CN109342499A - The resistance to through-flow method for testing performance of CCL, system, device and readable storage medium storing program for executing - Google Patents
The resistance to through-flow method for testing performance of CCL, system, device and readable storage medium storing program for executing Download PDFInfo
- Publication number
- CN109342499A CN109342499A CN201811168106.7A CN201811168106A CN109342499A CN 109342499 A CN109342499 A CN 109342499A CN 201811168106 A CN201811168106 A CN 201811168106A CN 109342499 A CN109342499 A CN 109342499A
- Authority
- CN
- China
- Prior art keywords
- ccl
- resistance
- test
- measured
- performance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 171
- 238000000034 method Methods 0.000 title claims abstract description 46
- 238000003860 storage Methods 0.000 title claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 111
- 238000003475 lamination Methods 0.000 claims abstract description 25
- 238000010276 construction Methods 0.000 claims abstract description 9
- 238000004590 computer program Methods 0.000 claims description 11
- 238000001514 detection method Methods 0.000 claims description 6
- 238000004364 calculation method Methods 0.000 claims 1
- 238000013461 design Methods 0.000 abstract description 10
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
- G01N25/48—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity on solution, sorption, or a chemical reaction not involving combustion or catalytic oxidation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
The invention discloses a kind of resistance to through-flow method for testing performance of CCL, including construction and each one-to-one test module of CCL material to be measured, test module is equipped with multiple via holes, and the quantity of via hole and position are determined by default lamination quantity and practical cabling;By the via hole in test module, it is routed in test module by preset rules;Obtain test parameter of the test module in default test environment;The resistance to through-flow performance of CCL material to be measured is obtained according to test parameter.As it can be seen that in practical applications, using the solution of the present invention, the resistance to through-flow performance of CCL material can be measured, can fast and accurately reflect the heat dissipation characteristics of CCL material, data support is provided for the design and guarantee product stability in later period.The invention also discloses a kind of resistance to through-flow performance detecting system of CCL, device and readable storage medium storing program for executing, have above-mentioned beneficial effect.
Description
Technical field
The present invention relates to board design fields, more particularly to a kind of resistance to through-flow method for testing performance of CCL, system, device
And readable storage medium storing program for executing.
Background technique
The realization of any circuit function is all based on the electrical characteristic parameter and dependability parameter of certain material, therefore, how
Accurate test sheet properties become current research hotspot.In view of the resistance to through-flow performance of different CCL materials is different, by resistance to
The board of the poor CCL material manufacture of through-flow performance, heat dissipation performance is poor, since external factor or internal factor lead to board table
When the temperature is excessively high, the performance of onboard chip will receive influence, such as driving capability decline even delay machine in face, influence circuit function
Realization, it is seen then that being detected when designing board to the resistance to through-flow performance of CCL material just becomes particularly important, still, existing
There is presently no the schemes of the resistance to through-flow performance of detection CCL material in technology.
Therefore, how to provide a kind of scheme of solution above-mentioned technical problem is that those skilled in the art need to solve at present
Problem.
Summary of the invention
The object of the present invention is to provide a kind of resistance to through-flow method for testing performance of CCL, can measure the resistance to through-flow property of CCL material
Can, it can fast and accurately reflect the heat dissipation characteristics of CCL material, provide data for the design and guarantee product stability in later period
It supports;It is a further object of the present invention to provide a kind of resistance to through-flow performance detecting system of CCL, device and readable storage medium storing program for executing.
In order to solve the above technical problems, the present invention provides a kind of resistance to through-flow method for testing performance of CCL, comprising:
Construction and each one-to-one test module of CCL material to be measured, the test module are equipped with multiple via holes, institute
The quantity and position for stating via hole are determined by default lamination quantity and practical cabling;
By the via hole in the test module, it is routed in the test module by preset rules;
Obtain test parameter of the test module in default test environment;
The resistance to through-flow performance of the CCL material to be measured is obtained according to the test parameter.
Preferably, the default lamination quantity is according to the lamination quantity of target board and the type selecting of the CCL material to be measured
It determines.
Preferably, it is described the resistance to through-flow performance of the CCL material to be measured is obtained according to the test parameter after, this method
Further include:
Best CCL material is determined according to the resistance to through-flow performance of all CCL materials to be measured;
The target board is manufactured by the best CCL material.
