CN203011557U - Layout structure and electric instrument for detecting temperature of cooling body - Google Patents
Layout structure and electric instrument for detecting temperature of cooling body Download PDFInfo
- Publication number
- CN203011557U CN203011557U CN 201220379722 CN201220379722U CN203011557U CN 203011557 U CN203011557 U CN 203011557U CN 201220379722 CN201220379722 CN 201220379722 CN 201220379722 U CN201220379722 U CN 201220379722U CN 203011557 U CN203011557 U CN 203011557U
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- circuit board
- arrangement
- cooling body
- holding device
- section
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
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- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a layout structure and an electric instrument for detecting temperature of a cooling body. The layout structure comprises a temperature sensor, a circuit board and a retaining device, wherein the circuit board is provided with a second circuit board section and a first circuit board section equipped with the temperature sensor, the first circuit board section and the second circuit board section are connected through such a small connecting area, so that the first circuit board section is elastically shiftable relative to the second circuit board section, especially can shift elastically, and the retaining device is arranged between the cooling body and the first circuit board section.
Description
Technical field
The utility model relates to arrangement and an electric instrument for detection of the cooling body temperature.
Background technology
The arrangement that is used for temperature sensor by DE102005013762B3 known is wherein by printed conductor/conductor circuit (Leiterbahn) realization of level and the thermo-contact of cooling body.
DE19516260C1 illustrates an arrangement for detected temperatures on measuring with transducer, and wherein a temperature sensor is arranged on and measures with between transducer and circuit board.
DE3903615A1 illustrates a circuit board, and it has at least one connecting portion for structure member and has a cooling body.
By the known temperature measuring equipment of DE19630794B4, wherein a temperature sensor is arranged on the elastomeric element that is integrated into the circuit board the inside.
DE7718039U illustrates the sensor of a resistance thermometer.
Summary of the invention
Therefore, the purpose of this utility model is, reliable and cost is advantageously realized the detection to the cooling body temperature in an electric instrument.
According to the utility model, this purpose realizes by arrangement and electric instrument with following characteristics.
The key character of arrangement of the present utility model is, this arrangement is designed to be suitable for detecting the temperature of cooling body, has a temperature sensor, a circuit board and a holding device,
Wherein, described circuit board has the first circuit board section that a second circuit board section and is equipped with temperature sensor, this first circuit board section is connected by so little join domain with the second circuit board section, make the first circuit board section can be offset, especially make the first circuit board section with respect to second circuit board section resilient bias with respect to second circuit board section elasticity
Wherein, be provided with a holding device between cooling body and first circuit board section,
Wherein, described temperature sensor and holding device are spaced apart, especially utilize first circuit board section and holding device spaced apart.
Advantageously to realize the hot tie-in that sensor is good in sensor installation at cost in this advantage.Due to flexible skew, can compensate machine error, these errors especially may produce due to thermal expansion or as foozle.By described sensor setting is being remained on respect to cooling body on section's section of the resiliently deflectable on a distance that limits by holding device by holding device, can make circuit board be fixed on one with housing parts that cooling body is fixedly connected with on.Therefore the error of housing parts, circuit board and/or cooling body and/or only caused admitting the corresponding resilient bias of the circuit board segment of sensor by the expansion that heat causes.In addition, by separating first circuit board section and second circuit board section, can realize enough electrical isolation distances between temperature sensor and other electric parts.This can realize by a middle recess that arranges and the connecting portion section of a corresponding enforcement in simple mode.Temperature sensor and holding device be spaced apart makes temperature sensor and disconnected being coupled of mechanical load that is applied to by cooling body on holding device and circuit board.Therefore reduce the mechanical load of temperature sensor and improve operation persistence and operational reliability.
In a favourable design proposal, be provided with a holding device between cooling body and first circuit board section.In this advantage be, the heat of cooling body is transmitted to sensor through holding device, and the temperature of cooling body is confirmable.Reduce in this way overheated danger, that is improved security.
