CN211429863U - Composite circuit board with high heat dissipation performance - Google Patents
Composite circuit board with high heat dissipation performance Download PDFInfo
- Publication number
- CN211429863U CN211429863U CN201922358775.7U CN201922358775U CN211429863U CN 211429863 U CN211429863 U CN 211429863U CN 201922358775 U CN201922358775 U CN 201922358775U CN 211429863 U CN211429863 U CN 211429863U
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- China
- Prior art keywords
- heat
- circuit board
- conducting plate
- fixedly connected
- conducting
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 19
- 239000002131 composite material Substances 0.000 title claims abstract description 13
- 239000000498 cooling water Substances 0.000 claims abstract description 35
- 238000010030 laminating Methods 0.000 claims abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 34
- 238000007789 sealing Methods 0.000 claims description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- 239000002826 coolant Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims 2
- 238000009826 distribution Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 3
- 238000009434 installation Methods 0.000 description 8
- 239000000110 cooling liquid Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model belongs to the technical field of electrical elements, in particular to a composite circuit board with high heat dissipation performance, which comprises a circuit board, a heat conducting plate and a small cooling water tank, wherein the outer wall of one side of the circuit board is fixedly connected with a plurality of laminating heat conducting blocks, the outer wall of one side of the circuit board close to the laminating heat conducting blocks is fixedly connected with a clamping heat conducting column, the heat conducting plate is detachably connected with the circuit board, the clamping heat conducting column is connected with the heat conducting plate in a clamping way, and the laminating heat conducting block is laminated with one side of the heat conducting plate close to; when using this device, heat on the circuit board can be through laminating heat conduction piece and block heat conduction post transmit to the heat-conducting plate above, then distribute away through the fin on the heat-conducting plate, can dispel the heat to the heat-conducting plate through small-size cooling water tank in addition to improve the radiating efficiency of heat-conducting plate, make that the heat-conducting plate can be better play radiating effect to the circuit board.
Description
Technical Field
The utility model belongs to the technical field of electrical element, concretely relates to composite circuit board that heat dispersion is high.
Background
The name of the circuit board is ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc., the circuit board makes the circuit miniaturized, visualized, plays an important role in the batch production of fixed circuit and the optimization of electrical equipment layout.
When current circuit board is using, because wire on the circuit board has the resistance and can generate heat when using, the heat can transmit to the circuit board on, still the circuit board is close to the part of the device that generates heat, the device that generates heat can cause the heat radiation to the circuit board, on the heat on the device that generates heat can transmit the circuit board, lead to the surface of circuit board to send out the boiling hot, if the heat on the circuit board can not obtain timely processing, when the temperature on circuit board surface reachs certain numerical value, can lead to circuit board carbonization damage.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a composite circuit board that heat dispersion is high to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a composite circuit board with high heat dissipation performance comprises a circuit board, a heat conducting plate and a small cooling water tank, wherein a plurality of laminating heat conducting blocks are fixedly connected to the outer wall of one side of the circuit board, clamping heat conducting columns are fixedly connected to the outer wall of one side, close to the laminating heat conducting blocks, of the circuit board, the heat conducting plate is detachably connected with the circuit board, the clamping heat conducting columns are connected with the heat conducting plate in a clamping manner, the laminating heat conducting blocks are laminated with one side, close to the circuit board, of the heat conducting plate, a plurality of uniformly distributed radiating fins are fixedly connected to one side, far away from the circuit board, of the heat conducting plate, two symmetrically distributed mounting plates are fixedly connected to two ends of the heat conducting plate, the small cooling water tank is symmetrically distributed on two sides of the radiating fins, and a, the water inlet connector is detachably connected with a first sealing cover, the other end of the small cooling water tank is fixedly connected with a water outlet connector, and the water outlet connector is detachably connected with a second sealing cover.
Preferably, the material of the attached heat-conducting block and the clamped heat-conducting column is aluminum, and the material of the heat-conducting plate and the heat-radiating fin is aluminum.
