CN209782284U

CN209782284U - Light source module

Info

Publication number: CN209782284U
Application number: CN201920224043.6U
Authority: CN
Inventors: 于正国
Original assignee: Sai Chuang Electric (tongling) Co Ltd
Current assignee: Guoci Saichuang Electric (Tongling) Co.,Ltd.
Priority date: 2019-02-22
Filing date: 2019-02-22
Publication date: 2019-12-13
Anticipated expiration: 2029-02-22

Abstract

The utility model provides a light source module, light source module adopt to set up a plurality of LED chips on circuit substrate and constitute for light source module's use is more nimble. Furthermore, the arrangement combination of the LED chip and the circuit substrate can be arranged on one side or two sides of the circuit substrate, and the combination of one or more circuit substrates can be adopted, so that the flexible configuration of the light source module is realized; compared with the traditional light emitting chip, the back space between the LED chips in the light source module is greatly reduced, so that the emission range close to 180 degrees is realized on the single surface of the circuit substrate. And the integration of the light source module is realized and the application range of the light source module is expanded.

Description

Light source module

Technical Field

The utility model relates to a light emitting device technical field, concretely relates to light source module.

Background

Referring to fig. 1, a conventional LED light-emitting lamp includes: the LED lamp comprises a lamp holder 04 ', a lamp body 02 ' positioned on the lamp holder 04 ', circuit boards 021 ' positioned on two sides of the lamp body 02 ', LED lamp beads 01 ' positioned on the circuit boards 021 ' and a front cover 00 of the lamp body. The lamp body front cover 00 is on top of the lamp body 02'. The LED lamp bead 01' is formed by fixing an LED chip on a ceramic substrate by conductive adhesive and packaging. The LED lamp bead 01 'is welded on the circuit board 021' through solder paste. The circuit boards 021 'are fixed on two sides of the lamp body 02' through heat-conducting silicone grease in a bonding mode. The circuit board 021' is a copper-based or aluminum-based circuit board.

The LED luminescent lamp has problems in light distribution and heat dissipation. First, in terms of heat dissipation: the heat conductivity coefficient of the heat-conducting silicone grease is very low, the maximum heat conductivity coefficient of the heat-conducting silicone grease in the current market reaches 6-10W/m.K, the heat conductivity coefficient of sn10sb solder paste is 50-70W/m.K, and the heat conductivity coefficient of the eutectic soldering process can reach 80-100W/m.K. The LED chip transfers heat to the ceramic substrate through the conductive adhesive, so that the heat generated by the lamp beads is transferred to the circuit board through the solder paste; and the heat of the circuit board is transferred to the lamp body through the heat-conducting silicone grease and finally diffused out. This structure not only increases the heat transfer path (4-level transfer), but also the heat transfer capability is greatly limited by the heat-conductive silicone grease with the lowest heat conductivity, and the heat transfer path and transfer capability are very limited. The heat dissipation is not good, the light attenuation is easy to happen due to poor heat dissipation treatment, and the service life of the car lamp is influenced.

In addition, each part of the structure is not mechanically fixed, for example, when the circuit board and the lamp body work in a high-temperature environment for a long time, colloid aging occurs, and the circuit board and the lamp body are peeled off (the adhesion is not firm); is not suitable for long-time illumination, and causes uneven product quality.

Secondly, the LED luminescent light of above-mentioned structure also does not well in the aspect of the light type design, for example the circuit board that LED lamp pearl was pasted to both sides passes through heat conduction silicone grease bonding to be fixed on the lamp body, has increaseed the interval between both sides LED lamp pearl like this. Compared with the traditional halogen lamp, the LED luminous lamp can be equivalent to a linear light source, and the traditional LED luminous lamp cannot be equivalent in structure and can not directly replace the traditional halogen car lamp. The LED light-emitting lamp structure increases the difficulty of light distribution and enables the use of the LED light-emitting lamp to be limited.

