CN215771200U - Novel thermoelectric separation LED light source - Google Patents
Novel thermoelectric separation LED light source Download PDFInfo
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- CN215771200U CN215771200U CN202122023106.1U CN202122023106U CN215771200U CN 215771200 U CN215771200 U CN 215771200U CN 202122023106 U CN202122023106 U CN 202122023106U CN 215771200 U CN215771200 U CN 215771200U
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Abstract
The utility model discloses a novel thermoelectric separation LED light source, and relates to the technical field of LED products; including heat conduction epoxy and integrative silver-plated copper bowl cup of being fixed in heat conduction epoxy, the bottom fixedly connected with heat conduction copper post of silver-plated copper bowl cup, heat conduction copper post middle part and second copper electrode welding, the left side of heat conduction copper post is provided with first copper electrode, and during heat conduction epoxy was fixed in on the upper portion of first copper electrode, the lower extreme of first copper electrode stretched out heat conduction epoxy lower extreme. The thermoelectric separation device achieves the purpose of thermoelectric separation by arranging the first copper electrode, the second copper electrode, the heat-conducting copper column and the gold wire; when the single-electrode chip is electrified to generate heat, the heat is guided to the heat-conducting copper column through the electric-conducting heat-conducting silver adhesive to dissipate the heat, so that the heat-conducting epoxy resin which is externally sealed is prevented from yellowing due to the fact that the heat cannot be dissipated in time, the light-emitting efficiency of the LED is improved, and the service life of the LED is prolonged.
Description
Technical Field
The utility model relates to a novel thermoelectric separation LED light source, in particular to a thermoelectric separation LED light source using a single-electrode chip.
Background
At present, LEDs with high power and good heat dissipation performance in the market are concentrated on products such as SMD (surface mounted device) patches, ceramic COBs (chip on Board) and thermoelectric separation plug-in LEDs using double-electrode chips; the single-electrode chip and the double-electrode chip have different use occasions, but in some cases, because the single-electrode chip and the double-electrode chip are made of different materials, for example, compared with SiC blue/green light (single electrode) and sapphire blue/green light (double electrode), the reliability of the chips is different due to different substrate materials, the single electrode is better than the double electrode, the ESD of the single electrode is better than that of the double electrode, and the single-electrode chip is better than the double electrode.
However, the conventional single-electrode chip plug-in type LED cannot realize thermoelectric separation, a high-power single-electrode LED generates a large amount of heat when in use, accumulated heat cannot be timely and effectively dissipated, and the luminous efficiency and the service life of an LED light source are seriously affected, so that the novel thermoelectric separation LED light source is provided.
SUMMERY OF THE UTILITY MODEL
The utility model provides a novel thermoelectric separation LED light source, which aims to solve the technical problems that: the single-electrode chip plug-in type LED can not realize thermoelectric separation, and the high-power single-electrode LED has poor heat dissipation effect when in use.
In order to solve the technical problems, the utility model adopts the following technical scheme: the utility model provides a novel thermoelectric separation LED light source, is fixed in the silver-plated copper bowl cup in the heat conduction epoxy including heat conduction epoxy with an organic whole, the bottom fixedly connected with heat conduction copper post of silver-plated copper bowl cup, heat conduction copper post middle part and second copper electrode welding, the left side of heat conduction copper post is provided with first copper electrode, and in the upper portion of first copper electrode was fixed in heat conduction epoxy, the lower extreme of first copper electrode stretched out heat conduction epoxy lower extreme.
Furthermore, the upper part of the heat-conducting copper column is positioned in the heat-conducting epoxy resin, and the second copper electrode is positioned outside the heat-conducting epoxy resin.
Furthermore, a silver-plated copper bonding pad is fixed on the top of the first copper electrode through solder paste or silver glue.
Further, be provided with electrically conductive heat conduction silver-colored glue on the silvered copper bowl cup, silvered copper bowl cup is through electrically conductive heat conduction silver-colored glue and single electrode chip fixed mounting, the anodal of single electrode chip and the one end welded fastening of gold wire, the other end and the silvered copper pad welded fastening of gold wire, the gold wire is located inside the heat conduction epoxy.
Furthermore, the first copper electrode and the second copper electrode are distributed in parallel.
Furthermore, the heat-conducting copper column is made of T2 red copper material, and the silver plating thickness on the surface of the heat-conducting copper column is larger than 80 μm.
