CN109342499B - CCL (continuous liquid chromatography) through-flow resistance detection method, system and device and readable storage medium - Google Patents
CCL (continuous liquid chromatography) through-flow resistance detection method, system and device and readable storage medium Download PDFInfo
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- CN109342499B CN109342499B CN201811168106.7A CN201811168106A CN109342499B CN 109342499 B CN109342499 B CN 109342499B CN 201811168106 A CN201811168106 A CN 201811168106A CN 109342499 B CN109342499 B CN 109342499B
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- 238000001514 detection method Methods 0.000 title claims abstract description 36
- 238000003860 storage Methods 0.000 title claims abstract description 15
- 238000004811 liquid chromatography Methods 0.000 title description 2
- 238000012360 testing method Methods 0.000 claims abstract description 165
- 239000000463 material Substances 0.000 claims abstract description 108
- 238000000034 method Methods 0.000 claims description 36
- 230000008569 process Effects 0.000 claims description 19
- 238000004590 computer program Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000003475 lamination Methods 0.000 claims 2
- 238000013461 design Methods 0.000 abstract description 9
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 239000002131 composite material Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
- G01N25/48—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity on solution, sorption, or a chemical reaction not involving combustion or catalytic oxidation
Abstract
The invention discloses a CCL (CCL) through-flow resistance performance detection method, which comprises the steps of constructing test modules corresponding to each CCL material to be detected one by one, wherein a plurality of through holes are formed in each test module, and the number and the positions of the through holes are determined by the number of preset laminated layers and actual routing; wiring on the test module according to a preset rule through the via hole on the test module; acquiring test parameters of a test module in a preset test environment; and obtaining the through-flow resistance of the CCL material to be tested according to the test parameters. Therefore, in practical application, the scheme of the invention can be used for measuring the through-flow resistance of the CCL material, quickly and accurately reflecting the heat dissipation characteristic of the CCL material and providing data support for later-stage design and product stability guarantee. The invention also discloses a CCL through-flow resistance detection system, a CCL through-flow resistance detection device and a readable storage medium, and the CCL through-flow resistance detection system, the CCL through-flow resistance detection device and the readable storage medium have the beneficial effects.
Description
Technical Field
The invention relates to the field of board card design, in particular to a method, a system and a device for detecting the through-current resistance of a CCL (peripheral component interconnect) and a readable storage medium.
Background
The realization of any circuit function is based on the electrical characteristic parameters and reliability parameters of specific materials, so that how to accurately test the plate characteristics becomes a research hotspot at present. Considering that the through-flow resistance of different CCL materials is different, a board card manufactured by the CCL material with poor through-flow resistance has poor heat dissipation performance, and when the surface temperature of the board card is too high due to external factors or internal factors, the performance of a chip on the board is affected, such as the reduction of driving capability or even downtime, and the realization of circuit functions is affected.
Therefore, how to provide a solution to the above technical problem is a problem that needs to be solved by those skilled in the art.
Disclosure of Invention
The invention aims to provide a CCL through-flow resistance detection method, which can be used for measuring the through-flow resistance of a CCL material, reflecting the heat dissipation characteristic of the CCL material quickly and accurately and providing data support for later-stage design and product stability guarantee; another object of the present invention is to provide a CCL current endurance detection system, apparatus and readable storage medium.
In order to solve the technical problem, the invention provides a method for detecting the through-flow resistance of a CCL, which comprises the following steps:
constructing test modules which correspond to each CCL material to be tested one by one, wherein a plurality of through holes are formed in each test module, and the number and the positions of the through holes are determined by the number of preset laminated layers and actual routing;
wiring on the test module according to a preset rule through the via hole on the test module;
acquiring test parameters of the test module in a preset test environment;
and obtaining the through-flow resistance of the CCL material to be tested according to the test parameters.
Preferably, the preset number of the stacked layers is determined according to the number of the stacked layers of the target board card and the model selection of the CCL material to be tested.
Preferably, after the through-flow resistance of the CCL material to be tested is obtained according to the test parameters, the method further includes:
determining the optimal CCL material according to the through-flow resistance of all the CCL materials to be detected;
and manufacturing the target board card by the optimal CCL material.
Correspondingly, the process of acquiring the test parameters of the test module in the preset test environment specifically comprises:
acquiring a current value of the test module at a preset test temperature;
the process of obtaining the through-flow resistance of the CCL material to be tested according to the test parameters specifically includes:
and obtaining the through-current resistance of the CCL material to be detected according to the current value.
