to represent the thermal source that this light-emitting diode 20 produces and can form more effective heat exchange with external environment, and improving heat radiation efficiency according to this.
Please refer to Fig. 5, show that the present invention has the cross-sectional schematic of another embodiment of the light-emitting device of heat pipe.The light-emitting device 2a with heat pipe of the present embodiment and the light-emitting device with heat pipe 2 of Fig. 3 and 4 are roughly the same, and wherein identical element is given identical numbering.The light-emitting device 2a with heat pipe of the present embodiment and the light-emitting device with heat pipe 2 of Fig. 3 and 4 different be in, in the present embodiment, described hole 223 is blind hole.That is described hole 223 is not opened on this first surface 221 of this first substrate 22.Comprehensively described, technical characteristics of the present invention namely is to remove the thermal resistance between this cooling fluid 24 and this light-emitting diode 20, so that the cooling effect of this cooling fluid 24 can maximize.
In the present embodiment, the thermal resistance of this light-emitting diode 20 is 5.395 ℃/W, and compared with prior art, another embodiment of the present invention still can effectively reduce the thermal resistance of this light-emitting diode 20.
Please refer to Fig. 6, show that the present invention has the cross-sectional schematic of another embodiment of the light-emitting device of heat pipe.The light-emitting device 2b with heat pipe of the present embodiment and the light-emitting device with heat pipe 2 of Fig. 3 and 4 are roughly the same, and wherein identical element is given identical numbering.The light-emitting device 2b with heat pipe of the present embodiment and the light-emitting device with heat pipe 2 of Fig. 3 and 4 different be in, in the present embodiment, this light-emitting device 2b with heat pipe also comprises a second substrate 28.The material of this second substrate 28 is aluminium, copper or pottery, and this second substrate 28 is heat-radiating substrate or circuit board, and it is between this second surface 222 and this heat pipe 26 of this first substrate 22.This second substrate 28 has at least one through hole 281.In the present embodiment, this second substrate 28 has three through holes 281.Described through hole 281 is communicated with described hole 223 and the described heat pipe opening 261 of this first substrate 22, so that this cooling fluid 24 can enter described hole 223 via described through hole 281.
Please refer to Fig. 7, show that the present invention has the cross-sectional schematic of another embodiment of the light-emitting device of heat pipe.The light-emitting device 2c with heat pipe of the present embodiment and the light-emitting device 2b with heat pipe of Fig. 6 are roughly the same, and wherein identical element is given identical numbering.The light-emitting device 2c with heat pipe of the present embodiment and the light-emitting device 2b with heat pipe of Fig. 6 different be in, in the present embodiment, described hole 223 is blind hole.That is described hole 223 is not opened on this first surface 221 of this first substrate 22.
Please refer to Fig. 8, show that the present invention has the cross-sectional schematic of another embodiment of the light-emitting device of heat pipe.The light-emitting device 2d with heat pipe of the present embodiment and the light-emitting device with heat pipe 2 of Fig. 3 are roughly the same, and wherein identical element is given identical numbering.The light-emitting device 2d with heat pipe of the present embodiment and the light-emitting device with heat pipe 2 of Fig. 3 different be in, in the present embodiment, the radiating fin 266 (Fig. 3) of this heat pipe 26 replace by a plurality of fin section 267.Described fin section 267 with described radiating fin 266 differences is, described fin section 267 is the part of this heat pipe 26, that is this capillary structure 263 and this hollow accommodation space 264 extend to described fin section 267.The heat pipe 26 of this embodiment is the fin type heat pipe.
Please refer to Fig. 9, show that the present invention has the cross-sectional schematic of another embodiment of the light-emitting device of heat pipe.The light-emitting device 2e with heat pipe of the present embodiment and the light-emitting device with heat pipe 2 of Fig. 3 are roughly the same, and wherein identical element is given identical numbering.The light-emitting device 2e with heat pipe of the present embodiment and the light-emitting device with heat pipe 2 of Fig. 3 different be in, in the present embodiment, this heat pipe 26 does not have described radiating fin 266 (Fig. 3), described protuberance 265 (Fig. 3) and described fin 267 (Fig. 8) of section.The heat pipe 26 of this embodiment is flat plate heat tube.