Correspondingly, described obtain the test module in the default process for testing the test parameter in environment specifically:
Obtain current value of the test module in default test temperature;
The then process of the resistance to through-flow performance that the CCL material to be measured is obtained according to the test parameter specifically:
The resistance to through-flow performance of the CCL material to be measured is obtained according to the current value.
It is preferably, described to obtain the test module in the default process for testing the test parameter in environment specifically:
Obtain temperature value of the test module when passing through predetermined current;
The then process of the resistance to through-flow performance that the CCL material to be measured is obtained according to the test parameter specifically:
The resistance to through-flow performance of the CCL material to be measured is obtained according to the temperature value.
Preferably, the resistance to through-flow performance according to all CCL materials to be measured determines the process tool of best CCL material
Body are as follows:
Compare current value of all test modules in the default test temperature;
The corresponding CCL material to be measured of the maximum test module of the current value is determined as best CCL material.
Preferably, the resistance to through-flow performance according to all CCL materials to be measured determines the process tool of best CCL material
Body are as follows:
Compare temperature value of all test modules when through the predetermined current;
The corresponding CCL material to be measured of the smallest test module of the temperature value is determined as best CCL material.
In order to solve the above technical problems, the present invention also provides a kind of resistance to through-flow performance detecting systems of CCL, comprising:
Constructing module is set in the test module for construction and each one-to-one test module of CCL material to be measured
There are multiple via holes, the quantity of the via hole and position are determined by default lamination quantity and practical cabling;
Interconnection module, for being routed in the test module by preset rules by the via hole in the test module;
Detection module, for obtaining test parameter of the test module in default test environment;
Module is obtained, for obtaining the resistance to through-flow performance of the CCL material to be measured according to the test parameter.
In order to solve the above technical problems, the present invention also provides a kind of resistance to through-flow device for detecting performance of CCL, comprising:
Memory, for storing computer program;
Processor realizes the resistance to through-flow performance inspection of the CCL as described in any one above when for executing the computer program
The step of survey method.
In order to solve the above technical problems, the present invention also provides a kind of readable storage medium storing program for executing, on the readable storage medium storing program for executing
It is stored with computer program, realizes that the CCL as described in any one above is resistance to through-flow when the computer program is executed by processor
The step of method for testing performance.
The present invention provides a kind of resistance to through-flow method for testing performance of CCL, including construction and each one a pair of CCL material to be measured
The test module answered, test module are equipped with multiple via holes, and the quantity of via hole and position are by default lamination quantity and practical cabling
It determines;By the via hole in test module, it is routed in test module by preset rules;Test module is obtained in default test wrapper
Test parameter in border;The resistance to through-flow performance of CCL material to be measured is obtained according to test parameter.As it can be seen that in practical applications, using
The solution of the present invention can measure the resistance to through-flow performance of CCL material, can fast and accurately reflect the heat dissipation characteristics of CCL material,
Data support is provided for the design and guarantee product stability in later period.The present invention also provides a kind of resistance to through-flow performance detections of CCL
System, device and readable storage medium storing program for executing have beneficial effect identical with above-mentioned resistance to through-flow method for testing performance.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to institute in the prior art and embodiment
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the invention
Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is a kind of step flow chart of the resistance to through-flow method for testing performance of CCL provided by the present invention;
Fig. 2 is a kind of structural schematic diagram of the resistance to through-flow performance detecting system of CCL provided by the present invention.
Specific embodiment
Core of the invention is to provide a kind of resistance to through-flow method for testing performance of CCL, can measure the resistance to through-flow property of CCL material
Can, it can fast and accurately reflect the heat dissipation characteristics of CCL material, provide data for the design and guarantee product stability in later period
It supports;Another core of the invention is to provide a kind of resistance to through-flow performance detecting system of CCL, device and readable storage medium storing program for executing.
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
Every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
Fig. 1 is please referred to, Fig. 1 is a kind of step flow chart of the resistance to through-flow method for testing performance of CCL provided by the present invention, packet
It includes:
Step 1: construction and each one-to-one test module of CCL material to be measured, test module are equipped with multiple via holes,
The quantity of via hole and position are determined by default lamination quantity and practical cabling;
Embodiment as one preferred presets lamination quantity according to the lamination quantity and CCL material to be measured of target board
Type selecting determine.
