CN204303804U - Detachably, assemblnig overlapping structure for semiconductor encapsulation body - Google Patents
Detachably, assemblnig overlapping structure for semiconductor encapsulation body Download PDFInfo
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- CN204303804U CN204303804U CN201420750110.5U CN201420750110U CN204303804U CN 204303804 U CN204303804 U CN 204303804U CN 201420750110 U CN201420750110 U CN 201420750110U CN 204303804 U CN204303804 U CN 204303804U
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- connector
- packaging body
- assemblnig
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Abstract
The utility model relates to a kind of detachable, assemblnig overlapping structure for semiconductor encapsulation body, it is characterized in that it comprises multiple packaging body (00) and plug connector (10), described packaging body (00) comprises substrate (20), described substrate (20) front is provided with through hole (200), described through hole (200) is provided with connector (50), be encapsulated with plastic packaging material (40) in described substrate (20) front and connector (50) periphery, described plug connector (10) inserts described connector (50) and is linked together by multiple packaging body (00).The utility model utilizes connector to replace traditional welding manner to solve the alignment issues of surface adhering technical and to cause the problem of warpage due to not mating of thermal coefficient of expansion between parts, thus can reliability be improved, utilize connector effectively to reduce stacks as high as input and output contact, packaging body is easy to plug.
Description
Technical field
The utility model relates to a kind of detachable, assemblnig overlapping structure for semiconductor encapsulation body, belongs to technical field of electronic encapsulation.
Background technology
Microelectronic device such as semiconductor chip needs to be connected with a lot of input and output of other electronic units.A lot of semiconductor chip be arranged on be suitable for surface install encapsulation in, be convenient to chip be installed to external substrate as on circuit board time operation.Input and output contact on chip is connected with the contact on substrate circuitry plate by ligament or projection.In the surface mounting process, encapsulation is placed on circuit board, each terminal in encapsulation is alignd with the corresponding contacts pad on circuit board.Scolding tin or other bonding materials are provided between terminal and contact weld pad.By heating with fusing or reflow tin soldering or otherwise activated bond material, will encapsulate for good and all that bonding is in place.Whole encapsulating structure does not almost have too many flexibility, needs lower package body accurate contraposition, and after shaping, its assembled scheme is difficult to change, detachable, the assemblnig packing forms flexibly of more difficult realization.
Semiconductor packaging chip is set as stacked arrangement usually, and wherein the first packaging body 00 arranges on circuit boards, and the second packaging body is arranged on the first packaging body.Multiple different chip can be allowed to install in the single area of coverage on circuit boards.In order to realize interconnecting between stacked package body, the structure of frame for movement connection and electrical connection must be used in the upper setting of each encapsulation.
In stacked package as traditional in Fig. 1, the electrical connection between the first packaging body 00 and the second packaging body by forming pre-welding material 60 or copper post and realizing in the first packaging body.Pre-welding material or copper post must be higher than the height of chip, so that connecting terminal.In such traditional stack encapsulating structure, the epoxy molding compounds provided due to the encapsulating component as sealing semiconductor chips and not mating on the thermal coefficient of expansion between the pre-welding material or copper post of the electrical connection between the first packaging body and the second packaging body in formation the first packaging body, warpage and crackle can be produced in the first packaging body, thus the reliability of stacked package can be reduced.
Summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, a kind of detachable, assemblnig overlapping structure for semiconductor encapsulation body is provided, solve the problem causing warpage because of not mating of thermal coefficient of expansion, thus can reliability be improved, effective reduction stacks as high, packaging body is easy to plug, freely assembles different packaging body as required, be easy to simplify system schema, reduce costs.
The purpose of this utility model is achieved in that a kind of detachable, assemblnig overlapping structure for semiconductor encapsulation body, it comprises multiple packaging body and plug connector, described packaging body comprises substrate, described substrate face is provided with through hole, described through hole is provided with connector, be encapsulated with plastic packaging material in described substrate face and connector periphery, described plug connector inserts described connector and is linked together by multiple packaging body.
Described connector comprises contact, spring and cavity, and described cavity is connected with through hole, and in the middle part of described spring and contact two ends are fixed on described cavity inner wall face, and described both ends of the spring is connected with described contact two ends.
Described substrate face is provided with pad and one deck ink for anchor pad, and described pad is connected by the contact of the conducting element on substrate with substrate upper and lower surface, and the cavity of described connector is together with pad solder.
