JP6503650B2 - Power converter cooling structure - Google Patents
Power converter cooling structure Download PDFInfo
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- JP6503650B2 JP6503650B2 JP2014139832A JP2014139832A JP6503650B2 JP 6503650 B2 JP6503650 B2 JP 6503650B2 JP 2014139832 A JP2014139832 A JP 2014139832A JP 2014139832 A JP2014139832 A JP 2014139832A JP 6503650 B2 JP6503650 B2 JP 6503650B2
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- 238000001816 cooling Methods 0.000 title claims description 21
- 239000004065 semiconductor Substances 0.000 claims description 31
- 230000017525 heat dissipation Effects 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 19
- 238000006243 chemical reaction Methods 0.000 claims description 15
- 230000005855 radiation Effects 0.000 claims description 13
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 8
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 8
- 229910002601 GaN Inorganic materials 0.000 claims description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 8
- 230000020169 heat generation Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
- Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes
Description
本発明は、電力変換装置の冷却構造に関し、特に、プリント基板にＳｉＣ（シリコンカーバイト）などの高いジャンクション温度を持つパワー半導体モジュールを実装した電力変換装置の冷却構造に関する。 The present invention relates to a cooling structure of a power conversion device, and more particularly to a cooling structure of a power conversion device in which a power semiconductor module having a high junction temperature such as SiC (silicon carbide) is mounted on a printed circuit board.
従来、プリント基板に実装された電力変換装置において、高いジャンクション温度を持つパワー半導体素子に大電流を流す場合、通電パターンの発熱を低減させるために種々の工夫が施されている。通電パターンの発熱を低減させる場合、例えば通電パターン幅を広げて電気抵抗を下げることで発熱量を下げ、且つ、放熱面積を広げるという手法がとられている。 Conventionally, when a large current flows in a power semiconductor device having a high junction temperature in a power conversion device mounted on a printed circuit board, various measures have been taken to reduce the heat generation of the conduction pattern. In order to reduce the heat generation of the energization pattern, for example, a method is adopted in which the amount of heat generation is reduced by widening the width of the energization pattern and lowering the electric resistance, and the heat dissipation area is expanded.
また通電パターンと並行に、銅バーやケーブルを接続することで通流部の抵抗値を下げつつ電流を分流させることで、発熱自体を低減させ、かつ放熱面積を増加させる手法も採用されている。 In addition, a method of reducing heat generation itself and increasing the heat dissipation area is also adopted by dividing the current while lowering the resistance value of the conduction part by connecting a copper bar or cable in parallel with the conduction pattern. .
下記の特許文献１に示された従来例には、通電パターンの発熱を放熱端子を介して、パワー半導体用のヒートシンクに放熱する技術が示されている。 The prior art disclosed in the following Patent Document 1 discloses a technique for dissipating the heat of the conduction pattern to the heat sink for the power semiconductor through the heat dissipation terminal.
上記のような、通電パターン幅を広げて電気抵抗を下げることで発熱量を下げ、且つ、放熱面積を広げるといった手法では、基板面積を増加させることになるため、装置を小型化することが難しくなるという課題がある。 With the above method of reducing the heat generation amount by widening the pattern width of current and lowering the electric resistance, and increasing the heat dissipation area, the substrate area is increased, so it is difficult to miniaturize the device. There is a problem of becoming
また通電パターンと並行に、銅バーやケーブルを接続することで通流部の抵抗値を下げつつ電流を分流させることで、発熱自体を低減させ、かつ放熱面積を増加させる手法も採用されている。しかし特に高圧回路の場合にこの手法を採用すると他部品との絶縁距離を確保することが困難になるという課題がある。 In addition, a method of reducing heat generation itself and increasing the heat dissipation area is also adopted by dividing the current while lowering the resistance value of the conduction part by connecting a copper bar or cable in parallel with the conduction pattern. . However, particularly in the case of a high voltage circuit, there is a problem that it becomes difficult to secure the insulation distance from other parts when this method is adopted.