Preferably, the process of obtaining the test parameters of the test module in the preset test environment specifically includes:
acquiring a temperature value of the test module when a preset current passes through the test module;
the process of obtaining the through-flow resistance of the CCL material to be tested according to the test parameters specifically includes:
and obtaining the through-flow resistance of the CCL material to be detected according to the temperature value.
Preferably, the process of determining the optimal CCL material according to the through-flow resistance of all the CCL materials to be tested specifically includes:
comparing current values of all the test modules in the preset test temperature;
and determining the CCL material to be tested corresponding to the test module with the maximum current value as the optimal CCL material.
Preferably, the process of determining the optimal CCL material according to the through-flow resistance of all the CCL materials to be tested specifically includes:
comparing the temperature values of all the test modules when the preset current passes through;
and determining the CCL material to be tested corresponding to the test module with the minimum temperature value as the optimal CCL material.
In order to solve the above technical problem, the present invention further provides a CCL through-flow resistance detection system, including:
the test module is provided with a plurality of through holes, and the number and the positions of the through holes are determined by the number of preset laminated layers and actual routing;
the wiring module is used for wiring on the test module according to a preset rule through the via hole on the test module;
the detection module is used for acquiring the test parameters of the test module in a preset test environment;
and the obtaining module is used for obtaining the through-flow resistance of the CCL material to be tested according to the test parameters.
In order to solve the above technical problem, the present invention further provides a CCL through-flow resistance detection device, including:
a memory for storing a computer program;
a processor configured to implement the steps of the CCL current endurance detection method according to any one of the above when executing the computer program.
In order to solve the technical problem, the present invention further provides a readable storage medium, where a computer program is stored, and when the computer program is executed by a processor, the method implements the steps of the CCL flow resistance detection method described in any one of the above.
The invention provides a method for detecting the through-flow resistance of a CCL (composite mold shell), which comprises the steps of constructing test modules corresponding to each CCL material to be detected one by one, wherein a plurality of through holes are formed in each test module, and the number and the positions of the through holes are determined by the number of preset laminated layers and actual routing; wiring on the test module according to a preset rule through the via hole on the test module; acquiring test parameters of a test module in a preset test environment; and obtaining the through-flow resistance of the CCL material to be tested according to the test parameters. Therefore, in practical application, the scheme of the invention can be used for measuring the through-flow resistance of the CCL material, can quickly and accurately reflect the heat dissipation characteristic of the CCL material, and provides data support for later-stage design and product stability guarantee. The invention also provides a CCL through-flow resistance detection system, a CCL through-flow resistance detection device and a readable storage medium, and the CCL through-flow resistance detection method has the same beneficial effects as the CCL through-flow resistance detection method.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed in the prior art and the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a flowchart illustrating steps of a method for detecting a through-flow resistance of a CCL according to the present invention;
fig. 2 is a schematic structural diagram of a CCL through-flow resistance detection system provided in the present invention.
Detailed Description
The core of the invention is to provide a CCL through-flow resistance detection method, which can measure the through-flow resistance of a CCL material, can quickly and accurately reflect the heat dissipation characteristic of the CCL material, and provides data support for later-stage design and product stability guarantee; another core of the present invention is to provide a CCL current endurance detection system, apparatus, and readable storage medium.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a flowchart illustrating steps of a method for detecting a through-current resistance of a CCL according to the present invention, including:
step 1: constructing test modules which correspond to each CCL material to be tested one by one, wherein a plurality of through holes are formed in the test modules, and the number and the positions of the through holes are determined by the preset laminated number and actual routing;
as a preferred embodiment, the preset number of stacked layers is determined according to the number of stacked layers of the target board card and the model selection of the CCL material to be tested.
Specifically, the preset number of stacked layers is determined according to the number of stacked layers required by the target board card, and the number of stacked layers and the thickness of different CCL materials which can be supported by the selection are different, if the number of stacked layers which can be supported by the CCL materials is less than the number of stacked layers required by the target board card, the CCL materials do not need to be considered when the target board card is designed, and the CCL materials to be tested in the invention are all CCL materials of which the number of supported stacked layers is greater than or equal to the number of stacked layers required by the target board. In practical application, a plurality of CCL materials to be tested meet the requirement of manufacturing a target board card, test modules corresponding to each CCL material to be tested are respectively constructed, the positions and the number of through holes are determined on each test module according to the preset laminated number and actual routing, the preset laminated number is assumed to be 12, that is, each test module needs to simulate routing sequence to set 24 through holes, and the size of every two through holes is consistent with the size of actual differential routing in the board.