In addition, the lamp has the problems of poor maintenance performance, certain gap between the appearance of the lamp and the bulb to which the lamp is used, challenge on human acceptance and the like.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above problems, the present invention is directed to provide a light source module and a light emitting lamp including the same, which aims to realize the integration of the light source module and expand the application range of the light source module; another object is to increase the light exit angle of the light source.

In order to achieve the above object, the present invention provides a light source module, including:

A circuit substrate;

And a plurality of LED chips arranged on the circuit substrate.

In some embodiments, the LED chips are respectively disposed on two side surfaces of the circuit substrate.

In some embodiments, a side of the circuit substrate is provided with a plurality of LED chips.

In some embodiments, the other side of the circuit substrate serves as an adhesive surface for bonding with other circuit substrates.

In some embodiments, the circuit substrate has a filler material between the adhesive faces.

In some embodiments, the bonding surfaces of the circuit substrates are bonded together by metal welding.

In some embodiments, the circuit substrate is a ceramic-based circuit board, or a metal-based circuit board.

In some embodiments, the thickness of the circuit substrate is less than 1 mm.

In some embodiments, a chip circuit board is arranged at the bottom of the LED chip; the chip circuit board is fixedly connected to the circuit substrate.

In some embodiments, the LED chip is packaged with a package structure; the packaging material is colloid.

The light source module of the utility model adopts the light source module formed by arranging a plurality of LED chips on the circuit substrate, so that the light source module is more flexible to use, and the application range of the light source module is expanded; furthermore, the arrangement combination of the LED chip and the circuit substrate may be on one side of the circuit substrate, or on both sides of the circuit substrate, or may be a single circuit substrate, or may be a combination of multiple circuit substrates; flexible configuration of the light source module is realized; compared with the traditional luminescent lamp, the back space between the surfaces with the LED chips in the light source module is greatly reduced, so that the emission range close to 180 degrees is realized on the single surface of the circuit substrate, the space between the two surfaces of the circuit substrate is small, namely the thickness of the circuit substrate is thinner, and the problem that the lamp body of the traditional luminescent lamp occupies larger volume and the luminescent lamp has black areas is solved.

Drawings

FIG. 1 is a schematic view of a conventional light-emitting lamp

Fig. 2 is a schematic structural view of a light-emitting lamp according to an embodiment of the present invention

FIG. 3 is a schematic view of the fitting relationship between the light source module and the sub-lamp according to an embodiment of the present invention

Fig. 4 is a schematic structural view of a light outlet according to an embodiment of the present invention; wherein, the figure on the right side of FIG. 4 is a schematic side view of the figure on the left side

Fig. 5 is a schematic structural diagram of a light source module according to an embodiment of the present invention

fig. 6 is a schematic structural diagram of a light source module according to an embodiment of the present invention

Fig. 7 is a schematic structural diagram of a light source module according to an embodiment of the present invention

Fig. 8 is a schematic structural diagram of a light source module according to an embodiment of the present invention.

Detailed Description

In order to make the contents of the present invention clearer and more understandable, the contents of the present invention are further explained below with reference to the drawings of the specification. Of course, the invention is not limited to this specific embodiment, and general alternatives known to those skilled in the art are also within the scope of the invention.

the present invention will be described in further detail with reference to the accompanying drawings 1 ~ 8, which are provided for convenience and clarity in describing the embodiments of the present invention, and which are not to be construed as limited to the precise proportions set forth herein.

Referring to fig. 2, a structure of a light emitting lamp according to an embodiment of the present invention is schematically illustrated. The light emitting lamp includes: a light source module 01 and a lamp body 02. The lamp body 02 has a light outlet 025. The light source module 01 is fixed in the inner region of the lamp body 02 and corresponds to the light outlet 025. Here, the light outlet 025 is disposed at the upper portion 023 of the lamp body 02, and the upper portion 023 of the lamp body 02 has at least two flat sides, and in this embodiment, has two flat sides, but this is not intended to limit the scope of the present invention. The light outlet 025 is disposed in the flat side. The lamp body 02 is formed by combining at least two sub-lamp bodies. In this embodiment, there are two sub lamp bodies 021, 022, and the sub lamp bodies 021, 022 can be fixed and connected by a mechanical method, such as the bolt 07 shown in fig. 2.