その他の手法として、銅箔厚を標準のものより厚くした所謂大電流基板を用いる手法もあるが、ＳＭＴ（表面実装技術）の部品実装に制約が生じてしまい且つコストが高くなるといった問題もあった。 As another method, there is also a method using a so-called high current substrate in which the copper foil thickness is made thicker than the standard one, but there is also a problem that the component mounting of SMT (surface mounting technology) is restricted and the cost becomes high. The
また上記特許文献１に示された従来技術では、伝熱させる対象の温度がヒートシンク温度より高い場合にしか適用できない（効果がない）という問題がある。特に、高いジャンクション温度を持つパワー半導体がＳｉＣ（シリコンカーバイト）などである場合に、プリント基板の許容温度よりパワー半導体の許容温度の方が高くなるため、上記したいずれかの方法を用いたとしてもパターン温度を下げることが困難であるという課題があった。
そこで本発明は、プリント基板の通電パターンの温度上昇を効率的にかつ容易に低減し、低コストで信頼性の高い電力変換装置の冷却構造を提供することにある。
The prior art disclosed in Patent Document 1 has a problem that it can be applied (no effect) only when the temperature of the heat transfer target is higher than the heat sink temperature. In particular, when the power semiconductor having a high junction temperature is SiC (silicon carbide) or the like, the allowable temperature of the power semiconductor becomes higher than the allowable temperature of the printed circuit board. There is also a problem that it is difficult to lower the pattern temperature.
Therefore, an object of the present invention is to provide a low-cost and highly reliable cooling structure of a power conversion device by efficiently and easily reducing the temperature rise of the conduction pattern of the printed circuit board.
そこで本発明は、プリント基板の通電パターンの温度上昇を効率的にかつ容易に低減し、低コストで信頼性の高い電力変換装置の冷却構造を提供することにある。 Therefore, an object of the present invention is to provide a low-cost and highly reliable cooling structure of a power conversion device by efficiently and easily reducing the temperature rise of the conduction pattern of the printed circuit board.
上記課題を解決するために本発明の請求項１記載の発明は、電力変換を行うパワー半導体モジュールの主回路電流を通電する通電パターンを設けたプリント基板において、前記通電パターンに電気的かつ熱的に接続された複数の基板実装型端子台のうちの少なくとも１つに放熱部材を取り付け、前記放熱部材は、底面部とこの底面部から上方に伸びるフィン部とを備え、前記基板実装型端子台の頂部に電気的接続のために螺着されるネジを用いて、前記放熱部材の前記底面部が前記基板実装型端子台の前記頂部にネジ止めされることを特徴とする。 In order to solve the above problems, the invention according to claim 1 of the present invention is a printed circuit board provided with a conduction pattern for passing a main circuit current of a power semiconductor module for performing power conversion, wherein the conduction pattern is electrically and thermally A heat dissipation member is attached to at least one of the plurality of substrate mounting type terminal blocks connected to the substrate, and the heat dissipation member includes a bottom surface portion and a fin portion extending upward from the bottom surface portion; The bottom portion of the heat dissipating member is screwed onto the top of the board-mounted terminal block using a screw screwed on the top of the substrate for electrical connection .
本発明の請求項２記載の発明は、電力変換を行うパワー半導体モジュールの主回路電流を通電する通電パターンを設けたプリント基板において、前記通電パターンに電気的かつ熱的に接続された複数の基板実装型端子台のうちの少なくとも１つに放熱部材を取り付け、前記放熱部材が、前記基板実装型端子台と同形状であり、前記通電パターンに取り付けられた前記基板実装型端子台上に逆向きに取り付けられることを特徴とする。
また本発明の請求項３記載の発明は、上記請求項２記載の発明において、前記基板実装型端子台の頂部に電気的接続のために螺着されるネジを用いて、前記放熱部材が前記基板実装型端子台の前記頂部にねじ止めされることを特徴とする。
According to a second aspect of the present invention, there is provided a printed circuit board provided with a conduction pattern for passing a main circuit current of a power semiconductor module for performing power conversion, the plurality of boards electrically and thermally connected to the conduction pattern. A heat dissipation member is attached to at least one of the mountable terminal blocks, and the heat dissipation member has the same shape as the substrate mount type terminal block, and the reverse direction is on the substrate mount type terminal block attached to the conduction pattern. It is characterized in that it is attached to
In the invention according to claim 3 of the present invention, in the invention according to claim 2, the heat dissipation member is a screw which is screwed for electrical connection on the top of the board mount type terminal block. It is characterized in that it is screwed to the top of the board-mounted terminal block.
