CN109342499A - The resistance to through-flow method for testing performance of CCL, system, device and readable storage medium storing program for executing - Google Patents

The resistance to through-flow method for testing performance of CCL, system, device and readable storage medium storing program for executing Download PDF

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Publication number
CN109342499A
CN109342499A CN201811168106.7A CN201811168106A CN109342499A CN 109342499 A CN109342499 A CN 109342499A CN 201811168106 A CN201811168106 A CN 201811168106A CN 109342499 A CN109342499 A CN 109342499A
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ccl
resistance
test
measured
performance
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CN109342499B (en
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孙龙
武宁
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Suzhou Inspur Intelligent Technology Co Ltd
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Zhengzhou Yunhai Information Technology Co Ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00Investigating or analyzing materials by the use of thermal means
    • G01N25/20Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
    • G01N25/48Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity on solution, sorption, or a chemical reaction not involving combustion or catalytic oxidation

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  • Testing Electric Properties And Detecting Electric Faults (AREA)
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Abstract

The invention discloses a kind of resistance to through-flow method for testing performance of CCL, including construction and each one-to-one test module of CCL material to be measured, test module is equipped with multiple via holes, and the quantity of via hole and position are determined by default lamination quantity and practical cabling;By the via hole in test module, it is routed in test module by preset rules;Obtain test parameter of the test module in default test environment;The resistance to through-flow performance of CCL material to be measured is obtained according to test parameter.As it can be seen that in practical applications, using the solution of the present invention, the resistance to through-flow performance of CCL material can be measured, can fast and accurately reflect the heat dissipation characteristics of CCL material, data support is provided for the design and guarantee product stability in later period.The invention also discloses a kind of resistance to through-flow performance detecting system of CCL, device and readable storage medium storing program for executing, have above-mentioned beneficial effect.

