CN208581397U - Circuit board and charging pile - Google Patents
Circuit board and charging pile Download PDFInfo
- Publication number
- CN208581397U CN208581397U CN201820904629.2U CN201820904629U CN208581397U CN 208581397 U CN208581397 U CN 208581397U CN 201820904629 U CN201820904629 U CN 201820904629U CN 208581397 U CN208581397 U CN 208581397U
- Authority
- CN
- China
- Prior art keywords
- busbar connector
- board
- board ontology
- ontology
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000009434 installation Methods 0.000 claims abstract description 23
- 238000003466 welding Methods 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 10
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/70—Energy storage systems for electromobility, e.g. batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/7072—Electromobility specific charging systems or methods for batteries, ultracapacitors, supercapacitors or double-layer capacitors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T90/00—Enabling technologies or technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02T90/10—Technologies relating to charging of electric vehicles
- Y02T90/12—Electric charging stations
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The utility model discloses a kind of circuit boards and the charging pile for being provided with the circuit board.The circuit board includes board ontology, and the board ontology is used for layout elements；Busbar connector, the busbar connector have the installation position for the element, and at least part of the busbar connector is attached on the first surface of the board ontology and is combined together by welding procedure and the plate ontology.The circuit board has the reliability of the electronic circuit system of enhancing.
Description
Technical field
The utility model belongs to circuit board manufacturing area, and in particular to a kind of circuit board.
The utility model further relates to a kind of charging pile for being provided with foregoing circuit plate.
Background technique
Common circuit board (also referred to as printed circuit board, pcb board or wiring board) substantially applies copper using surface and carries out
Circuit production.In energy class product, such as alternating-current charging pile, generally require to introduce on circuit boards tens amperes of high current into
The control of row on-off.The copper foil circuit of general circuit board can carry that electric current is small, and heat-sinking capability is poor, and temperature rise is bigger, and right
The product that relatively high closing inner chamber is required in water proof and dust proof is very big heat source.It is especially high in environment temperatures such as summers
Occasion, prolonged high current is through-flow to be will lead to circuit board and seriously overheats, and influences the stability of circuit system.
Utility model content
To be solved in the utility model is the limitation and thermal defect of ordinary circuit board through-current capability.Involved by the utility model
Circuit board, comprising:
Board ontology, the board ontology are used for layout elements；
Busbar connector, the busbar connector have at least one be used for the element installation position, at least the one of the busbar connector
Part is attached on the first surface of the board ontology and is combined together by welding procedure and the plate ontology.
In foregoing circuit plate, the installation position corresponds to the mounting hole of the element on the board ontology.
In foregoing circuit plate, terminal board is set, the busbar connector is located at the board ontology on the board ontology
On the first surface, the installation position corresponds to the installation site of the terminal board.
In foregoing circuit plate, the first end of the busbar connector is located on the first surface of the board ontology, institute
The second end for stating busbar connector is located on the second surface relative to the first surface of the board ontology.
In foregoing circuit plate, connecting hole is set on the busbar connector and is used for connecting wire, the conducting wire is for described
It is connected between element on circuit board；Slot on the board ontology, the busbar connector partially pass through the slot make it is described
Installation position is located on the first surface of the board ontology, and the connecting hole is located at second table of the board ontology
On face.
Another aspect of the utility model is to provide a kind of charging pile for being provided with foregoing circuit plate.
The utility model uses busbar connector.Punching is so as to be installed on the board ontology of the hole and circuit board on the busbar
Element mounting hole it is consistent, and the pin of high current terminal and power device can be inserted into the folded of board ontology and busbar connector
Layer.The circuit board of the utility model is packaged design for busbar connector, carries out busbar connector Surface Mount in the production line and to converge
Row is welded on board ontology, is inserted into high current terminal and power device carries out the welding (such as wave-soldering) of busbar connector.Make
Power current avoids circuit board copper foil and also avoids welding wire, carries out high efficiency of transmission by walking busbar connector, this reduces electricity
The temperature rise of road plate is beneficial to the heat dissipation of related component.The reliability of electronic circuit system is enhanced simultaneously, is especially being sealed
The inner cavity occasion closed.The customization busbar connector consistency of the utility model is good, easy to operate in volume production occasion, and can converge
The terminal device such as terminal board that high current is realized on row, to save the expense of these terminal devices.