また本発明の請求項４記載の発明は、請求項１記載の発明において、前記放熱部材が、前記基板実装型端子台よりも放熱面積が大きいことを特徴とする。
本発明の請求項５記載の発明は、上記請求項１乃至４のいずれか１項に記載の発明において、前記放熱部材が、前記通電パターンに生じる発熱量に応じて、前記複数の基板実装型端子台のうちの２つ以上に取り付けられるようにしたことを特徴とする。
The invention according to claim 4 of the present invention is characterized in that, in the invention according to claim 1, the heat radiation member has a heat radiation area larger than that of the substrate mounting type terminal block.
The invention according to a fifth aspect of the present invention is the invention according to any one of the first to fourth aspects, wherein the heat dissipation member is mounted on the plurality of substrate mount types according to the amount of heat generated in the conduction pattern. It is characterized in that it can be attached to two or more of the terminal blocks.
本発明の請求項６記載の発明は、上記請求項１記載の発明において、前記放熱部材が、側面視Ｕ字形状であることを特徴とする。
本発明の請求項７記載の発明は、上記請求項６記載の発明において、前記放熱部材が、前記フィン部の頂部が外向きに開かれた放熱板であることを特徴とする。
The invention according to a sixth aspect of the present invention is characterized in that, in the invention according to the first aspect, the heat dissipation member has a U-shape in a side view.
The invention according to a seventh aspect of the present invention is characterized in that, in the invention according to the sixth aspect, the heat dissipation member is a heat dissipation plate in which the top of the fin portion is opened outward.
本発明の請求項８記載の発明は、上記請求項１乃至７のいずれか１項に記載の発明において、前記パワー半導体モジュールが、ワイドバンドギャップ半導体によって形成された素子を含んで成ることを特徴とする。
本発明の請求項９記載の発明は、上記請求項８記載の発明において、前記ワイドバンドギャップ半導体によって形成された素子が、炭化ケイ素、窒化ガリウム、またはダイアモンドにより形成されたものであることを特徴とする。
The invention according to claim 8 of the present invention is characterized in that, in the invention according to any one of claims 1 to 7 , the power semiconductor module includes an element formed of a wide band gap semiconductor. I assume.
The invention according to claim 9 of the present invention is characterized in that, in the invention according to claim 8, the element formed by the wide band gap semiconductor is formed by silicon carbide, gallium nitride or diamond. I assume.
本発明によれば、プリント基板主回路パターンの放熱を効果的に行うことができ、特に、直接プリント基板に放熱器を実装する場合に比べると、プリント基板への取り付けを考慮する必要がなくなるため、放熱器の形状に自由度を持たせること可能となる一方、プリント基板実装型の端子台は実装が容易であり、実装不良になることがないという利点を有する。 According to the present invention, it is possible to effectively dissipate the heat of the printed circuit board main circuit pattern, and in particular, it is not necessary to consider attachment to the printed circuit board as compared to the case where the radiator is directly mounted on the printed circuit board. While it is possible to give the shape of the radiator a degree of freedom, the terminal board of the printed circuit board mounting type is easy to mount and has the advantage that no mounting failure occurs.
その結果、プリント基板の通電パターンの温度上昇を効率的にかつ容易に低減し、低コストで信頼性の高い電力変換装置の冷却構造を提供することが可能となる。 As a result, it is possible to efficiently and easily reduce the temperature rise of the current-carrying pattern of the printed circuit board, and to provide a low-cost and highly reliable cooling structure of the power conversion device.
