CN205692826U - Chip package vertical transition adapter, board structure - Google Patents
Chip package vertical transition adapter, board structure Download PDFInfo
- Publication number
- CN205692826U CN205692826U CN201620367163.8U CN201620367163U CN205692826U CN 205692826 U CN205692826 U CN 205692826U CN 201620367163 U CN201620367163 U CN 201620367163U CN 205692826 U CN205692826 U CN 205692826U
- Authority
- CN
- China
- Prior art keywords
- chip package
- vertical transition
- transition adapter
- pad
- upper substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
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- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The utility model discloses a kind of chip package vertical transition adapter, board structure, relate to chip encapsulation technology field.This utility model includes that insulation connects matrix, and in insulation linker body, vertical direction is at least provided with a conductor bores, is fixed with solid conductor post in this conductor bores, and the upper surface of solid conductor post is provided with pad, and the lower surface of solid conductor post is provided with lower pad.This utility model has that size is little, low cost, interconnection density high, can improve efficiency of assembling and the feature of the frequency of transmission signal, and preparation method is easy, be suitable for automatization, in high volume, miniaturization production application.
Description
Technical field
This utility model relates to chip encapsulation technology field, especially a kind of chip package vertical transition adapter, base
Plate structure.
Background technology
Currently, for adapting to miniaturization and multifunction development, electronics and device are all developing to three dimensional structure.For
The realization of three dimensional structure, chip package level technological means is a lot of and technology is the most ripe, such as chip-stacked, flip-chip, chip
Bonding (TSV technique) etc..The module slightly larger for size and component level product, particularly RF/Microwave field product, existing vertical
It is weak more than the technological means of straight interconnection, or size is big, efficiency of assembling low (such as coaxial cable, insulator), or price
Expensive, need pressure fixing (such as hair button), or design and processing cost high (such as flexible printed board).
Utility model content
Technical problem to be solved in the utility model is to provide a kind of chip package vertical transition adapter, substrate junction
Structure, this utility model has that size is little, low cost, interconnection density high, can improve efficiency of assembling and the frequency of transmission signal
Feature, preparation method is easy, be suitable for automatization, in high volume, miniaturization production application.
For solving above-mentioned technical problem, technical solution adopted in the utility model is: a kind of chip package vertically passing
Crossing adapter, connect matrix including insulation, in insulation linker body, vertical direction is at least provided with a conductor bores, in this conductor bores
Being fixed with solid conductor post, the upper surface of solid conductor post is provided with pad, and the lower surface of solid conductor post is provided with lower pad.
Further preferred technical scheme, described upper pad is bonding coating, and this coating meets bonding technology requirement；Institute
The lower pad stated is solderable coating, and this coating meets Surface Mount solder reflow process requirement.
Further preferred technical scheme, the contour structures of described connection matrix is cylinder.
Further preferred technical scheme, described cylinder is cuboid or cylinder.
Further preferred technical scheme, described solid conductor post fills conductor paste in conductor bores and formed,
Also can the via hole, central filler insulant formed.
Further preferred technical scheme, lower pad is castellated terminal design.
A kind of board structure utilizing chip package vertical transition adapter to connect, including upper substrate, infrabasal plate, box body
Framework and some chip package vertical transition adapters, upper substrate is provided with and some connects for chip package vertical transition
The via that device passes, upper substrate is fitted to the upper surface of box body framework, and box body framework is provided with corresponding with the via of upper substrate
Installing hole, infrabasal plate is installed on the lower surface of box body framework, the lower surface of chip package vertical transition adapter and lower base
Plate seam, the upper surface of chip package vertical transition adapter is concordant with the lower surface of upper substrate, and meanwhile, chip package is with hanging down
The upper surface of straight transition connector electrically couples with upper substrate.
Use and have the beneficial effects that produced by technique scheme: this utility model high temperature co-firing, low temperature co-fired pottery
Porcelain or pcb board technique make, and size is little, interconnection density is high, low cost, frequency transmission signal are the highest；Conventional Surface Mount is used to return
Fluid welding and the assembling of gold wire bonding technique, low cost, efficiency of assembling are high, are especially suitable for high-volume, automatization, miniaturized electronic device
Production application.
Accompanying drawing explanation
Fig. 1 is the top view of one embodiment of this utility model；
Fig. 2 is the upward view of Fig. 1；
Fig. 3 is this utility model board structure schematic diagram；
In figure: 1, upper pad；2, matrix is connected；3, lower pad；4, solid conductor post；5, upper substrate；6, infrabasal plate；7, box
Body framework；8, installing hole；9, chip package vertical transition adapter.
Detailed description of the invention
With detailed description of the invention, this utility model is described in further detail below in conjunction with the accompanying drawings.