Through the following detailed description with reference to the accompanying drawings, other aspect and feature of the utility model become obvious.But it answers
When knowing, which is only the purpose design explained, not as the restriction of the scope of the utility model, this is because its
It should refer to appended claims.It should also be noted that attached drawing is merely intended to conceptually illustrate structure and process described herein,
Unless otherwise noted, it is not necessary to scale attached drawing.
Detailed description of the invention
In conjunction with attached drawing refering to the detailed description of following specific embodiments, the utility model will be more fully appreciated, it is attached
Same reference numbers refer to same element in view always in figure.Wherein:
Fig. 1 be the utility model relates to manufacture circuit board method flow chart；
Fig. 2 shows the utility model relates to busbar connector a kind of embodiment structural schematic diagram；
Fig. 3 be the utility model relates to circuit board a kind of embodiment structural schematic diagram；
Fig. 4 is circuit board section sectional view in Fig. 3；
Fig. 5 be the utility model relates to circuit board another embodiment structural schematic diagram.
Specific embodiment
To help those skilled in the art that can definitely understand the theme of the requires of the utility model protection, below with reference to
Specific embodiment of the present utility model is described in detail in attached drawing.
The utility model relates to circuit board be a kind of circuit-board card structure for being integrated with busbar connector.Busbar connector is directly integrated
On the surface of the board ontology of circuit board.Because of the Low ESR of busbar connector, high current can pass through via busbar connector, have and change
Kind through-current capability and lesser temperature rise effect, therefore busbar connector can replace other electric conductors such as copper foil or conducting wire to connect big function
Rate component.The circuit board of the utility model can pass through the method scale of mass production of the utility model.Busbar connector becomes circuit
Circuit a part of plate, high-power components are connected with busbar connector, and high current passes through from busbar connector.Busbar connector can be incorporated into
Design has on the circuit board of circuit, in this case, even if existing simultaneously busbar connector and the weak conduction of through-current capability on circuit
Body, the busbar connector that electric current can select impedance low pass through.The circuit board of the utility model can be applied to need the occasion of high current,
Such as charging pile.
Referring to the flow chart of Fig. 1.Step S1-S3 is the preparation that busbar connector is integrated on board ontology.In step S1,
Board body design busbar connector is encapsulated first.Board ontology can without or have been subjected to circuit layout design.Encapsulation design packet
Include the design such as surface mount welding encapsulation and/or wave-soldering encapsulation.Installation position is reserved on busbar connector for connecting with element.Confluence
Row is integrated in being printed on the surface of circuit of board ontology, but busbar connector is not limited in the one side for only occurring in board ontology,
It is able to can be appeared in simultaneously in the opposing sides of board ontology according to actual circuit layout, busbar connector.
In step S2, setting corresponds to the pad of the busbar connector to Surface Mount and applies welding material on board ontology.Welding
Material is, for example, tin cream.In step S3, confluence is discharged on board ontology.In this step, the surface of busbar connector is attached to plate
On the brush pad of card ontology and the one side of welding material.The position of busbar connector need to be located on board ontology.In order to be accurately positioned,
Positioning column 205 is set on busbar connector 200, as shown in Fig. 2, being conducive to the placement of busbar connector 200 on production line in this way.Positioning column
205 number can be one or more.Positioning column can also be substituted by other structures used for positioning, such as positioning pin, tool
The threaded location structure being connected to each other, the location structure etc. that can be snapped connection each other.
In step s 4, busbar connector is welded on board ontology.It is soldered on board ontology, converges to adapt to busbar connector Surface Mount
It can be first surface-treated on stream row, such as tin plating or nickel plating.Pad and welding material, confluence are set on board ontology
Surface treatment is carried out on row and after board ontology and busbar connector relative position determine, the two is passed through into soldering furnace.In step S5
In, element is inserted on incorporated circuit board, component pin passes through the installation of the mounting hole and busbar connector of board ontology
Pin is then in step s 6 welded such as wave-soldering in position, and element is welded to busbar connector to be welded to circuit board
On.
