CN217283516U - Anticreep just has PCB circuit board of high heat conduction function - Google Patents
Anticreep just has PCB circuit board of high heat conduction function Download PDFInfo
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- CN217283516U CN217283516U CN202220147552.5U CN202220147552U CN217283516U CN 217283516 U CN217283516 U CN 217283516U CN 202220147552 U CN202220147552 U CN 202220147552U CN 217283516 U CN217283516 U CN 217283516U
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- circuit board
- heat conduction
- board body
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Abstract
The utility model discloses a PCB circuit board that anticreep just has high heat conduction function relates to circuit board heat conduction technical field. Including the circuit board body, the circuit board body includes the CPU subassembly, and the one end of circuit board body is connected with the electric wire, and the CPU subassembly passes through spliced pole fixed connection on the circuit board body, still is provided with dual heat conduction mechanism on the circuit board body. The utility model discloses a set up dual heat conduction mechanism, through having seted up a plurality of louvres as first heat conduction under the CPU subassembly on the circuit board body, at the lower surface of CPU subassembly still fixedly connected with heat conduction copper pipe, can effectually give off the heat that the CPU subassembly during operation produced through flowing through the coolant liquid in the heat conduction copper pipe, through the louvre, the combined action of heat conduction copper pipe and coolant liquid reaches the effect of carrying out high heat conduction to the circuit board body, the effectual heat that produces the circuit board body during operation distributes away.
Description
Technical Field
The utility model relates to a circuit board heat conduction technical field specifically is a PCB circuit board that anticreep just has high heat conduction function.
Background
A PCB, i.e., a printed wiring board, which is called a printed board for short, is one of important parts in the electronic industry. Almost every kind of electronic equipment, as small as electronic watches, calculators, as large as computers, communication electronics, military weaponry systems, has electronic components such as integrated circuits, and printed boards are used to electrically interconnect the various components. The printed circuit board consists of an insulating bottom plate, a connecting lead and a welding disc for assembling and welding electronic elements, and has double functions of a conductive circuit and the insulating bottom plate. The novel electronic product wiring device can replace complex wiring, realizes electrical connection among elements in a circuit, simplifies assembly and welding work of electronic products, reduces wiring workload in a traditional mode, and greatly reduces labor intensity of workers.
The existing PCB circuit board can generate a large amount of heat during working, so that the temperature inside the equipment can rise rapidly, if the heat cannot be distributed out in time, the equipment can continuously rise in temperature, the device can be damaged due to overheating, the reliability of the electronic equipment can be reduced, and therefore the effective heat dissipation treatment of the circuit board is very important, most of the existing circuit boards only have a heat dissipation mode, and the heat dissipation effect is not obvious.
To the above problem, the utility model provides an anticreep just has PCB circuit board of high heat conduction function.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide an anticreep PCB circuit board with high heat conduction function, which is provided with a dual heat conduction mechanism, a plurality of heat dissipation holes are arranged under a CPU component on the circuit board body as first heat conduction, a connection post is utilized to connect the CPU component with the circuit board body, an open space is arranged between the CPU component and the circuit board body, which is beneficial to the heat dissipation of the CPU component, a heat conduction copper pipe is fixedly connected with the lower surface of the CPU component, one end of the heat conduction copper pipe is communicated with a cooling liquid inlet through the circuit board, the other end of the heat conduction copper pipe is communicated with a cooling liquid outlet through the circuit board, the heat generated when the CPU component works can be effectively dissipated by flowing through the cooling liquid in the heat conduction copper pipe, the function of high heat conduction of the circuit board body is achieved by the combined action of the heat dissipation holes, the heat conduction copper pipe and the cooling liquid, and the heat generated when the circuit board body works is effectively dissipated, thereby solving the problems in the background art.
In order to achieve the above object, the utility model provides a following technical scheme: an anti-creeping PCB circuit board with a high heat conduction function comprises a circuit board body, wherein the circuit board body comprises a CPU (Central processing Unit) assembly, one end of the circuit board body is connected with an electric wire, the CPU assembly is fixedly connected to the circuit board body through a connecting column, and a dual heat conduction mechanism is further arranged on the circuit board body;
the dual heat conduction mechanism comprises a heat conduction copper pipe, the heat conduction copper pipe is fixedly connected to the lower surface of the CPU assembly, one end of the heat conduction copper pipe penetrates through the circuit board body and is connected with a cooling liquid inlet, the other end of the heat conduction copper pipe penetrates through the circuit board body and is connected with a cooling liquid outlet, and a plurality of heat dissipation holes are fixedly formed in the circuit board body under the CPU assembly.