Description

The resistance to through-flow method for testing performance of CCL, system, device and readable storage medium storing program for executing
Technical field
The present invention relates to board design fields, more particularly to a kind of resistance to through-flow method for testing performance of CCL, system, device And readable storage medium storing program for executing.
Background technique
The realization of any circuit function is all based on the electrical characteristic parameter and dependability parameter of certain material, therefore, how Accurate test sheet properties become current research hotspot.In view of the resistance to through-flow performance of different CCL materials is different, by resistance to The board of the poor CCL material manufacture of through-flow performance, heat dissipation performance is poor, since external factor or internal factor lead to board table When the temperature is excessively high, the performance of onboard chip will receive influence, such as driving capability decline even delay machine in face, influence circuit function Realization, it is seen then that being detected when designing board to the resistance to through-flow performance of CCL material just becomes particularly important, still, existing There is presently no the schemes of the resistance to through-flow performance of detection CCL material in technology.
Therefore, how to provide a kind of scheme of solution above-mentioned technical problem is that those skilled in the art need to solve at present Problem.
Summary of the invention
The object of the present invention is to provide a kind of resistance to through-flow method for testing performance of CCL, can measure the resistance to through-flow property of CCL material Can, it can fast and accurately reflect the heat dissipation characteristics of CCL material, provide data for the design and guarantee product stability in later period It supports;It is a further object of the present invention to provide a kind of resistance to through-flow performance detecting system of CCL, device and readable storage medium storing program for executing.
In order to solve the above technical problems, the present invention provides a kind of resistance to through-flow method for testing performance of CCL, comprising:
Construction and each one-to-one test module of CCL material to be measured, the test module are equipped with multiple via holes, institute The quantity and position for stating via hole are determined by default lamination quantity and practical cabling;
By the via hole in the test module, it is routed in the test module by preset rules;
Obtain test parameter of the test module in default test environment;
The resistance to through-flow performance of the CCL material to be measured is obtained according to the test parameter.
Preferably, the default lamination quantity is according to the lamination quantity of target board and the type selecting of the CCL material to be measured It determines.
Preferably, it is described the resistance to through-flow performance of the CCL material to be measured is obtained according to the test parameter after, this method Further include:
Best CCL material is determined according to the resistance to through-flow performance of all CCL materials to be measured;
The target board is manufactured by the best CCL material.
Correspondingly, described obtain the test module in the default process for testing the test parameter in environment specifically:
Obtain current value of the test module in default test temperature;
The then process of the resistance to through-flow performance that the CCL material to be measured is obtained according to the test parameter specifically:
The resistance to through-flow performance of the CCL material to be measured is obtained according to the current value.
It is preferably, described to obtain the test module in the default process for testing the test parameter in environment specifically:
Obtain temperature value of the test module when passing through predetermined current;
The then process of the resistance to through-flow performance that the CCL material to be measured is obtained according to the test parameter specifically:
The resistance to through-flow performance of the CCL material to be measured is obtained according to the temperature value.
Preferably, the resistance to through-flow performance according to all CCL materials to be measured determines the process tool of best CCL material Body are as follows:
Compare current value of all test modules in the default test temperature;
The corresponding CCL material to be measured of the maximum test module of the current value is determined as best CCL material.
Preferably, the resistance to through-flow performance according to all CCL materials to be measured determines the process tool of best CCL material Body are as follows:
Compare temperature value of all test modules when through the predetermined current;
The corresponding CCL material to be measured of the smallest test module of the temperature value is determined as best CCL material.
In order to solve the above technical problems, the present invention also provides a kind of resistance to through-flow performance detecting systems of CCL, comprising:
Constructing module is set in the test module for construction and each one-to-one test module of CCL material to be measured There are multiple via holes, the quantity of the via hole and position are determined by default lamination quantity and practical cabling;
Interconnection module, for being routed in the test module by preset rules by the via hole in the test module;
Detection module, for obtaining test parameter of the test module in default test environment;
Module is obtained, for obtaining the resistance to through-flow performance of the CCL material to be measured according to the test parameter.
In order to solve the above technical problems, the present invention also provides a kind of resistance to through-flow device for detecting performance of CCL, comprising:
Memory, for storing computer program;
Processor realizes the resistance to through-flow performance inspection of the CCL as described in any one above when for executing the computer program The step of survey method.
In order to solve the above technical problems, the present invention also provides a kind of readable storage medium storing program for executing, on the readable storage medium storing program for executing It is stored with computer program, realizes that the CCL as described in any one above is resistance to through-flow when the computer program is executed by processor The step of method for testing performance.