以下、本発明の実施の形態について、詳細に説明する。
図１は、本発明の実施形態に用いるプリント基板の部品配置例を示す図であり、図２は、当該プリント基板の裏面に配置された通電パターンの例を示す図である。
Hereinafter, embodiments of the present invention will be described in detail.
FIG. 1 is a view showing an example of arrangement of parts of a printed circuit board used in the embodiment of the present invention, and FIG. 2 is a view showing an example of a conduction pattern arranged on the back surface of the printed circuit board.
図１および図２に示されるプリント基板に実装される電力変換装置は、高いジャンクション温度を持つパワー半導体モジュールで構成され、例えば、ＳｉＣ（炭化ケイ素）で構成されたＭＯＳＦＥＴ（電界効果トランジスタ）から成るモジュール例について説明する。ここで説明するＳｉＣ-ＭＯＳＦＥＴから成るパワー半導体モジュールの例に限らず、他のパワー半導体モジュールであっても良い。例えば半導体モジュールが、窒化ガリウム、ダイアモンド等で構成されたものであってもよい。 The power conversion device mounted on the printed circuit board shown in FIGS. 1 and 2 is formed of a power semiconductor module having a high junction temperature, and is formed of, for example, a MOSFET (field effect transistor) formed of SiC (silicon carbide). An example module will be described. The present invention is not limited to the example of the power semiconductor module composed of the SiC-MOSFET described here, and may be another power semiconductor module. For example, the semiconductor module may be made of gallium nitride, diamond or the like.
図１に示されたプリント基板には、電力変換動作を行うパワー半導体モジュール１が主回路パターンとしてプリント基板上に矩形破線で囲まれた位置に配置・装着され、パワー半導体モジュール１の通電パターンに電気的かつ熱的に接続される複数の基板実装型端子台２のうちの少なくとも１つが放熱機能を備える部品として円形実線で囲まれた位置に一例として配置・装着される。図１に示されたプリント基板には、パワー半導体モジュール１や基板実装型端子台２以外の部品もレイアウトされているが本発明の実施形態に直接は関係しないのでその説明を省略する。 On the printed circuit board shown in FIG. 1, the power semiconductor module 1 performing the power conversion operation is disposed and mounted as a main circuit pattern at a position surrounded by a rectangular broken line on the printed circuit board. At least one of the plurality of board-mounted terminal blocks 2 electrically and thermally connected is disposed and mounted as an example at a position surrounded by a circular solid line as a component having a heat dissipation function. Although components other than the power semiconductor module 1 and the substrate mounting type terminal block 2 are also laid out on the printed circuit board shown in FIG. 1, the description thereof will be omitted because they are not directly related to the embodiment of the present invention.
図２は、図１に示されたプリント基板の裏面に設けられた、例えば銅箔で形成された通電パターンを示す図であり、適所に位置決めや半田付けのためのスルーホールが設けられている。なおこのようなプリント基板の裏面に銅箔からなるパターンを設けること自体は、その具体的な配置（レイアウト）例を除いて当業者によく知られているのでその説明を省略するものとする。 FIG. 2 is a view showing a conduction pattern, for example, formed of copper foil, provided on the back surface of the printed circuit board shown in FIG. 1, and through holes for positioning and soldering are provided at appropriate positions. . Providing a pattern made of copper foil on the back surface of such a printed circuit board itself is well known to those skilled in the art except for its specific arrangement (layout) example, and therefore the description thereof will be omitted.
