JP4861755B2 - Jig for position calibration of sensor part of circuit pattern inspection equipment - Google Patents

Description

  The present invention relates to a sensor part position calibration jig used in a circuit pattern inspection apparatus for inspecting a circuit pattern formed on a glass substrate such as a display apparatus.

  In general, a liquid crystal display panel for performing image display is a circuit pattern (scanning line) in which a plurality of wirings made of a conductor are arranged in parallel on the same surface using a semiconductor manufacturing technique on an insulating glass substrate. Alternatively, a bus line composed of data lines or the like is formed.

  The manufacturing process includes a pattern inspection process for inspecting a disconnection or a short circuit in a circuit pattern formed on the substrate.

  In general, for example, in the technique described in Patent Document 1, probe pairs arranged in advance and in contact with both ends of a circuit pattern formed at equal intervals on a substrate placed on a stage of an inspection apparatus are brought into contact with each other. In this manner, an inspection signal is applied to one end, and the presence or absence of disconnection or a short circuit is detected based on the current value or signal waveform detected from the other end.

In contrast to such a probe contact type circuit pattern inspection apparatus, for example, Patent Document 2 discloses a non-contact type circuit pattern inspection apparatus. In this circuit pattern inspection device, two non-contact sensor electrodes for inspection are electrically capacitively coupled so as to face each other with a predetermined interval between both ends of the circuit pattern, and an inspection signal is applied to one end. The detection signal is detected at the other end, and the circuit pattern is inspected for disconnection or short circuit.
JP-A-5-333357 JP 2004-191381 A

  The inspection probe pairs (or sensor electrode pairs) in the circuit pattern inspection apparatus described above must be sequentially inspected while moving over all circuit patterns arranged at equal intervals on the glass substrate. When the inspection is started after maintenance or repair of the apparatus, the position adjustment is performed so that the inspection probe pair faces the appropriate positions on both ends of the same circuit pattern. If it is a contact type inspection probe pair, the probe tip is brought into contact with one of the circuit patterns to be inspected or the test pattern and visually aligned using a magnifying glass, or the resistance value is set. Position adjustment can be performed by measuring.

  On the other hand, the position adjustment of the sensor electrode in the non-contact type circuit pattern inspection apparatus is non-contact, so it cannot be accurately positioned visually with a probe, and the resistance value cannot be measured. It is necessary to apply a signal from the sensor electrode to this circuit pattern, receive the signal transmitted from the other end, and adjust the position based on the measurement result, for example, the peak position of the detected signal.

  Accordingly, the sensor electrode position adjustment may be completed once, or the position adjustment may not be completed unless it is repeated a plurality of times, and it is necessary to acquire skill levels and procedures for adjustment based on experience. In addition, with the recent increase in scanning lines due to higher image quality, the tendency for the pitch between circuit patterns to become narrower has become stronger, and further adjustment of sensor electrode positions has become difficult.

  Accordingly, an object of the present invention is to provide a sensor electrode position calibration jig of a circuit pattern inspection apparatus capable of easily and accurately positioning an electrode position of a sensor unit for inspecting a circuit pattern in a non-contact manner. To do.

  In order to achieve the above object, at least one of transmitting and receiving the inspection signal in a circuit pattern inspection apparatus that performs inspection by transmitting and receiving inspection signals to and from both ends of the circuit pattern formed on the inspection substrate is non-contact. Used to calibrate the position of the sensor unit consisting of a pair of transmitting and receiving sensors, and is formed symmetrically about the straight line formed at the center of the calibration substrate, and the side to which signals for position calibration are applied The application-side wiring portion facing the transmission sensor and the reception-side wiring portion facing the reception sensor are arranged at different pitches, and a plurality of positions having steps at the connection portion between the application-side wiring portion and the reception-side wiring portion The calibration wiring and a straight reference line formed on both outer sides of the position calibration wiring, and applying the signal for position calibration from the transmission sensor The transmission sensor that scans and moves the sensor section across the position calibration wiring while applying to the wiring section and matches the step of the position calibration wiring selected from the signal data detected from the reception side wiring section And a sensor part position calibration jig of a circuit pattern inspection apparatus for calibrating the positional deviation of the reception sensor.

