CN220474651U - High-power LED packaging structure - Google Patents
High-power LED packaging structure Download PDFInfo
- Publication number
- CN220474651U CN220474651U CN202321974456.9U CN202321974456U CN220474651U CN 220474651 U CN220474651 U CN 220474651U CN 202321974456 U CN202321974456 U CN 202321974456U CN 220474651 U CN220474651 U CN 220474651U
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- injection molding
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- power led
- metal die
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 48
- 239000000084 colloidal system Substances 0.000 claims abstract description 46
- 239000002184 metal Substances 0.000 claims abstract description 46
- 229910052751 metal Inorganic materials 0.000 claims abstract description 46
- 238000001746 injection moulding Methods 0.000 claims abstract description 39
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 239000004332 silver Substances 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 238000005538 encapsulation Methods 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000004519 grease Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a high-power LED packaging structure which comprises a metal die-bonding base, an anode support pin, a cathode support pin, a first conductive connecting wire, a second conductive connecting wire, an injection molding packaging colloid and a lens colloid.
Description
Technical Field
The utility model relates to the technical field of LEDs, in particular to a high-power LED packaging structure.
Background
The LED lamp is used as an important lighting device in various occasions such as daily life work of people, and the packaging design structure of the LED lamp is also correspondingly improved to meet different demands of consumers.
In the related art, when a high-power LED is used, the generated heat is generally much higher than that of a common low-power LED lamp, so that the heat generated by the high-power LED lamp cannot be effectively dissipated outwards due to the problem of a high-power LED packaging structure, the inside of the high-power LED lamp is at an excessively high temperature for a long time, and the service life of the high-power LED lamp is reduced.
Therefore, how to improve the high-power LED package structure so that the heat generated by the high-power LED package structure is effectively dissipated outwards is a technical problem that needs to be solved by those skilled in the art.
Disclosure of Invention
The embodiment of the utility model provides a high-power LED packaging structure, which aims to solve the technical problem of short service life caused by the problem of heat dissipation performance of the high-power LED packaging structure in the related art.
In a first aspect, an embodiment of the present utility model provides a high power LED package structure, including:
the LED module comprises a metal die bonding base, wherein a die bonding region is arranged on the upper surface of the metal die bonding base, the die bonding region is used for arranging an LED chip, and the LED chip is fixed on the die bonding region through silver colloid;
the support pins comprise an anode support pin and a cathode support pin, and at least one fixing through hole is respectively formed in the anode support pin and the cathode support pin;
the first conductive connecting wire is used for connecting the anode of the LED chip and the anode bracket pin;
the second conductive connecting wire is used for connecting the negative electrode of the LED chip and the negative electrode support pin;
the injection molding packaging colloid is used for fixedly packaging the metal die bonding base, the anode support pin and the cathode support pin; wherein the lower surface of the metal die bonding base is exposed out of the injection molding packaging adhesive; the positive electrode support pins and the negative electrode support pins extend out of the injection molding encapsulation adhesive, so that at least one of the fixing passages positioned on the positive electrode support pins and the negative electrode support pins is positioned outside the injection molding encapsulation adhesive; the injection molding packaging colloid, the metal die bonding base, the anode support pin and the cathode support pin form a support cup, and fluorescent glue is arranged in the support cup;
and the lens colloid is arranged above the bracket cup and is used for transmitting light rays emitted by the LED chip.
The high-power LED packaging structure provided by the embodiment of the utility model has at least the following beneficial effects:
the embodiment of the utility model discloses a high-power LED packaging structure, which is provided with a metal die bonding base, an anode support pin, a cathode support pin, a first conductive connecting wire, a second conductive connecting wire, an injection molding packaging colloid and a lens colloid; the LED packaging structure comprises a metal die bonding base, a die bonding area, a first conductive connecting wire, a second conductive connecting wire, a lens colloid, a support cup, a fluorescent glue, a lens colloid and a high-power LED packaging structure, wherein the metal die bonding base is provided with the die bonding area, the LED chip is fixed on the die bonding area through silver glue, the first conductive connecting wire is used for connecting an anode and an anode support pin of the LED chip, the second conductive connecting wire is used for connecting a cathode and an anode support pin of the LED chip, the metal die bonding base, the anode support pin and the anode support pin are respectively fixedly packaged by the injection molding packaging colloid, the lower surface of the metal die bonding base is exposed out of the injection molding packaging colloid, the anode support pin and the anode support pin extend out of the injection molding packaging colloid, at least one fixing through hole on the anode support pin and the anode support pin is located out of the injection molding packaging colloid, in addition, the injection molding packaging colloid, the metal die bonding base, the anode support pin and the anode support pin form the support cup, the fluorescent glue is arranged in the support cup, and the lens colloid is used for transmitting light emitted by the LED chip outwards.