In another favourable design proposal, described join domain and a recess make the first circuit board section and second circuit board is intersegmental separates, and especially wherein, described recess is implemented as the milling section in circuit board.To be easy to make as the recess of milling section in this advantage.
In another favourable design proposal, described recess and join domain surround at least partly and/or frame encloses the second circuit board section, and especially wherein, described recess is arranged in circuit board fully.In this advantage be, the second circuit board section is resiliently deflectable in this case, but by described embedding, the little when danger of fracture passes in board edge than recess.
In another favourable design proposal, described recess comes into effect or leads to board edge from the edge of circuit board.In this advantage be, the described recess that comes into effect from the edge can be simply and cost advantageously make.
In another favourable design proposal, the width of described notch ratio first circuit board section deeper extends to inside circuit board.In this advantage be, the first circuit board section can especially flexibly be offset, and namely can realize skew in circuit board with small power and then small stress.
In another favourable design proposal, from cooling body via holding device to the heat transmission resistance of sensor less than via all other existing cooling body and sensor thermally conductive pathways, especially via the heat transmission resistance that is arranged on the air between cooling body and first circuit board section, especially wherein, described cooling body and/or holding device are metals, and be especially made of aluminum.Due to good hot tie-in, can realize due to small conductive heat loss accurately determining of cooling body temperature in this advantage.
In another favourable design proposal, described board design becomes multilayer, especially is configured to multilayer board and/or has interior layer.To realize connecting the deposited plated-through-hole of each layer in this advantage.Apply plated-through-hole here and refer to, recess is the inboard complete metal in hole for example.Can realize in this way the electricity and/or hot aspect favourable characteristic, especially also realize the less heat transmission resistance from the cooling body to the sensor.
In another favourable design proposal, described circuit board is with SMD(paster encapsulation) technology and/or utilize the straight cutting encapsulation technology to equip, especially described temperature sensor is equipped with the SMD technology.To realize producing in enormous quantities in this advantage.
In another favourable design proposal, the zone of each metal, especially layer are arranged in the first circuit board section, especially are arranged on the end face and/or bottom surface and/or interior layer of circuit board.That the heat transmission along circuit board is improved in the zone of described metal, also can set up especially thus the less heat transmission resistance from the cooling body to the sensor in this advantage.
In another favourable design proposal, the zone of described metal is implemented as the printed conductor/conductor circuit of circuit board (Leiterbahn), the printed conductor of especially being made by copper-bearing materials, especially zinc-plated copper printed conductor.To realize high electric conductivity and thermal conductivity by a kind of unique material in this advantage.
In another favourable design proposal, one of zone of the described metal of described holding device contact.Due to the small conductive heat loss via the zone of holding device and described metal, can accurately determine the temperature of cooling body in this advantage.
In another favourable design proposal, be provided with a recess in the first circuit board section, especially one holding device inserted or the deposited plated-through-hole of passing, the especially deposited plated-through-hole, the deposited plated-through-hole that is especially become by the especially zinc-plated copper of copper-bearing materials of a metal by it.That described deposited plated-through-hole can be perpendicular to printed conductor, namely realize the heat transmission by circuit board on the normal direction of printed conductor plane and/or circuit board plane in this advantage.
In another favourable design proposal, the wall section of the metallic region of described circuit board and deposited plated-through-hole is connected.That described deposited plated-through-hole is electrically connected to each metallic region of circuit board to be connected with heat conduction and can to realize via holding device the good hot tie-in of cooling body mutually in this advantage.
In another favourable design proposal, the wall section of plated-through-hole is applied in described holding device contact.That described deposited plated-through-hole makes holding device be connected with being connected with the circuit board electrical connection in this advantage.
In another favourable design proposal, being connected of described holding device and first circuit board section be especially to can be threaded connection with removable pine, especially, be provided with threaded hole in holding device, this threaded hole is admitted trip bolt, especially a metallic region of the head of screw contact circuit plate of trip bolt.That described cooling body can utilize holding device to be arranged on circuit board simply in this advantage.
