CN210928123U - Copper substrate easy to radiate heat - Google Patents
Copper substrate easy to radiate heat Download PDFInfo
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- CN210928123U CN210928123U CN201921429934.1U CN201921429934U CN210928123U CN 210928123 U CN210928123 U CN 210928123U CN 201921429934 U CN201921429934 U CN 201921429934U CN 210928123 U CN210928123 U CN 210928123U
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- heat
- heat dissipation
- copper substrate
- copper
- plate
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Abstract
The utility model discloses an easy radiating copper base plate, include: a body assembly including a base plate, a thermally conductive insulating block, and an insulating frame; the heat conduction assembly comprises a copper substrate body, an aluminum heat conduction sheet, a copper-clad laminate, a heat conduction insulation sheet, a graphite heat dissipation film, a welding layer, a composite plate and a through hole, wherein the aluminum heat conduction sheet is fixedly connected to the top of the copper substrate body; when the heat dissipation component is used, a heat source can dissipate heat through multiple channels such as an aluminum heat conduction sheet, a copper foil clad laminate and a graphite heat dissipation film, the surface of the heat dissipation component is provided with the insulating frame, the contact area of the copper substrate body and air is increased, the heat dissipation range of the copper substrate body is enlarged, the thermal resistance of a circuit is reduced, and the performance of related elements is more stable, so that the problems that the heat dissipation mode of the existing copper substrate heat dissipation component is passive, the heat conduction performance is poor and the copper substrate cannot be efficiently cooled are solved.
Description
Technical Field
The utility model relates to a copper base plate heat dissipation technical field specifically is an easy radiating copper base plate.
Background
Generally, there are gold immersion copper substrate, silver plating copper substrate, tin spraying copper substrate, oxidation resistant copper substrate, etc. The copper substrate and the copper substrate circuit layer are required to have large current carrying capacity, so that a thicker copper foil is used, the thickness is generally 35-280 mu m, the heat conduction insulating layer is the core technology of the copper substrate, the core heat conduction component is composed of aluminum oxide and silicon powder and a polymer filled with epoxy resin, the heat resistance is small, the viscoelasticity performance is excellent, the heat aging resistance is realized, and the mechanical and thermal stress can be borne. The copper substrate metal base layer is a supporting member of a copper substrate, which is required to have high thermal conductivity, and is generally a copper plate, and a copper plate (wherein the copper plate can provide better thermal conductivity) can be used, and is suitable for conventional machining such as drilling, punching, cutting and the like.
In the LED illumination product, the copper substrate is an important part of the LED illumination product, the copper substrate can play a role in fixing the LED lamp source, and meanwhile, the internal circuit of the copper substrate is connected with the control circuit to conduct electricity so as to supply power to the LED lamp source. Because the copper substrate can conduct heat, in the process of conducting electricity, heat is easily generated to enable the circuit to generate thermal resistance so as to influence the normal operation of the circuit and enable the LED lamp source to emit light unstably, a heat dissipation element needs to be added to the copper substrate to achieve heat dissipation, but the existing heat dissipation element of the copper substrate is passive in heat dissipation mode and poor in heat conduction performance, and cannot enable the copper substrate to achieve efficient heat dissipation, and therefore the copper substrate easy to dissipate heat is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an easy radiating copper base plate to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a copper substrate susceptible to heat dissipation, comprising:
a body assembly including a base plate, a thermally conductive insulating block, and an insulating frame;
the heat conduction assembly comprises a copper substrate body, an aluminum heat conduction sheet, a copper-clad laminate, a heat conduction insulation sheet, a graphite heat dissipation film, a welding layer, a composite plate and a through hole, wherein the aluminum heat conduction sheet is fixedly connected to the top of the copper substrate body, the copper-clad laminate is arranged on one side, away from the copper substrate body, of the aluminum heat conduction sheet, the heat conduction insulation sheet is arranged on one side, away from the aluminum heat conduction sheet, of the copper-clad laminate, and the graphite heat dissipation film is fixedly connected to the bottom of the copper substrate body;
the heat dissipation assembly comprises a polypropylene layer, a copper foil layer, a heat absorption plate, a punched heat dissipation plate, an aluminum alloy punched heat dissipation plate, heat dissipation holes, a phase-change crystal region and a phase-change crystal block.