Described packaging body can also comprise coupling, and described coupling is connected to the lower surface of described packaging body.
Described coupling can comprise soldered ball, connector or other conductors.
Described plug connector can be the solid content of arbitrary shape or material.
Described packaging body can have multiple semiconductor chip.
Described plug connector can be included in packaging body.
Compared with prior art, the beneficial effects of the utility model are:
The utility model utilizes connector to replace traditional welding manner to solve the alignment issues of surface adhering technical and to cause the problem of warpage due to not mating of thermal coefficient of expansion between parts, thus can reliability be improved, connector is utilized effectively to reduce stacks as high as input and output contact, packaging body is easy to plug, freely assemble different packaging body as required, be easy to simplify system schema, reduce costs.
Accompanying drawing explanation
Fig. 1 is traditional stack encapsulation sectional view;
Fig. 2 is the semiconductor package body according to the utility model embodiment;
Fig. 3 is the semiconductor package body according to embodiment of the present utility model;
Fig. 4 is semiconductor package body according to an alternative embodiment of the invention;
Fig. 5, Fig. 6 are the stacked structure of a kind of detachable, assemblnig semiconductor package body of the utility model;
Fig. 7 ~ Figure 11 is the structure sectional view of a kind of detachable, assemblnig overlapping structure for semiconductor encapsulation body method for making of the utility model.
Wherein:
Packaging body 00, plug connector 10, substrate 20, through hole 200, pad 201, ink 202, microelectronic element 30, plastic packaging material 40, connector 50, contact 500, spring 501, cavity 502, pre-welding material 60.
Detailed description of the invention
See Fig. 2, the utility model relates to a kind of detachable, assemblnig overlapping structure for semiconductor encapsulation body, comprises substrate 20, described substrate 20 has through hole 200, pad 201 and ink 202.Described substrate 20 can comprise one or more layers organic dielectric material or composite dielectric materials or lead frame.
Pad 201 on described substrate 20 can be interconnected by the contact (not shown) of the conducting element (not shown) on substrate 20 and substrate 20 upper and lower surface.
Described pad 201 can be connected with the contact (not shown) that described substrate 20 is connected with microelectronic element 30 by conducting element (not shown), described substrate 20 can be lead frame, described conducting element can be the lead-in wire of described lead frame, the function of components and parts in a packaging body can be exported to another packaging body by pad 201.
Described substrate 20 is provided with microelectronic element 30 and connector 50.Described microelectronic element 30 can be semiconductor chip or other comparable device.In fig. 2, the connected mode of microelectronic element 30 and substrate 20, can comprise lead-in wire or projection and be connected to contact (not shown) on substrate 20.
Described connector 50 comprises contact 500, spring 501 and cavity 502, and the cavity 502 on described connector 50 welds together with pad 201.The hollow part of described cavity 502 is connected with the described through hole about 200 on described substrate 20, and described plug connector 10 can be allowed to pass.
Described connector 50 can be made up of conductive material, and conductive material is such as copper, gold, nickel, scolding tin, aluminium etc.Also can be made up of combination of materials, such as, there is the inside of conductive material, there is the outer coating be coated on internal layer.Coating can be made up of the second conductive material, also can comprise insulating materials and make.
The cavity 502 of described connector 50 can form by the array of each cavity 502 of multiple described connector 50.This array can form area array configurations, uses structure described herein to implement modification.Packaging body 00 can realize being electrically connected and being mechanically connected by plug connector 10 with another micromodule by this array, as shown in Figure 5.
Described packaging body 00 can also comprise plastic packaging material 40.Described plastic packaging material 40 can cover in the part of the substrate 20 not covered by described microelectronic element 30 and described connector 50 or occupy.Described plastic packaging material 40 can also cover described microelectronic element 30 and described connector 50 substantially, a part for described microelectronic element 30 and described connector 50 can keep not covered by plastic packaging material 40, described microelectronic element 30 can be connected, such as Fig. 3 with outside with described connector 50.Described plastic packaging material 40 can have the surface of multiple differing heights, such as Fig. 4.