Further, an anti-creeping mechanism is sleeved on the electric wire.
Furthermore, anticreep mechanism includes insulating cover, and insulating ways establishes the kneck at electric wire and circuit board body, and the one end fixedly connected with rubber circle of circuit board body is kept away from to insulating cover, and the inner circle of rubber circle closely attaches on the surface of electric wire.
Further, the lower fixed surface of circuit board body is connected with buffer gear, and buffer gear includes the buffer beam, and the mounting groove has been seted up to the bottom surface of buffer beam, the interior bottom surface fixedly connected with spring's of mounting groove one end, the other end fixedly connected with rubber pad of spring.
Further, circuit board body upper surface one end fixedly connected with mount pad, can dismantle the card in the mount pad and be equipped with the fan, the fan is provided with the multiunit.
Further, the lower surface of circuit board body is provided with heat dissipation mechanism.
Further, heat dissipation mechanism includes the draw-in groove, and the draw-in groove is seted up at the lower extreme of circuit board body and is provided with a plurality ofly, the equal fixedly connected with rubber soft board in both sides of every draw-in groove, the one end fixedly connected with soft stopper of rubber soft board.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model provides a PCB circuit board with anti-creeping and high heat conduction function, which is characterized in that a plurality of heat dissipation holes are arranged under a CPU component on the circuit board body as first heat conduction, the CPU component is connected with the circuit board body by utilizing a connecting column, an open space is arranged between the CPU component and the circuit board body, which is beneficial to the heat dissipation of the CPU component, a heat conduction copper pipe is fixedly connected on the lower surface of the CPU component, one end of the heat conduction copper pipe is communicated with the circuit board and is connected with a cooling liquid inlet, the other end of the heat conduction copper pipe is communicated with the circuit board and is connected with a cooling liquid outlet, the heat generated when the CPU component works can be effectively dissipated by flowing through the cooling liquid in the heat conduction copper pipe, the function of high heat conduction on the circuit board body is achieved by the combined action of the heat dissipation holes, the heat conduction copper pipe and the cooling liquid, and the heat generated when the circuit board body works is effectively dissipated, thereby solving the problems in the background art.
2. The utility model provides a pair of PCB circuit board that anticreep just has high heat conduction function, the connector department cover through at electric wire and circuit board body is equipped with insulating cover, keeps away from one of circuit board body at insulating cover and serves fixedly connected with rubber circle, and the internal surface of rubber circle closely attached on the surface of electric wire, can play the kneck that prevents circuit board and electric wire like this and lead to the short circuit because of intaking to the effect of anticreep has been played to the circuit board body.
3. The utility model provides a pair of anticreep just has PCB circuit board of high heat conduction function, through the fixedly connected with buffer gear in the bottom four corners department of circuit board body, utilize spring and rubber pad among the buffer gear to carry out effectual protection to the circuit board body, prevent that the circuit board body from producing the damage when receiving equipment vibrations.
Drawings
Fig. 1 is a schematic view of the overall structure of a PCB circuit board with high thermal conductivity and anti-creeping function of the present invention;
fig. 2 is a schematic view of a cross-sectional structure of a PCB heat-conducting mechanism with anti-creeping and high heat-conducting functions of the present invention;
fig. 3 is a schematic structural view of an anti-creeping mechanism of a PCB with high thermal conductivity for preventing creeping of the present invention;
fig. 4 is a schematic structural view of a PCB circuit board buffering mechanism with anti-creeping and high heat-conducting functions according to the present invention;
fig. 5 is a schematic view of the structure a in fig. 1 according to the present invention.