Busbar connector is thickness range in 1mm to the metal row between 5mm, such as copper bar, aluminium row.
Fig. 3 is a kind of embodiment of the circuit board made by the above method.In this embodiment, busbar connector is located at board
Ontology 100 is printed on a side surface of circuit.As shown, be disposed on board ontology 100 first power device 301,
First terminal platform 401 and Second terminal platform 402.The board ontology 100 is equipped with the first busbar connector 201 and the second busbar connector 202.
They all distinguish one end and connect with 301 pin of the first power device, and the other end and corresponding 401,402 pin of terminal board connect
It connects.The first installation position is provided on first busbar connector 201, i.e., hole 211 as shown in the figure corresponds to first on board ontology 100
One mounting hole 101 of power device 301.The second installation position, i.e., hole as shown in the figure are additionally provided on first busbar connector 201
212, the mounting hole 103 corresponding to first terminal platform 401 on board ontology 100.The connection type such as first of second busbar connector 202
Busbar connector 201, the i.e. hole 213 of the second busbar connector 202 correspond to another mounting hole 102 of the first power device 301, and second converges
The hole 214 of stream row 202 corresponds to the mounting hole 104 of Second terminal platform 402.First and second busbar connectors 201,202 are according to above-mentioned
Method is welded on the surface of board ontology 100.By the first power device 301, first terminal platform 401 and Second terminal platform 402
The respective hole 211 ~ 214 of respective pin (as shown in the figure altogether there are four pin) insertion in.It is then enterprising in busbar connector 201,202
Row wave-soldering, by the first power device 301, first terminal platform 401 and Second terminal platform 402 via the first and second busbar connectors
201,202 are welded on board ontology 100.Fig. 4 schematically illustrates the first power device 300(or terminal board) one draw
The structure of foot 310 and busbar connector 201 after weld formation.
Fig. 5 is another embodiment of the circuit board made by the above method.In this embodiment, busbar connector 203,
204 one end is located at being printed on a side surface of circuit of board ontology 120, and the other end is located at the another of board ontology 120
On side surface.For printed circuit board, the side surface for being printed with circuit can be considered as bottom, the another of element will be disposed with
Side surface is considered as top layer.As shown, being disposed with the second power device 302 on board ontology 120, busbar connector 203,204 replaces
Terminal board.The circuit board is likewise equipped with third busbar connector 203 and the 4th busbar connector 204.For clear signal, third and fourth
Busbar connector 203,204 repeats expression in two ways in Fig. 5, and 120 lower section of board ontology is the third and fourth busbar connector
203,204 top view, the lower section of top view be the third and fourth busbar connector 203,204 sectional view, with show confluence
Arrange the structure of bending.Their one end is connect with 302 pin of the second power device, and another end stand has work identical with terminal board
With.The third installation position for the second power device 302 is provided on third busbar connector 203, hole 213 as illustrated in the diagram should
The setting of installation position corresponds to the mounting hole of the second power device 302 with the first installation position in embodiment illustrated in fig. 3
121.In addition, be additionally provided with the first threaded hole 214 on third busbar connector 203 for connecting wire, third busbar connector 203 is equipped with the
One end of one threaded hole 214 is arranged on a side surface of arrangement component for board ontology 120, therefore third busbar connector 203
This part be equivalent to terminal board.As shown in figure 5, the first slot 123 is opened on board ontology 120,203 bending of third busbar connector warp
Board ontology 120 is passed through by the first slot 123.One end of first threaded hole 214 stays in the surface of the layout elements of board ontology 120
On, one end of third installation position (i.e. hole 213) is provided on the surface for being printed with circuit of board ontology 120, and via upper
Production method is stated to be incorporated on board ontology 120.On third installation position, the pin and third of the second power device 302 converge
203 welding of row is to be welded on board ontology 120.Conducting wire can be connect with the first threaded hole 214 by screw.4th converges
The production method of stream row 204 is the same as third busbar connector 203.The second slot 124 is opened on board ontology 120, on the 4th busbar connector 204
If the second threaded hole 216, the 4th busbar connector 204 is used for the third installation position (i.e. hole 215) of the second power device in board ontology
120 be printed on the surface of circuit, corresponds to another mounting hole 122 of the second power device 302, and the second threaded hole 216 exists
On the surface of the layout elements of board ontology 120.