Please refer to Figure 10, show that the present invention has the cross-sectional schematic of another embodiment of the light-emitting device of heat pipe.The light-emitting device 2f with heat pipe of the present embodiment and the light-emitting device with heat pipe 2 of Fig. 3 and 4 are roughly the same, and wherein identical element is given identical numbering.The light-emitting device 2f with heat pipe of the present embodiment and the light-emitting device with heat pipe 2 of Fig. 3 and 4 different be in, in the present embodiment, this heat pipe 26 does not have heat pipe opening 261 (Fig. 4), but has at least one protruded stigma 268.This protruded stigma 268 is the some of this heat pipe 26, and this capillary structure 263 and this hollow accommodation space 264 extend to this protruded stigma 268.In the present embodiment, this protruded stigma 268 is inserted in this hole 223, so that this protruded stigma 268 can contact this light-emitting diode 20.Be understandable that, the technical characterictic that this heat pipe 26 has this protruded stigma 268 among Figure 10 can be applicable to the light-emitting device 2a with heat pipe of Fig. 5-9,2b, and 2c, 2d on the 2e, repeats no more in this.
But above-described embodiment only is explanation principle of the present invention and effect thereof, but not in order to limit the present invention.Therefore, those skilled in the art make amendment to above-described embodiment and change and still do not break away from spirit of the present invention.Interest field of the present invention should be listed such as claim.
Claims (22)
1. the light-emitting device with heat pipe is characterized in that, comprising:
At least one light-emitting diode;
At least one first substrate, have a first surface, a second surface and at least one hole, this at least one light-emitting diode is positioned at this first surface of this at least one first substrate, this at least one hole is opened on this second surface of this at least one first substrate, and with respect to this at least one light-emitting diode;
One heat pipe has at least one heat pipe opening, this this at least one hole of at least one heat pipe open communication; And
One cooling fluid is positioned at this at least one hole, thereby the heat that absorbs this at least one light-emitting diode flows in this heat pipe to form a boil-off gas.
2. the light-emitting device with heat pipe as claimed in claim 1 is characterized in that, this at least one hole is blind hole.
3. the light-emitting device with heat pipe as claimed in claim 1 is characterized in that, this at least one hole also is opened on this first surface of this at least one first substrate, so that this cooling fluid can contact this at least one light-emitting diode.
4. the light-emitting device with heat pipe as claimed in claim 1 is characterized in that, this cooling fluid is water, methyl alcohol, ethanol, ammonia, acetone or its combination in any.
5. the light-emitting device with heat pipe as claimed in claim 1, it is characterized in that, also comprise a second substrate, be positioned at this second surface of this at least one first substrate, this second substrate has at least one through hole, this at least one through hole is communicated with this at least one hole and this at least one heat pipe opening of this at least one first substrate, so that this cooling fluid can enter this at least one hole via this at least one through hole.
6. the light-emitting device with heat pipe as claimed in claim 5 is characterized in that, this at least one hole is blind hole.
7. the light-emitting device with heat pipe as claimed in claim 5 is characterized in that, this at least one hole also is opened on this first surface of this at least one first substrate, so that this cooling fluid can contact this at least one light-emitting diode.
8. the light-emitting device with heat pipe as claimed in claim 5 is characterized in that, this second substrate is heat-radiating substrate or circuit board.
9. the light-emitting device with heat pipe as claimed in claim 1, it is characterized in that, this heat pipe comprises a shell body and a capillary structure, this capillary structure is positioned at the madial wall of this shell body to define a hollow accommodation space, this at least one heat pipe opening runs through this shell body and this capillary structure, and is communicated to this hollow accommodation space, so that this boil-off gas can flow in this hollow accommodation space, and then across this shell body and external environment formation heat exchange, finally be condensed into liquid coolant.
10. the light-emitting device with heat pipe as claimed in claim 9, it is characterized in that, this heat pipe also comprises at least one protuberance, corresponding each this first substrate of each this protuberance, and have at least one heat pipe opening, this capillary structure and this hollow accommodation space extend to this at least one protuberance.
11. the light-emitting device with heat pipe as claimed in claim 9 is characterized in that, this heat pipe also comprises a plurality of fin section, and this capillary structure and this hollow accommodation space extend to described fin section.
12. the light-emitting device with heat pipe as claimed in claim 9 is characterized in that, also comprises a plurality of radiating fins, is connected to the lateral wall of the shell body of this heat pipe.
13. the light-emitting device with heat pipe as claimed in claim 9 is characterized in that, the material of this shell body is metal, and this capillary structure is that copper mesh, copper powder burn solution or groove.
14. the light-emitting device with heat pipe is characterized in that, comprising:
At least one light-emitting diode;
At least one first substrate, have a first surface, a second surface and at least one hole, this at least one light-emitting diode is positioned at this first surface of this at least one first substrate, this at least one hole is opened on this second surface of this at least one first substrate, and with respect to this at least one light-emitting diode;
One heat pipe has at least one protruded stigma, and this at least one protruded stigma is inserted in this at least one hole; And
One cooling fluid is positioned at this at least one protruded stigma, thereby the heat that absorbs this at least one light-emitting diode flows in this heat pipe to form a boil-off gas.
