CN216960640U

CN216960640U - Novel temperature sensing gasket

Info

Publication number: CN216960640U
Application number: CN202220389563.4U
Authority: CN
Inventors: 黄飞龙
Original assignee: Suzhou Milande Automation Technology Co ltd
Current assignee: Suzhou Milande Automation Technology Co ltd
Priority date: 2022-02-25
Filing date: 2022-02-25
Publication date: 2022-07-12
Anticipated expiration: 2032-02-25

Abstract

The utility model discloses a novel temperature sensing gasket, which comprises an upper cover and a lower cover, wherein heat-conducting ceramic plates and a plurality of heat-conducting grooves distributed in an array manner are arranged on the upper cover and the lower cover respectively, a plurality of first grooves and a plurality of second grooves are formed in the upper cover, the first grooves and the second grooves are integrally connected and distributed in a step shape, mounting holes are formed in the first grooves, and copper bars are mounted in the mounting holes. The temperature sensing gasket provided by the utility model has a simple and practical structure, is used for being installed on a circuit board to protect a circuit connector, and can be used for guiding out heat generated by a power connector through the arranged heat conduction ceramic chip.

Description

Novel temperature sensing gasket

Technical Field

The utility model relates to the technical field of heating sheets, in particular to a novel temperature sensing gasket.

Background

The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. Generally, various electronic components are mounted on a circuit board, so that the circuit board can generate a large amount of heat during operation, the power connector current of various electronic components on the circuit board often generates connector heating when flowing through, and the connector heating can cause the circuit board to be burnt out, so that certain potential safety hazards exist, and a heat conduction jig needs to be developed to solve the problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the problems and designs a novel temperature sensing gasket.

The technical scheme of the utility model is that the novel temperature sensing gasket comprises an upper cover and a lower cover, wherein the upper cover and the lower cover are both provided with a heat conduction ceramic plate and a plurality of heat conduction grooves distributed in an array manner, the upper cover is provided with a plurality of first grooves and a plurality of second grooves, the first grooves and the second grooves are integrally connected and distributed in a ladder shape, mounting holes are formed in the first grooves, and copper bars are mounted in the mounting holes.

As a further supplement of the utility model, mounting grooves are formed in the middle parts of the upper cover and the lower cover, the heat-conducting ceramic plate is clamped in the mounting grooves, and semicircular grooves integrally connected with the mounting grooves are formed in the four corners of the mounting grooves.

As a further supplement of the present invention, the mounting groove is adapted to the heat conducting ceramic sheet, and the upper surface of the heat conducting ceramic sheet is provided with a plurality of heat conducting grooves distributed in an array.

As a further supplement of the utility model, one end of the upper cover is provided with a limit groove, the limit groove is integrally connected with the heat conducting groove on the upper cover, and the depth of the limit groove is consistent with that of the heat conducting groove.

As a further supplement of the utility model, one end of the upper cover opposite to the limiting groove is provided with a plurality of through grooves, the through grooves are integrally connected with the first groove, and the depth of the through grooves is consistent with that of the first groove.

As a further supplement of the utility model, two ends of the upper cover and the lower cover are both provided with bulges, and four corners of the upper cover and the lower cover are both provided with fixing holes.

The temperature sensing gasket has the advantages that the temperature sensing gasket is simple and practical in structure, is mounted on a circuit board and used for protecting a circuit connector on the circuit board, heat generated by a power connector is led out through the arranged heat conducting ceramic chip, and the temperature sensing gasket is simple in mounting and dismounting, cannot influence the work of electronic components on the circuit board and has strong practicability because the temperature sensing gasket body is made of insulating heat insulating materials and is provided with a plurality of heat conducting grooves which are convenient for heat dissipation, and a large amount of heat can be effectively prevented from being concentrated on the circuit board to burn the circuit board.

Drawings

FIG. 1 is a schematic view of the structure of the upper cover of the present invention;

FIG. 2 is a schematic view of the upper cover of the present invention from another perspective;

FIG. 3 is a schematic view of the upper cover of the present invention from a further perspective;

fig. 4 is a schematic structural view of the lower cover of the present invention.

In the figure, 1, an upper cover; 2. a heat conducting groove; 3. a fixing hole; 4. a limiting groove; 5. mounting grooves; 6. a first groove; 7. a second groove; 8. a protrusion; 9. mounting holes; 10. a lower cover; 11. a heat-conducting ceramic sheet; 12. a semicircular groove; 13. a copper bar; 14. a through groove.

Detailed Description

Firstly, the utility model is designed originally, the electric power joints of various electronic components mounted on a plurality of circuit boards often generate joint heating phenomenon when current flows, the circuit boards may be burnt out, and certain potential safety hazard exists.