In implementation steps S1, can analyze the circuit layout through designing, determine great current lead wire be with terminal board in this way
Electric connector realize or realized with busbar connector.If it is the former, then busbar connector is customized to embodiment party as shown in Figure 3
Formula, i.e. busbar connector are only located on a surface of board ontology, the circuit layout of installation position aperture and board ontology on busbar connector
Mounting hole needs consistent；It is such as realized in a manner of the latter, then busbar connector is customized to embodiment as shown in Figure 5, need to be in board ontology
Upper fluting beats welding hole (i.e. installation position) and threaded hole on the busbar, and board ontology is passed through after busbar connector bending, so that welding
Hole and threaded hole are located on opposite two surfaces of board ontology.There is busbar connector one end of threaded hole that can play to be equivalent to
The effect of high current terminal block.
Although being illustrated in detail and having described specific embodiment of the utility model to illustrate the principles of the present invention,
It will be appreciated that the utility model can be with embodied in other without departing from such principle.
Claims (6)
1. a kind of circuit board, it is characterized in that including:
Board ontology, the board ontology are used for layout elements；
There is at least one to be used for the installation position of the element, at least part of the busbar connector for busbar connector, the busbar connector
It is attached on the first surface of the board ontology and is combined together by welding procedure and the board ontology.
2. circuit board according to claim 1, it is characterized in that: the installation position is corresponding to described on the board ontology
The mounting hole of element.
3. circuit board according to claim 1, it is characterized in that: terminal board, the busbar connector are arranged on the board ontology
On the first surface of the board ontology, the installation position corresponds to the installation site of the terminal board.
4. circuit board according to claim 1 or 2, it is characterized in that: the first end of the busbar connector is located at the board sheet
On the first surface of body, the second end of the busbar connector is located at relative to the first surface of the board ontology
On two surfaces.
5. circuit board according to claim 4 is led it is characterized in that: connecting hole is arranged on the busbar connector for connecting
Line, the conducting wire between the element on the circuit board for connecting；It slots on the board ontology, the busbar connector
Partially passing through the slot is located at the installation position on the first surface of the board ontology, and the connecting hole is located at institute
It states on the second surface of board ontology.
6. a kind of charging pile, it is characterized in that setting circuit board according to any one of claims 1-5 in the charging pile.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820904629.2U CN208581397U (en) | 2018-06-12 | 2018-06-12 | Circuit board and charging pile |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820904629.2U CN208581397U (en) | 2018-06-12 | 2018-06-12 | Circuit board and charging pile |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208581397U true CN208581397U (en) | 2019-03-05 |
Family
ID=65507056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820904629.2U Active CN208581397U (en) | 2018-06-12 | 2018-06-12 | Circuit board and charging pile |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208581397U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108566743A (en) * | 2018-06-12 | 2018-09-21 | 蔚来汽车有限公司 | Circuit board and method, the charging pile for manufacturing it |
-
2018
- 2018-06-12 CN CN201820904629.2U patent/CN208581397U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108566743A (en) * | 2018-06-12 | 2018-09-21 | 蔚来汽车有限公司 | Circuit board and method, the charging pile for manufacturing it |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200811 Address after: Susong Road West and Shenzhen Road North, Hefei Economic and Technological Development Zone, Anhui Province Patentee after: Weilai (Anhui) Holding Co., Ltd Address before: 30 Floor of Yihe Building, No. 1 Kangle Plaza, Central, Hong Kong, China Patentee before: NIO NEXTEV Ltd. |
|
| TR01 | Transfer of patent right |