Step 2: wiring on the test module according to a preset rule through the via hole on the test module;
specifically, after the test module is constructed, the test module is wired according to a preset rule, the wiring mode of each test module is the same, and the process of wiring on the test module according to the preset rule specifically includes: firstly, two via holes are taken as current input ends, the wires are led out from the two via holes, the wires are pulled to the two opposite via holes at the 1/10 distance of the actual wire routing space, namely, the current wire routing layer is completed, the current wire routing end point is taken as the next wire routing starting point, the wires are connected to the other pair of via holes in the same way, and the like, the via holes after all laminated wires are completed are taken as current output ends, the simulation is that the wires in the board are more intensive, if the actual design requirement is not so intensive, the current output ends can be properly widened, and the preset rule in the invention is determined according to the actual design requirement.
Of course, two vias may be used to implement routing of each layer, and a plurality of vias may be selected and determined according to actual routing requirements, which is not limited herein.
And step 3: acquiring test parameters of a test module in a preset test environment;
specifically, after the wiring is completed, each test module is tested, when testing, each test module is in the same preset test environment, the through-flow resistance of the CCL material to be tested is related to current and temperature, therefore, the preset test environment can indicate that each test module is tested under the same preset test temperature, at the moment, the test parameters are current values, the preset test environment can also indicate that the same current is introduced into each test module, at the moment, the test parameters are temperature values, and the temperature can be measured by setting thermocouple capacitors.
And 4, step 4: and obtaining the through-flow resistance of the CCL material to be tested according to the test parameters.
Specifically, the quality of the through-flow resistance of the CCL material can be determined according to the test parameters, when the test parameters are current values, the larger the current value of the test module is at the same temperature, the better the through-flow resistance of the CCL material to be tested is, or when the same current is introduced, the smaller the temperature value of the test module is, the better the through-flow resistance of the CCL material to be tested is, it can be understood that the better the through-flow resistance of the CCL material to be tested is, and the heat dissipation performance of the board card manufactured by the CCL material to be tested is relatively better.
Specifically, the preset test environment may also include a plurality of preset test temperatures, and assuming that the plurality of preset test temperatures include 60 degrees, 70 degrees, 80 degrees, and 90 degrees, a current value corresponding to each test module at 60 degrees is obtained, a current value corresponding to each test module at 70 degrees, a current value corresponding to each test module at 80 degrees, and a current value corresponding to each test module at 90 degrees are obtained, a temperature curve is drawn for each test module according to the obtained 4 current values, and the larger the current value is, the better the through-flow resistance of the CCL material is.
Specifically, when the temperature is adjusted, the current value needs to be recorded after the temperature is stabilized, and if the temperature is adjusted from 60 ℃ to 70 ℃, the current value can be recorded after the temperature is stabilized at 70 ℃ for more than 10min, so that the accuracy of obtaining the current value is improved, and the accuracy of a subsequent detection result of the current resistance performance is improved.
Certainly, when the through-flow resistance of the CCL material to be tested is determined according to the test parameters, corresponding preset values may also be set, for example, at the same temperature, if the current value is greater than the first preset value, it may be determined that the performance of the CCL material to be tested is excellent, if the current value is greater than the second preset value and less than the first preset value, it may be determined that the performance of the CCL material to be tested is good, and if the current value is less than the second preset value, it may be determined that the performance of the CCL; or after the same current value is fed into each test module, the performance of the CCL material to be tested can be judged to be excellent if the obtained temperature value is smaller than the third preset value, the performance of the CCL material to be tested can be judged to be good if the obtained temperature value is larger than the third preset value and smaller than the fourth preset value, and the performance of the CCL material to be tested can be judged to be poor if the obtained temperature value is larger than the fourth preset value.
The invention provides a method for detecting the through-flow resistance of a CCL (composite mold shell), which comprises the steps of constructing test modules corresponding to each CCL material to be detected one by one, wherein a plurality of through holes are formed in each test module, and the number and the positions of the through holes are determined by the number of preset laminated layers and actual routing; wiring on the test module according to a preset rule through the via hole on the test module; acquiring test parameters of a test module in a preset test environment; and obtaining the through-flow resistance of the CCL material to be tested according to the test parameters. Therefore, in practical application, the scheme of the invention can be used for measuring the through-flow resistance of the CCL material, can quickly and accurately reflect the heat dissipation characteristic of the CCL material, and provides data support for later-stage design and product stability guarantee.