Preferably, the heat conducting plate is provided with a connecting bolt, and the heat conducting plate is fixedly connected with the circuit board in a threaded manner through the connecting bolt.
Preferably, a plurality of radiating holes are uniformly distributed on the radiating fin.
Preferably, one end of the water inlet joint, which is far away from the small cooling water tank, is fixedly connected with a first hollow threaded pipe, the water inlet joint is fixedly connected with a first sealing cover through the first hollow threaded pipe in a threaded manner, the water outlet joint is far away from one end of the small cooling water tank, which is fixedly connected with a second hollow threaded pipe, and the water outlet joint is fixedly connected with a second sealing cover through the second hollow threaded pipe in a threaded manner.
Preferably, the small cooling water tank is made of aluminum, and a heat dissipation coating is uniformly coated on the outer wall of the small cooling water tank.
Compared with the prior art, the beneficial effects of the utility model are that:
when using this device, heat on the circuit board can be through laminating heat conduction piece and block heat conduction post transmit to the heat-conducting plate above, then distribute away through the fin on the heat-conducting plate, can dispel the heat to the heat-conducting plate through small-size cooling water tank in addition to improve the radiating efficiency of heat-conducting plate, make that the heat-conducting plate can be better play radiating effect to the circuit board.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural diagram of the circuit board of the present invention;
FIG. 3 is a schematic structural view of the circuit board, the heat-conducting plate and the small cooling water tank of the present invention;
fig. 4 is a schematic structural diagram of a small and medium cooling water tank of the present invention.
In the figure: 1. a circuit board; 11. attaching a heat conducting block; 12. clamping the heat-conducting column; 2. a heat conducting plate; 21. a connecting bolt; 22. a heat sink; 221. heat dissipation holes; 23. mounting a plate; 3. a small cooling water tank; 31. a water inlet joint; 311. a first hollow threaded pipe; 312. a first sealing cover; 32. a water outlet joint; 321. a second hollow threaded pipe; 322. a second sealing cover; 33. and (3) a heat dissipation coating.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides the following technical solutions: a composite circuit board with high heat dissipation performance comprises a circuit board 1, a heat conducting plate 2 and a small cooling water tank 3, wherein a plurality of laminating heat conducting blocks 11 are fixedly connected to the outer wall of one side of the circuit board 1, a clamping heat conducting column 12 is fixedly connected to the outer wall of one side of the circuit board 1 close to the laminating heat conducting blocks 11, the heat conducting plate 2 is detachably connected with the circuit board 1, the clamping heat conducting column 12 is connected with the heat conducting plate 2 in a clamping manner, the laminating heat conducting blocks 11 are laminated with one side of the heat conducting plate 2 close to the circuit board 1, a plurality of uniformly distributed radiating fins 22 are fixedly connected to one side of the heat conducting plate 2 away from the circuit board 1, two symmetrically distributed mounting plates 23 are fixedly connected to two ends of the heat conducting plate 2, two symmetrically distributed small cooling water tanks 3 are fixedly connected to the, the first sealing cover 312 is detachably connected to the water inlet connector 31, the other end of the small cooling water tank 3 is fixedly connected with the water outlet connector 32, and the second sealing cover 322 is detachably connected to the water outlet connector 32.
