CN213028694U

CN213028694U - Metal substrate with good heat conductivity

Info

Publication number: CN213028694U
Application number: CN202022349043.4U
Authority: CN
Inventors: 赵玉喜
Original assignee: Shenzhen Shengdafeng Electronic Technology Co ltd
Current assignee: Shenzhen Shengdafeng Electronic Technology Co ltd
Priority date: 2020-10-21
Filing date: 2020-10-21
Publication date: 2021-04-20
Anticipated expiration: 2030-10-21

Abstract

The utility model discloses a metal substrate that heat conductivity is good, including circuit board and electronic component, circuit board front end axle center department is provided with electronic component, circuit board and electronic component spot welding are fixed, circuit board a week department is provided with a plurality of mounting hole, both sides respectively are provided with a positive negative pole interface about the circuit board front end, the utility model discloses in through there being the heat dissipation polymer in heat conduction fin upper end axle center department, when fixing heat conduction fin like this, can reach spacing effect through the leg for heat conduction fin installation is more convenient, then fixes the heat dissipation polymer in heat conduction fin table end, then carries out spot welding through the leg, and heat conduction fin and epoxy's inboard can be better through the quick radiating effect of reaching of heat dissipation polymer like this.

Description

Metal substrate with good heat conductivity

Technical Field

The utility model belongs to the technical field of the circuit board is relevant, concretely relates to metal substrate that heat conductivity is good.

Background

The substrate is a basic material for manufacturing the PCB, generally, the substrate is a copper clad laminate, and the single-sided and double-sided printed boards are manufactured by selectively performing processing such as hole processing, chemical copper plating, electrolytic copper plating, etching and the like on the substrate material and the copper clad laminate to obtain a required circuit pattern.

The existing metal substrate technology has the following problems: the existing metal substrate generally adopts epoxy resin to conduct heat when conducting heat, so that poor heat conduction can occur if the epoxy resin is too thick during heat conduction, the phenomenon that the epoxy resin is too thin and is unqualified can occur integrally, and the heat conduction efficiency of the metal substrate can be influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a metal substrate that heat conductivity is good to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a metal substrate with good thermal conductivity comprises a circuit board and electronic elements, wherein the electronic elements are arranged at the axle center of the front end of the circuit board, the circuit board and the electronic elements are fixed in a spot welding mode, a plurality of mounting holes are formed in the periphery of the circuit board, positive and negative electrode interfaces are arranged on the upper side and the lower side of the front end of the circuit board respectively, the circuit board comprises heat conduction fins, epoxy resin, an aluminum substrate, copper foil and bonding pads, the epoxy resin is arranged at the upper ends of the heat conduction fins, the aluminum substrate is arranged at the upper ends of the epoxy resin, the copper foil is arranged at the upper ends of the aluminum substrate, the bonding pads are arranged on the left side and the right side of the upper.

Preferably, the heat conduction fin comprises a heat dissipation polymer, a main body and a welding leg, the heat dissipation polymer is arranged at the axis of the upper end of the main body, the welding leg is respectively arranged at the left end and the right end of the heat dissipation polymer, and the heat conduction fin is fixed with the epoxy resin through the welding leg in a spot welding manner.

Preferably, the number of the mounting holes is eight, the size and the specification of the eight mounting holes are the same, and the eight mounting holes penetrate through the thickness of the circuit board.

Preferably, the heat conduction fins are of plate-shaped structures, and the bottom ends of the heat conduction fins are of hollow structures.

Preferably, the electronic component is electrically connected with a power supply, and the left side and the right side of the bottom end of the electronic component are respectively provided with a pin.

Preferably, the number of the welding feet is two, and the two welding feet are respectively fixed on the left side and the right side of the upper end of the main body.

Compared with the prior art, the utility model provides a metal substrate that heat conductivity is good possesses following beneficial effect:

(1) the heat-conducting fin is more convenient to install by arranging the heat-radiating polymer at the axle center of the upper end of the heat-conducting fin, and then the heat-radiating polymer is fixed at the surface end of the heat-conducting fin and then spot welding is carried out through the welding leg, so that the heat-conducting fin and the inner side of the epoxy resin can better achieve the effect of quick heat radiation through the heat-radiating polymer;

(2) the utility model discloses well epoxy can transmit the heat that produces, and heat dissipation polymer and epoxy can be common reaches radiating effect like this, and the thickness to the epoxy design can be more convenient like this, and the heat dissipation polymer is made by the heat conduction membrane moreover to can carry out thermal transmission with the temperature of substrate table end.

