CN211019837U

CN211019837U - Printed circuit board fast dispels heat

Info

Publication number: CN211019837U
Application number: CN201922459683.8U
Authority: CN
Inventors: 章群; 殷华; 卞寿超
Original assignee: Wuxi Yuxi Electronic Technology Co ltd
Current assignee: Wuxi Yuxi Electronic Technology Co ltd
Priority date: 2019-12-30
Filing date: 2019-12-30
Publication date: 2020-07-14
Anticipated expiration: 2029-12-30

Abstract

The utility model relates to the technical field of printed circuit boards, in particular to a fast heat dissipation printed circuit board, which comprises a shell and a circuit board body, wherein the left and right inner side walls of the shell are symmetrically provided with heat conduction grooves, and the circuit board body is clamped in the heat conduction grooves, the utility model provides a fast heat dissipation printed circuit board, through the design and the use of a series of structures, the utility model solves the problems that although a certain heat dissipation effect is achieved when a water cooling mode is adopted for heat dissipation, when the electric elements on the printed circuit board are in trouble and need to be overhauled during the use, the electric elements are inconvenient to be disassembled and assembled, and the best heat dissipation effect can be ensured only by regularly replacing the cooling liquid by adopting the water cooling mode, the water cooling mode of the utility model can achieve the purpose of conveniently replacing the cooling liquid, thereby improving the use efficiency of the heat dissipation printed circuit board, and then the practicality of heat dissipation printed circuit board has been improved.

Description

Printed circuit board fast dispels heat

Technical Field

The utility model relates to a printed circuit board technical field, concretely relates to printed circuit board dispels heat fast.

Background

The printed circuit board, also called printed circuit board, short for printed board, short for PCB, uses insulating board as base material, and is cut into a certain size, on which at least one conductive pattern is attached, and is distributed with holes (such as element hole, fastening hole and metallized hole, etc.), and can be used for replacing chassis of electronic component and implementing interconnection between electronic components. Such boards are known as "printed" circuit boards because they are made using electronic printing. It is not exact to custom refer to a "printed wiring board" as a "printed circuit" because there are no "printed components" on the printed board, but only wiring.

When the printed circuit board is involved in use, however, most of the existing printed circuit boards are cooled by air, and the water cooling or heat conducting plate directly cools down, although certain heat dissipation effect is achieved when the water cooling method is adopted for heat dissipation, when the problem of an electrical component on the printed circuit board occurs and needs to be overhauled when the printed circuit board is used, the problem of inconvenient disassembly and assembly exists, and the water cooling method is adopted, the coolant liquid needs to be regularly replaced to ensure the best heat dissipation effect, the problem of inconvenient replacement of the coolant liquid exists in the current water cooling method, and further the use efficiency of the heat dissipation printed circuit board is reduced, and further the practicability of the heat dissipation printed circuit board is reduced, therefore, the problem needs to be solved through research and development of a quick heat dissipation printed circuit board.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects of the prior art, the utility model provides a quick heat dissipation printed circuit board, through the design and the use of a series of structures, the utility model solves the problems of inconvenient disassembly and assembly when the electric elements on the printed circuit board have problems and need to be overhauled when the electric elements are used, and the water cooling mode is adopted, the cooling liquid needs to be replaced regularly to ensure the best heat dissipation effect; and the utility model discloses novel structure, design scientific and reasonable, convenient to use has stronger practicality.

The utility model discloses a following technical scheme realizes:

the utility model provides a printed circuit board fast dispels heat, includes casing and circuit board body, the inside wall symmetry is equipped with the heat conduction groove about the casing, the joint has in the heat conduction groove the circuit board body, the upper and lower inside wall middle part symmetry of casing is equipped with elasticity heat conduction silica gel cover, the heating panel has been cup jointed in the elasticity heat conduction silica gel cover, and the downside the top of elasticity heat conduction silica gel cover with the bottom looks butt of circuit board body.

Preferably, the heat conduction groove is of a U-shaped structure, and an elastic heat conduction silica gel pad is embedded in the heat conduction groove.

Preferably, the heat dissipation plate is provided with an inner cavity, cooling oil is filled in the inner cavity of the heat dissipation plate, the bottom of the inner cavity of the heat dissipation plate is uniformly provided with U-shaped heat conduction pipes, the height of each U-shaped heat conduction pipe is slightly smaller than that of the inner cavity of the heat dissipation plate, the middle of the front side end of the heat dissipation plate is provided with a filling port, and the filling port is in threaded connection with an end cover.

Preferably, the U-shaped heat conduction pipe is a copper heat dissipation finned pipe.

Preferably, the shell and the heat conduction groove are both made of copper materials.

The utility model has the advantages that:

through the mutual cooperation of parts such as a shell, a circuit board body, a heat conduction groove, an elastic heat conduction silica gel sleeve, a heat dissipation plate, a U-shaped heat conduction pipe, a filling port and the like, the utility model solves the problems of inconvenient disassembly and assembly when electric elements on a printed circuit board are in trouble and need to be maintained when a water cooling mode is adopted for heat dissipation in the use process, and the best heat dissipation effect can be ensured only by regularly replacing cooling liquid by adopting the water cooling mode;

and the utility model discloses novel structure, design scientific and reasonable, convenient to use has stronger practicality.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of the present invention;

FIG. 2 is a schematic structural view of the circuit board body and the heat sink plate of the present invention;

fig. 3 is a schematic view of the internal structure of the heat dissipating plate of the present invention.