In this embodiment: the outer wall of one side of the circuit board 1 is fixedly connected with a plurality of laminating heat-conducting blocks 11, the outer wall of one side of the circuit board 1 close to the laminating heat-conducting blocks 11 is fixedly connected with a clamping heat-conducting column 12, the heat-conducting plate 2 is detachably connected with the circuit board 1, the clamping heat-conducting column 12 is connected with the heat-conducting plate 2 in a clamping way, the laminating heat-conducting block 11 and the side of the heat-conducting plate 2 close to the circuit board 1 are jointed and positioned on the part without welding spots, one side of the heat-conducting plate 2 far away from the circuit board 1 is fixedly connected with a plurality of evenly distributed radiating fins 22, the heat-conducting plate 2 can be clamped with the clamping heat-conducting column 12 on the circuit board 1 during installation, then the heat-conducting plate 2 is jointed with the laminating heat-conducting blocks 11, and heat on the circuit board 1 can, then the heat on the heat conducting plate 2 can be dissipated through the heat dissipating fins 22, two symmetrically distributed mounting plates 23 are fixedly connected to two ends of the heat conducting plate 2, when in installation, an external bolt can penetrate through the mounting plates 23 to fix the heat conducting plate 2, two symmetrically distributed small cooling water tanks 3 are fixedly connected to the heat conducting plate 2, the small cooling water tanks 3 are distributed on two sides of the heat dissipating fins 22, one ends of the small cooling water tanks 3 are fixedly connected with a water inlet connector 31, a first sealing cover 312 is detachably connected to the water inlet connector 31, the other ends of the small cooling water tanks 3 are fixedly connected with a water outlet connector 32, a second sealing cover 322 is detachably connected to the water outlet connector 32, cooling liquid can be added into the small cooling water tanks 3 through the water inlet connector 31, the small cooling water tanks 3 can absorb the heat on the heat conducting plate 2 through the cooling liquid, the heat conducting plate 2 can better radiate the circuit board 1, and the cooling liquid in the small cooling water tank 3 can be discharged through the water outlet joint 32.
Specifically, the material of the attached heat-conducting block 11 and the clamped heat-conducting column 12 is aluminum, and the material of the heat-conducting plate 2 and the heat-radiating fin 22 is aluminum; the aluminum material is light, does not influence the normal use of the device, and has low price.
Specifically, a connecting bolt 21 is arranged on the heat conducting plate 2, and the heat conducting plate 2 is fixed with the circuit board 1 in a threaded manner through the connecting bolt 21; during installation, the connecting bolt 21 can penetrate through the heat conducting plate 2 and the circuit board 1, then the connecting bolt 21 and a matched nut thereof are screwed, and the dismounting process is opposite, so that the installation and the dismounting between the heat conducting plate 2 and the circuit board 1 are realized.
Specifically, the heat sink 22 is provided with a plurality of heat dissipation holes 221 uniformly distributed; the speed of the airflow flowing between the heat radiating fins 22 can be increased by the heat radiating holes 221.
Specifically, one end of the water inlet joint 31, which is far away from the small cooling water tank 3, is fixedly connected with a first hollow threaded pipe 311, the water inlet joint 31 is fixedly screwed with a first sealing cover 312 through the first hollow threaded pipe 311, one end of the water outlet joint 32, which is far away from the small cooling water tank 3, is fixedly connected with a second hollow threaded pipe 321, and the water outlet joint 32 is fixedly screwed with the second sealing cover 322 through the second hollow threaded pipe 321; the first hollow threaded pipe 311 is screwed into the first sealing cover 312 during installation, the first hollow threaded pipe 311 is screwed out during disassembly, so that the installation and the disassembly between the water inlet connector 31 and the first sealing cover 312 are realized, the second hollow threaded pipe 321 is screwed into the second sealing cover 322 during installation, and the second hollow threaded pipe 321 is screwed out during disassembly, so that the installation and the disassembly between the water outlet connector 32 and the second sealing cover 322 are realized.
Specifically, the small cooling water tank 3 is made of aluminum, and the outer wall of the small cooling water tank 3 is uniformly coated with a heat dissipation coating 33; the heat dissipation coating enhances the heat dissipation performance of the object by improving the radiation efficiency of the surface of the object, and can increase self-cleaning property, insulating property and corrosion resistance while achieving radiation cooling.