Specifically, determining default lamination quantity by the lamination quantity of Target Board card request, it is contemplated that different CCL materials
The supported lamination quantity of type selecting and thickness it is different, if the supported lamination quantity of CCL material is less than Target Board card request
Lamination quantity, in design object board, then without the concern for the CCL material, the CCL material to be measured in the present invention is can
Lamination quantity is supported to be greater than or equal to the CCL material of the lamination quantity of Target Board card request.In practical applications, there are it is a variety of to
The requirement that CCL material meets manufacturing objective board is surveyed, respectively construction and each one-to-one test module of CCL material to be measured,
Position and the quantity of via hole are determined in each test module according to default lamination quantity and practical cabling, it is assumed that default lamination
Quantity is 12, that is to say, that each test module needs to simulate cabling sequence and 24 via holes is arranged, between every two via hole with plate
Interior practical differential is walked linear dimension and is consistent.
Step 2: by the via hole in test module, being routed in test module by preset rules;
Specifically, being routed in test module by preset rules, after construction complete test module to each test module
Wire laying mode it is all the same, can specifically include by the process that preset rules are routed in test module: taking two via holes first
As current input terminal, cabling is drawn from the two via holes, with 1/10 spacing bracing wire of practical cabling space to two, opposite mistake
Current routing layer cabling is completed in hole, using current cabling terminal as next layer of cabling starting point, bracing wire is connected in the same way
To another pair of via hole, and so on, for the via hole after covering all lamination cablings as current output terminal, the above simulation is plate
The more intensive situation of interior cabling, it is default in the present invention if actual design demand can suitably relax when no so intensive
Rule is determined according to actual design demand.
Certainly, in addition to the cabling that two via holes can be taken to realize every layer, multiple via holes can also be chosen, according to practical cabling
Demand determines that the present invention is it is not limited here.
Step 3: obtaining test parameter of the test module in default test environment;
Specifically, testing after the completion of wiring each test module, in test, each test module is located
In identical default test environment, it is contemplated that the resistance to through-flow performance of CCL material to be measured is temperature dependent with electric current, therefore, in advance
Each test module is tested respectively under same default test temperature if test environment can refer to, at this moment test parameter is
Current value, default test environment can also show each test module and be passed through identical electric current, and at this moment test parameter is temperature value,
Specifically, temperature can be measured by setting thermocouple capacitor.
Step 4: the resistance to through-flow performance of CCL material to be measured is obtained according to test parameter.
Specifically, the superiority and inferiority of the resistance to through-flow performance of CCL material is assured that according to test parameter, when test parameter is electricity
When flow valuve, at the same temperature, the current value of test module is bigger, illustrates that the resistance to through-flow performance of CCL material to be measured is better, or
When being passed through same current, the temperature value of test module is smaller, illustrates that the resistance to through-flow performance of CCL material to be measured is better, it is possible to understand that
, the resistance to through-flow performance of CCL material to be measured is better, and the heat dissipation performance for the board being produced from it is just relatively preferable.
Specifically, default test environment also may include multiple default test temperatures, it is assumed that multiple default test temperature packets
60 degree, 70 degree, 80 degree, 90 degree are included, each test module corresponding current value at 60 degree, the corresponding electric current at 70 degree are obtained
Value, corresponding current value, the corresponding current value at 90 degree at 80 degree are test module according to 4 current values got
Temperature curve is drawn, under identical temperature value, current value is bigger, and the resistance to through-flow performance of CCL material is better.
Specifically, when adjusting temperature, the temperature such as need to re-record current value after stablizing, such as by temperature by 60 degree adjust to
After 70 degree, temperature can be waited to stablize and re-record current value greater than 10min or so at 70 degree, obtain the accurate of current value to improve
Property, and then improve the accuracy of subsequent resistance to through-flow performance test results.
Certainly, it when determining the resistance to through-flow performance of CCL material to be measured according to test parameter, also can be set corresponding default
Value, such as at the same temperature, current value be greater than the first preset value can be determined that CCL material property to be measured be it is excellent, current value is big
In the second preset value and less than the first preset value can be determined that CCL material property to be measured be it is good, current value is pre- less than second
If value can be determined that CCL material property to be measured is poor;Or it after being passed through same current value to each test module, gets
Temperature value be less than third preset value can be determined that CCL material property to be measured be it is excellent, the temperature value got is default greater than third
Value and less than the 4th preset value can be determined that CCL material property to be measured be it is good, it is default that the temperature value got is greater than the 4th
Value can be determined that CCL material property to be measured is poor.