In the figure: the heat dissipation device comprises a shell 1, a circuit board body 2, a heat conduction groove 3, an elastic heat conduction silica gel sleeve 4, a heat dissipation plate 5, a U-shaped heat conduction pipe 6 and a filling port 7.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

The utility model provides a quick heat dissipation printed circuit board, includes casing 1 and circuit board body 2, and the inside wall symmetry is equipped with heat conduction groove 3 about casing 1, and the joint has circuit board body 2 in the heat conduction groove 3, and the upper and lower inside wall middle part symmetry of casing 1 is equipped with elasticity heat conduction silica gel cover 4, and the heat dissipation board 5 has been cup jointed in elasticity heat conduction silica gel cover 4, and the top of downside elasticity heat conduction silica gel cover 4 and the bottom looks butt of circuit board body 2.

Specifically, heat conduction groove 3 is the setting of U type structure, and the embedded elastic heat conduction silica gel pad that is equipped with of heat conduction groove 3.

Specifically, the heat dissipation plate 5 is provided with an inner cavity, cooling oil is filled in the inner cavity of the heat dissipation plate 5, the bottom of the inner cavity of the heat dissipation plate 5 is uniformly provided with U-shaped heat conduction pipes 6, the height of each U-shaped heat conduction pipe 6 is slightly smaller than the height of the inner cavity of the heat dissipation plate 5, the middle of the front side end of the heat dissipation plate 5 is provided with a filling port 7, and the filling port 7 is in threaded connection with an end cover.

Specifically, the U-shaped heat pipe 6 is a copper fin tube.

Specifically, the housing 1 and the heat conduction groove 3 are made of copper.

The working principle is as follows: when the utility model is used and the circuit board needs to be overhauled, the purpose of quickly disassembling and assembling the circuit board body 2 can be achieved by pushing and installing the left and right ends of the circuit board body 2 in the heat conducting groove 3 through the arranged heat conducting groove 3; the heat conducting groove 3 is arranged in a U-shaped structure, and the elastic heat conducting silica gel pad is embedded in the heat conducting groove 3, so that the elastic heat conducting silica gel pad has an elastic effect, and the stability of positioning and clamping the circuit board body 2 can be further enhanced;

the heat conducting groove 3 and the elastic heat conducting silica gel pad can achieve the purpose of conducting heat to the heat generated by the circuit board;

the heat dissipation plate 5 is sleeved in the elastic heat conduction silica gel sleeve 4 through the elastic heat conduction silica gel sleeve 4, and the heat dissipation plate 5 can be positioned and clamped by utilizing the elastic action of the elastic heat conduction silica gel sleeve 4, so that the aim of quickly disassembling and assembling the heat dissipation plate 5 can be fulfilled;

the heat generated by the circuit board can be conducted through the elastic heat conducting silica gel sleeves 4 on the upper side and the lower side of the circuit board body 2, the elastic heat conducting silica gel sleeves 4 are conducted through the heat dissipation plate 5, and the transferred heat can be rapidly subjected to heat exchange with cooling oil filled in the inner cavity of the heat dissipation plate 5 through the U-shaped heat conducting pipes 6 arranged in the inner cavity of the heat dissipation plate 5;

moreover, the U-shaped heat conduction pipe 6 is a copper heat dissipation finned pipe, and the shell 1 and the heat conduction groove 3 are all made of copper materials, so that the heat dissipation effect can be further improved; the end cover is connected to the filling port 7 through threads, so that the purpose of periodically replacing the cooling oil in the heat dissipation plate 5 when the heat dissipation plate 5 is disassembled and assembled can be achieved;

and then under the design and the use of above-mentioned structure, the utility model discloses in carrying out the use, solved though have certain radiating effect when adopting the water-cooling mode to dispel the heat, nevertheless when the electrical components on the printed circuit board goes wrong when using need overhaul, there is the problem of inconvenient dismantlement and equipment, adopt the water-cooling mode moreover, need regularly change just can guarantee best radiating effect to the coolant liquid, the utility model discloses a water-cooling mode can reach the purpose that conveniently changes the coolant liquid, and then has improved the availability factor of heat dissipation printed circuit board, and then has improved the practicality of heat dissipation printed circuit board.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. The utility model provides a quick heat dissipation printed circuit board, includes casing (1) and circuit board body (2), its characterized in that: the circuit board is characterized in that heat conduction grooves (3) are symmetrically formed in the left inner side wall and the right inner side wall of the shell (1), the circuit board body (2) is connected in the heat conduction grooves (3) in a clamping mode, elastic heat conduction silica gel sleeves (4) are symmetrically arranged in the middle of the upper inner side wall and the lower inner side wall of the shell (1), heat dissipation plates (5) are connected in the elastic heat conduction silica gel sleeves (4) in a sleeved mode, and the lower sides of the heat dissipation plates are abutted to the top of the elastic heat conduction silica gel sleeves (4.

2. The printed circuit board for rapid heat dissipation according to claim 1, wherein: the heat conduction groove (3) is of a U-shaped structure, and an elastic heat conduction silica gel pad is embedded in the heat conduction groove (3).

3. The printed circuit board for rapid heat dissipation according to claim 1, wherein: the cooling plate is characterized in that an inner cavity is formed in the cooling plate (5), cooling oil is filled in the inner cavity of the cooling plate (5), U-shaped heat conduction pipes (6) are uniformly arranged at the bottom of the inner cavity of the cooling plate (5), the height of each U-shaped heat conduction pipe (6) is slightly smaller than that of the inner cavity of the cooling plate (5), a filling port (7) is formed in the middle of the front side end of the cooling plate (5), and an end cover is connected to the filling port (7) in a threaded mode.

4. A printed circuit board for rapid heat dissipation as defined in claim 3, wherein: the U-shaped heat conduction pipe (6) is a copper heat dissipation finned pipe.

5. The printed circuit board for rapid heat dissipation according to claim 1, wherein: the shell (1) and the heat conducting groove (3) are both made of copper materials.