The structure of chip package vertical transition adapter sees shown in Fig. 1, Fig. 2, connects matrix 2, insulation including insulation
In connecting matrix 2, vertical direction is at least provided with a conductor bores, is fixed with solid conductor post 4, solid conductor post 4 in this conductor bores
Upper surface be provided with pad 1, the lower surface of solid conductor post 4 is provided with lower pad 3.
Wherein, described upper pad 1 is bonding coating, and this coating meets bonding technology requirement；Described lower pad 3 is can
Welding coating, this coating meets Surface Mount solder reflow process requirement.
Further instruction, the contour structures of described connection matrix 2 is cylinder；Described cylinder is preferably cuboid or cylinder
Body.
Wherein, described solid conductor post 4 is filled conductor paste in conductor bores and is formed, and conductor paste uses existing
Conductor paste in technology；Also can the via hole, central filler insulant formed.
Wherein, lower pad 3 is castellated terminal design.
A kind of board structure utilizing chip package vertical transition adapter to connect, shown in Figure 3, including upper substrate
5, infrabasal plate 6, box body framework 7 and some chip package vertical transition adapters 9, upper substrate 5 is provided with some for chip
The via that encapsulation vertical transition adapter 9 passes, upper substrate 5 is fitted to the upper surface of box body framework 7, box body framework 7 sets
Having the installing hole 8 corresponding with the via of upper substrate 5, infrabasal plate 6 is installed on the lower surface of box body framework 7, and chip package is with hanging down
The lower surface of straight transition connector 9 and infrabasal plate 6 seam, the chip package upper surface of vertical transition adapter 9 and upper substrate 5
Lower surface concordant, meanwhile, the upper surface of chip package vertical transition adapter 9 electrically couples with upper substrate 5.
The manufacture method of a kind of board structure utilizing chip package vertical transition adapter to connect, including following step
Rapid:
The upper substrate 5 mounted is assembled to the upper surface of box body framework 7；
Chip package vertical transition adapter 9 use two sides attachment solder reflow process be soldered on infrabasal plate 6；
By the chip package on infrabasal plate 6 with vertical transition adapter 9 through installing hole corresponding on box body framework 7,
And infrabasal plate 6 is installed to the lower surface of box body framework 7；
Upper substrate 5 and chip package vertical transition adapter 9 is connected by gold wire bonding technique.
Wherein, the fitted manner that upper substrate 5 and infrabasal plate 6 use with box body framework 7 is: screw installs, gluing or weld.
This utility model uses high temperature co-firing, LTCC or printed circuit board technology to realize.Wherein solid conductor
The quantity of post 4, is according to how many by signal way, the solid conductor post 4 of design varying number.This utility model surface uses
Nickel or gold plate, the coating of adapter upper surface meets the requirement of spun gold (aluminium wire or copper wire) bonding technology, the coating of lower surface
Meet the requirement of Surface Mount reflow soldering process, be connected with upper substrate by gold wire bonding technique and (aluminium wire or copper wire key can also be used
Close), lower surface is connected with infrabasal plate by Surface Mount reflow soldering process.Use that this assembly cost is low, efficiency of assembling is high.
Describe performance of the present utility model below in conjunction with the accompanying drawings in detail, but they are not intended that of the present utility model
Limiting, simultaneously by explanation, advantage of the present utility model will become clearer from easy to understand.
In embodiment shown in this utility model, conductor bores is provided with 3, Fig. 1 and Fig. 3 is that 3 road vertical transitions connect
The schematic diagram of device, it is also possible to design the adapter of more multichannel as required, such as can arrange 1,2,4,5 etc. multiple
Conductor bores, is designed as two-way, four tunnels, five tunnels etc., and the center distance of adjacent two pads is standard SMT device pitch, wherein, and upper table
The upper pad 1 in face meets bonding technology requirement, and the lower pad 3 of lower surface is standard Surface Mount pad design, meets standard circumfluence work
Skill requirement.
This utility model is suitable to the vertical connection between RF/Microwave assembly and module, and Fig. 3 is company described in the utility model
Connect the schematic diagram being applied between two PCB printed circuit board (PCB)s of device.Its assembling process is as follows: the upper substrate 5 that first will mount
(i.e. PCB printed circuit board (PCB)) is assembled to the upper surface of box body framework 7, can install with screw, gluing or welding；Two sides is used to paste again
This utility model and other components and parts are soldered to infrabasal plate 6(PCB printed circuit board (PCB) by dress reflow soldering process)；Infrabasal plate 6 is pacified
Be filled to the back side of box body framework 7, can install with screw, gluing or welding；This utility model adapter is through on box body framework 7 in advance
In the installing hole 8 stayed, its upper surface is concordant with upper substrate 5；Finally by bonding technology, upper substrate 5 and adapter are connected, from
And realize the electric vertical interconnection of upper substrate 5 and infrabasal plate 6.
