JP2008026271A - Method and apparatus for detecting short circuiting - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the possibility and time efficiency for detecting a short-circuited position between bus wires bundled on both sides of two systems. <P>SOLUTION: A short circuit detector, for detecting the short-circuited position between the bus wires bundled on first and second sides formed adjacent on an insulating substrate, has: short-circuit determining means (a resistance-measuring device 8, a data processor 9, and a controller 10) for determining whether there is a short circuit, by measuring the resistance value between arbitrary points of bundled wires of the bus wires bundled on the first and second sides; resistance value measuring means (probe units 3 and 4, and the resistance measuring device 8) for measuring the resistance value between the adjacent bundled wires at the respective opposite ends of the bus wires, bundled on both the first and the second sides and the resistance value between the adjacent bundled wires at the other end, when the short circuit determining means detect that there is a short circuit; and a resistance value comparison means (data processor 9) for comparing the resistance values. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to, for example, a short detection method and a short detection device for detecting a short portion between bus lines bundled on both sides of two systems formed adjacent to each other on a TFT (thin film transistor) substrate of an organic EL display.

  In general, in a flat panel display such as an organic EL display, a TFT substrate in which a glass substrate is mainly used as an insulating substrate and a semiconductor element or the like called TFT is formed in a drive circuit is used.

  This TFT substrate is manufactured by forming a TFT circuit and a wiring pattern from a wiring material or a semiconductor material formed by a technique such as sputtering or CVD using a semiconductor process called photolithography.

  In general, on a TFT substrate of an organic EL display, as shown in FIGS. 2A and 2B, a plurality of, for example, two systems of bus wirings 12, 13 bundled on both sides to supply a power source current or a reference voltage to each pixel circuit 11. Is formed.

  2A and 2B, for example, reference numeral 12 denotes a bus wiring bundled on both sides for power supply, and reference numeral 13 denotes a grounding both side formed adjacent to the bus wiring 12 bundled on both sides for power supply. The bus wiring bundled with is shown. The power supply bus line 12 and the ground bus line 13 are respectively connected to a plurality of pixel circuits 11 arranged in a matrix as shown in FIG. 2B.

  When forming the bus wirings 12 and 13 bundled on both sides of the two systems on the TFT substrate, foreign matter such as dust may be caused, causing a disconnection or a short circuit, and may not function as a TFT circuit. In an organic EL display in which a TFT substrate having a plurality of systems, for example, two systems of bus wiring bundled on both sides is incorporated, if there is a short circuit between the two systems of bus wirings 12 and 13, a full display error occurs. To do.

  This is a serious abnormal mode, and it is necessary to detect and repair a short-circuit between the two systems of bus wirings 12 and 13.

  Therefore, in the conventional mass production process of the TFT substrate, as shown in FIG. 2 formed adjacent to the TFT substrate, a short point between the bus wirings 12 and 13 bundled on both sides of the two systems is detected. The short-circuited portion was detected using an electrical inspection device or an optical inspection device.

Conventionally, there is a technique disclosed in Patent Document 1 for detecting a short-circuit portion between bus wirings. The one disclosed in Patent Document 1 is to determine whether a circuit pattern is short or open based on a difference between a resistance value detected by two pairs of contact means (needle) and an average resistance value. In the device disclosed in No. 1, no consideration is given to the detection of a short-circuited portion between bus wires bundled on both sides of two systems.
Japanese Patent Laid-Open No. 11-352173

  However, when the electrical inspection device detects a short-circuit portion between the bus wires 12 and 13 bundled on both sides of the two systems, the bus wire 12 can be used as long as the device has a short-circuit inspection function between the wires. And 13 can be detected, but there is a disadvantage that the position information of the short part cannot be obtained.

  In addition, when the optical inspection apparatus detects the short-circuited portion between the bus wirings 12 and 13 bundled on both sides of the two systems, it can obtain the positional information of the short-circuited portion, but the detection capability is limited. (Minimum detection size is usually 2 to 3 μm), there is a possibility of missing. Although this limitation can be relaxed by increasing the observation magnification, there is an inconvenience that the inspection time becomes longer because the observation area per time becomes smaller.

  Further, as shown in FIG. 2B, a wiring intersection occurs because the two lines of bus wirings 12 and 13 are pulled into the pixel circuit 11, and this intersection is insulated, but a short circuit occurs at this intersection. In such a case, there is a disadvantage that the detection probability is greatly reduced due to the characteristic that the short portion is difficult to appear as an image.

  In view of such a point, an object of the present invention is to detect a short portion between bus wires bundled on both sides of two systems with high probability and to increase the efficiency of detection time.

  The short detection method according to the present invention is a short detection method for detecting a short-circuit portion between bus wires bundled on both sides of a first and a second formed adjacently on an insulating substrate. When the resistance value between arbitrary points of the bundle wiring portion of the bus wiring bundled on both sides of the bus line is measured to determine the presence or absence of the short-circuited portion, and when it is determined that the short-circuited portion is present, the first and second Measure the resistance value between adjacent bundled wiring parts on one end side of each bus wire bundled on both sides and the resistance value between adjacent bundled wiring parts on the other end side, and compare this resistance value. In this case, it is determined that there is a short-circuited portion on the low resistance side.

  The short detection device of the present invention is a short detection device for detecting a short-circuit portion between bus wirings that are bundled on both sides of the first and second sides formed adjacent to each other on an insulating substrate. A short / presence detection means that detects the presence / absence of a short-circuit by measuring the resistance value between arbitrary points of the bus wiring bundled on both sides of the bus, and this short / non-presence detection means detects the presence of a short-circuit. Sometimes, the resistance value between adjacent bundled wiring portions on one end side of the bus wires bundled on both sides of the first and second sides and the resistance value between adjacent bundled wiring portions on the other end side thereof Resistance value measuring means for measuring the resistance value, and resistance value comparing means for comparing the resistance values.

  According to the present invention, since the short portion is detected using the resistance value measurement data, the detection probability of the short portion can be increased.

  In addition, according to the present invention, since the number of measurement points for the resistance value is reduced, it is possible to improve the time efficiency of detection of the short point.

  Hereinafter, an example of the best mode for carrying out the short detection method and the short detection device of the present invention will be described with reference to the drawings.

  FIG. 1 shows an outline of a short detection device according to this example. Referring to FIG. 1, in FIG. 1, reference numeral 2 denotes an XY stage on which a substrate 1 to be inspected is placed and which can be arbitrarily moved in the X-axis direction and the Y-axis direction. Probe units 3 and 4 are provided on one side and the other side of the XY stage 2, respectively.

  The probe units 3 and 4 have two probes 3a, 3b, 4a and 4b, respectively, and measure the resistance value during contact between the tips of the two probes 3a, 4a and 3b and 4b. Yes. The probe units 3 and 4 have a movement function in the Z-axis direction. By the movement function in the Z-axis direction, the probes 3a, 3b and 4a, 4b of the probe units 3 and 4 with respect to the substrate 1 to be inspected Realize contact and evacuation.

  The contact position of the substrate 1 to be inspected and the contacts of the probes 3a, 3b and 4a, 4b of the probe units 3 and 4 are aligned on the plane, and the XY stage 2 is controlled by a control signal from the XY stage controller 5. Then, the contact portion of the substrate 1 to be inspected is moved directly below the probes 3a, 3b and 4a, 4b of the probe units 3 and 4, and the probe units 3 and 4 are moved in the Z-axis direction by a control signal from the probe unit controller 6 Go to and do.

  In this case, the probe units 3 and 4 are flying probes that can be moved to arbitrary positions, and the tips of the probes 3a, 3b, 4a, and 4b of the probe units 3 and 4 are moved to the contact locations of the substrate 1 to be inspected. May be.

  After the tips of the probes 3a, 3b and 4a, 4b of the probe units 3 and 4 are brought into contact with predetermined contact portions of the substrate 1 to be inspected, the output signals from the probe units 3 and 4 are selected by the signal switch 7. Is supplied to the resistance measuring instrument 8, and the resistance value between the probes 3a and 3b or between the probes 4a and 4b is measured.

  The resistance value data obtained by the resistance measuring device 8 is supplied to a data processing device 9 that performs data processing such as comparison of resistance values.

  In this case, the XY stage control device 5, the probe unit control device 6, the signal switch 7 and the data processing device 9 are supplied with a command signal from a controller 10 comprising a microcomputer or the like, and operate according to this command. Has been made. In addition, the controller 10 issues a command according to the data processing result of the data processing device 9.

  A substrate 1 to be inspected according to this example is a TFT substrate of an organic EL display, for example, and as shown in FIGS. 2A and 2B, a bus wiring 12 bundled on both sides for power supply formed on an insulating substrate such as a glass substrate. The bus wiring 13 bundled on both sides for grounding is formed adjacently.

  The power supply bus line 12 and the ground bus line 13 are respectively connected to a plurality of pixel circuits 11 arranged in a matrix as shown in FIG. 2B. The crossing portion of the power supply bus wiring 12 and the ground bus wiring 13 is insulated by the cross wiring using different wiring layers in the actual substrate 1 to be inspected. The TFT substrate as the substrate 1 to be inspected is also manufactured by the same process as before.

  FIG. 3 shows an enlarged view of one end side (the same applies to the other end side) of a part of the bus wirings 12 and 13 bundled on both sides of the two systems of the substrate 1 to be inspected. In FIG. 3, 12 a (12 b) represents a bundle wiring portion on one end side (the other end side) of the bus wiring 12, and 13 a (13 b) represents a bundle wiring portion on one end side (the other end side) of the bus wiring 13. Reference numerals 12c and 13c correspond to the wirings (lines) of the bus wirings 12 and 13, respectively, and indicate probing pads provided in the bundled wiring portions 12a (12b) and 13a (13b). The probe unit 3 (4) As shown in FIG. 3, the two probes 3a (4a) and 3b (4b) are adjacent to the bundle wiring portions 12a (12b) and 13a (13b) of the bus wirings 12 and 13 bundled on both sides ( Line) probing pads 12c and 13c.

  FIG. 4 shows another example of the probing pads 12c and 13c of the bus wirings 12 and 13 bundled on both sides. This example in FIG. 4 corresponds to the respective wiring (lines) of the bus wirings 12 and 13, and the probing pads 12c and 13c are provided from the bundled wiring portions 12a (12b) and 13a (13b) through the lead wires. It is a thing. In this case, the resistance values of all the lead lines of the lead lines are made the same.

  FIG. 5 shows the adjacent probe wirings 12a, 12b and 13a, 13b adjacent to the bus wirings 12 and 13 in which the probes 3a, 3b and 4a, 4b of the probe units 3 and 4 are bundled on both sides of the substrate 1 to be inspected. An example of contacting the location to be performed is shown. When the probes 3a and 3b of the probe unit 3 are in contact with the adjacent portion A of the bundled wiring portions 12a and 13a on one end side of the bus wires 12 and 13 bundled on both sides of the two systems, the probe unit 4 The probes 4a and 4b are contacted to adjacent portions A 'of the bundled wiring portions 12b and 13b on the other end side of the bus wires 12 and 13 bundled on both sides of the two systems corresponding thereto.

  Similarly, when the probes 3a and 3b of the probe unit 3 are in contact with the adjacent portions B of the bundled wiring portions 12a and 13a on one end side of the bus wires 12 and 13 bundled on both sides of the two systems, The probes 4a and 4b of the unit 4 are brought into contact with adjacent portions B ′ of the bundled wiring portions 12b and 13b on the other end side of the bus wires 12 and 13 bundled on both sides of the two systems corresponding thereto. Similarly, when the probes 3a and 3b of the probe unit 3 are in contact with the adjacent portion C of the bundled wiring portions 12a and 13a on one end side of the bus wires 12 and 13 bundled on both sides of the two systems, The bundle wiring section 1 on the other end side of the bus wirings 12 and 13 in which the probes 4a and 4b of the unit 4 are bundled on both sides of the two systems corresponding thereto. So as to contact the adjacent points C'portions b and 13b.

  As shown in FIG. 5, contacts to the bundled wiring portions 12a, 12b and 13a, 13b of the bus wires 12 and 13 bundled on both sides of the probes 3a, 3b and 4a, 4b of the probe units 3 and 4 will be described later. This is used when determining whether the short-circuited portion is one end side or the other end side of the bus wires 12 and 13 bundled on both sides.

  FIG. 6 shows one end side of the bus wirings 12 and 13 in which the probes 3a, 3b, 4a and 4b of the probe units 3 and 4 are bundled on both sides of the substrate 1 to be inspected (the same applies to the other end side). An example of contacting the bundled wiring portions 12a and 13a (12b and 13b) will be described.

  In this case, when contacting the bundle wiring portions 12a and 13a on one end side of the bus wires 12 and 13 bundled on both sides, for example, the probe unit 3 is used, and the probes 3a and 3b are as shown in FIG. When contacting the bundled wiring portions 12a and 13a on one end side adjacent to each other and contacting the bundled wiring portions 12b and 13b on the other end side of the bus wires 12 and 13 bundled on both sides, for example, the probe unit 4 is used. The probes 4a and 4b are brought into contact with the adjacent bundled wiring portions 12b and 13b.

  The contact of the bus wirings 12 and 13 bundled on both sides with the bundled wiring portions 12a and 13a (12b and 13b) on one end side (the same applies to the other end side) Used for line detection at short-circuit points.

  With reference to the flowchart shown in FIG. 7, a procedure for detecting a short portion of the substrate 1 to be inspected by the short detection device of the above example will be described.

  When detection is started, first, in order to determine whether or not there is a short-circuit between the bus lines 12 and 13 bundled on both sides of the two systems, each of the bus lines 12 and 13 bundled on both sides of the two systems is determined. The probes 3a (or 4a) and 3b (or 4b) of the probe unit 3 (or 4) are contacted to arbitrary points of the bundled wiring sections 12a, 12b and 13a, 13b (step S1), and this is switched by the signal switch 7. The resistance value is measured by the resistance measuring instrument 8 (step S2).

  Next, the data processor 9 determines whether or not the measured resistance value is smaller than a specified abnormal resistance value (step S3). The non-defective inspected substrate 1 having no short-circuited portion between the bus wirings 12 and 13 bundled on both sides of the circuit is completed, and this short-circuit detection is terminated.

  When this resistance value is smaller than the specified abnormal resistance value, as will be described later, on which side of the plane where the inspected substrate 1 is defined as being divided into two at one end side and the other end side, as shown below The short part side detection for detecting is performed (step S4).

  Next, as will be described later, the side where the short portion is present is divided into a predetermined number of areas, and the resistance value of each division point is measured to detect the short portion area (step S5). ).

  Next, as will be described later, in this short location area, short location line detection is performed for which wiring (line) the short location is between (step S6), the short location is specified, and this detection is finished. To do.

  Depending on the request for detection of the short portion, the detection may be terminated upon completion of the short portion side detection (step S4) or the short portion area detection (step S5).

  Here, the short part side detection (step S4) will be described in detail. As shown in FIG. 8, the plane division definition of the substrate 1 to be inspected in the short part side detection includes bus wirings 12 bundled on both sides of two systems. 13 is a reference for defining the surface division of the substrate 1 to be inspected with intermediate lines (lines S1− = S2) of the bundled wiring portions 12a, 12b and 13a, 13b on one end side and the other end side facing each other. To do.

  The detection procedure for the short part side detection is shown in the flowchart of FIG. In this case, as shown in FIG. 5, adjacent portions of the bundled wiring portions 12a and 13a on one end side of the bus wires 12 and 13 where the probes 3a and 3b of the probe unit 3 are bundled on both sides of the two systems, for example, the A portion. And adjacent portions of the bundled wiring portions 12b and 13b on the other end side of the bus wires 12 and 13 bundled on both sides of the two systems corresponding to the probes 4a and 4b of the probe unit 4, for example, A ' Contact the department.

  When the short side detection is started, first, the probe 3a and the probe 3a of the probe unit 3 are placed in the adjacent portions of the bundle wiring portions 12a and 13a on one end side of the bus wirings 12 and 13 bundled on both sides of the two systems. 3b is contacted (step S10), and the resistance value between the adjacent bundled wiring portions 12a and 13a on one end side is measured (step S11).

  Next, the probes 4a and 4b of the probe unit 4 are contacted to adjacent portions of the bundled wiring portions 12b and 13b on the other end side of the bus wires 12 and 13 bundled on both sides of the two systems (step S12). The resistance value between the adjacent bundled wiring portions 12b and 13b on the other end side is measured (step S13).

  The resistance value between the adjacent bundled wiring portions 12a and 13a on one end side is compared with the resistance value between the adjacent bundled wiring portions 12b and 13b on the other end side opposite to each other, and the smaller resistance value is short-circuited. The side where the location exists is determined (step S14), and the short location side detection is terminated.

The basis for this short part side detection will be described below.
FIG. 10 shows an example of the substrate 1 to be inspected in which a short portion exists between the two systems of bus wirings 12 and 13.

  With respect to the substrate 1 to be inspected, the measurement locations on the bundled wiring portions 12a and 13a on one end side of the bus wires 12 and 13 bundled on both sides where the short portion exists, and the bundled wiring portions 12b and 13b on the other end side opposite thereto. FIG. 11 shows the wiring in the panel expressed as a resistance using the above measurement location as a node (see FIG. 10). In the resistance notation shown in FIG. 11, the two bus wirings 12 and 13 are developed and described on a plane. Further, Pk and Pk ′ in FIG. 10 indicate measurement locations on the bundle wiring portions 12a and 13a, and Pu and Pu ′ indicate measurement locations on the bundle wiring portions 12b and 13b facing the Pk and Pk ′.

  In FIG. 11, Rs is the resistance value of the short portion, Rb1 is the resistance value between the bundled wiring portions 12a and 13a where the short portion exists, Rb2 is the resistance value between the bundled wiring portions 12b and 13b where the short portion is present, and Rc is Resistance values Rx and Ry between adjacent bus lines of the wiring portions 12a, 12b, 13a, and 13b that bundle the bus lines are resistance values of bus lines that are not short-circuited (treated as block resistances).

The circuit of FIG. 11 is further developed to obtain FIG. In comparing the resistance value between Pk-Pk ′ and the resistance value between Pu-Pu ′, block 1 and block 2 are the same circuit, and block 3 connects block 1 and block 2; therefore, between Pk and Pz It is possible to replace the resistance value comparison between the resistance value between Pu and Pz with the resistance value between Pk and Pk ′ and the resistance value between Pu and Pu ′. In FIG.
Rz = (Rx + 2 × Rc) × (Ry + 2 × Rc) / (Rx + Ry + 4 × Rc)
It is.

Resistance value between Pk and Pz Rkz:
Rkz = (Rb1 × Rb2 + Rb1 × Rz) / (Rb1 + Rb2 + Rz)
Resistance value between Pu and Pz Ruz:
Ruz = (Rb1 × Rb2 + Rb2 × Rz) / (Rb1 + Rb2 + Rz)
In the comparison between Rkz and Ruz, since the denominator term is common, the magnitudes of the numerator terms Rkz1 and Ruz1 are compared.
Rkz1 = Rb1 × Rb2 + Rb1 × Rz
Ruz1 = Rb1 × Rb2 + Rb2 × Rz

  When the short-circuit portion exists on one end side of the two bus wirings 12 and 13, since Rb1 <Rb2, Rkz1 <Ruz1 is obtained, and as a result, Rkz <Ruz is derived, and thus the resistance value between Pk and Pk ′ is Regarding the comparison of the resistance value between Pu and Pu ′, it is derived that the resistance value between Pk and Pk ′ is smaller. Similarly, when there is a short-circuited portion on the other end side of the two systems of bus wirings 12 and 13, the resistance value between Pk and Pk ′ and the resistance value between Pu and Pu ′ are compared in the same manner as described above. , Pu-Pu ′ is derived to have a smaller resistance value.

  Next, the measurement location on the bundle wiring portions 12a and 13a on one end side of the bus line adjacent to the bus line where the short location exists and the measurement location on the bundle wiring portions 12b and 13b on the other end side as the nodes are defined as nodes. FIGS. 13A and 13B show resistance notation of the two bus wirings 12 and 13 and the wiring in the panel. In FIG. 13, Pj and Pj ′ indicate measurement points on the bundle wiring portions 12a and 13a on one end side, and Pv and Pv ′ indicate measurement points on the bundle wiring portions 12b and 13b on the other end side facing Pj and Pj ′. . In FIG. 13B, Rx ′ is a resistance value (handled as a block resistance) of the bus line where no short-circuit portion exists.

  The circuit of FIG. 13B is further developed to obtain FIG. In comparing the resistance value between Pj-Pj ′ and the resistance value between Pv-Pv ′, block 1 and block 2 are the same circuit, and block 3 connects block 1 and block 2; therefore, between Pj and Pz The resistance value comparison between Pv and Pv can be replaced with the resistance value comparison between Pj and Pj ′ and the resistance value between Pv and Pv ′.

In FIG.
Rd1 = Rb1 × (Ry + 2 × Rc) / (Rb1 + Rb2 + Ry + 2 × Rc)
Rd2 = Rb2 × (Ry + 2 × Rc) / (Rb1 + Rb2 + Ry + 2 × Rc)
Rd3 = Rb1 × Rb2 / (Rb1 + Rb2 + Ry + 2 × Rc)
Rs ′ = Rs + 2 × Rd3
It is.

Resistance value between Pj and Pz Rjz:
Rjz = (Rd1 + Rc) × (Rx ′ + Rc + Rd2)
/ (Rx ′ + Rd1 + Rd2 + 2Rc)
Resistance value between Pv and Pz Rvz:
Rvz = (Rd2 + Rc) × (Rx ′ + Rc + Rd1)
/ (Rx ′ + Rd1 + Rd2 + 2Rc)
In the comparison between Rjz and Rvz, the denominator term is common, and therefore the large and small numerator terms Rjz1 and Rvz1 are compared.

Rjz1 = (Rd1 + Rc) × (Rx ′ + Rc + Rd2)
Rvz1 = (Rd2 + Rc) × (Rx ′ + Rc + Rd1)
Rjz1 and Rvz1 are obtained by subtracting the common factor (Rd1 × Rc + Rd2 × Rc + Rd1 × Rd2 + Rc × Rx ′ + Rc × Rc) from Rjz1 and Rvz1.

Rjz2 = Rd1 × Rx ′
Rvz2 = Rd2 × Rx ′
When the short-circuit portion exists on one end side of the two bus wirings 12 and 13, Rd1 <Rd2 is obtained from the expressions of Rd1 and Rd2, and as a result, Rjz2 <Rvz2 and Rjz <Rvz are derived, and thus Pj−Pj Regarding the comparison between the resistance value between 'and the resistance value between Pv and Pv', it is derived that the resistance value between Pj and Pj 'is smaller. Similarly, when the short-circuit portion exists on the other end side of the two bus wirings 12 and 13, since Rd1> Rd2, the resistance value between Pj-Pj ′ and Pv-Pv ′ are similar to the above description. Regarding the comparison of the resistance values between the Pv and Pv ′, it is derived that the resistance value between Pv and Pv ′ is smaller.

Further, FIG. 15A and FIG. 15B show the two systems of bus wirings 12 and 13 and the wiring in the panel expressed as resistances, and FIG. 16 shows the development of FIG. In FIG. 15B, Rb is a resistance value of the bus line, and Rx ″ is a resistance value of the bus line having no short-circuit portion (handled as a block resistance). In FIG.
Re1 = Rb × (Rc + Rd1) / (Rb + Rd1 + Rd2 + 2 × Rc)
Re2 = Rb × (Rc + Rd2) / (Rb + Rd1 + Rd2 + 2 × Rc)
Re3 = (Rc + Rd1) × (Rc + Rd2) / (Rb + Rd1 + Rd2 + 2 × Rc)
It is.

  The circuit in FIG. 16 is similar to the circuit in FIG. 14, and the description regarding the circuit in FIG. 14 is applicable. In the description of the circuit of FIG. 14, the relationship between the magnitude relationship between Rd1 and Rd2 and the relationship between the positions of the short portions has already been described. Therefore, when the short portion exists on one end side of the two systems of bus wirings 12 and 13, As for the comparison between the resistance value between Pi and Pi ′ and the resistance value between Pw and Pw ′, it is derived that the resistance value between Pi and Pi ′ is smaller. Similarly, when it exists on the other end side of the two systems of bus wirings 12 and 13, it is derived that the resistance value between Pw and Pw 'is smaller.

  The resistance value comparison at other measurement points can also be explained by recursively explaining the above. With the above description, it is assumed that the side having the smaller resistance value of the two resistance values is determined as the side where the defect exists.

  Next, in order to describe in detail the short part area detection (step S5), FIG. 17 shows an example of the probe contact and the area division definition at this time. In the example of FIG. 17, the side of the short portion of the bus wirings 12 and 13 bundled on both sides is shown on the one end side (the same applies to the other end side). A predetermined number of areas divided on the bundled wiring portions 12a and 13a on the one end side, for example, in the example of FIG. 17, two lines of bus wirings 12 and 13 are provided in three consecutive measurement points out of five measurement points. The standard for area division definition. It should be noted that the predetermined number of measurement points on the bundled wiring portions 12a and 13a on the one end side need not be arranged at equal intervals.

  FIG. 18 is a flowchart showing the detection procedure for this short area detection (step S5). When this short location area detection is started, the bundled wiring portion on the short location side in this example, as shown in FIG. 17, the predetermined wiring on the bundled wiring portions 12a and 13a on the one end side S1 of the two bus wirings 12 and 13 is shown. In several examples, the probes 3a and 3b of the probe unit 3 are moved to five measurement points, and probe contact is made (step S20).

  Thereafter, the resistance value is measured by the resistance measuring device 8, and this measurement data is transmitted to the data processing device 9 (step S21). Thereafter, in all the measurement location examples, it is determined whether or not the resistance values at 5 locations as shown in FIG. 17 have been measured (step S22). In the example, resistance values at five locations are measured.

  Thereafter, in this example, when the measurement point where the minimum value is detected, for example, the third measurement point from the left is the minimum value among the measurement data of all resistance values, the third measurement point from the left In the example of FIG. 17 of the area between consecutive measurement locations, area 2 is set as the short location area (step S23), and the short location area detection is terminated. The explanation of the grounds for detecting the short part area is included in the explanation of the grounds for detecting the short part line, which will be described later, and will not be described here.

  Next, in order to describe in detail the short part line detection (step S6), FIG. 19 shows contact examples of the probes 3a (4a) and 3b (4b) of the probe unit 3 (4). This example of FIG. 19 is an example in which a short portion exists in one end side S1 of the two lines of bus wirings 12 and 13 and a short portion area exists in area 2.

  The detection procedure for this short part line detection is shown in the flowchart of FIG. When this short location line detection is started, the bundling wiring portion of the short location area on the short location side In FIG. 19 example, the 2 systems bundling wiring of the area 2 end T on one end side S1 of the 2 systems bus wiring 12 and 13 The probes 3a and 3b of the probe unit 3 are moved to all adjacent probing pads 12c and 13c on the parts 12a and 13a to make probe contacts (step S30).

  Thereafter, the resistance measuring device 8 measures the resistance value between the probes 3a and 3b of the adjacent bus lines in contact with the probe, and transmits the measurement data to the data processing device 9 (step S31). Thereafter, in all the measurement points in this example, it is determined whether or not the resistance values at the seven points at the end T of the area 2 have been measured (Step S32). In this example, the resistance values at seven locations are measured.

  Thereafter, in this example, the line connected to the measurement location where the minimum value is detected is determined as the short location line in the measurement data of all the resistance values (step S33), and this short location line detection is terminated.

  The basis for detecting this short part line will be described below. In the description, a substrate to be inspected having a short portion 15 is used as an example of the substrate to be inspected 1 as shown in FIG.

  With respect to the substrate 1 to be inspected, the measurement locations on the bundled wiring portions 12a and 13a on the bus line where the short portion 15 exists and the measurement locations on the bundled wiring portions 12a and 13a on the bus line adjacent thereto are defined as 2 nodes. 21A and B show the bus lines 12 and 13 of the system and the resistance notation of the wiring in the panel. Pk and Pk ′ in FIG. 21 are measurement points on the bundling wiring portions 12a and 13a on the bus line where the short portion exists, and Pj and Pj ′ in FIG. 21 are bundling wiring portions on the bus line adjacent to Pk and Pk ′. The measurement points on 12a and 13a are shown.

The circuit of FIG. 21B is further expanded to obtain FIG. In comparing the resistance value between Pk-Pk ′ and the resistance value between Pj-Pj ′, block 1 and block 2 are the same circuit, and block 3 connects block 1 and block 2; therefore, between Pk and Pz It is possible to replace the resistance value comparison between Pj-Pz and the resistance value between Pk-Pk ′ and the resistance value between Pj-Pj ′.
Resistance value between Pk and Pz Rkz:
Rkz = (Rx × Rd1 + 2 × Rc × Rd1 + Rd2 × Rd1)
/ (Rx + 2 × Rc + Rd2 + Rd1)
Resistance value between Pj and Pz Rjz:
Rjz = (Rx * Rc + Rc * Rc + Rd2 * Rc + Rx * Rd1 + Rc * Rd1
+ Rd2 × Rd1) / (Rx + 2 × Rc + Rd2 + Rd1)
In the comparison between Rkz and Rjz, the denominator term is common, so the magnitudes of the numerator terms Rkz1 and Rjz1 are compared.

Rkz1 = Rx × Rd1 + 2 × Rc × Rd1 + Rd2 × Rd1
Rjz1 = Rx * Rc + Rc * Rc + Rd2 * Rc + Rx * Rd1
+ Rc × Rd1 + Rd2 × Rd1
A value obtained by subtracting the common factor (Rx × Rd1 + Rd1 × Rd2) from Rkz1 and Rjz1 is divided by the common factor Rc, and a value obtained by further reducing Rd1 is defined as Rkz2 and Rjz2.
Rkz2 = Rd1
Rjz2 = Rx + Rc + Rd2

  In this example of the inspected substrate 1 in which the short-circuit portion 15 exists on one end S1 of the two bus wirings 12 and 13, Rd1 <Rd2 is obtained from the expressions Rd1 and Rd2, and as a result, Rkz2 <Rjz2 and Rkz <Rjz are satisfied. Therefore, regarding the comparison of the resistance value between Pk and Pk ′ and the resistance value between Pj and Pj ′, it is derived that the resistance value between Pk and Pk ′ is smaller.

  Next, the measurement points on the bundle wiring portions 12a and 13a on the bus line adjacent to the bus line where the short portion 15 exists and the measurement points on the bundle wiring portions 12a and 13a on the bus line adjacent to the bus line are used as nodes. FIG. 23A and FIG. 23B show the two bus wirings 12 and 13 and the in-panel wiring represented by resistance. In FIG. 23, Pj and Pj ′ are measurement points on the bundle wiring on the bus line adjacent to the bus line where the short defect exists, Pi and Pi ′ are the bundle wiring portions 12a on the bus line adjacent to Pj and Pj ′, and The measurement location on 13a is shown.

The circuit of FIG. 23B is further expanded to obtain FIG. In comparing the resistance value between Pj-Pj ′ and the resistance value between Pi-Pi ′, block 1 and block 2 are the same circuit, and block 3 connects block 1 and block 2; The resistance value comparison between Pi and Pz can be replaced with the resistance value comparison between Pj and Pj ′ and the resistance value between Pi and Pi ′.
Resistance value between Pj and Pz Rjz:
Rjz = Re1 × (Re2 + Rx ″ + 2 × Rc)
/ (Re1 + Re2 + Rx ″ + 2 × Rc)
Resistance value between Pi and Pz Riz:
Riz = (Re1 + Rc) × (Re2 + Rx ″ + Rc)
/ (Re1 + Re2 + Rx ″ + 2 × Rc)
In the comparison between Rjz and Riz, since the denominator term is common, the numerator terms Rjz1 and Riz1 are compared in magnitude.

Rjz1 = Re1 × Re2 + Re1 × Rx ″ + Re1 × 2 × Rc
Riz1 = Re1 × Re2 + Re1 × Rx ″ + Re1 × Rc + Rc × Re2
+ Rc × Rx ″ + Rc × Rc
A value obtained by subtracting the common factor (Re1 × Re2 + Re1 × Rx ″) from Rjz1 and Riz1 is divided by the common factor Rc, and further obtained by subtracting Re1 is defined as Rjz2 and Riz2.
Rjz2 = Re1
Riz2 = Re2 + Rx ″ + Rc

  In this example of the inspected substrate 1 in which the short portion 15 exists on one end side S1 of the two systems of bus wirings 12 and 13, Re1 <Re2 from Rd1 <Rd2 described above, and as a result, Rjz2 <Riz2, Rjz < Riz is derived. Therefore, regarding the comparison between the resistance value between Pj and Pj ′ and the resistance value between Pi and Pi ′, it is derived that the resistance value between Pj and Pj ′ is smaller.

  Furthermore, FIG. 25A and FIG. 25B show the two systems of bus wirings 12 and 13 shifted from the measurement point of one line and the resistance in the panel wiring, and FIG. 26 shows a further development of FIG. 25B. In FIG. 25B, Rx ″ ″ represents the resistance value of the bus line where no short-circuit portion exists (handled as a block resistance). The circuit in FIG. 26 is similar to the circuit in FIG. 24, and the description regarding the circuit in FIG. 24 is applicable. In the description of the circuit in FIG. 24, in the example of the inspected substrate 1 in which the short-circuit portion exists on one end side S1 of the two bus wirings 12 and 13, since Re1 <Re2 has been described, As a result, regarding the comparison between the resistance value between Pj and Pj ′ and the resistance value between Ph and Ph ′, it is derived that the resistance value between Pj and Pj ′ is smaller.

In FIG.
Rf1 = Rb × (Rc + Re1) / (Rb + Re1 + Re2 + 2 × Rc)
Rf2 = Rb × (Rc + Re2) / (Rb + Re1 + Re2 + 2 × Rc)
Rf3 = (Rc + Re1) × (Rc + Re2) / (Rb + Re1 + Re2 + 2 × Rc)
Rs ′ ″ = Rs + 2 × Rd3 + 2 × Re3 + 2 × Rf3
It is.

  The resistance value comparison at other measurement points can also be explained by recursively explaining the above, and it is derived that the measurement data increases as the distance from the bus line where the defect exists is increased. By the above, it is set as description of determining the line connected to the measurement location which detected the minimum value in all the measurement data as a short location 15 lines.

  The short part area detection is performed by applying the principle of short part line detection to measure the resistance value for each of a plurality of lines, not for each adjacent line. Although it is possible to identify the bus line where the short part exists, the short part side detection and the short part line detection can be performed, but the detection time is shortened by performing the short part area detection before the short part line detection. It becomes possible to do.

  According to this example, since the short portion is detected using the measurement data of the resistance value, the detection probability of the short portion can be increased.

  Moreover, according to this example, since the short part side detection and the short part area detection are performed, the resistance measurement points can be reduced, and the detection time efficiency can be improved.

  Of course, the present invention is not limited to the above-described examples, and various other configurations can be adopted without departing from the gist of the present invention.

It is a block diagram which shows the example of the best form for implementing this invention short detection apparatus. It is a diagram with which it uses for description of this invention. It is a diagram with which it uses for description of this invention. It is a diagram with which it uses for description of this invention. It is a diagram with which it uses for description of this invention. It is a diagram with which it uses for description of this invention. It is a flowchart with which it uses for description of this invention. It is a diagram with which it uses for description of this invention. It is a flowchart with which it uses for description of this invention. It is a diagram with which it uses for description of this invention. It is a diagram with which it uses for description of this invention. It is a diagram with which it uses for description of this invention. It is a diagram with which it uses for description of this invention. It is a diagram with which it uses for description of this invention. It is a diagram with which it uses for description of this invention. It is a diagram with which it uses for description of this invention. It is a diagram with which it uses for description of this invention. It is a flowchart with which it uses for description of this invention. It is a diagram with which it uses for description of this invention. It is a flowchart with which it uses for description of this invention. It is a diagram with which it uses for description of this invention. It is a diagram with which it uses for description of this invention. It is a diagram with which it uses for description of this invention. It is a diagram with which it uses for description of this invention. It is a diagram with which it uses for description of this invention. It is a diagram with which it uses for description of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Board to be inspected, 2 ... XY stage, 3, 4 ... Probe unit, 3a, 3b, 4a, 4b ... Probe, 5 ... XY stage controller, 6 ... Probe unit controller, 7 ... Signal switch, 8 ... Resistance measuring device, 9 ... Data processing device, 10 ... Controller, 11 ... Pixel circuit, 12, 13 ... Bus wiring bundled on both sides, 12a, 13a ... Bundling wiring section on one end side, 12b, 13b ... On the other end side Bundled wiring part, 15 ... Short part

Claims (4)

A short detection method for detecting a short portion between bus wires bundled on both sides of the first and second sides formed adjacent to each other on an insulating substrate,
When the resistance value between arbitrary points of the bundle wiring portion of the bus wiring bundled on both the first and second sides is measured to determine the presence or absence of a short portion, and when it is determined that the short portion is present, Measure the resistance value between adjacent bundled wiring portions on one end side of each of the bus wires bundled on both sides of the first and second sides and the resistance value between adjacent bundled wiring portions on the other end side, A short detection method characterized in that the resistance values are compared and it is determined that there is a short portion on the low resistance value side. The short detection method according to claim 1,
The side of the bus wiring that is bundled on both sides of the first and second sides is divided into a predetermined number of areas, and the side of the bus wiring that is bundled on both sides of the first and second sides is short. Measure the resistance value between each dividing point of each adjacent bundling wiring part, and determine that there is a short point in the area including the dividing point of the measured resistance minimum value part and the dividing points on both sides thereof A short detection method characterized by that. The short detection method according to claim 2,
The bus wiring bundled on both the first and second sides in the area including the division point of the minimum value portion of the resistance value of the bus wiring bundled on both the first and second sides and the division point on both sides thereof Measured all the resistance values between each wiring of the adjacent bundling wiring part on the side where the short part exists, and determined that there was a short part between the wiring of the minimum value part of the measured resistance value A characteristic short detection method. A short detection device for detecting a short point between bus wires bundled on both sides of the first and second sides formed adjacent to each other on an insulating substrate,
Short-circuit presence / absence detection means for detecting the presence / absence of a short-circuit portion by measuring a resistance value between arbitrary points of the bundle wiring portion of the bus wiring bundled on the first and second sides;
When the short-circuit presence / absence detecting means detects the presence of a short-circuited portion, the resistance value between adjacent bundled wiring portions on one end side of the bus wires bundled on both sides of the first and second sides and the respective A resistance value measuring means for measuring a resistance value between adjacent bundled wiring portions on the other end side;
And a resistance value comparing means for comparing the resistance values.

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