As further preferable in the present technical solution: the heat-conducting insulating blocks are fixedly connected to the two sides of the top of the bottom plate, and the insulating frames are fixedly connected to the tops of the two inner sides of the heat-conducting insulating blocks.
As further preferable in the present technical solution: the bottom fixedly connected with welding layer of graphite heat dissipation membrane, the one side that graphite heat dissipation membrane was kept away from to the welding layer is provided with the composite sheet.
As further preferable in the present technical solution: the through-holes are formed in the two sides of the surface of the heat conduction assembly, the number of the through-holes is four, and the through-holes are symmetrically arranged.
As further preferable in the present technical solution: the heat sink is characterized in that a copper foil layer is fixedly connected to the top of the polypropylene layer, a heat absorbing plate is arranged on one side, away from the polypropylene layer, of the copper foil layer, a punched hole heat dissipation plate is fixedly connected to the bottom of the polypropylene layer, and an aluminum alloy punched hole heat dissipation plate is arranged on one side, away from the polypropylene layer, of the punched hole heat dissipation plate.
As further preferable in the present technical solution: the surface of the punching heat dissipation plate is provided with heat dissipation holes, the inner side wall of the heat absorption plate is provided with a phase change crystal area, and a phase change crystal block is embedded in the surface of the phase change crystal area.
Compared with the prior art, the beneficial effects of the utility model are that: when the heat dissipation component is used, a heat source can dissipate heat through a plurality of channels such as an aluminum heat conduction sheet, a copper foil clad laminate and a graphite heat dissipation film, the insulating frame is arranged on the surfaces of the heat dissipation component and the heat conduction component, the contact area of the copper substrate body and air is increased, the heat dissipation range of the copper substrate body is expanded, the thermal resistance of a circuit is reduced, and the performance of related elements is more stable, so that the problems that the heat dissipation mode of the existing copper substrate heat dissipation component is passive, the heat conduction performance is poor and the copper substrate cannot be efficiently cooled are solved.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of the heat conducting assembly of the present invention;
fig. 3 is a schematic top view of the heat conducting assembly of the present invention;
fig. 4 is a schematic structural view of the heat dissipation assembly of the present invention;
FIG. 5 is a schematic top view of the punched heat sink of the present invention;
fig. 6 is a schematic structural diagram of the phase-change crystal region of the present invention.
In the figure: 10. a body assembly; 11. a base plate; 12. a heat-conducting insulating block; 13. an insulating frame; 20. a heat conducting component; 21. a copper substrate body; 22. an aluminum heat-conducting sheet; 23. a copper clad laminate; 24. a thermally conductive insulating sheet; 25. a graphite heat dissipation film; 26. welding layer; 27. a composite board; 28. a through hole; 30. a heat dissipating component; 31. a polypropylene layer; 32. a copper foil layer; 33. a heat absorbing plate; 34. punching a heat dissipation plate; 35. an aluminum alloy punched heat dissipation plate; 36. heat dissipation holes; 37. a phase change crystal region; 38. and (4) phase-change crystal blocks.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Examples
Referring to fig. 1-6, the present invention provides a technical solution: a copper substrate susceptible to heat dissipation, comprising:
a main body assembly 10, wherein the main body assembly 10 comprises a bottom plate 11, a heat conducting insulation block 12 and an insulation frame 13;
the heat conducting assembly 20 comprises a copper substrate body 21, an aluminum heat conducting sheet 22, a copper clad laminate 23, a heat conducting insulating sheet 24, a graphite heat dissipation film 25, a welding layer 26, a composite plate 27 and a through hole 28, wherein the aluminum heat conducting sheet 22 is fixedly connected to the top of the copper substrate body 21, the copper clad laminate 23 is arranged on one side, away from the copper substrate body 21, of the aluminum heat conducting sheet 22, the heat conducting insulating sheet 24 is arranged on one side, away from the aluminum heat conducting sheet 22, of the copper clad laminate 23, and the graphite heat dissipation film 25 is fixedly connected to the bottom of the copper substrate body 21;
the heat dissipation assembly 30 comprises a polypropylene layer 31, a copper foil layer 32, a heat absorption plate 33, a punched heat dissipation plate 34, an aluminum alloy punched heat dissipation plate 35, heat dissipation holes 36, a phase change crystal region 37 and a phase change crystal block 38.
In this embodiment, specifically: heat-conducting insulating blocks 12 are fixedly connected to both sides of the top of the bottom plate 11, and insulating frames 13 are fixedly connected to the tops of the inner sides of the two heat-conducting insulating blocks 12; through the above arrangement, the bottom plate 11 can fix the heat conducting component 20 and the heat radiating component 30, and the heat conducting insulating block 12 and the insulating frame 13 can increase the insulating property of the copper substrate, thereby preventing the occurrence of electric leakage and damaging components.
In this embodiment, specifically: the bottom of the graphite heat dissipation film 25 is fixedly connected with a welding layer 26, and a composite plate 27 is arranged on one side of the welding layer 26, which is far away from the graphite heat dissipation film 25; with the above arrangement, the purpose of the welding layer 26 is to allow welding, and the composite plate 27 can achieve an anti-corrosion effect.
In this embodiment, specifically: through holes 28 are formed in both sides of the surface of the heat conducting assembly 20, the number of the through holes 28 is four, and the four through holes 28 are symmetrically arranged; with the above arrangement, the through hole 28 facilitates the user to install the heat conducting assembly 20 by means of a screw.
In this embodiment, specifically: the top of the polypropylene layer 31 is fixedly connected with a copper foil layer 32, one side of the copper foil layer 32, which is far away from the polypropylene layer 31, is provided with a heat absorbing plate 33, the bottom of the polypropylene layer 31 is fixedly connected with a punched heat dissipation plate 34, and one side of the punched heat dissipation plate 34, which is far away from the polypropylene layer 31, is provided with an aluminum alloy punched heat dissipation plate 35; through the arrangement, the heat dissipation effect of the copper substrate body 21 is improved, and the problem that the heat dissipation effect is poor and the use requirement of people cannot be met is solved.
In this embodiment, specifically: heat dissipation holes 36 are formed in the surface of the punched heat dissipation plate 34, a phase change crystal area 37 is arranged on the inner side wall of the heat absorption plate 33, and a phase change crystal block 38 is embedded in the surface of the phase change crystal area 37; through the arrangement, the phase-change crystal block 38 of the phase-change crystal area 37 has the characteristics of heat absorption melting, cooling crystallization and cyclic utilization.
In this embodiment, specifically: the thermally conductive insulating sheet 24 is model number TC 900S.
