CN219350226U - High-power LED three-in-one ceramic bowl cup support and packaging structure thereof - Google Patents

Abstract

The utility model discloses a high-power LED three-in-one ceramic bowl cup support and a packaging structure thereof, wherein the bowl cup is fixedly arranged on the upper surface of the support, one side of the outer surface of the bowl cup is provided with a positive electrode identifier, the front surface of the support is divided into six metal pads by a ceramic insulating isolation belt, namely a positive metal pad, a positive two-metal pad, a positive three-metal pad, a positive four-metal pad, a positive five-metal pad and a positive six-metal pad, the back surface of the support is divided into seven metal pads by the ceramic insulating isolation belt, namely a back seven metal pad, a back eight metal pad, a back nine metal pad, a back ten metal pad and a back eleven metal pad.

Description

High-power LED three-in-one ceramic bowl cup support and packaging structure thereof

Technical Field

The utility model relates to the technical field of LEDs, in particular to a high-power LED three-in-one ceramic bowl cup bracket and a packaging structure thereof.

Background

Along with the continuous improvement of the technology level, the application of the LED (english full name: light Emitting Diode) is becoming wider and wider, for example, the application of infrared light in the fields of car safety monitoring, mobile device biological identification (iris, face, fingerprint identification), digital medical treatment (heartbeat blood oxygen sensing), electronic contest notebook computer, infrared touch panel, near infrared spectrometer, amplification and virtual reality/eye tracking, car sensing and car light reaching and unmanned aerial vehicle, proximity switch, etc.; the LED white light is applied to the fields of household illumination, commercial illumination, vehicle illumination, road illumination and the like;

in PR positioning of a wafer cutting machine, high-power high-brightness 850nm infrared light, 950nm infrared light and 6500K white light are required to be used for irradiation wafer positioning cutting, and currently three-color light in the market is an independent light source product.

Disclosure of Invention

The utility model aims to provide a high-power LED three-in-one ceramic bowl cup bracket and a packaging structure thereof, which are used for solving the problems in the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a three unification ceramic bowl cup supports of high power LED and packaging structure thereof, includes the support, support upper surface fixed mounting has the bowl cup, bowl cup surface one side is provided with the anodal identifier, the support front is cut apart into six metal pads by ceramic insulation median, is just one metal pad, just two metal pads, just three metal pads, just four metal pads, just five metal pads, just six metal pads respectively, the support back is cut apart into seven metal pads by ceramic insulation median, is back seven metal pads, back eight metal pads, back nine metal pads, back ten metal pads, back eleven metal pads, back twelve metal pads, back thirteen metal pads respectively, there is No. two infrared wafer through silver colloid on the just one metal pad, there is No. one infrared wafer through silver colloid solid on the just three metal pad, there is white light wafer through silver colloid solid on the just six metal pads.

Preferably, the positive first metal pad and the back seventh metal pad, the positive second metal pad and the back eighth metal pad, the positive third metal pad and the back ninth metal pad, the positive fourth metal pad and the back tenth metal pad, the positive fifth metal pad and the back eleventh metal pad, and the positive sixth metal pad and the back twelfth metal pad are respectively electrically connected through a plurality of positive back through holes.

Preferably, the bracket and the bowl cup are made of aluminum nitride ceramic materials.

Preferably, the first infrared wafer is an 850nm infrared wafer, the second infrared wafer is a 950nm infrared wafer, and the white light wafer is a 6500K white light wafer.

Preferably, the first infrared wafer is welded with the positive four-metal bonding pad through a gold wire, the second infrared wafer is welded with the positive two-metal bonding pad through a gold wire, the white light wafer is welded with the positive hardware bonding pad through a gold wire, and the first infrared wafer, the second infrared wafer and the white light wafer are packaged and cured through silica gel.

Preferably, the first infrared wafer has a length and a width of 35mil, the second infrared wafer has a length and a width of 42mil, and the white light wafer has a length and a width of 40mil.

Preferably, the bowl cup depth is 0.6mm.