Referring to fig. 2 and 3, an upper portion 023 of each of the sub lamp bodies 021, 022 has a flat surface; the light outlet 025 is provided in a flat surface of the upper portion 023 of each of the sub lamp bodies 021, 022. The light source module 01 is clamped in the two sub lamp bodies 021 and 022 and corresponds to the light outlet 025, so that light emitted by the light source module 01 can be emitted from the light outlet 025. Referring to fig. 5, in particular, the light source module 01 includes an LED chip 102 and a circuit substrate 101, and therefore, the LED chip 102 should correspond to the light outlet 025, so that light emitted from the LED chip 102 can be emitted from the light outlet 025. In some cases, when the light source module 01 is clamped in the sub-lamp bodies 021 and 022, the LED chip 102 protrudes outward from the bottom of the light outlet 025, please refer to fig. 4, where the left side in fig. 4 is a schematic diagram of the position and the shape of the light outlet 025 at the upper portion 023, the right side in fig. 4 is a matching relationship between the light outlet 025 and the groove, and the black coil in fig. 4 is the light outlet 025. Here, the outward protrusion may be disposed such that the top of the LED chip 102 is flush with the flat surface of the sub lamp 021, 022, may not exceed the flat surface, or may slightly exceed the flat surface. From the viewpoint of safety and light emission, it is preferable that the top of the LED chip 102 is flush with or slightly beyond the flat surface of the sub-lamp 021, 022. In this way, the thickness of the upper part 021 of the lamp body 02 may be equal to or less than the thickness of the light source module 01, that is, the sum of the thickness of the circuit substrate 101 + the thickness of the LED chip 102. Of course, in other embodiments, the thickness of the upper part 021 of the lamp body 02 may be larger than the sum of the thickness of the circuit substrate 101 + the thickness of the LED chip 102. In order to increase the light emitting angle and realize a large-range light emitting, the sidewall of the light outlet 025 is inclined and is in an outward-opening shape. The upper portions 023 of the sub lamp bodies 021, 022 have grooves 026 (shown in dotted lines in the structure on the right in fig. 4 for convenience of expression). Here, it is possible to define: the trenches 026 have a length direction parallel to the planar surface and a height direction perpendicular to the evaluation plane. The light outlet 025 is disposed adjacent to the groove 026 and communicates with the groove 026, so that the circuit substrate 101 can be accommodated in a cavity formed by the grooves 026 of the two sub-lamps 021 and 022, and the LED chip 102 can be accommodated in the light outlet 025.

Referring to fig. 2 again, the light source module 01 may be fixed inside the lamp body 02 composed of the sub-lamp bodies 021 and 022 by welding. Metal soldering, for example using solder paste, may be used. In addition, in order to further improve the stability of the light source module 01 in the lamp body 02, the light source module 01 and the sub-lamp body 02 are mechanically fixed, and as shown in fig. 2, the light source module 01 and the sub-lamp body 02 are fixed by bolts 06.

Referring to fig. 2, the lamp body 02 has a heat dissipation structure 024 at a lower portion thereof, where the heat dissipation structure 024 is disposed coaxially with the lamp body 02, and the heat dissipation structure 024 has a plurality of fins protruding outward in a direction perpendicular to the axial direction, thereby increasing a heat dissipation area and a heat dissipation effect. The heat dissipation structure 024 may be, but not limited to, a metal material, and in order to enhance thermal management, a special treatment, such as an anodic oxidation treatment or the like, may be performed on a surface of the metal material to form an oxide film on the surface of the metal material, thereby reducing a time required for thermal equilibrium and reducing light attenuation.