In another favourable design proposal, described holding device is fixedly connected with cooling body and/or material is connected in combination, especially is connected by riveted structure.In this advantage be, described holding device and being connected of cooling body be compact and each cooling muscle that do not disturb cooling body between cooling-air stream.
In another favourable design proposal, described holding device and the cooling body parts by screw-threaded engagement are connected in the mode of removable pine.That described holding device can be arranged on cooling body simply in this advantage.
In another favourable design proposal, a framework makes cooling body mechanically, especially mechanical rigid ground is connected with circuit board.In this advantage be, but the lip-deep electric parts of holding circuit plate are avoided mechanical damage.
In another favourable design proposal, framework is connected with the mode of cooling body with removable pine, especially wherein, described Frame Design becomes housing parts and/or described framework to form at least partly housing, wherein, described framework mechanically is connected in the zone of second circuit board section with circuit board, especially mechanical rigid ground connects.That cooling body, framework and circuit board form in the unit and the housing of can packing into simply of a compactness in this advantage.
In another favourable design proposal, described sensor setting circuit board on the surface of cooling body.In this advantage be, described sensor is avoided mechanical damage by cooling body, especially in first circuit board section resilient bias.
In another favourable design proposal, described sensor is connected by soldering connecting structure/technology with circuit board.In this advantage be the contacting of described sensor and fixing can the realization in a procedure of processing and with a kind of unique material.
In another favourable design proposal, described sensor has joint face and a temperature detection face of connecting for electric contact, and wherein, the metallic region soldering that one on the temperature detection face of described sensor and circuit board extends in the wall section of deposited plated-through-hole is connected.That described electric contact connection can simply and cost advantageously realizes by soldering connecting structure/technology and the temperature detection face of described sensor is connected with deposited plated-through-hole through metallic region with heat conduction and is connected with cooling body through holding device thus by soldering connecting structure in this advantage.
In another favourable design proposal, described holding device is designed to spigot.That spigot can be installed simply in this advantage.
In another favourable design proposal, be provided with the pad of a spacer sleeve and/or a metal between cooling body and first circuit board section.To adjust a distance of determining and can reduce the mechanical load of circuit board between cooling body and first circuit board section in this advantage.
The utility model is at an electric instrument, especially one to be used for to the key character aspect the current transformer of motor, especially asynchronous machine and/or synchronous motor power supply be that described electric instrument comprises an above-mentioned arrangement for detection of the cooling body temperature.
In this advantage be, can monitor the temperature of electric instrument, can avoid thus overheated, the security when namely improving operation.
In another favourable design proposal, a cooling body is connected with heat conduction with thermogenesis element on being arranged on circuit board.In this advantage be, the temperature of described element can be determined to monitor by the temperature of cooling body, can avoid thus overheated.
In another favourable design proposal, described current transformer has only circuit board, and this circuit board not only comprises low-voltage area, especially controls electronic installation, and comprises high voltage region, especially power electric device.That the whole electronic installation of described current transformer can be made in a unique step and can install simply in this advantage.
In another favourable design proposal, described control electronic installation spatially separates with power electric device and/or the electricity isolation, and the signal of wherein controlling between electronic installation and power electric device passes through the photo-coupler realization.That signal transmits interference-free and realizes, especially avoids short circuit in this advantage.
In another favourable design proposal, the cooling-air stream that is driven by a blower fan flows through on the surf zone of cooling body.That the heat with electric instrument is discharged to surrounding air effectively in this advantage.
In another favourable design proposal, described cooling body is connected with the coldplate of one switch cubicle/panel box.Can be effectively the heat of electric instrument to be discharged on coldplate in this advantage.
In another favourable design proposal, described coldplate has passage, these passages MEDIA FLOW mistake that is cooled.Effectively to discharge the heat of coldplate and also to discharge thus the heat of electric instrument by heat eliminating medium in this advantage.
The utility model is not limited to the Feature Combination in claims.Draw other suitable combinatory possibility of claim and/or single claim feature and/or instructions feature and/or accompanying drawing feature the task that especially can propose from the proposition of task and/or by the comparison with prior art to those skilled in the art.
Description of drawings
Explain in detail the utility model by accompanying drawing now.
Schematically show out with sectional view the arrangement that has temperature sensor according to of the present utility model in Fig. 1,
Schematically show out a circuit board segment with vertical view in Fig. 2, it has according to arrangement of the present utility model,
Fig. 3 illustrates the partial enlarged drawing according to the xsect of arrangement of the present utility model
Fig. 4 illustrates a front according to circuit board with the cooling body that is connected with this circuit board of electric instrument of the present utility model with oblique view, the housing of not shown described arrangement wherein,
Fig. 5 illustrates the back side of circuit board with oblique view,
Circuit board is shown together with the front of connected cooling body with the framework that is connected with cooling body with vertical view in Fig. 6,
The front of the circuit board that there is no cooling body is shown with vertical view in Fig. 7,
Fig. 8 illustrates the printed conductor structure of circuit board, especially layout/typesetting design with vertical view.
Reference numerals list:
1 cooling body
2 holding devices
3 first circuit board sections
4 screws
5 temperature sensors
10 first recesses
11 surface of contact
12 circuit boards
13 printed conductors/conductor circuit
14 apply plated-through-hole
20 microprocessors
21 first capacitors
22 first power-supply filters
23 first cooling muscle
24 first floor section
25 backboards
26 cooling muscle
27 first connectors
28 inductance
29 second capacitors
30 transformers
31 second connectors
32 first coupling arrangements
33 second coupling arrangements
34 first photo-couplers
35 second photo-couplers
36 the 3rd coupling arrangements
37 the 4th coupling arrangements
40 second recesses
41 second floor section
42 frame parts
50 resistance
51 shunt resistances
52 second source wave filters
60 circuits
61 inverters
Embodiment
Fig. 1 illustrates the arrangement according to the temperature for detection of cooling body 1 of the present utility model.This arrangement has a holding device 2, and this holding device makes cooling body 1 with 3 hot tie-ins of first circuit board section and/or is electrically connected to.Holding device 2 for example is designed to spigot or pin.Heat transfer between cooling body 1 and holding device 2 has small heat transmission resistance.Cooling body 1 and holding device 2 are designed to metal, and be preferably made of aluminum.Holding device 2 and cooling body 1 riveted joint.Holding device 2 be designed to removable pine being connected of first circuit board section 3, especially connect by screw 4, it is threaded into the threaded hole the inside in holding device 2.On first circuit board section 3 spatially to be provided with a sensor, preferred temperature sensor 5 near the mode of holding device 2.Temperature sensor 5 preferably arranges at interval by first circuit board section 3 and holding device 2.
Fig. 2 illustrates first circuit board section 3, is provided with a recess of temperature sensor 5 and circuit board segment 3 thereon.This recess especially is configured to apply plated-through-hole 14.Here apply plated-through-hole and refer to, the inwall complete metal of recess especially uses copper or tin-coated copper in order to metallization.The surface of contact 11 of metal, be that printed conductor section section is connected in the wall section of applying plated-through-hole 14.The surface of contact 11 of metal especially radially surrounds recess in the plane of printed conductor section section, make holding device 2 insert and/or pass by this recess.Preferably implement respectively this Metal Contact face 11 in a plurality of or all circuit board segment.At this, the wall section of plated-through-hole 14 and/or the surface of contact 11 of metal are applied in holding device 2 contacts, for example pass through the head of screw of screw 4.
First circuit board section 3 remainder by another recess 10 and little join domain and circuit board 12 thermally, mechanically with electricly separately.Make thus first circuit board section 3 relatively the remainder of circuit board 12 flexibly be offset.Compared to the remainder of circuit board 12 and being rigidly connected of cooling body 1, first circuit board section 3 is the flexibly skew by caused by manufacturing technology and/or the error in length that caused by heat of holding device 2 especially.
Make described another recess 10 that the remainder of first circuit board section 3 and circuit board 12 separates preferably be arranged in circuit board 12 inside fully.
Implement so little join domain, make recess 10 surround first circuit board section 3 up at least 75% ground.Especially, the contact area of join domain and first circuit board section 3 is less than the length of this join domain, thereby first circuit board section 3 can be with respect to the remainder resilient bias of circuit board 12.
The surface of contact 11 of metal reaches recess 10 always and is implemented in as printed conductor 13 on the end face and/or bottom surface and/or interior layer of first circuit board section 3.Temperature sensor 5 be positioned at first circuit board section 3 on that side of cooling body 1 and utilize Metal Contact face 11 electricity ground and/or thermally be connected with holding device 2.Temperature sensor 5 especially has the joint face and the temperature detection face that is connected with Metal Contact face 11 of connecting for electric contact.
At this, the metal inside layer of first circuit board section 3 also contacts and applies plated-through-hole 14, but interior layer contact temperature sensor 5 not.Temperature sensor 5 especially has minimum spacing with the metal inside layer of first circuit board section 3.
Cooling body 1 is by framework 42 and circuit board 12 mechanical connections.This connects mechanical rigid especially.This connection is preferably implemented as removable pine, for example utilizes various screw connections.
Determine a plane at this circuit board 12, this plane has a normal vector.The base plate of cooling body 1 is basically parallel to this plane.Temperature sensor 5 is arranged on circuit board 12 like this, makes holding device 2 comprise at least in part the vertical projection of temperature sensor 5 on normal vector in the vertical projection on normal vector.Especially holding device 2 is arranged on circuit board 12 like this, makes holding device 2 extend further than being parallel on the direction on circuit board 12 planes at all on the direction of normal vector.
Spatially be arranged between cooling body 1 and circuit board 12 at this holding device 2 and temperature sensor 5.By this middle setting of temperature sensor 5, temperature sensor 5 extend into inside a spatial dimension, and this spatial dimension defines by the metal surface section of uniform temp at least partly, i.e. the surface section of cooling body 1, holding device 2 and circuit board 12.
Other according to embodiment of the present utility model in, recess 10 comes into effect from the edge of circuit board 12, wherein recess 10 deeper extends in circuit board 12 than the width of first circuit board section 3.
Other according to embodiment of the present utility model in, be provided with a spacer sleeve between cooling body 1 and first circuit board section 3.By first circuit board section 3 is pressed on spacer sleeve with screw 4 top that is screwed in holding device 2, especially spacer sleeve, can adjust between cooling body 1 and circuit board 3 set a distance really.
Other according to embodiment of the present utility model in, holding device 2 was fixed with being connected of circuit board 3, for example by the riveted joint.
Other according to embodiment of the present utility model in, holding device 2 is removable pine with the mechanical connection of cooling body 1, preferably utilizes screw connection.
Other according to embodiment of the present utility model in, be provided with pad between head of screw and first circuit board section 3 and/or between spacer sleeve and first circuit board section 3, be used for to first circuit board section 3 mechanical relief.Pad is preferably made by metal material, reduces thus the heat transmission resistance between holding device 2 and Metal Contact face 11.
Shown in Figure 4 when removing housing according to electric instrument of the present utility model, a current transformer especially, this current transformer has the end face that is arranged on circuit board 12, is the cooling body 1 on the front.The electricity instrument can be connected on power supply grid by the first connector 27.Realize in load, the especially electrical connection on motor, preferred asynchronous machine and/or synchronous motor by the second connector 31.
Second area is the high voltage region with power electric device.Be provided with in the zone of power electric device:
-inverter 61
-for the first power-supply filter 22 that goes to input signal to disturb, have inductance 28,
-second source wave filter 52 is used for going to disturb to output signal,
-shunt resistance 51.
Control that signal transmission utilization electricity between electronic installation and power electric device is isolation, the first photo-coupler 34 that be used for control signal and the second photo-coupler 35 electricity isolation, that be used for measuring-signal realize.Circuit board 12 does not especially all have printed conductor, is metal level in all planes in the zone of controlling between electronic installation and power electric device.Photo-coupler 34 is connected with inverter 61 by each parallel circuit 60 with being connected.Utilize transformer 30 to realize the expansion of switching network (Aufbereitung).