Compared with the prior art, the utility model has the beneficial effects that:

the utility model integrates three wafers with different specifications in the same bracket, can effectively meet the use requirements of different brightness of the wafer cutting machine, does not occupy too much self space, can effectively solve the problems of space utilization and line simplification of LEDs in application, ensures that the luminous effect is more concentrated, meets the use requirements of wafer cutting, adopts a bowl design structure, can improve the light-emitting efficiency, can prevent light from overflowing from the edge, has good use performance, and has better heat conduction effect, particularly has high heat conduction system rate of more than or equal to 170W/mK, and effectively solves the heat dissipation problem.

Drawings

FIG. 1 is a schematic diagram of a front structure of an embodiment of the present utility model;

FIG. 2 is a schematic view of a back structure of an embodiment of the present utility model;

FIG. 3 is a schematic diagram of the internal structure of an LED three-in-one ceramic bracket according to an embodiment of the utility model;

FIG. 4 is a package structure product diagram of an embodiment of the present utility model;

fig. 5 is an equivalent circuit diagram of an LED package structure according to an embodiment of the present utility model.

In the figure: 101. a bracket; 102. a bowl cup; 103. a positive electrode identifier; 201. a positive metal pad; 202. a positive two metal bonding pad; 203. a positive three metal bonding pad; 204. positive four metal pads; 205. a metal pad; 206. a positive six metal pad; 207. a back seven metal bonding pad; 208. back eight metal bonding pads; 209. back nine metal pads; 210. back ten metal bonding pads; 211. back eleven metal pads; 212. back twelve metal pads; 213. back thirteen metal bonding pads; 214. front and back vias; 301. a first infrared wafer; 302. a second infrared wafer; 303. a white light chip; 401. gold wires; 501. silica gel.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Referring to fig. 1-5, an embodiment of the present utility model is provided: referring to fig. 1, 2 and 4, a three-in-one ceramic bowl cup support for a high-power LED and a packaging structure thereof include a support 101, wherein the external dimension of the support 101 is 5.00 x 0.98mm, a bowl cup 102 is fixedly mounted on the upper surface of the support 101, the support 101 and the bowl cup 102 are both made of aluminum nitride ceramic materials, the depth of the bowl cup 102 is 0.6mm, a positive electrode identifier 103 is arranged on one side of the outer surface of the bowl cup 102, the front surface of the support 101 is divided into six metal pads by a ceramic insulating isolation belt, the six metal pads are respectively a positive one metal pad 201, a positive two metal pad 202, a positive three metal pad 203, a positive four metal pad 204, a positive five metal pad 205 and a positive six metal pad 206, the back surface of the support 101 is divided into seven metal pads by a ceramic insulating isolation belt, the seven metal pads 207, the eight metal pads 208, the nine metal pads 209, the ten metal pads 210, the eleven metal pads 211, the twelve metal pads 212 and the thirteen metal pads 213 are respectively, the positive one metal pad 201 is fixed with a second infrared pad 302 by silver adhesive, the positive one wafer is fixed with a positive one metal pad 301 by a silver adhesive, and the positive three metal pad 203 is fixed with a positive one wafer 303 by a silver adhesive pad;

furthermore, the silver adhesive is a chip adhesive composed of epoxy resin and silver powder, has high heat conductivity of 25W/mK, mainly plays roles of chip fixing, heat conduction and electric conduction, and improves the fixing performance;

referring to fig. 1 and 2, the positive metal pad 201 and the back seventh metal pad 207, the positive two metal pad 202 and the back eighth metal pad 208, the positive three metal pad 203 and the back ninth metal pad 209, the positive four metal pad 204 and the back tenth metal pad 210, the positive five metal pad 205 and the back eleventh metal pad 211, and the positive six metal pad 206 and the back twelfth metal pad 212 are electrically connected through a plurality of positive back vias 214;

and back thirteen metal pads 213 are individual pads of one thermally conductive path.

Further, referring to fig. 4 specifically, the first infrared wafer 301 is soldered to the fourth metal pad 204 through a gold wire 401, the second infrared wafer 302 is soldered to the second metal pad 202 through a gold wire 401, the white light wafer 303 is soldered to the fifth metal pad 205 through a gold wire 401, and the first infrared wafer 301, the second infrared wafer 302 and the white light wafer 303 are packaged and cured through a silica gel 501, so as to complete the packaging effect;

in the embodiment, the gold wire has a specification of 1.0mil and a gold content of more than 99%, and mainly plays a role in the electrical connection between the chip and the bonding pad;

wherein, the equivalent circuit diagram after encapsulation is shown in figure 5;

further, to meet the requirements, the first infrared wafer 301 has a length and a width of 35mil, the second infrared wafer 302 has a length and a width of 42mil, and the white light wafer 303 has a length and a width of 40mil.