Connector, owing to adopting elastic contact blade, has certain elastic space, can fixing plug-in connector, and provides electric linkage function.When plug connector embeds connector, usually leave certain back gauge apart from connector annular seal space, press down to the side near elastic contact blade, due to the elastic reaction of contact, make plug connector pass packaging body, after loosing one's grip, plug connector is just stuck in the bayonet socket of connector.If plug connector will be taken out from connector, then firmly press down near the side of elastic contact blade, and outside mobile plug connector, plug connector just can be made to shift out the bayonet socket of connector.
If packaging body carries plug connector, then directly can insert in another packaging body with connector, realize electrical connection, if do not have, separately join the plug connector of a suitable size, many packaging bodies flexible assembling can be realized, as Fig. 6.
Its manufacture method is as follows:
Step one, see Fig. 7, get the substrate with pad and through hole;
Step 2, see Fig. 8, by the mode of SMT with connector in the substrate front side attachment of pad and through hole,
Step 3, see Fig. 9, carry out load routing in the substrate front side load region with pad and through hole;
Step 4, see Figure 10, to pad and through hole substrate front side encapsulating region adopt stripping film emulsion method carry out plastic packaging, expose connector;
Step 5, see Figure 11, by plug connector stacked package body.
Claims (8)
1. detachable, an assemblnig overlapping structure for semiconductor encapsulation body, it is characterized in that it comprises multiple packaging body (00) and plug connector (10), described packaging body (00) comprises substrate (20), described substrate (20) front is provided with through hole (200), described through hole (200) is provided with connector (50), be encapsulated with plastic packaging material (40) in described substrate (20) front and connector (50) periphery, described plug connector (10) inserts described connector (50) and is linked together by multiple packaging body (00).
2. detachable, the assemblnig overlapping structure for semiconductor encapsulation body of one according to claim 1, it is characterized in that described connector (50) comprises contact (500), spring (501) and cavity (502), described cavity (502) is connected with through hole (200), described spring (501) middle part and contact (500) two ends are fixed on described cavity (502) internal face, and described spring (501) two ends are connected with described contact (500) two ends.
3. detachable, the assemblnig overlapping structure for semiconductor encapsulation body of one according to claim 1, it is characterized in that being provided with pad (201) and one deck ink (202) for anchor pad (201) in described substrate (20) front, described pad (201) is connected by the contact of the conducting element on substrate (20) with substrate (20) upper and lower surface, and cavity (502) and the pad (201) of described connector (50) weld together.
4. detachable, the assemblnig overlapping structure for semiconductor encapsulation body of one according to claim 1, it is characterized in that described packaging body (00) can also comprise coupling, described coupling is connected to the lower surface of described packaging body (00).
5. detachable, the assemblnig overlapping structure for semiconductor encapsulation body of one according to claim 4, is characterized in that described coupling can comprise soldered ball, connector (50) or other conductors.
6. detachable, the assemblnig overlapping structure for semiconductor encapsulation body of one according to claim 1, is characterized in that described plug connector (10) can be the solid content of arbitrary shape or material.
7. detachable, the assemblnig overlapping structure for semiconductor encapsulation body of one according to claim 1, is characterized in that described packaging body (00) can have multiple semiconductor chip.
8. detachable, the assemblnig overlapping structure for semiconductor encapsulation body of one according to claim 1, is characterized in that described plug connector (10) can be included in packaging body (00).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420750110.5U CN204303804U (en) | 2014-12-04 | 2014-12-04 | Detachably, assemblnig overlapping structure for semiconductor encapsulation body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420750110.5U CN204303804U (en) | 2014-12-04 | 2014-12-04 | Detachably, assemblnig overlapping structure for semiconductor encapsulation body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204303804U true CN204303804U (en) | 2015-04-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420750110.5U Withdrawn - After Issue CN204303804U (en) | 2014-12-04 | 2014-12-04 | Detachably, assemblnig overlapping structure for semiconductor encapsulation body |
Country Status (1)
| Country | Link |
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| CN (1) | CN204303804U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104465606A (en) * | 2014-12-04 | 2015-03-25 | 江苏长电科技股份有限公司 | Semiconductor packaging body stacking structure capable of being disassembled and assembled and preparation method thereof |
-
2014
- 2014-12-04 CN CN201420750110.5U patent/CN204303804U/en not_active Withdrawn - After Issue
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104465606A (en) * | 2014-12-04 | 2015-03-25 | 江苏长电科技股份有限公司 | Semiconductor packaging body stacking structure capable of being disassembled and assembled and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20150429 Effective date of abandoning: 20171201 |