Cooling body 1 is arranged in the zone of power electric device, and this cooling body covers power- supply filter 22 and 52 and resistance 50 and shunt resistance 51 and inverter 61.Cooling body 1 extends to the second connector 31 from the first connector 27 always on the whole length of circuit board 12.
Utilize continuous casting process to make the blank of cooling body 1 and utilize thus other processing process for producing cooling body 1.Continuous casting section bar has base plate, form on this base plate the upwardly extending cooling muscle 26 of Continuous Casting Square and one tabular, at the upwardly extending rear wall of Continuous Casting Square, be backboard 25.Backboard 25 is preferably perpendicular to base plate.
Be formed with recess 40 in cooling body 1 in the zone of inductance 28.The base plate that recess 40---is preferably transverse to Continuous Casting Square to the circular hole that is worked in continuous casting section bar---cooling body 1 is divided into two zones: the first floor section 24 and the second floor section 41.At this, recess 40 is not only processed in base plate, and processing is in the cooling muscle 26 of centre.Especially, the inductance 28 that is arranged on circuit board 12 stretches in the recess 40 of cooling body 1.Especially, form---preferred drilling and/or mill out---recess 40 after the continuous casting of cooling body 1.
Other according to embodiment of the present utility model in, coldplate with the opposed side of electric instrument on have the structure that the surface is strengthened, for example cooling muscle and/or cooling finger, they are cooled by convection current.
Other according to embodiment of the present utility model in, cooling body 1 is directly cast as single parts together with the second recess 40.
Other according to embodiment of the present utility model in, be provided with an isolation structures between cooling body 1 and power electric device, wherein, this isolation structures makes electric parts and cooling body 1 electrical isolation on the one hand, on the other hand, this isolation structures have than all other heat-transfer paths between electric parts and cooling body 1 less, from electric parts to cooling body 1 heat transmission resistance.For example can use heat conductive pad or heat-conducting cream as electric isolation structures.
Other according to embodiment of the present utility model in, electric instrument is cooling by air by blower fan.Aeration flow by cooling muscle 26 guiding blower fans also is discharged to surrounding air with heat thus for this reason.
Claims (35)
1. arrangement for detection of the cooling body temperature, this arrangement has a temperature sensor, a circuit board and a holding device,
Wherein, described circuit board has the first circuit board section that a second circuit board section and is equipped with temperature sensor, this first circuit board section is connected by so little join domain with the second circuit board section, makes this first circuit board section can be with respect to described second circuit board section resilient bias
Wherein, be provided with holding device between cooling body and first circuit board section,
Wherein, described temperature sensor and holding device are spaced apart.
2. arrangement as claimed in claim 1, is characterized in that, described temperature sensor is spaced apart by first circuit board section and holding device.
3. arrangement as claimed in claim 1 or 2, is characterized in that, described join domain and a recess make the first circuit board section and second circuit board is intersegmental separates.
4. arrangement as claimed in claim 3, is characterized in that, described recess is implemented as the milling section in circuit board.
5. arrangement as claimed in claim 3, is characterized in that, described recess and join domain surround at least partly and/or frame encloses the second circuit board section, wherein,
-described recess is arranged in circuit board, perhaps fully
-described recess comes into effect from the edge of circuit board, perhaps
-described recess leads to the edge of circuit board, perhaps
The width of-described notch ratio first circuit board section deeper extends in circuit board.
6. arrangement as claimed in claim 1 or 2, is characterized in that, from cooling body via holding device to the heat transmission resistance of the sensor heat transmission resistance less than other existing thermally conductive pathways cooling body and sensor via all.
7. arrangement as claimed in claim 6, is characterized in that, from cooling body via holding device to the heat transmission resistance of sensor less than via the heat transmission resistance that is arranged on the air cooling body and first circuit board section.
8. arrangement as claimed in claim 6, is characterized in that, described cooling body and/or holding device are metals.
9. arrangement as claimed in claim 8, is characterized in that, described cooling body and/or holding device are made of aluminum.