Working principle or structural principle, when in use, the heat source can radiate heat through the aluminum heat conducting sheet 22, the copper clad laminate 23 and the graphite heat radiating film 25, then the heat generated by the copper substrate body 21 is absorbed through the arrangement of the heat conducting insulating sheet 24, the welding layer 26 and the composite board 27, and is guided into the heat radiating assembly 30 for cooling, the insulating frame 13 is arranged on the surfaces of the heat radiating assembly 30 and the heat conducting assembly 20, so that the contact area of the copper substrate body 21 and air is increased, the heat radiating range of the copper substrate body 21 is expanded, the phase change crystal area 37 is arranged in the heat radiating assembly 30, the phase change crystal block 38 on the phase change crystal area 37 can absorb the heat of the internal heat source, meanwhile, the heat conducting insulating block 12 can further promote the guiding-out of the internal heat, the thermal resistance of a circuit is reduced, the performance of related elements is more stable, in addition, the phase change crystal block, the characteristic of cooling crystallization has cyclic utilization's characteristic to it is comparatively passive to have solved current copper base plate radiating element radiating mode, and the heat conductivility is relatively poor, can't make the copper base plate obtain high-efficient radiating problem.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A copper substrate facilitating heat dissipation, comprising:
a body assembly (10), the body assembly (10) comprising a base plate (11), a thermally conductive insulating block (12) and an insulating frame (13);
the heat conduction assembly (20) comprises a copper substrate body (21), an aluminum heat conduction sheet (22), a copper clad laminate (23), a heat conduction insulation sheet (24), a graphite heat dissipation film (25), a welding layer (26), a composite plate (27) and through holes (28), wherein the aluminum heat conduction sheet (22) is fixedly connected to the top of the copper substrate body (21), the copper clad laminate (23) is arranged on one side, away from the copper substrate body (21), of the aluminum heat conduction sheet (22), the heat conduction insulation sheet (24) is arranged on one side, away from the aluminum heat conduction sheet (22), of the copper clad laminate (23), and the graphite heat dissipation film (25) is fixedly connected to the bottom of the copper substrate body (21);
the heat dissipation assembly (30) comprises a polypropylene layer (31), a copper foil layer (32), a heat absorption plate (33), a punched heat dissipation plate (34), an aluminum alloy punched heat dissipation plate (35), heat dissipation holes (36), a phase change crystal region (37) and a phase change crystal block (38).
2. The copper substrate easy to dissipate heat of claim 1, wherein: the heat-conducting insulating blocks (12) are fixedly connected to the two sides of the top of the bottom plate (11), and the insulating frames (13) are fixedly connected to the inner sides of the two heat-conducting insulating blocks (12).
3. The copper substrate easy to dissipate heat of claim 1, wherein: the bottom fixedly connected with welding layer (26) of graphite heat dissipation membrane (25), one side that graphite heat dissipation membrane (25) was kept away from in welding layer (26) is provided with composite sheet (27).
4. The copper substrate easy to dissipate heat of claim 1, wherein: through-hole (28) have all been seted up to the both sides on heat conduction subassembly (20) surface, and the quantity of through-hole (28) is four, four through-hole (28) are the symmetry and set up.
5. The copper substrate easy to dissipate heat of claim 1, wherein: the heat sink is characterized in that a copper foil layer (32) is fixedly connected to the top of the polypropylene layer (31), a heat absorbing plate (33) is arranged on one side, away from the polypropylene layer (31), of the copper foil layer (32), a punched heat dissipating plate (34) is fixedly connected to the bottom of the polypropylene layer (31), and an aluminum alloy punched heat dissipating plate (35) is arranged on one side, away from the polypropylene layer (31), of the punched heat dissipating plate (34).
6. The copper substrate easy to dissipate heat of claim 1, wherein: heat dissipation holes (36) are formed in the surface of the punched heat dissipation plate (34), a phase change crystal area (37) is arranged on the inner side wall of the heat absorption plate (33), and a phase change crystal block (38) is embedded in the surface of the phase change crystal area (37).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921429934.1U CN210928123U (en) | 2019-08-30 | 2019-08-30 | Copper substrate easy to radiate heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921429934.1U CN210928123U (en) | 2019-08-30 | 2019-08-30 | Copper substrate easy to radiate heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210928123U true CN210928123U (en) | 2020-07-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921429934.1U Expired - Fee Related CN210928123U (en) | 2019-08-30 | 2019-08-30 | Copper substrate easy to radiate heat |
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| CN (1) | CN210928123U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114050420A (en) * | 2021-11-29 | 2022-02-15 | 南京航空航天大学 | Heat dissipation-wave absorption integrated passive frequency selective surface wave absorber |
-
2019
- 2019-08-30 CN CN201921429934.1U patent/CN210928123U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114050420A (en) * | 2021-11-29 | 2022-02-15 | 南京航空航天大学 | Heat dissipation-wave absorption integrated passive frequency selective surface wave absorber |
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Granted publication date: 20200703 Termination date: 20210830 |