On the basis of the above-described embodiment:
as a preferred embodiment, after obtaining the through-flow resistance of the CCL material to be tested according to the test parameters, the method further includes:
determining the optimal CCL material according to the through-flow resistance of all CCL materials to be detected;
and manufacturing the target board card by using the optimal CCL material.
Specifically, considering that the detected through-flow resistance of the to-be-detected CCL material can provide data support for later-stage design and product stability guarantee, after the through-flow resistance of each to-be-detected CCL material is detected, the to-be-detected CCL material with the best through-flow resistance can be selected to manufacture the target board card, so that the heat dissipation performance of the target board card can be improved to a certain extent, and the product stability is improved.
As a preferred embodiment, the process of determining the optimal CCL material according to the through-flow resistance of all CCL materials to be tested specifically includes:
comparing current values of all the test modules at a preset test temperature;
and determining the CCL material to be tested corresponding to the test module with the maximum current value as the optimal CCL material.
As a preferred embodiment, the process of determining the optimal CCL material according to the through-flow resistance of all CCL materials to be tested specifically includes:
comparing the temperature values of all the test modules when preset current passes through;
and determining the CCL material to be tested corresponding to the test module with the minimum temperature value as the optimal CCL material.
Specifically, according to the above description, the larger the current value of the test module is at the same temperature, the better the through-flow resistance of the CCL material to be tested corresponding to the test module is, and therefore, the CCL material to be tested corresponding to the test module with the largest current value can be determined as the optimal CCL material, or the smaller the temperature value of the test module is, the better the through-flow resistance of the CCL material to be tested corresponding to the test module with the smallest temperature value is, and therefore, the CCL material to be tested corresponding to the test module with the smallest temperature value can be determined as the optimal CCL material, and the board card manufactured by the optimal CCL material has good heat dissipation performance and high stability.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a CCL current endurance detection system provided in the present invention, including:
the test module comprises a construction module 1, a plurality of test modules and a plurality of modules, wherein the construction module 1 is used for constructing test modules which correspond to each CCL material to be tested one by one, a plurality of through holes are arranged on each test module, and the number and the positions of the through holes are determined by the number of preset laminated layers and actual routing;
the wiring module 2 is used for wiring on the test module according to a preset rule through the via hole on the test module;
the detection module 3 is used for acquiring test parameters of the test module in a preset test environment;
and the obtaining module 4 is used for obtaining the through-flow resistance of the CCL material to be tested according to the test parameters.
Correspondingly, the invention also provides a device for detecting the through-flow resistance of the CCL, which comprises:
a memory for storing a computer program;
and the processor is used for realizing the steps of the CCL through-current resistance detection method when executing the computer program.
Correspondingly, the invention further provides a readable storage medium, wherein a computer program is stored on the readable storage medium, and when being executed by a processor, the computer program realizes the steps of the method for detecting the through-flow resistance of the CCL.
The CCL through-current resistance detection system, the CCL through-current resistance detection device and the readable storage medium have the same beneficial effects as the CCL through-current resistance detection method.
For the introduction of the CCL through-current resistance performance detection system, the CCL through-current resistance performance detection device, and the readable storage medium provided by the present invention, please refer to the above embodiments, and the present invention is not repeated herein.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. A CCL through-flow resistance detection method is characterized by comprising the following steps:
constructing test modules which correspond to each CCL material to be tested one by one, wherein a plurality of through holes are formed in each test module, and the number and the positions of the through holes are determined by the number of preset laminated layers and actual routing;
wiring on the test module according to a preset rule through the via hole on the test module;
acquiring test parameters of the test module in a preset test environment;
obtaining the through-flow resistance of the CCL material to be tested according to the test parameters;
the process of acquiring the test parameters of the test module in the preset test environment specifically comprises the following steps:
acquiring a current value of the test module at a preset test temperature;
the process of obtaining the through-flow resistance of the CCL material to be tested according to the test parameters specifically includes:
obtaining the through-current resistance of the CCL material to be detected according to the current value;
or the like, or, alternatively,
the process of acquiring the test parameters of the test module in the preset test environment specifically comprises the following steps:
acquiring a temperature value of the test module when a preset current passes through the test module;
the process of obtaining the through-flow resistance of the CCL material to be tested according to the test parameters specifically includes:
and obtaining the through-flow resistance of the CCL material to be detected according to the temperature value.
2. The method for detecting the through-flow resistance of the CCL according to claim 1, wherein the preset number of laminations is determined according to the number of laminations of a target board card and the type selection of the CCL material to be detected.