10. arrangement as claimed in claim 1 or 2, is characterized in that, and is that described board design becomes multilayer and/or have an interior layer.
11. arrangement as claimed in claim 10 is characterized in that, described circuit board is implemented as multilayer board.
12. arrangement as claimed in claim 10 is characterized in that, described circuit board is equipped with the SMD technology or by the straight cutting encapsulation technology, and/or described temperature sensor is equipped with the SMD technology.
13. arrangement as claimed in claim 10, it is characterized in that, the zone of a plurality of metals is arranged in the first circuit board section on the end face and/or bottom surface and/or interior layer of circuit board, wherein, described metallic region is designed to the printed conductor of circuit board, wherein, one of described metallic region of described holding device contact.
14. arrangement as claimed in claim 13 is characterized in that, the layer of a plurality of metals is arranged in the first circuit board section on the end face and/or bottom surface and/or interior layer of circuit board.
15. arrangement as claimed in claim 13 is characterized in that, described metallic region is designed to the printed conductor made by copper-bearing materials.
16. arrangement as claimed in claim 15 is characterized in that, described metallic region is designed to zinc-plated copper printed conductor.
17. arrangement as claimed in claim 1 or 2, it is characterized in that, be provided with one by its deposited plated-through-hole that makes described holding device introduce or pass and/or insert or inserted in the first circuit board section, wherein, the wall section of one metallic region of described circuit board and deposited plated-through-hole is connected, wherein, the wall section of plated-through-hole is applied in described holding device contact.
18. arrangement as claimed in claim 17 is characterized in that, described deposited plated-through-hole is the deposited plated-through-hole of a metal.
19. arrangement as claimed in claim 18 is characterized in that, described deposited plated-through-hole is the deposited plated-through-hole of being made by copper-bearing materials.
20. arrangement as claimed in claim 19 is characterized in that, described deposited plated-through-hole is the deposited plated-through-hole that is become by zinc-plated copper.
21. arrangement as claimed in claim 1 or 2 is characterized in that, described holding device with can tear open being connected of first circuit board section the pine.
22. arrangement as claimed in claim 21 is characterized in that, described holding device is to be threaded with being connected of first circuit board section.
23. arrangement as claimed in claim 22 is characterized in that, is provided with threaded hole in holding device, this threaded hole is admitted a trip bolt, a metallic region of the head of screw contact circuit plate of this trip bolt.
24. arrangement as claimed in claim 1 or 2 is characterized in that, described holding device is fixedly connected with cooling body and/or material is connected in combination; Perhaps described holding device is connected in the mode that can tear pine open with the parts of cooling body by a screw-threaded engagement.
25. arrangement as claimed in claim 24 is characterized in that, described holding device is fixedly connected with by riveted joint with cooling body.
26. arrangement as claimed in claim 1 or 2, it is characterized in that, one framework mechanically is connected cooling body with circuit board, wherein, described Frame Design becomes housing parts and/or described framework to form at least partly housing, wherein, described framework mechanically is connected in the zone of second circuit board section with circuit board.
27. arrangement as claimed in claim 26 is characterized in that, described framework makes cooling body mechanical rigid ground be connected with circuit board; Described framework is connected with circuit board mechanical rigid ground in the zone of second circuit board section.
28. arrangement as claimed in claim 26 is characterized in that, described framework makes cooling body mechanically be connected with circuit board in the mode that can tear pine open.
29. arrangement as claimed in claim 1 or 2 is characterized in that, described sensor setting circuit board on the surface of cooling body, wherein, described sensor is connected by soldering connecting structure with circuit board.
30. arrangement as claimed in claim 17, it is characterized in that, described sensor has joint face and a temperature detection face of connecting for electric contact, and the metallic region soldering that one on the temperature detection face of wherein said sensor and circuit board extends in the wall section of deposited plated-through-hole is connected.
31. arrangement as claimed in claim 1 or 2 is characterized in that, described holding device is implemented as spigot; And/or be provided with the pad of a spacer sleeve and/or a metal between cooling body and first circuit board section.