The utility model discloses a theory of operation and use flow: when using this device, can be to heat-conducting plate 2 on the heat transfer of circuit board 1 through laminating heat conduction piece 11 and block heat conduction post 12, then the heat on the heat-conducting plate 2 can distribute away through fin 22, and can add the coolant liquid to small-size cooling water tank 3 in through water supply connector 31, small-size cooling water tank 3 can absorb the heat on the heat-conducting plate 2 through its inside coolant liquid, thereby improve heat-radiating efficiency of heat-conducting plate 2, make heat-conducting plate 2 can be better play radiating effect to circuit board 1, can discharge the coolant liquid in small-size cooling water tank 3 through water connectors 32.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A composite circuit board with high heat dissipation performance comprises a circuit board (1), a heat conducting plate (2) and a small cooling water tank (3), it is characterized in that the outer wall of one side of the circuit board (1) is fixedly connected with a plurality of jointed heat-conducting blocks (11), the outer wall of one side of the circuit board (1) close to the attached heat-conducting block (11) is fixedly connected with a clamping heat-conducting column (12), the heat conducting plate (2) is detachably connected with the circuit board (1), the clamping heat conducting column (12) is clamped and connected with the heat conducting plate (2), the joint heat-conducting block (11) is jointed with one side of the heat-conducting plate (2) close to the circuit board (1), one side of the heat conducting plate (2) far away from the circuit board (1) is fixedly connected with a plurality of radiating fins (22) which are uniformly distributed, two symmetrically distributed mounting plates (23) are fixedly connected to two ends of the heat conducting plate (2);
two symmetric distributions of fixedly connected with on heat-conducting plate (2) small-size coolant tank (3), small-size coolant tank (3) distribute in the both sides of fin (22), small-size coolant tank (3) one end fixedly connected with water supply connector (31), can dismantle on water supply connector (31) and be connected with first sealed lid (312), small-size coolant tank (3) other end fixedly connected with goes out water swivel (32), go out water swivel (32) and go up to dismantle and be connected with the sealed lid of second (322).
2. The composite circuit board with high heat dissipation performance according to claim 1, wherein: the material of laminating heat conduction piece (11) with block heat conduction post (12) is aluminium, heat-conducting plate (2) with the material of fin (22) is aluminium.
3. The composite circuit board with high heat dissipation performance according to claim 1, wherein: the heat-conducting plate (2) is provided with a connecting bolt (21), and the heat-conducting plate (2) is fixedly connected with the circuit board (1) through the connecting bolt (21).
4. The composite circuit board with high heat dissipation performance according to claim 1, wherein: the radiating fins (22) are provided with a plurality of radiating holes (221) which are uniformly distributed.
5. The composite circuit board with high heat dissipation performance according to claim 1, wherein: the water inlet connector (31) is far away from a first hollow threaded pipe (311) fixedly connected with one end of the small cooling water tank (3), the water inlet connector (31) is fixed through the first hollow threaded pipe (311) and a first sealing cover (312) in a threaded mode, the water outlet connector (32) is far away from a second hollow threaded pipe (321) fixedly connected with one end of the small cooling water tank (3), and the water outlet connector (32) is fixed through the second hollow threaded pipe (321) and a second sealing cover (322) in a threaded mode.
6. The composite circuit board with high heat dissipation performance according to claim 1, wherein: the small cooling water tank (3) is made of aluminum, and a heat dissipation coating (33) is uniformly coated on the outer wall of the small cooling water tank (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922358775.7U CN211429863U (en) | 2019-12-25 | 2019-12-25 | Composite circuit board with high heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922358775.7U CN211429863U (en) | 2019-12-25 | 2019-12-25 | Composite circuit board with high heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211429863U true CN211429863U (en) | 2020-09-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922358775.7U Expired - Fee Related CN211429863U (en) | 2019-12-25 | 2019-12-25 | Composite circuit board with high heat dissipation performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211429863U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113135101A (en) * | 2021-05-11 | 2021-07-20 | 杜志奇 | New energy automobile charging gun and control method |
-
2019
- 2019-12-25 CN CN201922358775.7U patent/CN211429863U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113135101A (en) * | 2021-05-11 | 2021-07-20 | 杜志奇 | New energy automobile charging gun and control method |
| CN113135101B (en) * | 2021-05-11 | 2023-10-24 | 海南辰禾投资有限公司 | New energy automobile charging gun and control method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200904 |
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| CF01 | Termination of patent right due to non-payment of annual fee |