Compared with the prior art, the utility model has the beneficial effects that:
1. the LED chip thermoelectric separation device is provided with the first copper electrode, the second copper electrode, the silver-plated copper bonding pad, the gold wire and the heat conduction copper column, the second copper electrode is welded with the middle part of the heat conduction copper column, and the first copper electrode is electrically conducted with the LED chip through the gold wire because the second copper electrode is not in contact with the LED chip, so that the thermoelectric separation purpose is achieved.
2. According to the utility model, the middle part of the heat-conducting copper column is fixedly connected with the second copper electrode, so that no current passes through the lower part of the heat-conducting copper column, and no extra heat is generated; the middle-upper part of the heat-conducting copper column also generates a small part of heat through current, and the heat can be conducted to the lower part of the heat-conducting copper column to accelerate heat dissipation, so that a better heat-conducting and heat-dissipating effect is achieved, yellowing of the externally-sealed heat-conducting epoxy resin due to the fact that the heat cannot be dissipated in time is prevented, the light-emitting efficiency of the LED is improved, and the service life of the LED is prolonged.
Drawings
FIG. 1 is a schematic structural diagram of an embodiment of the present invention;
fig. 2 is a schematic top view of the present invention.
In the figure, 1, a single electrode chip; 2. plating a silver copper bowl cup; 3. electric and heat conductive silver adhesive; 4. a thermally conductive epoxy resin; 5. a gold wire; 6. silver-plated copper bonding pads; 7. a first copper electrode; 8. a second copper electrode; 9. a thermally conductive copper pillar.
Detailed Description
The utility model is further explained below with reference to the figures and the embodiments.
The embodiment of the utility model provides a novel thermoelectric separation LED light source, which comprises a heat-conducting epoxy resin 4 and a silver-plated copper bowl cup 2 integrally fixed in the heat-conducting epoxy resin 4, wherein the heat-conducting epoxy resin 4 is a transparent solid, the silver-plated copper bowl cup 2 can be replaced by an electric and heat-conducting platform, the bottom of the silver-plated copper bowl cup 2 is fixedly connected with a heat-conducting copper column 9, the middle part of the heat-conducting copper column 9 is welded with a second copper electrode 8, a first copper electrode 7 is arranged on the left side of the heat-conducting copper column 9, the upper part of the first copper electrode 7 is fixed in the heat-conducting epoxy resin 4, the lower end of the first copper electrode 7 extends out of the lower end of the heat-conducting epoxy resin 4, and the first copper electrode 7 is electrically conducted with a single electrode chip 1 through a gold wire 5 because the second copper electrode 8 is not in contact with the single electrode chip 1, so that the thermoelectric separation purpose is achieved.
The upper part of the heat-conducting copper column 9 is positioned in the heat-conducting epoxy resin 4, the second copper electrode 8 is positioned outside the heat-conducting epoxy resin 4, and the middle part of the heat-conducting copper column 9 is fixedly connected with the second copper electrode 8, so that no current passes through the lower part of the heat-conducting copper column 9, no extra heat is generated, the middle upper part of the heat-conducting copper column 9 can conduct electricity and also can play a certain heat dissipation role, and when the single electrode chip 1 is electrified to generate heat, the heat is guided to the heat-conducting copper column 9 through the electricity-conducting heat-conducting silver adhesive 3 to dissipate the heat; the middle upper part of the heat conduction copper column 9 also generates a small part of heat through current, and the heat can be conducted to the lower part of the heat conduction copper column 9 to accelerate heat dissipation, so that a better heat conduction and heat dissipation effect is achieved, the heat conduction epoxy resin 4 which is sealed outside is prevented from yellowing due to the heat, the light emitting efficiency of a product is improved, and the service life of an LED chip is prolonged.
The top of the first copper electrode 7 is fixed with a silver-plated copper pad 6 through solder paste or silver paste.
The silver-plated copper bowl cup 2 is provided with the electric and heat conductive silver adhesive 3, the electric and heat conductive silver adhesive 3 has good electric and heat conductive performance, the silver-plated copper bowl cup 2 is fixedly installed with the single electrode chip 1 through the electric and heat conductive silver adhesive 3, the single electrode chip 1 is placed into a 170 ℃ oven for curing after the fixing, the positive electrode of the single electrode chip 1 and one end of the gold wire 5 are welded and fixed through a welding machine after the curing, the other end of the gold wire 5 is welded and fixed with the silver-plated copper pad 6, the gold wire 5 is located inside the heat conductive epoxy resin 4, the heat conductive epoxy resin 4 is fixed around the single electrode chip 1 through a glue pouring mode after the series of fixing is completed, and the heat conductive epoxy resin 4 can effectively isolate the silver-plated copper pad 6 from the heat conductive copper column 9 and fix the heat conductive copper column 9, the silver-plated copper pad 6 and the first copper electrode 7.
The first copper electrode 7 and the second copper electrode 8 are arranged in parallel.
The heat conducting copper column 9 is made of T2 red copper material, and the silver plating thickness on the surface is more than 80 μm.
In summary, in the utility model, the second copper electrode 8 is not in contact with the single electrode chip 1, and the first copper electrode 7 is electrically conducted with the single electrode chip 1 through the gold wire 5, so that the purpose of thermoelectric separation is achieved, the middle part of the heat-conducting copper column 9 is fixedly connected with the second copper electrode 8, so that no current passes through the lower part of the heat-conducting copper column 9, and no heat is generated, the middle upper part of the heat-conducting copper column 9 can conduct electricity and also play a certain role in heat dissipation, and when the single electrode chip 1 is electrified to generate heat, the heat is guided to the heat-conducting copper column 9 through the electric-conducting heat-conducting silver adhesive 3 to dissipate the heat; the middle upper part of the heat-conducting copper column 9 also generates a small part of heat through current, and the heat can be conducted to the lower part of the heat-conducting copper column 9 to accelerate heat dissipation, so that a better heat-conducting and heat-dissipating effect is achieved, yellowing of the heat-conducting epoxy resin which is externally sealed due to the fact that the heat cannot be dissipated in time is prevented, the light-emitting efficiency of the LED is improved, and the service life of the LED is prolonged.
The above description is only for the purpose of illustrating the technical solutions of the present invention and not for the purpose of limiting the same, and other modifications or equivalent substitutions made by those skilled in the art to the technical solutions of the present invention should be covered within the scope of the claims of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (6)
1. A novel thermoelectric separation LED light source which is characterized in that: be fixed in silver-plated copper bowl cup (2) in heat conduction epoxy (4) including heat conduction epoxy (4) and an organic whole, the bottom fixedly connected with heat conduction copper post (9) of silver-plated copper bowl cup (2), heat conduction copper post (9) middle part and second copper electrode (8) welding, the left side of heat conduction copper post (9) is provided with first copper electrode (7), and the upper portion of first copper electrode (7) is fixed in heat conduction epoxy (4), and heat conduction epoxy (4) lower extreme is stretched out to the lower extreme of first copper electrode (7).
2. The novel thermoelectric separation LED light source as claimed in claim 1, wherein: the upper part of the heat conduction copper column (9) is positioned in the heat conduction epoxy resin (4), and the second copper electrode (8) is positioned outside the heat conduction epoxy resin (4).
3. The novel thermoelectric separation LED light source as claimed in claim 1, wherein: and a silver-plated copper bonding pad (6) is fixed on the top of the first copper electrode (7) through solder paste or silver adhesive.
4. The novel thermoelectric separation LED light source as claimed in claim 1, wherein: be provided with electrically conductive heat conduction silver colloid (3) on silvered copper bowl cup (2), silvered copper bowl cup (2) are through electrically conductive heat conduction silver colloid (3) and single electrode chip (1) fixed mounting, the anodal one end welded fastening with gold wire (5) of single electrode chip (1), the other end and silvered copper pad (6) welded fastening of gold wire (5), and gold wire (5) are located inside heat conduction epoxy (4).
5. The novel thermoelectric separation LED light source as claimed in claim 1, wherein: the first copper electrode (7) and the second copper electrode (8) are distributed in parallel.
6. The novel thermoelectric separation LED light source as claimed in claim 1, wherein: the heat-conducting copper column (9) is made of T2 red copper material, and the silver plating thickness on the surface of the heat-conducting copper column is more than 80 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122023106.1U CN215771200U (en) | 2021-08-26 | 2021-08-26 | Novel thermoelectric separation LED light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122023106.1U CN215771200U (en) | 2021-08-26 | 2021-08-26 | Novel thermoelectric separation LED light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215771200U true CN215771200U (en) | 2022-02-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122023106.1U Active CN215771200U (en) | 2021-08-26 | 2021-08-26 | Novel thermoelectric separation LED light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215771200U (en) |
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2021
- 2021-08-26 CN CN202122023106.1U patent/CN215771200U/en active Active
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