Referring to fig. 2, the light source module 01 is connected to a wire 03, which can be disposed at the bottom of the light source module 01. One end of the lead 03 is positioned in the lamp body 02 and connected with the light source module 01, specifically, the circuit substrate 101; the other end of the lead 03 penetrates out of the lamp body 02 to be connected with an external circuit. Here, a base 04 is disposed at the bottom of the lamp body 02, a circuit structure is disposed in the base 04, and the lead 03 may be connected to the circuit interface. The bottom of the lamp body 02 can be connected with the base 04 in a mechanical manner, but not limited to, as shown in fig. 2, the top of the base 04 is provided with a connection structure, the base 04 can be connected to the bottom of the lamp body 02, the connection structure is shown in fig. 2 as the top of the base 04 protrudes upwards, and an edge extending outwards is arranged below the top, so that the bottom of the assembly structure of the lamp body 02 is provided with a hole matched with the top protrusion of the base 04, and the clamping connection is realized. Of course, a screw thread may be provided on the top of the base 04, and a screw thread matching with the screw thread on the top of the base 04 may be provided on the bottom of the lamp body 02, so as to realize the screw connection.

With continued reference to fig. 2, a heat sink 05 may be further disposed below the interior of the lamp body 02. The heat sink 05 interfaces with circuitry in the base 04 to make electrical connection to external circuitry. The heat sink 05 has through holes penetrating the top and bottom of the heat sink 05, and the wires 03 are inserted into the circuit structure of the base 04 through the through holes. Preferably, the heat sink 05 can be surrounded by a propeller blade to form a hollow structure, as shown in fig. 2. In other embodiments, a hollow structure surrounded by the heat dissipation pipe may also be adopted. The hollow structure serves as the above-mentioned through hole so that the lead wire 03 passes through the heat sink 05. The heat sink 05 may be disposed inside the lamp body 02, may be disposed below the outside of the lamp body 02, or may be disposed in the base 04. When the heat sink 05 is disposed in the base 04, the height of the base 04 is greater than the height of the heat sink 05, thereby accommodating the heat sink 05. Of course, in other embodiments, the height of the heat spreader 05 may be equal to the height of the submount 04 or greater than the height of the submount 04 to achieve different thermal management capabilities.

Next, the light source module of the present invention is described in detail.

Referring to fig. 5, the light source module includes a circuit substrate 101; the LED chips 102 are disposed on the circuit substrate 101, and the LED chips 102 may be packaged by a package structure, and the package material is preferably a transparent colloid material. Here, the LED chip 102 is provided on both side surfaces of the circuit substrate 101. Because the thickness that adopts circuit substrate 101 is very little, is less than 1mm usually to improved the similarity of LED chip 101's light-emitting light distribution and traditional automobile-used bulb, effectively promoted the utilization ratio of light, made light-emitting more accord with automobile-used illumination standard simultaneously.

Referring to fig. 6, a plurality of LED chips 102 may also be disposed on a single side surface of the circuit substrate 101. The side of the circuit board 101 on which the LED chip 102 is provided may be used as an adhesive surface to be adhered to another circuit board 101. The two circuit substrates 101 in fig. 6 may be bonded together by, but not limited to, soldering, for example, solder paste soldering. The circuit board 101 may be a ceramic-based circuit board or a metal-based circuit board. Preferably, the metal-based circuit board may be a copper-based circuit board or an aluminum-based circuit board.

referring to fig. 7, a plurality of LED chips 102 are disposed on a single surface of a circuit substrate 101. The LED chip 102 is provided on one side of the circuit board 101. The other side of the circuit boards 101 serves as an adhesive surface, and a filler is interposed between the adhesive surfaces of the two circuit boards 101. The filling material is used for improving heat dissipation and enhancing bonding capability, and can be a heat-conducting organic material, such as heat-conducting silicone grease and the like. The bonding surfaces of the two circuit substrates 101 are bonded by metal soldering. The description of fig. 6 can be referred to for the welding mode, and the description is omitted here.

Referring to fig. 8, a chip circuit board 103 is further disposed at the bottom of the LED chip 102. The LED chip 102 is fixedly and electrically connected to the chip circuit board 103, and the chip circuit board 103 is fixedly connected to the circuit substrate 101. The connection between the chip circuit board 103 and the circuit substrate 101 may be performed by metal soldering, such as solder paste soldering. The chip circuit board 103 may be a ceramic-based circuit board or a metal-based circuit board. Preferably, the metal-based circuit board may be a copper-based circuit board or an aluminum-based circuit board.

