CN210743984U

CN210743984U - 2-string 2-parallel common-cathode COB light source

Info

Publication number: CN210743984U
Application number: CN201922453853.1U
Authority: CN
Inventors: 王志成
Original assignee: SHENZHEN GETIAN OPTO-ELECTRONICS CO LTD
Current assignee: SHENZHEN GETIAN OPTO-ELECTRONICS CO LTD
Priority date: 2019-12-30
Filing date: 2019-12-30
Publication date: 2020-06-12
Anticipated expiration: 2029-12-30

Abstract

The utility model provides a 2 cluster 2 and common cathode COB light sources, it relates to COB light source technical field. It includes: a copper substrate; a support; four wafers; and, a lens; a copper foil circuit is arranged in the copper substrate; a boss is etched on the copper substrate; and, a plurality of pads; the copper foil circuit is designed between the boss and the bonding pad; the bracket is an insulating bracket; a die bonding area is arranged on the bracket; and, an electrical line; the surfaces of the lug boss, the bonding pad, the copper foil circuit and the bracket are all subjected to gold plating treatment; the wafer is adhered to the solid crystal area through a high-thermal-conductivity alloy; the wafer is welded on the copper substrate through gold wires; the surface of the wafer is coated with fluorescent powder; the support is welded on the lug boss in a reflow soldering mode; the lens is closely attached to and covers the surface of the wafer; the electric circuit is electrically connected with the copper foil circuit and the wafer 2 string 2 in parallel and in a common cathode mode. By adopting the technical scheme, the heat dissipation device has the advantages of good heat dissipation effect, stable performance and long service life.

Description

2-string 2-parallel common-cathode COB light source

Technical Field

The utility model relates to a COB light source technical field, concretely relates to 2 cluster 2 and negative pole COB light sources altogether.

Background

The COB light source is a high-light-efficiency integrated surface light source technology for directly attaching an LED chip to a mirror surface metal substrate with high light reflection rate, the technology eliminates the concept of a bracket, and has no electroless plating, reflow soldering and no surface mounting process, so that the process is reduced by about one third, and the cost is also saved by one third. At present, a stage lamp light source in the industry selects a PPA material + multi-channel Pin feet mode, or a ceramic substrate is used for fixing a wafer, the used crystal fixing material is insulating glue and silver glue, the thermal resistance is generally 12 ℃/W, the thermal resistance is relatively high, heat emitted by the wafer during working cannot be timely conducted to a heat dissipation plate, the junction temperature of the wafer can be increased, the luminous efficiency and luminous flux of the wafer are reduced, the service life of the wafer is seriously influenced by the increase of the junction temperature, and a novel COB light source needs to be found.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to prior art's defect and not enough, provide a 2 cluster 2 and common negative pole COB light sources, it is good to have the radiating effect, the stable performance, long service life's advantage.

In order to achieve the above object, the utility model adopts the following technical scheme: a 2-string 2-parallel co-cathode COB light source comprising: a copper substrate; a support; four wafers; and, a lens; a copper foil circuit is arranged in the copper substrate; a boss is etched on the copper substrate; and, a plurality of pads; the copper foil circuit is designed between the boss and the bonding pad; the bracket is an insulating bracket; a die bonding area is arranged on the bracket; and, an electrical line; the surfaces of the lug boss, the bonding pad, the copper foil circuit and the bracket are all subjected to gold plating treatment; the wafer is adhered to the solid crystal area through a high-thermal-conductivity alloy; the wafer is welded on the copper substrate through gold wires; the surface of the wafer is coated with fluorescent powder; the support is welded on the lug boss in a reflow soldering mode; the lens is closely attached to and covers the surface of the wafer; the electric circuit is electrically connected with the copper foil circuit and the wafer 2 string 2 in parallel and in a common cathode mode.

The utility model discloses further set up, a plurality of lock screw holes have been seted up on the copper base plate.

The utility model discloses further set up, the copper base plate is made for high heat conduction red copper.

The utility model discloses further set up, the support is made for insulating ceramic.

The utility model discloses further set up, copper base plate dimension specification is 26.8X 28mm X1.5 mm; the size specification of the boss is 3.53 multiplied by 3.23 mm.

The utility model discloses further set up, support size specification 7.0 x 7.0mm x 0.38 mm.

The utility model discloses further set up, lock screw hole specification is phi 6 mm.