  ADVANTAGE OF THE INVENTION According to this invention, the jig | tool for sensor part position calibration of the circuit pattern test | inspection apparatus which can position easily and correctly the position calibration of the sensor part for test | inspecting a circuit pattern by a non-contact system can be provided.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a view showing a conceptual configuration example of a circuit pattern inspection apparatus using a sensor part position calibration jig according to the present invention.

  This circuit pattern inspection apparatus is a non-contact type in which an inspection is performed without contacting a sensor portion serving as an inspection probe to a region to be inspected. The circuit pattern inspection apparatus is mounted on the stage 2 by driving a stage 2 on which at least a display panel glass substrate (hereinafter referred to as an inspection substrate) 1 to be inspected and a sensor unit 5 which will be described later are driven. An inspection unit 4 for inspecting defects due to disconnection or short circuit of the circuit pattern 3 formed on the inspection substrate 1, a transport unit 6 for placing the inspection substrate 1 on the stage 2 and carrying it in and out, and control of the entire apparatus A control processing unit 7 for driving the sensor unit 5 to perform defect determination processing based on a detection signal from the inspection unit 4, an input unit 8 including a keyboard, a touch panel, etc. for inputting an operator's instruction, etc. And a display unit 9 for displaying the above information. The inspection unit 4, the sensor unit 5, and the control processing unit 7 that performs defect determination processing constitute a defect detection unit.

  Further, the stage 2 is provided with a suction mechanism 10 including a plurality of grooves and holes, and including a suction pump for sucking and fixing the inspection substrate 1 through the grooves and holes. In the following description, the mounting surface of the stage 2 is the XY plane (horizontal plane in the X and Y axis directions), and the vertical direction perpendicular to the mounting surface is the Z axis direction.

  On the inspection substrate 1 in the present embodiment, for example, a circuit pattern 3 that is, for example, a bus line (scanning line or data line) that is linear and parallel and arranged at equal intervals is formed. Both sides of these circuit patterns 3 are open ends. Of course, this is only an example and is not limited. Normally, the circuit pattern 3 has both ends as open ends. Judgment inspection can be performed. In some cases, test pads 3a and 3b are provided at the ends of the wiring.

  The sensor unit 5 includes a pair of transmission sensor 5a and reception sensor 5b, and is arranged so as to face the circuit pattern 3 with a predetermined interval (gap) therebetween in the X-axis direction. Each of these sensors 5a and 5b includes a sensor electrode 11 (transmission sensor electrode 11a and reception sensor electrode 11b). The sensor unit 5 is not limited to only one pair of sensors, and may include three or more sensors. The inspection may be performed by appropriately combining these sensors and using them as a pair. You can also. Further, in the case of an apparatus configuration including four or more sensors, it is possible to inspect a plurality of circuit patterns in parallel by driving a plurality of pairs of sensors at the same time.

  These sensors 5a and 5b have a position adjustment mechanism that can finely adjust the positions of the sensor electrodes 11a and 11b in three dimensions (XYZ axial directions), and a sensor base portion to which the position adjustment mechanism is fixed. The sensor base portion is attached to a movable portion of the linear slider 13 that can move linearly, and the sensors 5a and 5b are moved linearly and smoothly in the X-axis direction according to an instruction from the control processing portion 7. The fixed portion side of the linear slider 13 is provided on the gantry 14. Both ends of the gantry 14 are attached to a linear slider 15, and the linear slider 13 and the sensors 5 a and 5 b can be moved linearly and smoothly in the Y-axis direction.

  In FIG. 1, an inspection substrate 1 and a sensor part position calibration jig are arranged on a stage 2. In this example, the same six circuit patterns 1a to 1f are formed on the inspection substrate 1, and the inspection substrate 1 is mounted at a predetermined inspection position. As these circuit patterns 1a to 1f, a large number of wirings arranged in a straight line, in parallel and at equal intervals as shown in FIG. In this example, the circuit patterns 1a to 1f are mounted at the inspection position so that the direction in which the wiring of the circuit patterns 1a to 1f extends matches the X-axis direction. Two sensor portion position calibration jigs (hereinafter referred to as calibration substrate 21) are arranged in the range of movement of the linear sliders 13 and 15 in the vicinity of the inspection substrate 1.