The present invention provides a kind of resistance to through-flow method for testing performance of CCL, including construction and each one a pair of CCL material to be measured The test module answered, test module are equipped with multiple via holes, and the quantity of via hole and position are by default lamination quantity and practical cabling It determines;By the via hole in test module, it is routed in test module by preset rules;Test module is obtained in default test wrapper Test parameter in border;The resistance to through-flow performance of CCL material to be measured is obtained according to test parameter.As it can be seen that in practical applications, using The solution of the present invention can measure the resistance to through-flow performance of CCL material, can fast and accurately reflect the heat dissipation characteristics of CCL material, Data support is provided for the design and guarantee product stability in later period.The present invention also provides a kind of resistance to through-flow performance detections of CCL System, device and readable storage medium storing program for executing have beneficial effect identical with above-mentioned resistance to through-flow method for testing performance.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to institute in the prior art and embodiment Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the invention Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings Obtain other attached drawings.
Fig. 1 is a kind of step flow chart of the resistance to through-flow method for testing performance of CCL provided by the present invention;
Fig. 2 is a kind of structural schematic diagram of the resistance to through-flow performance detecting system of CCL provided by the present invention.
Specific embodiment
Core of the invention is to provide a kind of resistance to through-flow method for testing performance of CCL, can measure the resistance to through-flow property of CCL material Can, it can fast and accurately reflect the heat dissipation characteristics of CCL material, provide data for the design and guarantee product stability in later period It supports;Another core of the invention is to provide a kind of resistance to through-flow performance detecting system of CCL, device and readable storage medium storing program for executing.
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art Every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
Fig. 1 is please referred to, Fig. 1 is a kind of step flow chart of the resistance to through-flow method for testing performance of CCL provided by the present invention, packet It includes:
Step 1: construction and each one-to-one test module of CCL material to be measured, test module are equipped with multiple via holes, The quantity of via hole and position are determined by default lamination quantity and practical cabling;
Embodiment as one preferred presets lamination quantity according to the lamination quantity and CCL material to be measured of target board Type selecting determine.
Specifically, determining default lamination quantity by the lamination quantity of Target Board card request, it is contemplated that different CCL materials The supported lamination quantity of type selecting and thickness it is different, if the supported lamination quantity of CCL material is less than Target Board card request Lamination quantity, in design object board, then without the concern for the CCL material, the CCL material to be measured in the present invention is can Lamination quantity is supported to be greater than or equal to the CCL material of the lamination quantity of Target Board card request.In practical applications, there are it is a variety of to The requirement that CCL material meets manufacturing objective board is surveyed, respectively construction and each one-to-one test module of CCL material to be measured, Position and the quantity of via hole are determined in each test module according to default lamination quantity and practical cabling, it is assumed that default lamination Quantity is 12, that is to say, that each test module needs to simulate cabling sequence and 24 via holes is arranged, between every two via hole with plate Interior practical differential is walked linear dimension and is consistent.
Step 2: by the via hole in test module, being routed in test module by preset rules;
Specifically, being routed in test module by preset rules, after construction complete test module to each test module Wire laying mode it is all the same, can specifically include by the process that preset rules are routed in test module: taking two via holes first As current input terminal, cabling is drawn from the two via holes, with 1/10 spacing bracing wire of practical cabling space to two, opposite mistake Current routing layer cabling is completed in hole, using current cabling terminal as next layer of cabling starting point, bracing wire is connected in the same way To another pair of via hole, and so on, for the via hole after covering all lamination cablings as current output terminal, the above simulation is plate The more intensive situation of interior cabling, it is default in the present invention if actual design demand can suitably relax when no so intensive Rule is determined according to actual design demand.
Certainly, in addition to the cabling that two via holes can be taken to realize every layer, multiple via holes can also be chosen, according to practical cabling Demand determines that the present invention is it is not limited here.
Step 3: obtaining test parameter of the test module in default test environment;
Specifically, testing after the completion of wiring each test module, in test, each test module is located In identical default test environment, it is contemplated that the resistance to through-flow performance of CCL material to be measured is temperature dependent with electric current, therefore, in advance Each test module is tested respectively under same default test temperature if test environment can refer to, at this moment test parameter is Current value, default test environment can also show each test module and be passed through identical electric current, and at this moment test parameter is temperature value, Specifically, temperature can be measured by setting thermocouple capacitor.
Step 4: the resistance to through-flow performance of CCL material to be measured is obtained according to test parameter.
Specifically, the superiority and inferiority of the resistance to through-flow performance of CCL material is assured that according to test parameter, when test parameter is electricity When flow valuve, at the same temperature, the current value of test module is bigger, illustrates that the resistance to through-flow performance of CCL material to be measured is better, or When being passed through same current, the temperature value of test module is smaller, illustrates that the resistance to through-flow performance of CCL material to be measured is better, it is possible to understand that , the resistance to through-flow performance of CCL material to be measured is better, and the heat dissipation performance for the board being produced from it is just relatively preferable.
Specifically, default test environment also may include multiple default test temperatures, it is assumed that multiple default test temperature packets 60 degree, 70 degree, 80 degree, 90 degree are included, each test module corresponding current value at 60 degree, the corresponding electric current at 70 degree are obtained Value, corresponding current value, the corresponding current value at 90 degree at 80 degree are test module according to 4 current values got Temperature curve is drawn, under identical temperature value, current value is bigger, and the resistance to through-flow performance of CCL material is better.