The utility model discloses further set up, the wafer is flip chip.

The utility model discloses further set up, lens are the glass piece of high luminousness low reflectivity.

After the technical scheme is adopted, the utility model discloses beneficial effect does:

1. in the utility model, the copper substrate is not used as a conductor, but is used as a heat dissipation carrier, the circuit part and the heat layer part are arranged on different circuit layers, the thermoelectric separation is realized, the heat dissipated by the wafer during operation can be transmitted to the heat dissipation plate through the copper substrate in time, the structure is simple and compact, the performance is stable, the service life of the COB light source is correspondingly prolonged, and the large-batch production is facilitated; and the high-thermal-conductivity alloy is adopted for welding and die bonding, so that the old process silver paste or insulating paste can be replaced for die bonding, and the phenomenon that the wafer falls off due to the influence of the environment is avoided.

2. The utility model discloses in, the wafer is flip chip, so the cracked problem of no gold thread prevents to appear the problem of the dead lamp of broken string because of electrical apparatus connected reason.

3. The utility model discloses in, lens are the glass piece of high luminousness low reflectivity, not only can improve the light transmissivity of light source, and the protection is glued the face and is not polluted and can also completely cut off the direct contact who glues face and environment, slows down the ageing of gluing the face, makes the life of product obtain greatly improving.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of the present invention;

FIG. 2 is a copper foil wiring diagram;

FIG. 3 is a diagram of a pad;

FIG. 4 is a front plan view of the rack;

FIG. 5 is a rear plan view of the bracket;

FIG. 6 is a diagram of gold wire connections.

Description of reference numerals: 1. a copper substrate; 2. a support; 3. a wafer; 4. a lens; 5. a boss; 6. a pad; 7. a copper foil circuit; 8. an electrical line; 9. gold thread; 10. and locking the screw hole.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment as required without making a contribution, but all the embodiments are protected by the patent law within the scope of the claims of the present invention.

This embodiment relates to a 2-string 2-parallel-cathode COB light source, as shown in fig. 1-6, including: a copper substrate 1; a bracket 2; four wafers 3; and, a lens 4; a copper foil circuit 7 is arranged in the copper substrate 1; a boss 5 is etched on the copper substrate 1; and, several pads 6; the copper foil circuit 7 is designed between the boss 5 and the bonding pad 6; the bracket 2 is an insulating bracket; a die bonding area is arranged on the bracket 2; and, an electric line 8; gold plating is carried out on the surfaces of the boss 5, the bonding pad 6, the copper foil circuit 7 and the bracket 2; the wafer 3 is adhered to the crystal fixing area through the high heat conduction alloy; the chip 3 is soldered on the copper substrate 1 by gold wires 9; the surface of the wafer 3 is coated with fluorescent powder; the bracket 2 is welded on the lug boss 5 in a reflow soldering way; the lens 4 is closely covered on the surface of the wafer 3; the electric line 8 is electrically connected to the copper foil line 7 and the series 2 of

chips

3, 2 in parallel with a common cathode. The copper substrate 1 is not used as a conductor, but only used as a heat dissipation carrier, and the circuit part and the heat layer part are arranged on different circuit layers, so that thermoelectric separation is realized, heat dissipated by the wafer 3 during operation can be timely transmitted to a heat dissipation plate through the copper substrate 1, the structure is simple and compact, the performance is stable, the service life of the COB light source is correspondingly prolonged, and mass production is facilitated; in addition, the copper foil circuit 7 is designed between the boss 5 and the bonding pad 6, which is beneficial to reducing the volume of the copper substrate 1; the high-thermal-conductivity alloy is adopted for welding and die bonding, so that the old process silver paste or insulating paste can be replaced for die bonding, and the wafer 3 cannot fall off due to the influence of the environment.

As shown in fig. 1, the copper substrate 1 is provided with a plurality of locking screw holes 10 for screws to pass through and lock, in this embodiment, two locking screw holes 10 are located at two sides of the bracket 2.

In this embodiment, the copper substrate 1 is made of red copper with high thermal conductivity, the thermal conductivity of red copper is 398W/m · K, which is much higher than that of common aluminum, and the purity is 99.9%.

In this embodiment, the bracket 2 is made of insulating ceramic, and can be changed according to different requirements, such as high temperature resistant PC resin.