The present invention provides a kind of resistance to through-flow method for testing performance of CCL, including construction and each one a pair of CCL material to be measured
The test module answered, test module are equipped with multiple via holes, and the quantity of via hole and position are by default lamination quantity and practical cabling
It determines;By the via hole in test module, it is routed in test module by preset rules;Test module is obtained in default test wrapper
Test parameter in border;The resistance to through-flow performance of CCL material to be measured is obtained according to test parameter.As it can be seen that in practical applications, using
The solution of the present invention can measure the resistance to through-flow performance of CCL material, can fast and accurately reflect the heat dissipation characteristics of CCL material,
Data support is provided for the design and guarantee product stability in later period.
On the basis of the above embodiments:
Embodiment as one preferred, after the resistance to through-flow performance that CCL material to be measured is obtained according to test parameter, the party
Method further include:
Best CCL material is determined according to the resistance to through-flow performance of all CCL materials to be measured;
Pass through best CCL material manufacturing objective board.
Specifically, in view of detecting that the resistance to through-flow performance of CCL material to be measured can be the design and guarantee product in later period
Stability provides data and supports, after the resistance to through-flow performance to each CCL material to be measured detects, can choose resistance to through-flow
The best CCL material manufacturing objective board to be measured of performance, can be improved the heat dissipation performance of target board to a certain extent, thus
Improve product stability.
Embodiment as one preferred determines best CCL material according to the resistance to through-flow performance of all CCL materials to be measured
Process specifically:
Compare current value of all test modules in default test temperature;
The corresponding CCL material to be measured of the maximum test module of current value is determined as best CCL material.
Embodiment as one preferred determines best CCL material according to the resistance to through-flow performance of all CCL materials to be measured
Process specifically:
Compare temperature value of all test modules when passing through predetermined current;
The corresponding CCL material to be measured of the smallest test module of temperature value is determined as best CCL material.
Specifically, at the same temperature, test module current value is bigger according to described above, illustrate it is corresponding to
The resistance to through-flow performance for surveying CCL material is better, therefore, can be true by the corresponding CCL material to be measured of the maximum test module of current value
It is set to best CCL material, or in the case where being passed through same current, the temperature value of test module is smaller, illustrates corresponding
CCL material to be measured resistance to through-flow performance it is better, therefore, can be by the corresponding CCL material to be measured of the smallest test module of temperature value
Material is determined as best CCL material, the board manufactured by best CCL material, perfect heat-dissipating, and stability is high.
Referring to figure 2., Fig. 2 is a kind of structural schematic diagram of the resistance to through-flow performance detecting system of CCL provided by the present invention, packet
It includes:
Constructing module 1 is equipped with for constructing with each one-to-one test module of CCL material to be measured, test module
Multiple via holes, the quantity of via hole and position are determined by default lamination quantity and practical cabling;
Interconnection module 2, for being routed in test module by preset rules by the via hole in test module;
Detection module 3, for obtaining test parameter of the test module in default test environment;
Module 4 is obtained, for obtaining the resistance to through-flow performance of CCL material to be measured according to test parameter.
Correspondingly, the present invention also provides a kind of resistance to through-flow device for detecting performance of CCL, comprising:
Memory, for storing computer program;
Processor is realized when for executing computer program such as the resistance to through-flow method for testing performance of any one CCL above
Step.
Correspondingly, it is stored with computer program on readable storage medium storing program for executing the present invention also provides a kind of readable storage medium storing program for executing,
The step of through-flow method for testing performance as resistance to such as any one CCL above is realized when computer program is executed by processor.
A kind of resistance to through-flow performance detecting system of CCL provided by the present invention, device and readable storage medium storing program for executing, have and above-mentioned
The identical beneficial effect of resistance to through-flow method for testing performance.
For a kind of introduction of CCL resistance to through-flow performance detecting system, device and readable storage medium storing program for executing provided by the present invention
Above-described embodiment is please referred to, details are not described herein by the present invention.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.For device disclosed in embodiment
For, since it is corresponded to the methods disclosed in the examples, so being described relatively simple, related place is said referring to method part
It is bright.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (10)
1. a kind of resistance to through-flow method for testing performance of CCL characterized by comprising
Construction and each one-to-one test module of CCL material to be measured, the test module are equipped with multiple via holes, the mistake
The quantity in hole and position are determined by default lamination quantity and practical cabling;
By the via hole in the test module, it is routed in the test module by preset rules;
Obtain test parameter of the test module in default test environment;
The resistance to through-flow performance of the CCL material to be measured is obtained according to the test parameter.