In the figure: 1. a circuit board body; 11. a CPU component; 2. a dual heat conducting mechanism; 21. heat dissipation holes; 22. a heat conducting copper pipe; 3. connecting columns; 4. an anti-creeping mechanism; 41. an insulating sleeve; 42. a rubber ring; 5. a mounting seat; 6. a fan; 7. an electric wire; 8. a heat dissipation mechanism; 81. a card slot; 82. a soft rubber plate; 83. a soft plug; 9. a buffer mechanism; 91. a buffer rod; 92. mounting grooves; 93. a spring; 94. and (7) a rubber pad.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, an anti-creeping PCB circuit board with high heat conduction function comprises a circuit board body 1, wherein the circuit board body 1 comprises a CPU component 11, one end of the circuit board body 1 is connected with a wire 7, the CPU component 11 is fixedly connected to the circuit board body 1 through a connecting column 3, and the circuit board body 1 is further provided with a dual heat conduction mechanism 2; dual heat conduction mechanism 2 includes heat conduction copper pipe 22, and heat conduction copper pipe 22 fixed connection is at the lower surface of CPU subassembly 11, and heat conduction copper pipe 22's one end link up circuit board body 1 and is connected with the coolant liquid import, and heat conduction copper pipe 22's the other end link up circuit board body 1 and is connected with the coolant liquid export, and a plurality of louvres 21 have been seted up to fixed under CPU subassembly 11 on the circuit board body 1. Its aim at, current PCB circuit board can produce a large amount of heats at the during operation to make the inside temperature of equipment rise rapidly, if can not be timely distribute away this heat, equipment will continue to heat up, the device will damage because of overheated, electronic equipment's reliable performance will descend, consequently it is very important to carry out effectual heat dissipation to the circuit board, current circuit board mostly all only has a radiating mode, leads to the radiating effect unobvious. The utility model is provided with the double heat conduction mechanism 2, a plurality of heat dissipation holes 21 are arranged on the circuit board body 1 under the CPU component 11 to be used as the first heat conduction, the connection column 3 is used for connecting the CPU component 11 with the circuit board body 1, an open space is arranged between the CPU component 11 and the circuit board body 1, which is beneficial to the heat dissipation of the CPU component 11, the lower surface of the CPU component 11 is also fixedly connected with a heat conduction copper pipe 22, one end of the heat conduction copper pipe 22 penetrates through the circuit board body 1 and is connected with a cooling liquid inlet, the other end of the heat conduction copper pipe 22 is connected with a cooling liquid outlet through the circuit board body 1, the heat generated when the CPU component 11 works can be effectively dissipated by flowing the cooling liquid in the heat conduction copper pipe 22, reach the effect of carrying out high heat conduction to circuit board body 1 through the combined action of louvre 21, heat conduction copper pipe 22 and coolant liquid, effectually distribute away the heat that circuit board body 1 during operation produced.
The electric wire 7 is sleeved with the anti-creeping mechanism 4, the anti-creeping mechanism 4 comprises an insulating sleeve 41, the insulating sleeve 41 is sleeved at the joint of the electric wire 7 and the circuit board body 1, one end of the insulating sleeve 41, far away from the circuit board body 1, is fixedly connected with a rubber ring 42, and the inner ring of the rubber ring 42 is closely attached to the surface of the electric wire 7. The object is that most of the existing circuit board bodies 1 do not have the anti-creeping mechanism 4, and although some circuit boards are also provided with the anti-creeping mechanism 4, the anti-creeping mechanism 4 is mostly arranged on the circuit board body 1, which causes the load on the circuit board body 1 to be too large, and easily damages the surface of the circuit board body 1. The utility model discloses a connector department cover at electric wire 7 and circuit board body 1 is equipped with insulating cover 41, keeps away from one of circuit board body 1 at insulating cover 41 and serves fixedly connected with rubber circle 42, and the internal surface of rubber circle 42 closely attaches on the surface of electric wire 7, can play like this and prevent that the kneck of circuit board body 1 and electric wire 7 from leading to the short circuit because of intaking to circuit board body 1 has played the effect of anticreep.
Fixed surface of circuit board body 1 is connected with buffer gear 9, and buffer gear 9 includes buffer beam 91, and mounting groove 92 has been seted up to buffer beam 91's bottom surface, the interior bottom surface fixedly connected with spring 93's of mounting groove 92 one end, spring 93's other end fixedly connected with rubber pad 94. The purpose is that most of the existing PCB circuit boards are not provided with an effective buffer mechanism 9, which may cause that the circuit board body 1 may cause certain influence on the dual heat-conducting mechanism 2 and the precision parts added on the circuit board due to the vibration of the equipment when being installed inside the electronic component. The utility model discloses a fixedly connected with buffer gear 9 in the bottom four corners department of circuit board body 1 utilizes spring 93 and rubber pad 94 among the buffer gear 9 to carry out effectual protection to circuit board body 1, prevents that circuit board body 1 from producing the damage when receiving equipment vibrations.
The lower surface of circuit board body 1 is provided with heat dissipation mechanism 8, and heat dissipation mechanism 8 includes draw-in groove 81, and draw-in groove 81 is seted up at the lower extreme of circuit board body 1 and is provided with a plurality ofly, the equal fixedly connected with rubber soft board 82 in both sides of every draw-in groove 81, the one end fixedly connected with cork 83 of rubber soft board 82. Its aim at, insert through in draw-in groove 81 and establish the copper sheet and can assist dual heat conduction mechanism 2 to distribute away the heat faster.