Working principle: the three-in-one LED product can be used by a person skilled in the art by adopting a conventional use method, the bracket 101 is installed in a working area and is connected with power, the use requirements of a wafer cutter for different brightness can be met by integrating the three groups of chips, and the three groups of chips are arranged, so that the problems of space utilization and line simplification of the LED in application can be effectively solved, the luminous effect is more concentrated, the use requirement of wafer cutting is met, the bowl-cup design structure is adopted, the light emitting efficiency can be improved, light overflow from the edge can be prevented, the bracket and the bowl cup made of aluminum nitride ceramic material have good heat conducting effect, and the heat dissipation problem is effectively solved, wherein the heat conducting effect is more than or equal to 170W/mK.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (7)

1. The utility model provides a three unification ceramic bowl cup supports of high power LED and packaging structure thereof, includes support (101), its characterized in that, support (101) upper surface fixed mounting has bowl cup (102), bowl cup (102) surface one side is provided with anodal identifier (103), support (101) openly is cut apart into six metal pads by ceramic insulation median, is just two metal pads (201) respectively, just two metal pads (202), just three metal pads (203), just four metal pads (204), just five metals pad (205), just six metal pads (206), support (101) back is cut apart into seven metal pads by ceramic insulation median, is back seven metal pads (207), back eight metal pads (208), back nine metal pads (209), back ten metal pads (210), back eleven metal pads (211), back twelve metal pads (212), back thirteen metal pads (213), just have a No. infrared wafer (302) through the silver colloid on the metal pad (201), just three metal pads (203) have a No. infrared wafer (301) through the silver colloid, on the white light wafer (303) has.

2. The high-power LED three-in-one ceramic bowl and cup support and packaging structure thereof according to claim 1, wherein the high-power LED three-in-one ceramic bowl and cup support is characterized in that: the positive metal pad (201) and the back seven metal pad (207), the positive two metal pad (202) and the back eight metal pad (208), the positive three metal pad (203) and the back nine metal pad (209), the positive four metal pad (204) and the back ten metal pad (210), the positive hardware pad (205) and the back eleven metal pad (211) and the positive six metal pad (206) and the back twelve metal pad (212) are respectively electrically connected through a plurality of positive back through holes (214).

3. The high-power LED three-in-one ceramic bowl and cup support and packaging structure thereof according to claim 1, wherein the high-power LED three-in-one ceramic bowl and cup support is characterized in that: the bracket (101) and the bowl cup (102) are made of aluminum nitride ceramic materials.

4. The high-power LED three-in-one ceramic bowl and cup support and packaging structure thereof according to claim 1, wherein the high-power LED three-in-one ceramic bowl and cup support is characterized in that: the first infrared wafer (301) is an 850nm infrared wafer, the second infrared wafer (302) is a 950nm infrared wafer, and the white light wafer (303) is a 6500K white light wafer (303).

5. The high-power LED three-in-one ceramic bowl and cup support and packaging structure thereof according to claim 1, wherein the high-power LED three-in-one ceramic bowl and cup support is characterized in that: the first infrared wafer (301) is welded with the positive four-metal bonding pad (204) through a gold wire (401), the second infrared wafer (302) is welded with the positive two-metal bonding pad (202) through the gold wire (401), the white light wafer (303) is welded with the positive five-metal bonding pad (205) through the gold wire (401), and the first infrared wafer (301), the second infrared wafer (302) and the white light wafer (303) are packaged and cured through silica gel (501).

6. The high-power LED three-in-one ceramic bowl and cup support and packaging structure thereof according to claim 1, wherein the high-power LED three-in-one ceramic bowl and cup support is characterized in that: the length and the width of the first infrared wafer (301) are 35mil, the length and the width of the second infrared wafer (302) are 42mil, and the length and the width of the white light wafer (303) are 40mil.

7. The high-power LED three-in-one ceramic bowl and cup support and packaging structure thereof according to claim 1, wherein the high-power LED three-in-one ceramic bowl and cup support is characterized in that: the depth of the bowl cup (102) is 0.6mm.

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