3. The method for detecting the through-flow resistance of the CCL according to claim 2, wherein after the through-flow resistance of the CCL material to be tested is obtained according to the test parameters, the method further comprises the following steps:
determining the optimal CCL material according to the through-flow resistance of all the CCL materials to be detected;
and manufacturing the target board card by the optimal CCL material.
4. The method for detecting the through-flow resistance of the CCL according to claim 3, wherein the process of determining the optimal CCL according to the through-flow resistance of all the CCL materials to be detected specifically comprises the following steps:
comparing current values of all the test modules in the preset test temperature;
and determining the CCL material to be tested corresponding to the test module with the maximum current value as the optimal CCL material.
5. The method for detecting the through-flow resistance of the CCL according to claim 4, wherein the process of determining the optimal CCL according to the through-flow resistance of all the CCL materials to be detected specifically comprises the following steps:
comparing the temperature values of all the test modules when the preset current passes through;
and determining the CCL material to be tested corresponding to the test module with the minimum temperature value as the optimal CCL material.
6. A CCL flow resistance detection system, comprising:
the test module is provided with a plurality of through holes, and the number and the positions of the through holes are determined by the number of preset laminated layers and actual routing;
the wiring module is used for wiring on the test module according to a preset rule through the via hole on the test module;
the detection module is used for acquiring the test parameters of the test module in a preset test environment;
the obtaining module is used for obtaining the through-flow resistance of the CCL material to be tested according to the test parameters;
the process of acquiring the test parameters of the test module in the preset test environment specifically comprises the following steps:
acquiring a current value of the test module at a preset test temperature;
the process of obtaining the through-flow resistance of the CCL material to be tested according to the test parameters specifically includes:
obtaining the through-current resistance of the CCL material to be detected according to the current value;
or the like, or, alternatively,
the process of acquiring the test parameters of the test module in the preset test environment specifically comprises the following steps:
acquiring a temperature value of the test module when a preset current passes through the test module;
the process of obtaining the through-flow resistance of the CCL material to be tested according to the test parameters specifically includes:
and obtaining the through-flow resistance of the CCL material to be detected according to the temperature value.
7. A CCL resistance to through-flow performance detection device characterized by comprising:
a memory for storing a computer program;
a processor configured to implement the steps of the CCL current endurance detection method according to any one of claims 1 to 5 when executing the computer program.
8. A readable storage medium, characterized in that the readable storage medium has stored thereon a computer program, which when executed by a processor implements the steps of the CCL current endurance detection method according to any one of claims 1 to 5.
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102505134A (en) * | 2011-12-21 | 2012-06-20 | 广东生益科技股份有限公司 | Aluminum plate for radiating substrate and treatment method thereof |
CN103304938A (en) * | 2013-05-24 | 2013-09-18 | 安邦电气集团有限公司 | PTC (Positive Temperature Coefficient) thermistor base material and preparation method thereof |
CN104133539A (en) * | 2014-08-06 | 2014-11-05 | 浪潮电子信息产业股份有限公司 | Method for realizing heat dissipation according to electric current change |
JP2016019333A (en) * | 2014-07-07 | 2016-02-01 | 富士電機株式会社 | Cooling structure of power conversion system |
CN105806887A (en) * | 2016-04-22 | 2016-07-27 | 全球能源互联网研究院 | Measuring method and measuring jig for thermal resistance junction to case of power semiconductor device |
CN105928637A (en) * | 2016-06-27 | 2016-09-07 | 滨州学院 | Temperature calibrating apparatus for IGBT power module chip and temperature correction method thereof |
-
2018
- 2018-10-08 CN CN201811168106.7A patent/CN109342499B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102505134A (en) * | 2011-12-21 | 2012-06-20 | 广东生益科技股份有限公司 | Aluminum plate for radiating substrate and treatment method thereof |
CN103304938A (en) * | 2013-05-24 | 2013-09-18 | 安邦电气集团有限公司 | PTC (Positive Temperature Coefficient) thermistor base material and preparation method thereof |
JP2016019333A (en) * | 2014-07-07 | 2016-02-01 | 富士電機株式会社 | Cooling structure of power conversion system |
CN104133539A (en) * | 2014-08-06 | 2014-11-05 | 浪潮电子信息产业股份有限公司 | Method for realizing heat dissipation according to electric current change |
CN105806887A (en) * | 2016-04-22 | 2016-07-27 | 全球能源互联网研究院 | Measuring method and measuring jig for thermal resistance junction to case of power semiconductor device |
CN105928637A (en) * | 2016-06-27 | 2016-09-07 | 滨州学院 | Temperature calibrating apparatus for IGBT power module chip and temperature correction method thereof |
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