This utility model uses high temperature co-firing, LTCC or pcb board technique to make, and size is little, such as this practicality
Novel connection matrix can be made into the cylinder of 1.5 × 1.5mm, and makes multichannel connection, and interconnection density is high, low cost, uses routine
Surface Mount Reflow Soldering and bonding technology assembling, low cost, efficiency of assembling are high, are especially suitable for high-volume, automatization, the many merits of miniaturization
Can electronic device production application.
Claims (7)
1. a chip package vertical transition adapter, it is characterised in that include that insulation connects matrix (2), insulate linker
Body (2) interior vertical direction, at least provided with a conductor bores, is fixed with solid conductor post (4), solid conductor post (4) in this conductor bores
Upper surface be provided with pad (1), the lower surface of solid conductor post (4) is provided with lower pad (3).
Chip package vertical transition adapter the most according to claim 1, it is characterised in that described upper pad (1) is
Bonding coating, this coating meets bonding technology requirement；Described lower pad (3) is solderable coating, and this coating meets Surface Mount
Solder reflow process requirement.
Chip package vertical transition adapter the most according to claim 1, it is characterised in that described connection matrix (2)
Contour structures be cylinder.
Chip package vertical transition adapter the most according to claim 3, it is characterised in that described cylinder is rectangular
Body or cylinder.
Chip package vertical transition adapter the most according to claim 1, it is characterised in that described solid conductor post
(4) filling conductor paste in conductor bores and formed, it is possible to the via hole, central filler insulant is formed.
Chip package vertical transition adapter the most according to claim 1, it is characterised in that lower pad (3) is castle
Shape terminal design.
7. utilizing the board structure that chip package as any one of power 1-6 connects with vertical transition adapter, its feature exists
In, including upper substrate (5), infrabasal plate (6), box body framework (7) and some chip packages vertical transition adapter (9), upper base
Plate (5) is provided with some vias passed for chip package vertical transition adapter (9), and upper substrate (5) is fitted to box body
The upper surface of framework (7), box body framework (7) is provided with the installing hole (8) corresponding with the via of upper substrate (5), infrabasal plate (6)
It is installed on the lower surface of box body framework (7), the chip package lower surface of vertical transition adapter (9) and infrabasal plate (6) seam,
The upper surface of chip package vertical transition adapter (9) is concordant with the lower surface of upper substrate (5), and meanwhile, chip package is with hanging down
The upper surface of straight transition connector (9) electrically couples with upper substrate (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620367163.8U CN205692826U (en) | 2016-04-27 | 2016-04-27 | Chip package vertical transition adapter, board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620367163.8U CN205692826U (en) | 2016-04-27 | 2016-04-27 | Chip package vertical transition adapter, board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205692826U true CN205692826U (en) | 2016-11-16 |
Family
ID=57264967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620367163.8U Withdrawn - After Issue CN205692826U (en) | 2016-04-27 | 2016-04-27 | Chip package vertical transition adapter, board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205692826U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110021831A (en) * | 2019-04-17 | 2019-07-16 | 中国电子科技集团公司第十三研究所 | Microwave vertical transition connection structure and microwave device |
| CN112290170A (en) * | 2020-09-30 | 2021-01-29 | 中国航空工业集团公司雷华电子技术研究所 | Radio frequency vertical transition structure with tunable circuit |
| CN114630491A (en) * | 2022-03-22 | 2022-06-14 | 广东松普微波技术有限公司 | Radio frequency 3D micro-packaging integrated structure, radio frequency packaging device and method thereof |
-
2016
- 2016-04-27 CN CN201620367163.8U patent/CN205692826U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110021831A (en) * | 2019-04-17 | 2019-07-16 | 中国电子科技集团公司第十三研究所 | Microwave vertical transition connection structure and microwave device |
| CN112290170A (en) * | 2020-09-30 | 2021-01-29 | 中国航空工业集团公司雷华电子技术研究所 | Radio frequency vertical transition structure with tunable circuit |
| CN112290170B (en) * | 2020-09-30 | 2021-12-28 | 中国航空工业集团公司雷华电子技术研究所 | Radio frequency vertical transition structure with tunable circuit |
| CN114630491A (en) * | 2022-03-22 | 2022-06-14 | 广东松普微波技术有限公司 | Radio frequency 3D micro-packaging integrated structure, radio frequency packaging device and method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20161116 Effective date of abandoning: 20181225 |