In this embodiment, the copper substrate 1 has a dimension of 26.8 × 28mm × 1.5 mm; the size specification of the boss 5 is 3.53 multiplied by 3.23 mm; the size specification of the bracket 2 is 7.0 multiplied by 7.0mm multiplied by 0.38 mm; the size specification of the lock screw hole 10 is phi 6mm, the size is small, the structure is compact, and the production cost is saved.

In this embodiment, the chip 3 is a flip chip, so there is no problem of breaking the gold wire 9, and the problem of lamp failure due to electrical connection is prevented.

In this embodiment, lens 4 is the glass piece of high luminousness low reflectivity, not only can improve the light transmissivity of light source, and the protection is glued the face and is not polluted and can also completely cut off the direct contact who glues face and environment, slows down the ageing of gluing the face, makes the life of product obtain greatly improving.

The working principle of the utility model is as follows: the method comprises the following steps of adopting a red copper material copper substrate 1 with good heat dissipation performance as a heat dissipation substrate, etching a boss 5 and a plurality of bonding pads 6 on the heat dissipation substrate, designing a copper foil circuit 7 and a support 2 made of aluminum nitride ceramics in a matching mode, carrying out gold plating treatment on the surface of the support 2 and designing a circuit 8, adhering a flip chip to a die bonding area of the support 2 through high-thermal-conductivity alloy die bonding, carrying out die bonding by using a 2-in-2-out connection mode, and then carrying out flip chip mounting on the die bonding area of the support 2 under the protection of nitrogen atmosphere through an eutectic furnace; then, the surface of the wafer 3 is welded on the copper substrate 1 through a gold wire 9, corresponding fluorescent powder is dotted on the surface of a product after crystal fixing is finished according to different customer requirements, the dried fluorescent powder is baked, the bracket 2 is welded on the boss 5 in a reflow mode, and finally the lens 4 is covered to form 2 strings of 2 parallel common-cathode COB light sources which are completely designed.

The above description is only for the purpose of illustration and not limitation, and other modifications or equivalent replacements made by those skilled in the art to the technical solution of the present invention should be covered by the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solution of the present invention.

Claims

1. A 2 string 2 parallel common cathode COB light source, comprising: a copper substrate (1); a support (2); four wafers (3); and, a lens (4);

a copper foil circuit (7) is arranged in the copper substrate (1);

a boss (5) is etched on the copper substrate (1); and, a number of pads (6);

the copper foil circuit (7) is designed between the boss (5) and the bonding pad (6);

the bracket (2) is an insulating bracket;

a crystal fixing area is arranged on the bracket (2); and, an electric line (8);

the surfaces of the boss (5), the bonding pad (6), the copper foil circuit (7) and the bracket (2) are all subjected to gold plating treatment;

the wafer (3) is adhered to the solid crystal area through a high heat conduction alloy;

the wafer (3) is welded on the copper substrate (1) through gold wires (9);

the surface of the wafer (3) is coated with fluorescent powder;

the bracket (2) is welded on the lug boss (5) in a reflow mode;

the lens (4) is closely attached to and covers the surface of the wafer (3);

the electric circuit (8) is electrically connected with the copper foil circuit (7) and the wafer (3)2 in series 2 in a common cathode manner.

2. 2-string 2-parallel-common-cathode COB light source according to claim 1, characterized in that the copper substrate (1) is provided with several lock screw holes (10).

3. 2-string 2-co-cathode COB light source according to claim 1, characterized in that the copper substrate (1) is made of highly heat-conductive red copper.

4. 2-string 2-co-cathode COB light source according to claim 1, characterized in that the support (2) is made of insulating ceramic.

5. 2-string 2-co-cathode COB light source according to claim 3, characterized in that the copper substrate (1) has dimensions 26.8 x 28mm x 1.5 mm; the size of the boss (5) is 3.53 multiplied by 3.23 mm.

6. 2-string 2-co-cathode COB light source according to claim 4, characterized in that the support (2) has dimensions of 7.0 x 7.0mm x 0.38 mm.

7. 2-string 2-co-cathode COB light source according to claim 2, characterized in that the lock screw hole (10) size specification is Φ 6 mm.

8. 2-string 2-co-cathode COB light source according to claim 1, characterized in that the wafer (3) is a flip-chip.

9. 2-string 2-co-cathode COB light source according to claim 1, characterized in that the lens (4) is a high light transmission low reflectivity glass sheet.