2. the resistance to through-flow method for testing performance of CCL according to claim 1, which is characterized in that the default lamination quantity root
It is determined according to the lamination quantity of target board and the type selecting of the CCL material to be measured.
3. the resistance to through-flow method for testing performance of CCL according to claim 2, which is characterized in that described to be joined according to the test
After number obtains the resistance to through-flow performance of the CCL material to be measured, this method further include:
Best CCL material is determined according to the resistance to through-flow performance of all CCL materials to be measured;
The target board is manufactured by the best CCL material.
4. the resistance to through-flow method for testing performance of CCL according to claim 3, which is characterized in that described to obtain the test mould
The process of test parameter of the block in default test environment specifically:
Obtain current value of the test module in default test temperature;
The then process of the resistance to through-flow performance that the CCL material to be measured is obtained according to the test parameter specifically:
The resistance to through-flow performance of the CCL material to be measured is obtained according to the current value.
5. the resistance to through-flow method for testing performance of CCL according to claim 3, which is characterized in that described to obtain the test mould
The process of test parameter of the block in default test environment specifically:
Obtain temperature value of the test module when passing through predetermined current;
The then process of the resistance to through-flow performance that the CCL material to be measured is obtained according to the test parameter specifically:
The resistance to through-flow performance of the CCL material to be measured is obtained according to the temperature value.
6. the resistance to through-flow method for testing performance of CCL according to claim 4, which is characterized in that it is described according to it is all it is described to
The resistance to through-flow performance for surveying CCL material determines the process of best CCL material specifically:
Compare current value of all test modules in the default test temperature;
The corresponding CCL material to be measured of the maximum test module of the current value is determined as best CCL material.
7. the resistance to through-flow method for testing performance of CCL according to claim 5, which is characterized in that it is described according to it is all it is described to
The resistance to through-flow performance for surveying CCL material determines the process of best CCL material specifically:
Compare temperature value of all test modules when through the predetermined current;
The corresponding CCL material to be measured of the smallest test module of the temperature value is determined as best CCL material.
8. a kind of resistance to through-flow performance detecting system of CCL characterized by comprising
Constructing module is equipped with more for constructing with each one-to-one test module of CCL material to be measured, the test module
A via hole, the quantity of the via hole and position are determined by default lamination quantity and practical cabling;
Interconnection module, for being routed in the test module by preset rules by the via hole in the test module;
Detection module, for obtaining test parameter of the test module in default test environment;
Module is obtained, for obtaining the resistance to through-flow performance of the CCL material to be measured according to the test parameter.
9. a kind of resistance to through-flow device for detecting performance of CCL characterized by comprising
Memory, for storing computer program;
Processor realizes the resistance to through-flow performance of the CCL as described in claim 1-7 any one when for executing the computer program
The step of detection method.
10. a kind of readable storage medium storing program for executing, which is characterized in that be stored with computer program, the meter on the readable storage medium storing program for executing
The step of the resistance to through-flow method for testing performance of the CCL as described in claim 1-7 any one is realized when calculation machine program is executed by processor
Suddenly.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811168106.7A CN109342499B (en) | 2018-10-08 | 2018-10-08 | CCL (continuous liquid chromatography) through-flow resistance detection method, system and device and readable storage medium |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811168106.7A CN109342499B (en) | 2018-10-08 | 2018-10-08 | CCL (continuous liquid chromatography) through-flow resistance detection method, system and device and readable storage medium |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109342499A true CN109342499A (en) | 2019-02-15 |
CN109342499B CN109342499B (en) | 2021-03-26 |
Family
