CN210778593U

CN210778593U - Double-colored COB light source

Info

Publication number: CN210778593U
Application number: CN201922491932.1U
Authority: CN
Inventors: 王志成
Original assignee: SHENZHEN GETIAN OPTO-ELECTRONICS CO LTD
Current assignee: SHENZHEN GETIAN OPTO-ELECTRONICS CO LTD
Priority date: 2019-12-30
Filing date: 2019-12-30
Publication date: 2020-06-16
Anticipated expiration: 2029-12-30

Abstract

A double-color COB light source relates to the technical field of COB light sources. It includes: a red copper substrate; an aluminum nitride ceramic support; four wafers; and, a lens; two paths of the wafer are coated with fluorescent powder; a copper foil circuit is arranged in the red copper substrate; a boss is etched on the red copper substrate; and, a plurality of pads; a jumper wire is arranged on the red copper substrate; the front surface and the back surface of the aluminum nitride ceramic support are communicated through copper column connection; a crystal fixing area is arranged on the aluminum nitride ceramic bracket; and, an electrical line; the surfaces of the lug boss, the bonding pad, the copper foil circuit and the aluminum nitride ceramic support are subjected to nickel-palladium-gold plating treatment; the wafer is enclosed into a square retaining wall structure through the enclosure glue; the wafer is adhered to the solid crystal area through a high-thermal-conductivity alloy; the wafer is welded on the substrate through gold wires; the aluminum nitride ceramic support is welded on the lug boss in a reflow mode; the lens is closely attached to and covers the surface of the wafer. Adopt above-mentioned technical scheme radiating effect good.

Description

Double-colored COB light source

Technical Field

The utility model relates to a COB light source technical field specifically relates to a double-colored COB light source.

Background

The COB light source is a high-light-efficiency integrated surface light source technology for directly attaching an LED chip to a mirror surface metal substrate with high light reflection rate, the technology eliminates the concept of a bracket, and has no electroless plating, reflow soldering and no surface mounting process, so that the process is reduced by about one third, and the cost is also saved by one third. The whole radiating effect of current COB light source is not good, urgently needs to improve.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to prior art's defect with not enough, provide a double-colored COB light source, have the good advantage of whole heat dissipation.

In order to achieve the above object, the utility model adopts the following technical scheme: a two-color COB light source, comprising: a red copper substrate; an aluminum nitride ceramic support; four wafers; and, a lens; two paths of the wafer are coated with fluorescent powder; a copper foil circuit is arranged in the red copper substrate; a boss is etched on the red copper substrate; and, a plurality of pads; a jumper wire for realizing thermoelectric separation is arranged on the red copper substrate; the front surface and the back surface of the aluminum nitride ceramic support are communicated through copper column connection; a crystal fixing area is arranged on the aluminum nitride ceramic bracket; and, an electrical line; the surfaces of the lug boss, the bonding pad, the copper foil circuit and the aluminum nitride ceramic support are all subjected to nickel-palladium-gold plating treatment; the wafer is enclosed into a square retaining wall structure through the enclosure glue; the wafer is adhered to the solid crystal area through a high-thermal-conductivity alloy; the wafer is welded on the substrate through gold wires; the aluminum nitride ceramic support is welded on the lug boss in a reflow mode; the lens is closely attached to and covers the surface of the wafer. The utility model discloses further set up, the electric line adopts 4 strings 1 parallel mode, can connect in series and parallel with the red copper base plate cluster of difference, accomplishes 4

strings

1 and, 2

strings

2 and, 4 strings 1 and.

The utility model discloses further set up, the red copper base plate specification of size is 40 x 36mm x 2 mm; the size specification of the lug boss is 4.76 multiplied by 4.76 mm; the size specification of the bonding pad is phi 5 mm.

The utility model discloses further set up, aluminium nitride ceramic support specification 7.0 x 7.0mm x 0.38 mm.

The utility model discloses further set up, the wafer is flip chip.

The utility model discloses further set up, lens are the glass piece of high luminousness low reflectivity.

After the technical scheme is adopted, the utility model discloses beneficial effect does:

1. in the utility model, the red copper substrate is used, which has high thermal conductivity, and the aluminum nitride ceramic bracket is used, which has high pressure resistance and high thermal conductivity, so that the COB double-color light source has good heat dissipation effect; the red copper substrate adopts a jumper wire mode, so that two paths of independent driving are realized, thermoelectric separation is also realized, heat emitted by the wafer during working can be timely transmitted to the heat dissipation plate through the substrate, the structure is simple and compact, the performance is stable, the service life of the COB light source is correspondingly prolonged, and mass production is facilitated; the high-thermal-conductivity alloy is adopted for welding and die bonding, so that the old process silver paste or insulating paste can be replaced for die bonding, and the wafer cannot fall off due to the influence of the environment; and fluorescent powder is dotted on the wafer, so that the COB dual-color light source can emit light with two colors.

2. The utility model discloses in, the wafer is flip chip, so the cracked problem of no gold thread prevents to appear the problem of the dead lamp of broken string because of electrical apparatus connected reason.

3. The utility model discloses in, lens are the glass piece of high luminousness low reflectivity, not only can improve the light transmissivity of light source, and the protection is glued the face and is not polluted and can also completely cut off the direct contact who glues face and environment, slows down the ageing of gluing the face, makes the life of product obtain greatly improving.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of the present invention;

FIG. 2 is a copper foil wiring diagram;

FIG. 3 is a diagram of a pad;

FIG. 4 is a front plan view of the rack;

FIG. 5 is a rear plan view of the bracket;

FIG. 6 is a view of a gold wire connection;

FIG. 7 is a front and back side view of the bracket with copper pillars attached.

Description of reference numerals: 1. a red copper substrate; 2. an aluminum nitride ceramic support; 3. a wafer; 4. a lens; 5. a boss; 6. a pad; 7. a copper foil circuit; 8. a copper pillar; 9. an electrical line; 10. and (4) gold wires.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment as required without making a contribution, but all the embodiments are protected by the patent law within the scope of the claims of the present invention.

This embodiment relates to a two-color COB light source, as shown in fig. 1-7, including: a red copper substrate 1; an aluminum nitride ceramic support 2; four wafers 3; and, a lens 4; the chip 3 has a path of fluorescent powder with two points; a copper foil circuit 7 is arranged in the red copper substrate 1; a boss 5 is etched on the red copper substrate 1; and, several pads 6; a jumper wire for realizing thermoelectric separation is arranged on the red copper substrate 1; the front surface and the back surface of the aluminum nitride ceramic support 2 are connected and communicated through a copper column 8; a crystal fixing area is arranged on the aluminum nitride ceramic bracket 2; and, an electric line 9; the surfaces of the boss 5, the bonding pad 6, the copper foil circuit 7 and the aluminum nitride ceramic bracket 2 are all subjected to nickel-palladium-gold plating treatment; the wafer (3) is enclosed into a square retaining wall structure through the wall glue; the wafer 3 is adhered to the solid crystal area through a high heat conduction alloy; the chip 3 is soldered on the substrate 1 by gold wires 10; the aluminum nitride ceramic bracket 2 is welded on the lug boss 5 in a reflow manner; the lens 4 is closely covered on the surface of the wafer 3. The COB double-color light source has the advantages that the red copper substrate 1 is used, high thermal conductivity is achieved, the aluminum nitride ceramic support 2 is used, high pressure resistance and high thermal conductivity are achieved, the COB double-color light source is good in heat dissipation effect, and high pressure resistance can reach more than 3000V; the maximum output current of a single wafer 3 can reach 6A, and the maximum power can reach 60W; in the circuit design, the bottom of a copper substrate is used as a positive electrode or a negative electrode in the prior art, thermoelectricity cannot be separated, the performance of a light source is poor, and the problem of cross lines exists at this time, a jumper mode is adopted, two paths of independent driving are achieved, thermoelectricity separation is also realized, heat emitted by a wafer 3 during working can be timely transmitted to a heat dissipation plate through the substrate, the structure is simple and compact, the performance is stable, the service life of the COB light source is correspondingly prolonged, and mass production is facilitated; the high-thermal-conductivity alloy is adopted for welding and die bonding, so that the old process silver paste or insulating paste can be replaced for die bonding, and the wafer 3 cannot fall off due to the influence of the environment; and fluorescent powder is dotted on the wafer 3, so that the COB dual-color light source can emit light with two colors.

The electric circuit 9 adopts a 4-string 1-parallel mode, can be connected with different red copper substrates 1 in series and parallel, achieves 4-string 1-parallel, 2-string 2-parallel and 4-string 1-parallel, and enables the types of products to be more various. In the present embodiment, as shown in fig. 2, 4 and 5, the electric wiring 9 is connected in 2 series 2 parallel to the copper foil wiring 7 on the red copper substrate 1.