According to the high-power LED packaging structure of other embodiments of the utility model, the metal die bonding base is made of metal copper;
both sides of the metal die bonding base are provided with buckling structures.
According to other embodiments of the present utility model, the positive electrode support pin includes a first segment pin and a second segment pin;
the first section of pins are provided with first fixing welding spots for being welded and fixed with the first conductive connecting wires, and the first section of pins are wrapped in the injection molding packaging colloid;
and 2 fixing through holes are formed in the second-section pins, and the second-section pins extend out of the injection molding packaging adhesive body.
According to other embodiments of the present utility model, the high-power LED package structure, the negative support pin includes a third segment pin and a fourth segment pin;
the third section of pins are provided with second fixing welding spots for being welded and fixed with the second conductive connecting wires, and the third section of pins are wrapped in the injection molding packaging colloid;
and 2 fixing through holes are formed in the fourth-section pin, and the fourth-section pin extends out of the injection molding packaging adhesive body.
According to the high-power LED packaging structure of other embodiments of the present utility model, the positive electrode support pin and the negative electrode support pin are respectively located at two opposite sides of the metal die bonding base.
According to the high-power LED packaging structure of other embodiments of the utility model, the first conductive connecting wire is a first arc-shaped gold wire;
the second conductive connecting wire is a second arc gold wire.
According to the high-power LED packaging structure of other embodiments of the utility model, the upper surface of the metal die bond base is provided with a silver coating.
According to the high-power LED packaging structure of other embodiments of the utility model, the lower surface of the metal die bonding base is provided with heat conduction silicone grease.
According to the high-power LED packaging structure of other embodiments of the present utility model, the lens colloid is formed by dispensing the lens colloid, and the lens colloid is made of silica gel.
Drawings
FIG. 1 is a schematic diagram illustrating a side view of a high power LED package structure according to an embodiment of the present utility model;
FIG. 2 is a schematic top view of a high power LED package structure according to an embodiment of the present utility model;
fig. 3 is a schematic diagram illustrating a side view of a high-power LED package structure according to an embodiment of the present utility model when the package structure is actually mounted and used.
Detailed Description
The conception and technical effects of the present utility model will be clearly and completely described in conjunction with the following examples to fully understand the objects, features and effects of the present utility model. It is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments, and that other embodiments obtained by those skilled in the art without inventive effort are within the scope of the present utility model based on the embodiments of the present utility model.
In the description of the embodiments of the present utility model, if "several" is referred to, it means more than one, if "multiple" is referred to, it is understood that the number is not included if "greater than", "less than", "exceeding", and it is understood that the number is included if "above", "below", "within" is referred to. If reference is made to "first", "second" it is to be understood as being used for distinguishing technical features and not as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
Referring to fig. 1, an embodiment of the present utility model provides a high-power LED package structure, which includes a metal die attach base 100, an LED chip 200, a support pin including a positive support pin 310 and a negative support pin 320, a first conductive connection line 410, a second conductive connection line 420, an injection molding encapsulation colloid 500, and a lens colloid 700; wherein, at least one fixing through hole is arranged on the anode support pin 310 and the cathode support pin 320, a die bonding area is arranged on the upper surface of the metal die bonding base 100, the die bonding area is used for fixing the LED chip 200, and the LED chip 200 is fixed on the die bonding area through silver colloid. In addition, the first conductive connection wire 410 is used for connecting the anode and the anode support pin 310 of the LED chip 200, the second conductive connection wire 420 is used for connecting the cathode and the cathode support pin 320 of the LED chip 200, the injection molding encapsulation colloid 500 is used for encapsulating and fixing the metal die bond base 100, the anode support pin 310 and the cathode support pin 320, the lower surface of the metal die bond base 100 is exposed out of the injection molding encapsulation colloid 500, and the anode support pin 310 and the cathode support pin 320 extend out of the injection molding encapsulation colloid 500, so that at least one fixing through hole located in the anode support pin 310 and at least one fixing through hole located in the cathode support pin 320 are located out of the injection molding encapsulation colloid 500. In this embodiment, after the metal die bond base 100, the positive electrode support pin 310 and the negative electrode support pin 320 are fixed and packaged by the injection molding encapsulation colloid 500, a cavity area, i.e. a support cup 600 is formed, fluorescent glue for adjusting the color temperature of light emitted by the LED chip is disposed in the support cup 600, and the fluorescent glue is also used for protecting the first conductive connection 410 and the second conductive connection wire 420 and radiating heat generated by the LED chip 200. The lens body 700 is disposed above the bracket cup 600, and encapsulates the LED chip 200, the first conductive connection line 410, and the second conductive connection line 420 in the bracket cup 600, and is used for transmitting the light emitted by the LED chip 200. According to the high-power LED packaging structure, the metal die bonding base 100 which is easy to transfer heat conduction is adopted, the LED chip 200 is fixed on the die bonding area of the metal die bonding base 100 by adopting silver colloid, and then heat generated by the LED chip 200 can be effectively transferred outwards through the metal die bonding base 100, so that the technical problem that the service life of the high-power LED packaging structure in the related art is low due to the fact that the heat generated by the LED chip cannot be effectively dissipated is solved.