In addition, the connection method of the LED chip 102 and the circuit substrate 101 may be, but not limited to, eutectic metal fusion connection. The thermal conductivity coefficient of eutectic metal fusion is greater than that of solder paste, so that the heat dissipation capability can be improved, and the thermal management of the LED chip 102 is enhanced.

Here, the LED chip 102 is further covered with an encapsulation structure, for example, an organic gel encapsulation. By adopting the package structure, the LED chip 102 is not damaged, the position of the LED chip 102 in the lamp body 02 (shown in fig. 2) of the light emitting lamp can be flexibly set, and the thickness of the groove 026 (shown in fig. 3) of the upper portion 023 of the lamp body 02 and the thickness of the light outlet 025 can be flexibly set, for example, whether the top of the LED chip 102 is flush with the top of the light outlet 025, or exceeds the top of the light outlet 025, or does not exceed the top of the light outlet 025.

To sum up, the light source module and the light emitting lamp of the present invention adopt the light source module formed by arranging a plurality of LED chips on the circuit substrate, so that the light source module is more flexible to use, and the application range of the light source module is expanded; furthermore, the arrangement combination of the LED chip and the circuit substrate may be on one side of the circuit substrate, or on both sides of the circuit substrate, or may be a single circuit substrate, or may be a combination of multiple circuit substrates; flexible configuration of the light source module is realized; compared with the traditional luminescent lamp, the back space between the surfaces with the LED chips in the light source module is greatly reduced, so that the emission range close to 180 degrees is realized on the single surface of the circuit substrate, the space between the two surfaces of the circuit substrate is small, namely the thickness of the circuit substrate is thinner, and the problem that the lamp body of the traditional luminescent lamp occupies larger volume and the luminescent lamp has black areas is solved. Furthermore, the utility model discloses a luminescent lamp sets up light source module in lamp body inner region when setting up, has increased light-emitting angle and radiation three-dimensional space angle, has avoided the appearance in above-mentioned black district, has realized all-round effective light-emitting. In addition, the light source module and the lamp body are set to be unified and integrated, and mechanical fixation is adopted, so that the stability of the whole structure of the luminescent lamp is improved, the heat propagation path is greatly shortened, the heat management capability of the light source module is improved, and the light attenuation is reduced. Furthermore, the light outlet adopts an inclined divergence design, so that the light outlet angle is further improved. In addition, the lower part of the lamp body is provided with the heat dissipation structure, the heat radiator is arranged below the lamp body, the heat radiator is used for actively dissipating heat, the heat dissipation structure is used for passively dissipating heat, the heat dissipation effect is improved, the time required by heat balance is shortened, and the light attenuation is greatly reduced; the heat dissipation structure is further made of metal, the surface of the metal is processed to form an oxide film, for example, anodic oxidation processing and the like are adopted, and the heat management of the light source module is enhanced.

Although the present invention has been described with reference to the preferred embodiments, which are given by way of illustration only, and not by way of limitation, it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. A light source module, comprising:

A circuit substrate;

a plurality of LED chips disposed on the circuit substrate; the LED chips are respectively arranged on the surfaces of the two sides of the circuit substrate; or a plurality of LED chips are arranged on one side surface of the circuit substrate, the other side surface of the circuit substrate is used as an adhesive surface, and the adhesive surfaces of the two circuit substrates are oppositely adhered.

2. The light source module of claim 1, wherein the circuit substrate has a filler material between the bonding surfaces.

3. The light source module of claim 1, wherein the bonding surfaces of the circuit substrates are bonded together by metal welding.

4. The light source module of claim 1, wherein the circuit substrate is a ceramic-based circuit board or a metal-based circuit board.

5. The light source module of claim 1, wherein the thickness of the circuit substrate is less than 1 mm.

6. The light source module of claim 1, wherein a chip circuit board is disposed at the bottom of the LED chip; the chip circuit board is fixedly connected to the circuit substrate.

7. The light source module of claim 1, wherein the LED chip is packaged with a package structure.