Specifically, when adjusting temperature, the temperature such as need to re-record current value after stablizing, such as by temperature by 60 degree adjust to After 70 degree, temperature can be waited to stablize and re-record current value greater than 10min or so at 70 degree, obtain the accurate of current value to improve Property, and then improve the accuracy of subsequent resistance to through-flow performance test results.
Certainly, it when determining the resistance to through-flow performance of CCL material to be measured according to test parameter, also can be set corresponding default Value, such as at the same temperature, current value be greater than the first preset value can be determined that CCL material property to be measured be it is excellent, current value is big In the second preset value and less than the first preset value can be determined that CCL material property to be measured be it is good, current value is pre- less than second If value can be determined that CCL material property to be measured is poor;Or it after being passed through same current value to each test module, gets Temperature value be less than third preset value can be determined that CCL material property to be measured be it is excellent, the temperature value got is default greater than third Value and less than the 4th preset value can be determined that CCL material property to be measured be it is good, it is default that the temperature value got is greater than the 4th Value can be determined that CCL material property to be measured is poor.
The present invention provides a kind of resistance to through-flow method for testing performance of CCL, including construction and each one a pair of CCL material to be measured The test module answered, test module are equipped with multiple via holes, and the quantity of via hole and position are by default lamination quantity and practical cabling It determines;By the via hole in test module, it is routed in test module by preset rules;Test module is obtained in default test wrapper Test parameter in border;The resistance to through-flow performance of CCL material to be measured is obtained according to test parameter.As it can be seen that in practical applications, using The solution of the present invention can measure the resistance to through-flow performance of CCL material, can fast and accurately reflect the heat dissipation characteristics of CCL material, Data support is provided for the design and guarantee product stability in later period.
On the basis of the above embodiments:
Embodiment as one preferred, after the resistance to through-flow performance that CCL material to be measured is obtained according to test parameter, the party Method further include:
Best CCL material is determined according to the resistance to through-flow performance of all CCL materials to be measured;
Pass through best CCL material manufacturing objective board.
Specifically, in view of detecting that the resistance to through-flow performance of CCL material to be measured can be the design and guarantee product in later period Stability provides data and supports, after the resistance to through-flow performance to each CCL material to be measured detects, can choose resistance to through-flow The best CCL material manufacturing objective board to be measured of performance, can be improved the heat dissipation performance of target board to a certain extent, thus Improve product stability.
Embodiment as one preferred determines best CCL material according to the resistance to through-flow performance of all CCL materials to be measured Process specifically:
Compare current value of all test modules in default test temperature;
The corresponding CCL material to be measured of the maximum test module of current value is determined as best CCL material.
Embodiment as one preferred determines best CCL material according to the resistance to through-flow performance of all CCL materials to be measured Process specifically:
Compare temperature value of all test modules when passing through predetermined current;
The corresponding CCL material to be measured of the smallest test module of temperature value is determined as best CCL material.
Specifically, at the same temperature, test module current value is bigger according to described above, illustrate it is corresponding to The resistance to through-flow performance for surveying CCL material is better, therefore, can be true by the corresponding CCL material to be measured of the maximum test module of current value It is set to best CCL material, or in the case where being passed through same current, the temperature value of test module is smaller, illustrates corresponding CCL material to be measured resistance to through-flow performance it is better, therefore, can be by the corresponding CCL material to be measured of the smallest test module of temperature value Material is determined as best CCL material, the board manufactured by best CCL material, perfect heat-dissipating, and stability is high.
Referring to figure 2., Fig. 2 is a kind of structural schematic diagram of the resistance to through-flow performance detecting system of CCL provided by the present invention, packet It includes:
Constructing module 1 is equipped with for constructing with each one-to-one test module of CCL material to be measured, test module Multiple via holes, the quantity of via hole and position are determined by default lamination quantity and practical cabling;
Interconnection module 2, for being routed in test module by preset rules by the via hole in test module;
Detection module 3, for obtaining test parameter of the test module in default test environment;
Module 4 is obtained, for obtaining the resistance to through-flow performance of CCL material to be measured according to test parameter.
Correspondingly, the present invention also provides a kind of resistance to through-flow device for detecting performance of CCL, comprising:
Memory, for storing computer program;
Processor is realized when for executing computer program such as the resistance to through-flow method for testing performance of any one CCL above Step.
Correspondingly, it is stored with computer program on readable storage medium storing program for executing the present invention also provides a kind of readable storage medium storing program for executing, The step of through-flow method for testing performance as resistance to such as any one CCL above is realized when computer program is executed by processor.
A kind of resistance to through-flow performance detecting system of CCL provided by the present invention, device and readable storage medium storing program for executing, have and above-mentioned The identical beneficial effect of resistance to through-flow method for testing performance.
For a kind of introduction of CCL resistance to through-flow performance detecting system, device and readable storage medium storing program for executing provided by the present invention Above-described embodiment is please referred to, details are not described herein by the present invention.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other The difference of embodiment, the same or similar parts in each embodiment may refer to each other.For device disclosed in embodiment For, since it is corresponded to the methods disclosed in the examples, so being described relatively simple, related place is said referring to method part It is bright.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one The widest scope of cause.

Claims (10)

1. a kind of resistance to through-flow method for testing performance of CCL characterized by comprising
Construction and each one-to-one test module of CCL material to be measured, the test module are equipped with multiple via holes, the mistake The quantity in hole and position are determined by default lamination quantity and practical cabling;
By the via hole in the test module, it is routed in the test module by preset rules;
Obtain test parameter of the test module in default test environment;
The resistance to through-flow performance of the CCL material to be measured is obtained according to the test parameter.
2. the resistance to through-flow method for testing performance of CCL according to claim 1, which is characterized in that the default lamination quantity root It is determined according to the lamination quantity of target board and the type selecting of the CCL material to be measured.
3. the resistance to through-flow method for testing performance of CCL according to claim 2, which is characterized in that described to be joined according to the test After number obtains the resistance to through-flow performance of the CCL material to be measured, this method further include:
Best CCL material is determined according to the resistance to through-flow performance of all CCL materials to be measured;
The target board is manufactured by the best CCL material.
4. the resistance to through-flow method for testing performance of CCL according to claim 3, which is characterized in that described to obtain the test mould The process of test parameter of the block in default test environment specifically:
Obtain current value of the test module in default test temperature;
The then process of the resistance to through-flow performance that the CCL material to be measured is obtained according to the test parameter specifically:
The resistance to through-flow performance of the CCL material to be measured is obtained according to the current value.
5. the resistance to through-flow method for testing performance of CCL according to claim 3, which is characterized in that described to obtain the test mould The process of test parameter of the block in default test environment specifically:
Obtain temperature value of the test module when passing through predetermined current;
The then process of the resistance to through-flow performance that the CCL material to be measured is obtained according to the test parameter specifically:
The resistance to through-flow performance of the CCL material to be measured is obtained according to the temperature value.
6. the resistance to through-flow method for testing performance of CCL according to claim 4, which is characterized in that it is described according to it is all it is described to The resistance to through-flow performance for surveying CCL material determines the process of best CCL material specifically:
Compare current value of all test modules in the default test temperature;
The corresponding CCL material to be measured of the maximum test module of the current value is determined as best CCL material.
7. the resistance to through-flow method for testing performance of CCL according to claim 5, which is characterized in that it is described according to it is all it is described to The resistance to through-flow performance for surveying CCL material determines the process of best CCL material specifically:
Compare temperature value of all test modules when through the predetermined current;
The corresponding CCL material to be measured of the smallest test module of the temperature value is determined as best CCL material.
8. a kind of resistance to through-flow performance detecting system of CCL characterized by comprising
Constructing module is equipped with more for constructing with each one-to-one test module of CCL material to be measured, the test module A via hole, the quantity of the via hole and position are determined by default lamination quantity and practical cabling;
Interconnection module, for being routed in the test module by preset rules by the via hole in the test module;
Detection module, for obtaining test parameter of the test module in default test environment;
Module is obtained, for obtaining the resistance to through-flow performance of the CCL material to be measured according to the test parameter.
9. a kind of resistance to through-flow device for detecting performance of CCL characterized by comprising
Memory, for storing computer program;
Processor realizes the resistance to through-flow performance of the CCL as described in claim 1-7 any one when for executing the computer program The step of detection method.
10. a kind of readable storage medium storing program for executing, which is characterized in that be stored with computer program, the meter on the readable storage medium storing program for executing The step of the resistance to through-flow method for testing performance of the CCL as described in claim 1-7 any one is realized when calculation machine program is executed by processor Suddenly.
CN201811168106.7A 2018-10-08 2018-10-08 CCL (continuous liquid chromatography) through-flow resistance detection method, system and device and readable storage medium Active CN109342499B (en)

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CN103304938A (en) * 2013-05-24 2013-09-18 安邦电气集团有限公司 PTC (Positive Temperature Coefficient) thermistor base material and preparation method thereof
CN104133539A (en) * 2014-08-06 2014-11-05 浪潮电子信息产业股份有限公司 Method for realizing heat dissipation according to electric current change
JP2016019333A (en) * 2014-07-07 2016-02-01 富士電機株式会社 Cooling structure of power conversion system
CN105806887A (en) * 2016-04-22 2016-07-27 全球能源互联网研究院 Measuring method and measuring jig for thermal resistance junction to case of power semiconductor device
CN105928637A (en) * 2016-06-27 2016-09-07 滨州学院 Temperature calibrating apparatus for IGBT power module chip and temperature correction method thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102505134A (en) * 2011-12-21 2012-06-20 广东生益科技股份有限公司 Aluminum plate for radiating substrate and treatment method thereof
CN103304938A (en) * 2013-05-24 2013-09-18 安邦电气集团有限公司 PTC (Positive Temperature Coefficient) thermistor base material and preparation method thereof
JP2016019333A (en) * 2014-07-07 2016-02-01 富士電機株式会社 Cooling structure of power conversion system
CN104133539A (en) * 2014-08-06 2014-11-05 浪潮电子信息产业股份有限公司 Method for realizing heat dissipation according to electric current change
CN105806887A (en) * 2016-04-22 2016-07-27 全球能源互联网研究院 Measuring method and measuring jig for thermal resistance junction to case of power semiconductor device
CN105928637A (en) * 2016-06-27 2016-09-07 滨州学院 Temperature calibrating apparatus for IGBT power module chip and temperature correction method thereof

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