Referring to fig. 1, in some embodiments, the first conductive connection line 410 includes a first arcuate gold wire and the second conductive connection line includes a second arcuate gold wire; the gold wires have stable and good conductivity and toughness, and are arranged in an arc-shaped structure, so that the first conductive connecting wire 410 or the second connecting wire 420 cannot be broken due to temperature rise even under higher environmental conditions, and the LED chip 200 cannot normally be electrified to work.
Referring to fig. 1, in other embodiments, a silver coating is coated on the upper surface of the metal die-bonding base 100, the silver coating has a good light reflection effect, light can be effectively reflected and transmitted, and the light emitted by the LED chip 200 can be effectively concentrated and transmitted outwards through the lens colloid 700 by coating the silver coating on the upper surface of the metal die-bonding base 100, so that the light-emitting brightness of the LED lamp is effectively improved, and the characteristic that better illumination brightness can be provided under the same power is realized.
Referring to fig. 1, in some embodiments, the metal die bond pad 100 is made of metal copper, and the metal copper has good heat conducting property, so that heat generated during operation of the LED chip 200 can be dissipated outwards through the metal die bond pad 100, so that the operating environment temperature of the LED chip 200 is in a lower environment, and the service life of the LED chip 200 is ensured. In addition, in this embodiment, two sides of the metal die-bonding base 100 are further provided with fastening structures respectively, wherein the first side is provided with a first fastening structure 110, the second side is provided with a second fastening structure 120, and when the first fastening structure 110 and the second fastening structure 120 are used for being fixedly combined with the injection molding packaging colloid 500, the first fastening structure and the second fastening structure 120 can be combined with the injection molding packaging colloid 500 more firmly, so that the overall structure of the high-power LED packaging structure implemented by the utility model is more stable.
Referring to fig. 1 and 2, in some embodiments, positive support pin 310 includes a first segment pin 311 and a second segment pin 312; wherein, the first section pin 311 wraps the injection molding package colloid 500, a first fixing welding spot is provided on the first section pin 311, the first fixing welding spot is used for being welded and fixed with the first conductive connecting wire 410, 2 fixing through holes are provided on the second section pin 312, the fixing through holes comprise a first fixing through 313 and a second fixing through hole 314, the second section pin 312 extends out of the injection molding package colloid 500 and is positioned outside the injection molding package colloid 500 through the first fixing through 313 and the second fixing through hole 314.
Referring to fig. 1 and 2, in some embodiments, negative support pin 320 includes a third segment pin 321 and a fourth segment pin 322; wherein, the third section pin 321 is provided with a second fixing solder joint, the second fixing solder joint is used for being welded and fixed with the second conductive connecting wire 420, the fourth section pin 322 is provided with 2 fixing through holes, including a third fixing through hole 323 and a fourth fixing through hole 324, the fourth section pin 322 extends out of the injection molding packaging colloid 500 and the third fixing through hole 323 and the fourth fixing through hole 324 are located outside the injection molding packaging colloid 500.
Referring to fig. 1 and 2, in some embodiments, the positive support pins 310 and the negative support pins 320 are disposed on opposite sides of the metal die attach base 100, respectively, and in order to make the positive support pins 310 and the negative support pins 320 better combined with the fixation of the injection molding encapsulant 500, and to provide easier installation for the user. The first section pin 311 and the second section pin 312 of the positive electrode support pin 310 have a certain height difference, the third section pin 321 and the fourth section pin 322 of the negative electrode support pin also have a consistent height difference, the first section pin 311 and the third section pin 321 are positioned at the same height position, and the second section pin 312 and the fourth section pin 322 are positioned at the same height position.