The present invention will be described in detail with reference to the accompanying drawings, as shown in fig. 1 to 4, the temperature sensing gasket mainly includes two parts: the circuit board comprises an upper cover (1) and a lower cover (10), wherein heat-conducting ceramic plates (11) are arranged on the upper cover (1) and the lower cover (10) and used for conducting heat and dissipating heat to prevent a circuit board from being burnt out by a large amount of heat generated by a power connector when current flows through the power connector, and a plurality of heat-conducting grooves (2) distributed in an array mode are formed in the upper surface of each heat-conducting ceramic plate (11) and used for conducting heat and dissipating heat; mounting groove (5) have all been seted up at the middle part of upper cover (1) and lower cover (10), mounting groove (5) and heat conduction potsherd (11) looks adaptation for the fixed heat conduction potsherd (11) of installation, wherein set up semicircular groove (12) rather than a body coupling in the four corners position of mounting groove (5), be convenient for after installing in mounting groove (5) when heat conduction potsherd (11) and dismantle it, if not have the gap, the good dismantlement of heat conduction potsherd (11).

For better heat dissipation, a plurality of heat conducting grooves (2) distributed in an array manner are also formed in the upper cover (1) and the lower cover (10), a limiting groove (4) is formed in one end of the upper cover (1), a plurality of first grooves (6) and a plurality of second grooves (7) are formed in the other end of the upper cover, the limiting groove (4) is integrally connected with the heat conducting grooves (2) in the upper cover (1), the depth of the limiting groove (4) is consistent with that of the heat conducting grooves (2), the limiting groove (4) is used for fixing components on an electronic circuit board, the first grooves (6) are integrally connected with the second grooves (7) and distributed in a ladder shape, mounting holes (9) are formed in the first grooves (6), copper bars (13) are mounted in the mounting holes (9), and the copper bars (13) are in contact with circuits on the circuit board and used for guiding out heat; the first groove (6) is communicated with the heat conducting groove (2) through a through groove (14) to be integrally connected, and the depth of the through groove (14) is consistent with that of the first groove (6); both ends of the upper cover (1) and the lower cover (10) are provided with protrusions (8), so that a certain gap exists between the upper cover (1) and the lower cover (10), a circuit board is convenient to fix, and fixing holes (3) are formed in the four corners of the upper cover (1) and the lower cover (10) and used for fixing the upper cover (1) and the lower cover (10).

The temperature sensing gasket is assembled on the circuit board, the power connector on the circuit board is fixed between the upper cover (1) and the lower cover (10), a large amount of heat generated by the power connector when current passes through the power connector can be guided into the heat conducting ceramic sheet (11), and the heat conducting grooves (2) formed in the upper cover (1) and the lower cover (10) can accelerate heat conduction, so that the circuit board is quickly cooled, and the circuit board is prevented from being damaged due to overheating, therefore, the temperature sensing gasket has strong practicability.

The technical solutions described above only represent the preferred technical solutions of the present invention, and some possible modifications to some parts of the technical solutions by those skilled in the art all represent the principles of the present invention, and fall within the protection scope of the present invention.

Claims

1. The utility model provides a novel temperature sensing gasket, includes upper cover (1) and lower cover (10), its characterized in that, upper cover (1) with all be provided with heat conduction potsherd (11) and a plurality of heat conduction groove (2) that are array distribution on lower cover (10), a plurality of first recesses (6) and a plurality of second recess (7) have been seted up on upper cover (1), first recess (6) with second recess (7) body coupling just is the echelonment and distributes, mounting hole (9) have been seted up in first recess (6), install copper bar (13) in mounting hole (9).

2. The novel temperature sensing gasket as claimed in claim 1, wherein the upper cover (1) and the lower cover (10) are both provided with mounting grooves (5) at the middle portions thereof, the heat conductive ceramic sheet (11) is clamped in the mounting grooves (5), and semicircular grooves (12) integrally connected with the mounting grooves (5) are formed at four corners of the mounting grooves.

3. The novel temperature sensing gasket as claimed in claim 2, wherein the mounting groove (5) is adapted to the heat conducting ceramic sheet (11), and a plurality of heat conducting grooves (2) are formed on the upper surface of the heat conducting ceramic sheet (11) in an array.

4. The novel temperature sensing gasket as claimed in claim 1, wherein a limiting groove (4) is formed at one end of the upper cover (1), the limiting groove (4) is integrally connected with the heat conducting groove (2) on the upper cover (1), and the depth of the limiting groove (4) is the same as that of the heat conducting groove (2).

5. The novel temperature-sensing gasket as claimed in claim 1, wherein a plurality of through grooves (14) are formed at the end of the upper cover (1) opposite to the limiting groove (4), the through grooves (14) are integrally connected with the first groove (6), and the depth of the through grooves (14) is consistent with that of the first groove (6).

6. The novel temperature-sensing gasket as claimed in claim 1, wherein the upper cover (1) and the lower cover (10) are provided with protrusions (8) at both ends thereof, and fixing holes (3) are formed at four corners thereof.