ID=65307823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811168106.7A Active CN109342499B (en) | 2018-10-08 | 2018-10-08 | CCL (continuous liquid chromatography) through-flow resistance detection method, system and device and readable storage medium |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109342499B (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102505134A (en) * | 2011-12-21 | 2012-06-20 | 广东生益科技股份有限公司 | Aluminum plate for radiating substrate and treatment method thereof |
CN103304938A (en) * | 2013-05-24 | 2013-09-18 | 安邦电气集团有限公司 | PTC (Positive Temperature Coefficient) thermistor base material and preparation method thereof |
CN104133539A (en) * | 2014-08-06 | 2014-11-05 | 浪潮电子信息产业股份有限公司 | Method for realizing heat dissipation according to electric current change |
JP2016019333A (en) * | 2014-07-07 | 2016-02-01 | 富士電機株式会社 | Cooling structure of power conversion system |
CN105806887A (en) * | 2016-04-22 | 2016-07-27 | 全球能源互联网研究院 | Measuring method and measuring jig for thermal resistance junction to case of power semiconductor device |
CN105928637A (en) * | 2016-06-27 | 2016-09-07 | 滨州学院 | Temperature calibrating apparatus for IGBT power module chip and temperature correction method thereof |
-
2018
- 2018-10-08 CN CN201811168106.7A patent/CN109342499B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102505134A (en) * | 2011-12-21 | 2012-06-20 | 广东生益科技股份有限公司 | Aluminum plate for radiating substrate and treatment method thereof |
CN103304938A (en) * | 2013-05-24 | 2013-09-18 | 安邦电气集团有限公司 | PTC (Positive Temperature Coefficient) thermistor base material and preparation method thereof |
JP2016019333A (en) * | 2014-07-07 | 2016-02-01 | 富士電機株式会社 | Cooling structure of power conversion system |
CN104133539A (en) * | 2014-08-06 | 2014-11-05 | 浪潮电子信息产业股份有限公司 | Method for realizing heat dissipation according to electric current change |
CN105806887A (en) * | 2016-04-22 | 2016-07-27 | 全球能源互联网研究院 | Measuring method and measuring jig for thermal resistance junction to case of power semiconductor device |
CN105928637A (en) * | 2016-06-27 | 2016-09-07 | 滨州学院 | Temperature calibrating apparatus for IGBT power module chip and temperature correction method thereof |
Also Published As
Publication number | Publication date |
---|---|
CN109342499B (en) | 2021-03-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106920797A (en) | Memory construction and preparation method thereof, the method for testing of memory | |
WO2022041198A1 (en) | Temperature change calculation method for three-dimensional stacked memory chip | |
CN106021676B (en) | A kind of more telegram in reply cable stable state temperature rise acquisition methods based on transfer matrix | |
JP2016025355A (en) | Electrostatic capacitance test structure and electrostatic capacitance test method for monitoring thickness of dielectric | |
CN103199041A (en) | Management system of wafer acceptable test procedure and application method thereof | |
CN108362996A (en) | A kind of " measurement of near distance " theory and method | |
CN106021189A (en) | Multi-loop cable steady-state temperature rise acquisition method adapting to various boundary conditions | |
CN109799008A (en) | A kind of temperature sensor automatic calibrating method and temperature sensor | |
CN108180890A (en) | The acquisition methods and terminal of a kind of height above sea level | |
CN109342499A (en) | The resistance to through-flow method for testing performance of CCL, system, device and readable storage medium storing program for executing | |
CN208273350U (en) | A kind of flexible circuit board cable structure to be tested | |
CN106053527A (en) | Method for testing anisotropic heat diffusion coefficient of power battery at same time | |
CN113779742B (en) | Modeling method and device for simplified model of thermal resistance network and chip junction temperature prediction method | |
CN103499368B (en) | One carries out voltage and thermometric device to lithium battery group | |
CN107505516B (en) | Simulation test CPU heat dissipation power device | |
CN104635139A (en) | Low-temperature performance test system of integrated circuit | |
CN107305852B (en) | IGBT chip screening structure based on switching characteristic measurement | |
Yin et al. | An Integrated Flow–Electric–Thermal Model for a Cylindrical Li‐Ion Battery Module with a Direct Liquid Cooling Strategy | |
TW201108016A (en) | Method of interconnect checking and verification for multiple electrostatic discharge specifications | |
US20210262959A1 (en) | Non-transitory computer-readable recording medium and thermal analysis device | |
KR101959734B1 (en) | Shunt resistor using for cycler and production method of it | |
CN111722019A (en) | Contact resistance testing device and method, electronic equipment and storage medium | |
CN109188101A (en) | Acquisition methods, system, device and the readable storage medium storing program for executing of medium electric parameter | |
CN219532295U (en) | Thermometer fixture | |
CN117452176B (en) | Device power resistance test system, method and fixture |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20210205 Address after: Building 9, No.1, guanpu Road, Guoxiang street, Wuzhong Economic Development Zone, Wuzhong District, Suzhou City, Jiangsu Province Applicant after: SUZHOU LANGCHAO INTELLIGENT TECHNOLOGY Co.,Ltd. Address before: Room 1601, floor 16, 278 Xinyi Road, Zhengdong New District, Zhengzhou City, Henan Province Applicant before: ZHENGZHOU YUNHAI INFORMATION TECHNOLOGY Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant |