JP2016025355A - Electrostatic capacitance test structure and electrostatic capacitance test method for monitoring thickness of dielectric - Google Patents

Electrostatic capacitance test structure and electrostatic capacitance test method for monitoring thickness of dielectric Download PDF

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JP2016025355A
JP2016025355A JP2015142923A JP2015142923A JP2016025355A JP 2016025355 A JP2016025355 A JP 2016025355A JP 2015142923 A JP2015142923 A JP 2015142923A JP 2015142923 A JP2015142923 A JP 2015142923A JP 2016025355 A JP2016025355 A JP 2016025355A
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electrode plate
test
dielectric
upper electrode
lower electrode
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其 勇 柯
Jiyong Ke
其 勇 柯
嘉 哲 許
Chia-Che Hsu
嘉 哲 許
印 高
Yin Gao
印 高
智 岡 陳
Zhi Gang Chen
智 岡 陳
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EverDisplay Optronics Shanghai Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide an electrostatic capacitance test structure and test method for monitoring the thickness of a dielectric.SOLUTION: A test structure includes an upper polar plate including a protrusion for connection with a first test pad, and a lower polar plate including a protrusion for connection with a second test pad, a monitored dielectric film is arranged between the upper polar plate and lower polar plate, which are arranged so that the protrusion of a polar plate does not overlap any part of other polar plate. By the electrostatic capacitance test structure and test method for monitoring the thickness of a dielectric, an ideal electrostatic capacitance can be obtained, and the thickness of a dielectric can be monitored precisely.SELECTED DRAWING: Figure 2

Description

本発明は、静電容量テストの技術分野に関し、具体的には誘電体の膜厚をモニタリングすることに用いられる静電容量テスト構造及び静電容量テスト方法に関する。   The present invention relates to a technical field of a capacitance test, and more particularly to a capacitance test structure and a capacitance test method used for monitoring a film thickness of a dielectric.

ディスプレイの製造過程において、各工程の処理結果が受け入れられるか否か、又は好ましいか否かを確認するために、素子又は構造の厚さ、抵抗、密集度、汚染度、臨界寸法及び電気特性等を測定すべきである。このような測定過程において、素子の破損を避けるために、パネルの所定部分にテストエレメントグループ(TEG)と称されるパターンを形成し、実際に実施される処理条件と同じ条件で処理した後、TEGパターンを測定することにより相応の処理又は素子の特徴を評価する。   In the manufacturing process of the display, the thickness, resistance, density, contamination degree, critical dimension, electrical characteristics, etc. of the element or structure are checked in order to confirm whether the processing results of each process are acceptable or preferable. Should be measured. In such a measurement process, in order to avoid damage to the element, a pattern called a test element group (TEG) is formed on a predetermined part of the panel, and after processing under the same conditions as the actual processing conditions, The corresponding process or device characteristics are evaluated by measuring the TEG pattern.

ディスプレイの製造過程において、例えば、窒化ケイ素膜、シリカ膜、フォトレジスト膜等の複数回の成膜過程を行う必要があり、膜厚の適当さはディスプレイの最終性能に極めて重要な影響を及ぼす。従って、膜厚のモニタリングは非常に重要なことである。膜厚のモニタリングは、通常静電容量のテスト方法を採用し、即ち、静電容量構造を形成して、測定しようとする膜を誘電体膜として上極板と下極板との間に形成し、且つ、誘電体膜の誘電率を一定として、静電容量を測定することで膜厚の寸法を反映している。即ち、静電容量が小さいと、誘電体膜は比較的に厚く、静電容量が大きいと、誘電体膜は比較的に薄くなっている。該テスト過程において、静電容量の構造はテスト結果の正確さに直接影響を与え、ひいては膜厚のモニタリングに影響を及ぼす。   In the display manufacturing process, it is necessary to perform a plurality of film forming processes such as a silicon nitride film, a silica film, and a photoresist film, and the appropriateness of the film thickness has a very important influence on the final performance of the display. Therefore, film thickness monitoring is very important. Film thickness monitoring usually uses a capacitance test method, that is, a capacitance structure is formed, and the film to be measured is formed as a dielectric film between the upper and lower electrode plates. In addition, the thickness of the dielectric film is reflected by measuring the capacitance while keeping the dielectric constant of the dielectric film constant. That is, when the capacitance is small, the dielectric film is relatively thick, and when the capacitance is large, the dielectric film is relatively thin. In the test process, the capacitance structure has a direct effect on the accuracy of the test results and thus the film thickness monitoring.

図1は、従来の静電容量テスト構造を示す模式図であり、図1に示すように、上極板2と下極板1を重ねて配置し、モニタリング用の誘電体膜は上極板と下極板との重なり部3に形成されている。例え、面積がa×aである誘電体膜を測定しょうとする場合、重なり部3の面積をa×aとする。テスト信号を入力するために、上極板2は第1テストパッド4と接続する突出部2-1を含み、下極板1も第2テストパッドと接続する突出部1-1を含む。上極板2の突出部2-1と下極板1の同士に面積がx×yである重なり部が存在するので、実際に測定した静電容量はC=ε×(a×a+x×y)/dになり、ε×x×y/dに相当する静電容量値が余って、テスト結果に影響を及ぼし、ひいては誘電体膜厚のモニタリングにも影響を及ぼす。   FIG. 1 is a schematic diagram showing a conventional capacitance test structure. As shown in FIG. 1, an upper electrode plate 2 and a lower electrode plate 1 are arranged so as to overlap each other, and a dielectric film for monitoring is an upper electrode plate. And the lower electrode plate. For example, when measuring a dielectric film having an area of a × a, the area of the overlapping portion 3 is set to a × a. In order to input a test signal, the upper electrode plate 2 includes a protrusion 2-1 connected to the first test pad 4, and the lower electrode plate 1 also includes a protrusion 1-1 connected to the second test pad. Since there is an overlapping portion with an area of x × y between the protruding portion 2-1 of the upper electrode plate 2 and the lower electrode plate 1, the actually measured capacitance is C = ε × (a × a + x Xy) / d, and an excess capacitance value corresponding to ε × x × y / d affects the test result, and thus also affects the monitoring of the dielectric film thickness.

従って、現在、誘電体の膜厚を正確にモニタリングできる静電容量テスト構造及び静電容量テスト方法が必要になっている。   Therefore, there is a need for a capacitance test structure and a capacitance test method that can accurately monitor the dielectric film thickness.

本発明は、理想的な静電容量値が得られ、誘電体の膜厚を精密にモニタリングできる誘電体の膜厚のモニタリング用静電容量テスト構造及び静電容量テスト方法を提供することを目的とする。   An object of the present invention is to provide a capacitance test structure and a capacitance test method for monitoring a dielectric film thickness, which can obtain an ideal capacitance value and can accurately monitor the dielectric film thickness. And

上記の目的を達成するために、本発明は以下のような構成を採用する。
誘電体の膜厚のモニタリング用静電容量テスト構造であって、第1テストパッドと接続する第1突出部を備える上極板と、第2テストパッドと接続する第2突出部を備える下極板とを含み、モニタリングしようとする誘電体膜は前記上極板と下極板との間に配置され、極板の突出部が他方の極板のいずれかの部分と重ならないように、前記上極板と前記下極板が配置されている。
In order to achieve the above object, the present invention adopts the following configuration.
A capacitance test structure for monitoring the thickness of a dielectric, wherein the upper electrode plate includes a first protrusion connected to the first test pad, and the lower electrode includes a second protrusion connected to the second test pad. A dielectric film to be monitored is disposed between the upper electrode plate and the lower electrode plate, and the protruding portion of the electrode plate does not overlap any part of the other electrode plate. An upper electrode plate and the lower electrode plate are arranged.

ここで、前記上極板と前記下極板はずらして重なるように配置されている。
ここで、前記モニタリングしようとする誘電体は、上極板と下極板との重なり部に配置されている。
Here, the upper electrode plate and the lower electrode plate are arranged so as to be shifted and overlapped.
Here, the dielectric to be monitored is disposed in an overlapping portion between the upper electrode plate and the lower electrode plate.

ここで、前記上極板と下極板の形状はいずれも矩形である。
ここで、前記誘電体の誘電率が一定である。
Here, the upper electrode plate and the lower electrode plate are both rectangular.
Here, the dielectric constant of the dielectric is constant.

本発明は、さらに、誘電体の膜厚をモニタリングする静電容量テスト方法を提供し、下極板の第2突出部が第1テストパッドと接続する下極板を提供し、前記下極板上にモニタリングしようとする誘電体膜を形成し、上極板の第1突出部が第2テストパッドと接続するように、前記誘電体膜上に上極板を配置し、極板の突出部が他方の極板のいずれかの部分と重ならないように、前記上極板と前記下極板を配置し、前記第1テストパッドと第2テストパッドに信号を入力して静電容量のテストを行って、誘電体の膜厚をモニタリングする。   The present invention further provides a capacitance test method for monitoring a film thickness of a dielectric, and provides a lower electrode plate in which a second protrusion of the lower electrode plate is connected to a first test pad. A dielectric film to be monitored is formed on the upper electrode plate, and the upper electrode plate is disposed on the dielectric film so that the first protrusion of the upper electrode plate is connected to the second test pad. The upper electrode plate and the lower electrode plate are arranged so that one of the other electrode plates does not overlap, and a signal is input to the first test pad and the second test pad to test the capacitance. To monitor the dielectric film thickness.

ここで、前記上極板と前記下極板をずらして重なるように配置する。
ここで、前記モニタリングしようとする誘電体を、上極板と下極板との重なり部に配置する。
Here, the upper electrode plate and the lower electrode plate are disposed so as to overlap each other.
Here, the dielectric to be monitored is disposed in an overlapping portion between the upper electrode plate and the lower electrode plate.

ここで、前記上極板と下極板の形状はいずれも矩形である。
ここで、前記誘電体膜の誘電率が一定である。
Here, the upper electrode plate and the lower electrode plate are both rectangular.
Here, the dielectric constant of the dielectric film is constant.

本発明に係る誘電体の膜厚のモニタリングテスト用静電容量構造及び静電容量テスト方法によって、理想的な静電容量値が得られ、さらに実際の工程に近い実際データが得られ、誘電体の膜厚を精密にモニタリングできる。   According to the capacitance structure for dielectric film thickness monitoring test and the capacitance test method according to the present invention, an ideal capacitance value can be obtained, and actual data close to an actual process can be obtained. The film thickness can be monitored accurately.

従来の静電容量テスト構造を示す模式図である。It is a schematic diagram which shows the conventional electrostatic capacitance test structure. 具体的な実施形態における静電容量テスト構造を示す模式図である。It is a schematic diagram which shows the electrostatic capacitance test structure in specific embodiment.

以下、添付の図面および具体的な実施例を参照して、本発明をさらに詳しく説明する。ここで記載された具体的な実施例は、本発明を説明するために用いられ、本発明に対する限定ではないことは自明なことである。また、記載の便宜のため、図面では本発明に関する部分のみを示し、全部の構造を示しなかった。   Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings and specific embodiments. It will be appreciated that the specific embodiments described herein are used to illustrate the present invention and are not a limitation on the present invention. Further, for convenience of description, only the part related to the present invention is shown in the drawings, and the entire structure is not shown.

本実施形態にかかる誘電体の膜厚のモニタリング用静電容量テスト構造の模式図は、図2に示されている。当該構造は、第1テストパッド401と接続する第1突出部201-1を備える上極板201と、第2テストパッド501と接続する第2突起部101-1を備える下極板101とを含み、極板の突出部が他方の極板のいずれかの部分と重ならないように、前記上極板と前記下極板とを配置する。   A schematic diagram of a capacitance test structure for monitoring the thickness of the dielectric according to the present embodiment is shown in FIG. The structure includes an upper electrode plate 201 having a first protrusion 201-1 connected to the first test pad 401 and a lower electrode plate 101 having a second protrusion 101-1 connected to the second test pad 501. The upper electrode plate and the lower electrode plate are arranged so that the protruding portion of the electrode plate does not overlap any part of the other electrode plate.

図2から分かるように、上極板と下極板とは重なって配置されており、重なり部の長さ及び幅のいずれもaであり、これは仮定したものであり、実際にはテストの必要に応じて重なり部の長さ及び幅を自由に設定することができる。例え、面積がa×bである誘電体膜の静電容量を測定する必要がある場合、極板の重なり部の長さをaに設定し、幅をbに設定することができる。同時に、上極板と下極板との形状を自由に設定することができ、工程の便利性及び空間(位置)を節約する面から考慮して、通常、上極板と下極板を矩形の形状に設定することが好ましい。   As can be seen from FIG. 2, the upper electrode plate and the lower electrode plate are arranged so as to overlap each other, and both the length and width of the overlapping portion are a, which is assumed, and actually the test The length and width of the overlapping portion can be freely set as required. For example, when it is necessary to measure the capacitance of a dielectric film having an area of a × b, the length of the overlapping portion of the electrode plates can be set to a and the width can be set to b. At the same time, the shape of the upper and lower plates can be set freely, and considering the convenience of the process and the space (position) saving, the upper and lower plates are usually rectangular. It is preferable to set to the shape.

テストを行う場合、モニタリングしようとする誘電体膜を上極板と下極板との重なり部のみに配置する。第1テストパッド401と第2テストパッド501からテスト信号を入力する場合、測定し得た静電容量値はC=ε×a×a/dであり、ここでεは誘電率を示し、a×aは静電容量構造の面積を示す。当該面積はテストに必要な理想の面積と一致し、dは二つの極板の間の距離であり、即ち、モニタリングしようとする誘電体の膜厚である。モニタリングしようとする誘電体膜の誘電率が一定で変化しないため、測定された静電容量値によって誘電体の膜厚を反映し、誘電体膜の膜厚をモニタリングする目的を達することができる。また、上記のテスト面積は必要な理想の面積と一致するため、実際の工程に近いデータが得られ、誘電体の膜厚を精密にモニタリングできる。   When performing the test, the dielectric film to be monitored is disposed only on the overlapping portion of the upper electrode plate and the lower electrode plate. When a test signal is input from the first test pad 401 and the second test pad 501, the measured capacitance value is C = ε × a × a / d, where ε indicates a dielectric constant, and a Xa indicates the area of the capacitance structure. The area corresponds to the ideal area required for the test, and d is the distance between the two plates, that is, the thickness of the dielectric to be monitored. Since the dielectric constant of the dielectric film to be monitored is constant and does not change, the purpose of monitoring the thickness of the dielectric film can be achieved by reflecting the film thickness of the dielectric according to the measured capacitance value. In addition, since the above test area matches the required ideal area, data close to the actual process can be obtained, and the film thickness of the dielectric can be accurately monitored.

上記の内容から分かるように、極板の突出部が他方の極板のいずれかの部分と重なっていないため、重なり部の面積をテストを必要とする膜厚の面積に設定でき、これにより、必要な静電容量を完全に正確に測定することができる。ひいては、誤差が発生しないように誘電体の膜厚を精密にモニタリングすることができる。   As can be seen from the above, since the protruding part of the electrode plate does not overlap with any part of the other electrode plate, the area of the overlapping part can be set to the area of the film thickness that needs to be tested, The required capacitance can be measured completely accurately. As a result, the film thickness of the dielectric can be accurately monitored so that no error occurs.

本実施形態では、更に誘電体の膜厚をモニタリングする静電容量テスト方法を提供し、方法当該は、下極板の第2突出部101-1が第2テストパッド501と接続する下極板101を提供し、前記下極板上にモニタリングしようとする誘電体膜を形成し、上極板の突出部201-1が第1テストパッド401と接続するように前記誘電体膜上に上極板201を配置し、極板の突出部が他方の極板のいずれかの部分と重ならないように、前記上極板と前記下極板を配置し、前記第1テストパッド及び第2テストパッドに信号を入力して静電容量のテストを行って、誘電体の膜厚をモニタリングすることを含む。   In the present embodiment, a capacitance test method for further monitoring the dielectric film thickness is provided. The method relates to a lower electrode plate in which the second protrusion 101-1 of the lower electrode plate is connected to the second test pad 501. 101 is formed, a dielectric film to be monitored is formed on the lower electrode plate, and an upper electrode is formed on the dielectric film so that the protruding portion 201-1 of the upper electrode plate is connected to the first test pad 401. The plate 201 is arranged, the upper electrode plate and the lower electrode plate are arranged so that the protruding portion of the electrode plate does not overlap any part of the other electrode plate, and the first test pad and the second test pad And performing a capacitance test to monitor the dielectric film thickness.

以上の内容は、本発明の好ましい実施例及び運用した技術原理のみに過ぎない。当業者にとって、本発明はここに記載の特定の実施例により限定されるものではなく、本発明の保護範囲を逸脱しない範囲内で、さまざまな変更、新たな調整及び代替を行うことは、自明なことである。従って、以上の実施例では本発明について詳細に説明したが、本発明は以上の実施例のみに限定するのではなく、本発明の要旨を逸脱しない範囲内に、他の均等な実施例もさらに含まれ、本発明の範囲は添付の請求の範囲によって限定される。   The above description is only a preferred embodiment of the present invention and the technical principle used. It will be apparent to those skilled in the art that the present invention is not limited to the specific embodiments described herein, and that various modifications, new adjustments, and alternatives can be made without departing from the protection scope of the present invention. It is a thing. Therefore, although the present invention has been described in detail in the above embodiments, the present invention is not limited to only the above embodiments, and other equivalent embodiments are further within the scope of the present invention. Inclusive, the scope of the present invention is limited by the appended claims.

1 下極板
1−1 下極板の突出部
2 上極板
2−1 上極板の突出部
3 上極板と下極板との重なり部
4 第1テストパッド
5 第2テストパッド
101 下極板
101−1 下極板の突出部
201 上極板
201−1 上極板の突出部
301 上極板と下極板との重なり部
401 第1テストパッド
501 第2テストパッド。
DESCRIPTION OF SYMBOLS 1 Lower electrode plate 1-1 Lower electrode plate protrusion 2 Upper electrode plate 2-1 Upper electrode plate protrusion 3 Upper electrode plate and lower electrode plate overlap 4 First test pad 5 Second test pad 101 Below Electrode plate 101-1 Lower electrode plate protrusion 201 Upper electrode plate 201-1 Upper electrode plate protrusion 301 Overlapping portion 401 of upper electrode plate and lower electrode plate First test pad 501 Second test pad.

Claims (2)

静電容量テスト構造であって、誘電体の膜厚のモニタリングに用いられ、
前記静電容量テスト構造は、
第1突出部を備える上極板と、
前記上極板とずらして重なって配置され、且つ第2突出部を備える下極板と、
前記上極板の前記第1突出部と接続する第1テストパッドと、
前記下極板の前記第2突出部と接続する第2テストパッドと、
を含み、
前記第1テストパッド及び前記第2テストパッドの何れか一方が、テスト信号を入力することに用いられ、他方がテスト信号を出力することに用いられ、
前記上極板の前記第1突出部又は前記下極板の前記第2突出部が、他方の極板のいずれかの部分と重ならないように、前記上極板及び前記下極板が配置され、
モニタリングしようとする前記誘電体膜が、前記上極板と前記下極板との重なり部に配置され、
前記誘電体膜の誘電率が一定である、ことを特徴とする静電容量テスト構造。
Capacitance test structure, used to monitor dielectric film thickness,
The capacitance test structure is:
An upper electrode plate having a first protrusion;
A lower electrode plate which is arranged to be shifted and overlapped with the upper electrode plate, and which has a second protrusion,
A first test pad connected to the first protrusion of the upper electrode plate;
A second test pad connected to the second protrusion of the lower electrode plate;
Including
Either one of the first test pad and the second test pad is used to input a test signal, and the other is used to output a test signal.
The upper electrode plate and the lower electrode plate are arranged so that the first protrusion of the upper electrode plate or the second protrusion of the lower electrode plate does not overlap any part of the other electrode plate. ,
The dielectric film to be monitored is disposed in an overlapping portion between the upper electrode plate and the lower electrode plate,
A capacitance test structure, wherein a dielectric constant of the dielectric film is constant.
静電容量テスト方法であって、誘電体の膜厚のモニタリングに用いられ、
前記静電容量テスト方法は、
第2突出部分を備える下極板を提供し、
前記下極板上に誘電体膜を形成し、
第1突出部を備える上極板を提供し、前記上極板と前記下極板とがずらして重なるように配置され、前記上極板が前記誘電体膜上に配置され、
前記上極板の第1突出部と接続する第1テストパッドを提供し、
前記下極板の第2突出部と接続する第2テストパッドを提供し、
前記上極板又は前記下極板の突出部が他方の極板のいずれかの部分と重ならないように、前記上極板及び前記下極板を配置し、
前記第1テストパッド及び第2テストパッドの何れか一方から信号を入力し、他方から信号を出力して、前記誘電体膜の静電容量のテストを行って、前記誘電体の膜厚をモニタリングすることを含み、
前記誘電体膜の誘電率が一定である、ことを特徴とする静電容量テスト方法。
Capacitance test method used to monitor dielectric film thickness,
The capacitance test method includes:
Providing a lower electrode plate having a second protruding portion;
Forming a dielectric film on the lower electrode plate;
An upper electrode plate having a first protrusion is provided, and the upper electrode plate and the lower electrode plate are disposed so as to overlap each other, and the upper electrode plate is disposed on the dielectric film,
Providing a first test pad connected to the first protrusion of the upper electrode plate;
Providing a second test pad connected to the second protrusion of the lower electrode plate;
The upper electrode plate and the lower electrode plate are arranged so that the protruding portion of the upper electrode plate or the lower electrode plate does not overlap with any part of the other electrode plate,
A signal is input from one of the first test pad and the second test pad, a signal is output from the other, the capacitance of the dielectric film is tested, and the film thickness of the dielectric is monitored Including
A capacitance test method, wherein a dielectric constant of the dielectric film is constant.
JP2015142923A 2014-07-18 2015-07-17 Electrostatic capacitance test structure and electrostatic capacitance test method for monitoring thickness of dielectric Pending JP2016025355A (en)

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