図３は、本発明の実施形態に係る電力変換装置の冷却構造の具体例を示す斜視図であり、図１に示した放熱用の基板実装型端子台２と同一の端子台を逆向きにして装着した端子台３の例、および、異形状（例．頂部が外向きに開かれた端子板）の放熱用の基板実装台４をネジ止めして放熱器として使用する例、をそれぞれ斜視図により示している。図３には、本発明に直接関係しない部品もプリント基板に装着されているが、それらの部品についての説明については割愛することにする。 FIG. 3 is a perspective view showing a specific example of the cooling structure of the power conversion device according to the embodiment of the present invention, in which the same terminal block as the substrate mounting type terminal block 2 for heat dissipation shown in FIG. Of the mounted terminal block 3 and an example of screwing the board mounting base 4 for radiation of a different shape (for example, a terminal plate whose top is opened outward) and using it as a radiator, respectively. It shows by the figure. Although parts not directly related to the present invention are also mounted on the printed circuit board in FIG. 3, the description of those parts will be omitted.
図３に示した端子台３の具体例は、普通では基板実装型端子台として使用されているものであるがそれを逆向きにしてプリント基板に装着しその端子を放熱フィンとして使用する端子台３、およびまたは、端子台の形状を異形（例．頂部が外向きに開かれた放熱板）にして放熱用の基板実装台４とするためにネジ止めして使用する。このように、端子台２の上に端子台３や基板実装台４を取り付けた場合であっても、以下に示す図４や図７から明らかなように、その部分にケーブルや配線を電気的に接続（ネジ止め）することが可能である。 Although the specific example of the terminal block 3 shown in FIG. 3 is normally used as a substrate mounting type terminal block, the terminal block is mounted on a printed circuit board in the reverse direction and is used as a radiation fin 3 and / or screwed in order to make the shape of the terminal block a different shape (for example, a heat dissipation plate whose top is opened outward) to form a substrate mounting base 4 for heat dissipation. As described above, even when the terminal block 3 and the board mounting table 4 are mounted on the terminal block 2, as is apparent from FIGS. 4 and 7 shown below, cables and wiring are electrically connected to the portions. Connection (screwing) is possible.
図４は、図３に示した端子台３を拡大して示した斜視図である。さらに図５は、ネジを外し図４と異なるアングルから観た図３に示した端子台３を拡大して示した斜視図である。また図６は、図５に示した端子台３の様子を示す平面図（ａ）、正面図（ｂ）および側面図（ｃ）である。これらの図５及び図６に示された構造によって図３に示された端子台３が有する冷却構造が明らかとなろう。 FIG. 4 is an enlarged perspective view of the terminal block 3 shown in FIG. 5 is an enlarged perspective view showing the terminal block 3 shown in FIG. 3 with screws removed and viewed from a different angle from FIG. 6 is a plan view (a), a front view (b) and a side view (c) showing the state of the terminal block 3 shown in FIG. The cooling structure which the terminal block 3 shown in FIG. 3 has will be apparent from the structures shown in FIGS. 5 and 6.
図７は、図３に示した放熱用の基板実装台４を拡大して示した斜視図であり、端子台の頂部が外向きに開かれた端子板を有してネジ止めされる構成となっていることが明らかであろう。 FIG. 7 is an enlarged perspective view showing the substrate mounting base 4 for heat dissipation shown in FIG. 3, in which the top of the terminal block is screwed with a terminal plate opened outward. It will be clear that it has become.
上記したように図４及び図７に示した端子台では、端子台の頂部に差し込まれたネジを含んで放熱器が形成されている例を示したが、これをさらに発展させて、例えば図示省略しているが、同一ネジ径を持ち更に形状を異ならせた端子台にしても良いし、また端子台に代えてプリント基板に同一ネジ径でネジ止めされる放熱性に優れた金属導体を設ける形状にしても良い。 As described above, the terminal block shown in FIG. 4 and FIG. 7 shows an example in which the radiator is formed including the screw inserted into the top of the terminal block, but this is further developed to be shown, for example, Although omitted, terminal blocks having the same screw diameter and different shapes may be used, or a metal conductor with excellent heat dissipation can be screwed to the printed circuit board with the same screw diameter instead of the terminal block. The shape may be provided.