15. the light-emitting device with heat pipe as claimed in claim 14 is characterized in that, this at least one hole is blind hole.
16. the light-emitting device with heat pipe as claimed in claim 14 is characterized in that, this at least one hole also is opened on this first surface of this at least one first substrate, so that this at least one protruded stigma can contact this at least one light-emitting diode.
17. the light-emitting device with heat pipe as claimed in claim 14 is characterized in that, this cooling fluid is water, methyl alcohol, ethanol, ammonia, acetone or its combination in any.
18. the light-emitting device with heat pipe as claimed in claim 14, it is characterized in that, this heat pipe comprises a shell body and a capillary structure, this capillary structure is positioned at the madial wall of this shell body to define a hollow accommodation space, this capillary structure and this hollow accommodation space extend to this at least one protruded stigma, so that this boil-off gas can flow, and then form heat exchange across this shell body and external environment in this hollow accommodation space, finally be condensed into liquid coolant.
19. the light-emitting device with heat pipe as claimed in claim 18, it is characterized in that, this heat pipe also comprises at least one protuberance, corresponding each this first substrate of each this protuberance, and have at least one protruded stigma, this capillary structure and this hollow accommodation space extend to this at least one protuberance.
20. the light-emitting device with heat pipe as claimed in claim 18 is characterized in that, this heat pipe also comprises a plurality of fin section, and this capillary structure and this hollow accommodation space extend to described fin section.
21. the light-emitting device with heat pipe as claimed in claim 18 is characterized in that, also comprises a plurality of radiating fins, is connected to the lateral wall of the shell body of this heat pipe.
22. the light-emitting device with heat pipe as claimed in claim 18 is characterized in that, the material of this shell body is metal, and this capillary structure is that copper mesh, copper powder burn solution or groove.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100128098A TWI439636B (en) | 2011-08-08 | 2011-08-08 | Light-emitting apparatus having heat pipe |
| TW100128098 | 2011-08-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102931331A true CN102931331A (en) | 2013-02-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102871569A Pending CN102931331A (en) | 2011-08-08 | 2011-09-15 | Light-emitting device with heat pipe |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102931331A (en) |
| TW (1) | TWI439636B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103090240A (en) * | 2013-02-25 | 2013-05-08 | 杭州杭科光电股份有限公司 | High-efficiency luminescence light emitting diode (LED) light source and LED lamp using thereof |
| CN103196057A (en) * | 2013-03-18 | 2013-07-10 | 林智勇 | High-power liquid heat dissipating LED (light emitting diode) lamp |
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| TWI261938B (en) * | 2004-04-06 | 2006-09-11 | Yu-Chao Wu | LED device and LED heat dissipation system |
| US20070090737A1 (en) * | 2005-10-20 | 2007-04-26 | Foxconn Technology Co., Ltd. | Light-emitting diode assembly and method of fabrication |
| CN101389202A (en) * | 2007-09-12 | 2009-03-18 | 鑫电光科技股份有限公司 | Cooling device for electronic element |
| CN201425207Y (en) * | 2009-06-02 | 2010-03-17 | 热速得控股股份有限公司 | Luminescent diode lighting device |
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- 2011-08-08 TW TW100128098A patent/TWI439636B/en not_active IP Right Cessation
- 2011-09-15 CN CN2011102871569A patent/CN102931331A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI261938B (en) * | 2004-04-06 | 2006-09-11 | Yu-Chao Wu | LED device and LED heat dissipation system |
| US20070090737A1 (en) * | 2005-10-20 | 2007-04-26 | Foxconn Technology Co., Ltd. | Light-emitting diode assembly and method of fabrication |
| CN101389202A (en) * | 2007-09-12 | 2009-03-18 | 鑫电光科技股份有限公司 | Cooling device for electronic element |
| CN201425207Y (en) * | 2009-06-02 | 2010-03-17 | 热速得控股股份有限公司 | Luminescent diode lighting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103090240A (en) * | 2013-02-25 | 2013-05-08 | 杭州杭科光电股份有限公司 | High-efficiency luminescence light emitting diode (LED) light source and LED lamp using thereof |
| CN103196057A (en) * | 2013-03-18 | 2013-07-10 | 林智勇 | High-power liquid heat dissipating LED (light emitting diode) lamp |
| CN105283708A (en) * | 2013-03-18 | 2016-01-27 | 朱洪华 | High-power liquid radiating LED lamp |
| CN105283708B (en) * | 2013-03-18 | 2018-05-08 | 佛山市雷兴电气照明有限公司 | High-power liquid radiating LED light |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201307739A (en) | 2013-02-16 |
| TWI439636B (en) | 2014-06-01 |
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