Referring to fig. 3, the following describes a mounting and using process of the high-power LED package structure according to an embodiment of the present utility model. In this embodiment, the present utility model is applied to the circuit substrate 800, wherein the high-power LED package structure is integrally fixed on the circuit substrate 800 by the first fixing screw 910, the second fixing screw 920, the third fixing screw 930 and the fourth fixing screw 940 through the first fixing through hole 313, the second fixing through hole 314, the third fixing through hole 323 and the fourth fixing through hole 324, respectively. In this embodiment, in order to further improve the heat dissipation effect of the high-power LED package structure, the lower surface of the metal die-bonding base 100 is provided with the heat-conducting silicone grease 810 and then attached to the circuit substrate 800, so that heat generated during the operation of the LED chip 200 is transmitted outwards through the silver paste, the metal die-bonding base 100, the heat-conducting silicone grease 810 and the circuit substrate 800, thereby ensuring that the operating temperature of the LED chip 200 is lower and the service life of the LED chip 200 is prolonged. In addition, in the embodiment, the lens colloid 700 is made of silica gel, so that the lens colloid 700 has better high temperature resistance and waterproof performance.
The embodiments of the present utility model have been described in detail with reference to the accompanying drawings, but the present utility model is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present utility model. Furthermore, embodiments of the utility model and features of the embodiments may be combined with each other without conflict.
Claims (9)
1. A high power LED package structure, comprising:
the LED module comprises a metal die bonding base, wherein a die bonding region is arranged on the upper surface of the metal die bonding base, the die bonding region is used for arranging an LED chip, and the LED chip is fixed on the die bonding region through silver colloid;
the support pins comprise an anode support pin and a cathode support pin, and at least one fixing through hole is respectively formed in the anode support pin and the cathode support pin;
the first conductive connecting wire is used for connecting the anode of the LED chip and the anode bracket pin;
the second conductive connecting wire is used for connecting the negative electrode of the LED chip and the negative electrode support pin;
the injection molding packaging colloid is used for fixedly packaging the metal die bonding base, the anode support pin and the cathode support pin; wherein the lower surface of the metal die bonding base is exposed out of the injection molding packaging adhesive; the positive electrode support pins and the negative electrode support pins extend out of the injection molding encapsulation adhesive, so that at least one of the fixing passages positioned on the positive electrode support pins and the negative electrode support pins is positioned outside the injection molding encapsulation adhesive; the injection molding packaging colloid, the metal die bonding base, the anode support pin and the cathode support pin form a support cup, and fluorescent glue is arranged in the support cup;
and the lens colloid is arranged above the bracket cup and is used for transmitting light rays emitted by the LED chip.
2. The high-power LED package structure of claim 1, wherein said metal die attach submount is metallic copper;
both sides of the metal die bonding base are provided with buckling structures.
3. The high power LED package structure of claim 1 or 2, wherein the positive support pin comprises a first segment pin and a second segment pin;
the first section of pins are provided with first fixing welding spots for being welded and fixed with the first conductive connecting wires, and the first section of pins are wrapped in the injection molding packaging colloid;
and 2 fixing through holes are formed in the second-section pins, and the second-section pins extend out of the injection molding packaging adhesive body.
4. The high power LED package structure of claim 3, wherein said negative support pins comprise a third segment pin and a fourth segment pin;
the third section of pins are provided with second fixing welding spots for being welded and fixed with the second conductive connecting wires, and the third section of pins are wrapped in the injection molding packaging colloid;
and 2 fixing through holes are formed in the fourth-section pin, and the fourth-section pin extends out of the injection molding packaging adhesive body.
5. The high power LED package structure of claim 4, wherein said positive support pins and said negative support pins are on opposite sides of said metal die attach mount, respectively.
6. The high power LED package structure of claim 1 or 2, wherein the first electrically conductive connection line is a first arcuate gold wire;
the second conductive connecting wire is a second arc gold wire.
7. The high power LED package structure of claim 1, 2, 4 or 5, wherein the upper surface of the metal die attach submount is provided with a silver coating.
8. The high power LED package structure of claim 7, wherein the lower surface of said metal fixture base is provided with thermally conductive silicone.
9. The high-power LED package structure of claim 1, 2 or 8, wherein the lens gel is formed by dispensing a lens gel, and the lens gel is made of a silicone gel material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321974456.9U CN220474651U (en) | 2023-07-25 | 2023-07-25 | High-power LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321974456.9U CN220474651U (en) | 2023-07-25 | 2023-07-25 | High-power LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220474651U true CN220474651U (en) | 2024-02-09 |
Family
ID=89774810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321974456.9U Active CN220474651U (en) | 2023-07-25 | 2023-07-25 | High-power LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220474651U (en) |
-
2023
- 2023-07-25 CN CN202321974456.9U patent/CN220474651U/en active Active
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