Drawings

Fig. 1 is a schematic top view of a metal substrate with good thermal conductivity according to the present invention;

FIG. 2 is a schematic view of the cross-sectional structure of the circuit board of the present invention;

fig. 3 is a schematic front view of the heat-conducting fin of the present invention;

in the figure: 1. mounting holes; 2. positive and negative electrode interfaces; 3. an electronic component; 4. a circuit board; 41. a heat conductive fin; 411. a heat dissipating polymer; 412. a main body; 413. welding feet; 42. an epoxy resin; 43. an aluminum substrate; 44. copper foil; 45. and a bonding pad.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Referring to fig. 1-3, the present invention provides a technical solution: a metal substrate with good heat conductivity comprises a circuit board 4 and an electronic element 3, wherein the electronic element 3 is arranged at the axis of the front end of the circuit board 4, the electronic element 3 is electrically connected with a power supply, so that the stability of the whole structure can be improved, the left side and the right side of the bottom end of the electronic element 3 are respectively provided with a pin, the circuit board 4 and the electronic element 3 are fixed in a spot welding manner, a plurality of mounting holes 1 are arranged at the periphery of the circuit board 4, the number of the mounting holes 1 is eight, so that the circuit board 4 can be tightly fixed through the mounting holes 1, the size and the specification of the eight mounting holes 1 are the same, the eight mounting holes 1 penetrate through the thickness of the circuit board 4, the upper side and the lower side of the front end of the circuit board 4 are respectively provided with a positive electrode interface and a negative electrode interface 2, the circuit board 4 comprises, the heat conducting fin 41 comprises a heat radiating polymer 411, a main body 412 and two welding feet 413, the heat radiating polymer 411 is arranged at the upper end axis of the main body 412, the left end and the right end of the heat radiating polymer 411 are respectively provided with one welding foot 413, the two welding feet 413 are arranged together, so that the fixing and stabilizing effects can be better achieved, the two welding feet 413 are respectively fixed at the left side and the right side of the upper end of the main body 412, the heat conducting fin 41 is fixed with an epoxy resin 42 through the welding feet 413 in a spot welding mode, the heat conducting fin 41 is of a plate-shaped structure, so that the heat radiating efficiency of the whole equipment can be accelerated, the bottom end of the heat conducting fin 41 is of a hollow structure, an aluminum substrate 43 is arranged at the upper end of the epoxy resin 42, copper foils 44 are arranged at the upper end of the aluminum substrate 43, pads.

The utility model discloses a theory of operation and use flow: when the circuit board 4 is to be used, a user firstly takes out the circuit board 4, then fixes the circuit board 4 at a proper position through the mounting hole 1, after the circuit board 4 is fixed stably, the power is switched on, so that the electronic element 3 works, heat generated by the electronic element 3 during working can be absorbed through the copper foil 44, when the heat is absorbed, the heat can be transferred through the internal epoxy resin 42, finally the dissipated heat can be discharged through the heat conducting fin 41, and the heat dissipating polymer 411 is arranged at the axle center of the upper end of the heat conducting fin 41, so that when the heat conducting fin 41 is fixed, the limiting effect can be achieved through the welding feet 413, the heat conducting fin 41 is more convenient to mount, then the heat dissipating polymer 411 is fixed at the surface end of the heat conducting fin 41, and then spot welding is carried out through the welding feet 413, thus, the heat-conducting fins 41 and the inner side of the epoxy resin 42 can better achieve the effect of rapid heat dissipation through the heat-dissipating polymer 411.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A metal substrate with good thermal conductivity comprises a circuit board (4) and an electronic element (3), and is characterized in that: an electronic element (3) is arranged at the axle center of the front end of the circuit board (4), the circuit board (4) and the electronic element (3) are fixed in a spot welding way, a plurality of mounting holes (1) are arranged on the periphery of the circuit board (4), positive and negative electrode interfaces (2) are respectively arranged on the upper side and the lower side of the front end of the circuit board (4), the circuit board (4) comprises heat-conducting fins (41), epoxy resin (42), an aluminum substrate (43), copper foil (44) and bonding pads (45), the upper end of the heat conduction fin (41) is provided with epoxy resin (42), the upper end of the epoxy resin (42) is provided with an aluminum substrate (43), the upper end of the aluminum substrate (43) is provided with a copper foil (44), the left side and the right side of the upper end of the copper foil (44) are respectively provided with a welding disc (45), the circuit board (4) is fixed with the electronic element (3) through the welding disc (45) in a spot welding mode.

2. The metal substrate with good thermal conductivity according to claim 1, wherein: the heat conduction fin (41) comprises a heat dissipation polymer (411), a main body (412) and a welding leg (413), wherein the heat dissipation polymer (411) is arranged at the axis of the upper end of the main body (412), the welding leg (413) is respectively arranged at the left end and the right end of the heat dissipation polymer (411), and the heat conduction fin (41) is fixed with epoxy resin (42) through the welding leg (413) in a spot welding mode.

3. The metal substrate with good thermal conductivity according to claim 1, wherein: the mounting holes (1) are eight in number, the size and the specification of the mounting holes (1) are the same, and the mounting holes (1) penetrate through the thickness of the circuit board (4).

4. The metal substrate with good thermal conductivity according to claim 1, wherein: the heat conduction fins (41) are of plate-shaped structures, and the bottom ends of the heat conduction fins (41) are of hollow structures.

5. The metal substrate with good thermal conductivity according to claim 1, wherein: the electronic element (3) is electrically connected with a power supply, and the left side and the right side of the bottom end of the electronic element (3) are respectively provided with a pin.

6. The metal substrate with good thermal conductivity according to claim 2, wherein: the number of the welding feet (413) is two, and the two welding feet (413) are respectively fixed on the left side and the right side of the upper end of the main body (412).