図８は、図１に示したパワー半導体モジュールの具体例としてのＳｉＣ-ＭＯＳＦＥＴモジュールの構成例を示す図であり、ＳｉＣ-ＭＯＳＦＥＴモジュールがパワー半導体モジュールパッケージ１０内に納められ、ＳｉＣ-ＭＯＳＦＥＴモジュールに設けられているピン２１〜２５をモジュールパッケージ１０外に突出させている。 FIG. 8 is a diagram showing a configuration example of a SiC-MOSFET module as a specific example of the power semiconductor module shown in FIG. 1, wherein the SiC-MOSFET module is housed in the power semiconductor module package 10 and The provided pins 21 to 25 are made to project out of the module package 10.
このパワー半導体モジュールは図２に示すプリント基板の裏面側に装着される。具体的には、パワー半導体モジュールのピン２１〜２５は、プリント基板の裏面側から、プリント基板の部品配置面側と裏面側との電気的接続を行うためのスルーホールに挿入された後、半田付される。したがって、図１に示すプリント基板の部品配置面側には、図３に示すようにパワー半導体モジュールのピン２１〜２５の頂部のみが現れている。 The power semiconductor module is mounted on the back side of the printed circuit board shown in FIG. Specifically, the pins 21 to 25 of the power semiconductor module are inserted into through holes for making electrical connection between the component placement side and the back side of the printed circuit board from the back side of the printed circuit board, and then soldered. Will be attached. Therefore, as shown in FIG. 3, only the tops of the pins 21 to 25 of the power semiconductor module appear on the component placement side of the printed circuit board shown in FIG.
また、このパワー半導体モジュールの底面は放熱用の冷却面であり、この面に冷却体（不図示）が熱的に装着される。この冷却体には放熱フィンが取り付けられており、半導体素子で発生する熱の大部分は、この放熱フィンを介して外気に放熱される。 Further, the bottom surface of the power semiconductor module is a cooling surface for heat radiation, and a cooling body (not shown) is thermally attached to this surface. A radiation fin is attached to the cooling body, and most of the heat generated by the semiconductor element is dissipated to the outside air through the radiation fin.
１ パワー半導体モジュール
２ 基板実装型端子台
３ 逆向き装着の基板実装型端子台
４ 異形状の基板実装型端子台
１０ パワー半導体モジュールパッケージ
DESCRIPTION OF SYMBOLS 1 power semiconductor module 2 board-mounted terminal block 3 board-mounted terminal block of reverse mounting 4 board-mounted terminal block of different shape 10 power semiconductor module package
Claims (9)
前記放熱部材は、底面部とこの底面部から上方に伸びるフィン部とを備え、
前記基板実装型端子台の頂部に電気的接続のために螺着されるネジを用いて、前記放熱部材の前記底面部が前記基板実装型端子台の前記頂部にネジ止めされることを特徴とする電力変換装置の冷却構造。 In a printed circuit board provided with a conduction pattern for conducting a main circuit current of a power semiconductor module for performing power conversion, at least one of a plurality of board mount type terminal blocks electrically and thermally connected to the conduction pattern Attach the heat dissipation member,
The heat radiation member, e Bei a fin portion extending upward from the bottom portion and the bottom portion,
The bottom portion of the heat dissipation member is screwed to the top of the board-mounted terminal block by using a screw screwed for electrical connection on the top of the board-mounted terminal block. cooling structure to that power converter.
前記放熱部材は、前記基板実装型端子台と同形状であり、前記通電パターンに取り付けられた前記基板実装型端子台上に逆向きに取り付けられることを特徴とする電力変換装置の冷却構造。 In a printed circuit board provided with a conduction pattern for conducting a main circuit current of a power semiconductor module for performing power conversion, at least one of a plurality of board mount type terminal blocks electrically and thermally connected to the conduction pattern Attach the heat dissipation member,
The heat dissipation member, the a substrate mount type terminal block having the same shape, the cooling structure for you, wherein power conversion device that is attached to the opposite on the substrate mount type terminal block mounted on the energization pattern .
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