In this embodiment, the red copper substrate 1 has a size specification of 40 × 36mm × 2 mm; the size specification of the boss 5 is 4.76 multiplied by 4.76 mm; the size specification of the bonding pad 6 is phi 5 mm; the dimension specification of the aluminum nitride ceramic bracket 2 is 7.0 multiplied by 7.0mm multiplied by 0.38 mm; the size is small, the structure is compact, and the production cost is saved.

In this embodiment, the chip 3 is a flip chip, so there is no problem of breaking the gold wire 10, and the problem of lamp failure due to electrical connection is prevented.

In this embodiment, lens 4 is the glass piece of high luminousness low reflectivity, not only can improve the light transmissivity of light source, and the protection is glued the face and is not polluted and can also completely cut off the direct contact who glues face and environment, slows down the ageing of gluing the face, makes the life of product obtain greatly improving.

The working principle of the utility model is as follows: a red copper substrate with good heat dissipation performance is used as a heat dissipation substrate, a boss 5, a plurality of bonding pads 6, a copper foil circuit 7 and a support made of aluminum nitride ceramics are etched on the red copper substrate, the surface of the aluminum nitride ceramic support 2 is subjected to gold plating treatment and is provided with a circuit 9, and then a solid crystal area is surrounded into a square retaining wall structure by enclosure glue; the flip chip is adhered to a die bonding area of the bracket through high-thermal-conductivity alloy die bonding, die bonding is carried out in a 2-in-parallel connection mode, and then the flip chip is coated on the die bonding area of the aluminum nitride ceramic bracket 2 through an eutectic furnace under the protection of nitrogen atmosphere; then, the surface of the wafer 3 is welded on the red copper substrate 1 through a gold thread 10, then, on the surface of a product after crystal solidification, corresponding fluorescent powder is coated on any two points of the wafer 3 according to different customer requirements, the dried fluorescent powder is baked, the aluminum nitride ceramic support 2 is welded on the boss 5 in a reflow mode, and finally, the lens 4 is covered, so that a completely designed bicolor COB light source is formed.

The above description is only for the purpose of illustration and not limitation, and other modifications or equivalent replacements made by those skilled in the art to the technical solution of the present invention should be covered by the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solution of the present invention.

Claims

1. A two-color COB light source, comprising: a red copper substrate (1); an aluminum nitride ceramic support (2); four wafers (3); and, a lens (4);

two fluorescent powder particles are coated on one path of the wafer (3);

a copper foil circuit (7) is arranged in the red copper substrate (1);

a boss (5) is etched on the red copper substrate (1); and, a number of pads (6);

a jumper wire for realizing thermoelectric separation is arranged on the red copper substrate (1);

the front surface and the back surface of the aluminum nitride ceramic support (2) are connected and communicated through a copper column (8);

a crystal fixing area is arranged on the aluminum nitride ceramic bracket (2); and, an electric line (9);

the surfaces of the lug boss (5), the bonding pad (6), the copper foil circuit (7) and the aluminum nitride ceramic support (2) are all subjected to nickel-palladium-gold plating treatment;

the wafer (3) is enclosed into a square retaining wall structure through the wall glue;

the wafer (3) is adhered to the solid crystal area through a high heat conduction alloy;

the wafer (3) is welded on the substrate (1) through gold wires (10);

the aluminum nitride ceramic support (2) is welded on the boss (5) in a reflow mode;

the lens (4) is closely attached to and covers the surface of the wafer (3).

2. A bi-color COB light source according to claim 1, characterized in that the electrical lines (9) are in a 4-string 1-parallel mode, and can be connected in series and parallel with different red copper substrates (1), making 4-string 1-parallel, 2-string 2-parallel, and 4-string 1-parallel.

3. Two-color COB light source according to claim 1, characterized in that the red copper substrate (1) has a size specification of 40 x 36mm x 2 mm; the size specification of the boss (5) is 4.76 multiplied by 4.76 mm; the size specification of the welding pad (6) is phi 5 mm.

4. Two-color COB light source according to claim 1, characterized in that the aluminium nitride ceramic support (2) has dimensions of 7.0 x 7.0mm x 0.38 mm.

5. Two-color COB light source according to claim 1, characterized in that the chip (3) is a flip chip.

6. Two-color COB light source according to claim 1, characterized in that the lens (4) is a high light transmission low reflectivity glass sheet.