In conclusion: the utility model is provided with the double heat conduction mechanism 2, a plurality of heat dissipation holes 21 are arranged on the circuit board body 1 under the CPU component 11 to be used as the first heat conduction, the connection column 3 is used to connect the CPU component 11 with the circuit board body 1, an open space is arranged between the two components, which is beneficial to the heat dissipation of the CPU component 11, the lower surface of the CPU component 11 is also fixedly connected with a heat conduction copper pipe 22, one end of the heat conduction copper pipe 22 penetrates through the circuit board body 1 and is connected with a cooling liquid inlet, the other end of the heat conduction copper pipe 22 is connected with a cooling liquid outlet through the circuit board body 1, the heat generated when the CPU component 11 works can be effectively dissipated by flowing the cooling liquid in the heat conduction copper pipe 22, the combined action of the heat dissipation holes 21, the heat conduction copper pipes 22 and the cooling liquid achieves the effect of high heat conduction on the circuit board body 1, and heat generated when the circuit board body 1 works is effectively dissipated.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides an anticreep just has PCB circuit board of high heat conduction function, includes circuit board body (1), circuit board body (1) includes CPU subassembly (11), the one end of circuit board body (1) is connected with electric wire (7), its characterized in that: the CPU component (11) is fixedly connected to the circuit board body (1) through the connecting column (3), and the circuit board body (1) is also provided with a double heat conduction mechanism (2);
the dual heat conduction mechanism (2) comprises a heat conduction copper pipe (22), the heat conduction copper pipe (22) is fixedly connected to the lower surface of the CPU assembly (11), one end of the heat conduction copper pipe (22) penetrates through the circuit board body (1) and is connected with a cooling liquid inlet, the other end of the heat conduction copper pipe (22) penetrates through the circuit board body (1) and is connected with a cooling liquid outlet, and a plurality of heat dissipation holes (21) are fixedly formed in the circuit board body (1) under the CPU assembly (11).
2. The PCB circuit board with the functions of preventing electric leakage and high heat conduction according to claim 1, wherein: and the electric wire (7) is sleeved with an anti-creeping mechanism (4).
3. The PCB circuit board with the functions of preventing electric leakage and high heat conduction according to claim 2, wherein: anticreep mechanism (4) are including insulating cover (41), insulating cover (41) cover is established at the kneck of electric wire (7) and circuit board body (1), one end fixedly connected with rubber ring (42) of circuit board body (1) are kept away from in insulating cover (41), the inner circle of rubber ring (42) is closely attached on the surface of electric wire (7).
4. The PCB circuit board with the functions of preventing electric leakage and high heat conduction according to claim 1, wherein: the lower fixed surface of circuit board body (1) is connected with buffer gear (9), buffer gear (9) are including buffer rod (91), mounting groove (92) have been seted up to the bottom surface of buffer rod (91), the one end of interior bottom surface fixedly connected with spring (93) of mounting groove (92), the other end fixedly connected with rubber pad (94) of spring (93).
5. The PCB circuit board with the functions of preventing electric leakage and high heat conduction according to claim 1, wherein: the circuit board is characterized in that a mounting seat (5) is fixedly connected to one end of the upper surface of the circuit board body (1), fans (6) are detachably clamped in the mounting seat (5), and multiple groups of fans (6) are arranged.
6. The PCB circuit board with the functions of preventing electric leakage and high heat conduction according to claim 1, wherein: the lower surface of the circuit board body (1) is provided with a heat dissipation mechanism (8).
7. The PCB circuit board with the functions of preventing electric leakage and high heat conduction according to claim 6, wherein: the heat dissipation mechanism (8) comprises a clamping groove (81), the clamping groove (81) is formed in the lower end of the circuit board body (1) and is provided with a plurality of rubber soft boards (82) and each rubber soft board (82) is fixedly connected to the two sides of the clamping groove (81), and the rubber soft boards (82) are fixedly connected with soft plugs (83).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220147552.5U CN217283516U (en) | 2022-01-19 | 2022-01-19 | Anticreep just has PCB circuit board of high heat conduction function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220147552.5U CN217283516U (en) | 2022-01-19 | 2022-01-19 | Anticreep just has PCB circuit board of high heat conduction function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217283516U true CN217283516U (en) | 2022-08-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220147552.5U Active CN217283516U (en) | 2022-01-19 | 2022-01-19 | Anticreep just has PCB circuit board of high heat conduction function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217283516U (en) |
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2022
- 2022-01-19 CN CN202220147552.5U patent/CN217283516U/en active Active
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