32. an electric instrument is characterized in that, described electric instrument comprises just like at least one described arrangement in the claims.
33. electric instrument as claimed in claim 32 is characterized in that, described electric instrument is one to be used for the current transformer to the motor power supply.
34. electric instrument as claimed in claim 33 is characterized in that, described motor is asynchronous machine or synchronous motor.
35. electric instrument as claimed in claim 33 is characterized in that, a cooling body is connected with heat conduction with thermogenesis element on being arranged on circuit board, wherein,
-described current transformer has only circuit board, and this circuit board not only comprises low-voltage area, namely controls electronic installation, and comprise high voltage region, be power electric device,
-described control electronic installation spatially separates with power electric device and/or the electricity isolation,
Signal between-control electronic installation and power electric device passes through photo-coupler and realizes,
-flow through to release heat to surrounding air by the cooling-air stream of a blower fan driving on the surf zone of cooling body, and/or described cooling body is connected to release heat to coldplate with the coldplate of a switch cubicle, wherein, described coldplate has the passage that is flow through by heat eliminating medium.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102011109097.9 | 2011-08-02 | ||
| DE102011109097 | 2011-08-02 | ||
| DE102012013466A DE102012013466A1 (en) | 2011-08-02 | 2012-07-09 | Arrangement for detecting temperature of heat sink mounted in e.g. converter, has holding device arranged for holding a temperature sensor, which is provided between heat sink and specific circuit board section of printed circuit board |
| DE102012013466.5 | 2012-07-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203011557U true CN203011557U (en) | 2013-06-19 |
Family
ID=47554242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220379722 Expired - Lifetime CN203011557U (en) | 2011-08-02 | 2012-08-01 | Layout structure and electric instrument for detecting temperature of cooling body |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN203011557U (en) |
| DE (1) | DE102012013466A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111492215A (en) * | 2017-10-23 | 2020-08-04 | 盛思锐股份公司 | Sensor module, in particular for measuring the ambient temperature, the relative air humidity and the gas concentration in the environment in which the sensor module is located |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005013762C5 (en) * | 2005-03-22 | 2012-12-20 | Sew-Eurodrive Gmbh & Co. Kg | Electronic device and method for determining the temperature of a power semiconductor |
| DE102016201447A1 (en) * | 2016-02-01 | 2017-08-03 | Continental Automotive Gmbh | Connection between a winding and a circuit board |
| DE102017004748A1 (en) | 2016-07-14 | 2018-01-18 | Sew-Eurodrive Gmbh & Co Kg | Method for temperature detection and electrical appliance |
| EP3627570A1 (en) | 2018-09-18 | 2020-03-25 | Heraeus Additive Manufacturing GmbH | Heat exchanger for semiconductor elements |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE7718039U1 (en) | 1977-06-08 | 1977-09-22 | W.C. Heraeus Gmbh, 6450 Hanau | SENSOR OF A RESISTANCE THERMOMETER |
| DE3903615A1 (en) | 1989-02-08 | 1990-08-16 | Kostal Leopold Gmbh & Co Kg | Electrical printed circuit board |
| DE19516260C1 (en) | 1995-04-27 | 1996-10-02 | Mannesmann Ag | Measuring transducer temp indication device |
| DE19630794B4 (en) | 1996-07-31 | 2005-09-29 | Robert Bosch Gmbh | temperature measuring |
| DE102005013762C5 (en) | 2005-03-22 | 2012-12-20 | Sew-Eurodrive Gmbh & Co. Kg | Electronic device and method for determining the temperature of a power semiconductor |
-
2012
- 2012-07-09 DE DE102012013466A patent/DE102012013466A1/en active Granted
- 2012-08-01 CN CN 201220379722 patent/CN203011557U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111492215A (en) * | 2017-10-23 | 2020-08-04 | 盛思锐股份公司 | Sensor module, in particular for measuring the ambient temperature, the relative air humidity and the gas concentration in the environment in which the sensor module is located |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102012013466A1 (en) | 2013-02-07 |
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Granted publication date: 20130619 |
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| CX01 | Expiry of patent term |