  FIG. 2 is a diagram showing a configuration example of the calibration substrate 21 according to the first embodiment of the present invention. FIG. 3 is a diagram showing details of the calibration wiring formed on the calibration substrate 21 in FIG.

  The calibration substrate 21 shown in FIG. 2 is formed of a rectangular or insulating resin that is not easily deformed by heat, an external impact or a load, or a metal plate whose surface is insulated, and at least one of them. Position calibration wiring 22 is formed on the surface. As a formation method, for example, a metal film is formed using a plating process or a vapor deposition method, and after patterning using a photolithography technique or the like, an etching process is performed to form a wiring.

  The calibration substrate 21 is provided with two small-diameter holes 25 used for positioning at the approximate center of both outer sides on the long side. These holes 25 are provided with projections or the like at predetermined positions on the stage 2 and are fitted to these to position the calibration substrate 21. Further, notches 26 are provided at the four corners on the long side of the calibration substrate 21, and the positioned calibration substrate 21 is screwed so that screws are hooked into these notches 26. Of course, the fixing method is not limited to screwing, and for example, a claw-shaped dedicated fixing bracket or the like for fixing on the stage 2 may be produced and used.

  In this configuration example, the front and rear ends of the position calibration wiring 22 formed on the calibration substrate 21 are open ends. Reference lines 23 and 24 are provided on both outer sides of the position calibration wiring 22 so as to be parallel to the position calibration wiring 22. These reference lines 23 and 24 are used as references for obtaining position calibration values based on the calibration detection signals P1 and P1 ′ as shown in FIG. 6 obtained from the position calibration wiring 22 in calibrating the sensor electrode positions. Used. In addition, the calibration wiring 22 is used for the initial alignment of the transmission sensor electrode 11a and the reception sensor electrode 11b so that an effective detection result, that is, a detection result within a range in which position calibration is possible, is obtained. It is done. The calibration detection signal does not need to be a specially created signal, and may be an inspection signal used for a normal inspection.

  The reference lines 23 and 24 include power supply side line portions 23a and 24a to which a calibration signal is applied from the transmission sensor electrode 11a, and power reception side line portions 23b and 24b for the reception sensor electrode 11b to receive the calibration signal. Connected and configured. The line widths of the power supply side line portions 23a and 24a are wider than those of the power reception side line portions 23b and 24b so that the calibration signal is reliably applied. These line widths are appropriately set according to the size of the sensor electrode 11, the pitch between lines of the position calibration wiring 22 described later, and the line width thereof.

  As shown in FIG. 2, the position calibration wiring 22 is a half parallel wiring with a pitch Pa on the A end side, and spreads on both sides around the straight wiring O (L1), and ends at the B end of the pitch Pb (Pa <Pb). Parallel wiring on the side. The position calibration wiring 22 spreads on both sides so that the inclination of the straight line (position shift direction) connecting the transmission sensor electrode 11a and the reception sensor electrode 11b can be detected in any state with respect to the straight wiring O. It is to do.

Next, detection of positional deviation between the transmission sensor electrode 11a and the reception sensor electrode 11b using such a calibration substrate 21 will be described.
FIG. 3 shows the position calibration wiring on one side in detail with respect to the straight wiring O (L1) for ease of explanation. FIGS. 4A and 4B are diagrams for explaining the positional deviation between the sensor electrode 11 and the position calibration wiring 22. FIG. 5 is a diagram illustrating a positional relationship between the sensor unit and the calibration substrate. FIG. 6 is a diagram illustrating an example of a calibration detection signal obtained from the position calibration wiring.
In FIG. 3, for example, all the pitches of the parallel wirings on the A end side are 10 μm, and all the pitches of the parallel position calibration wirings on the B end side are 40 μm. That is, in the case of the position calibration wiring L2 (FIG. 4A), there is a distance of 30 μm between the A end side and the B end side. Similarly, the position calibration wiring L3 is 60 μm, the position calibration wiring L4 is 90 μm, the position calibration wiring L5 (FIG. 4B) is 120 μm, and the step is expanded outward in units of 30 μm. 4A and 4B, the sensor 5a is a transmission sensor electrode 11a in the transmission sensor, and the sensor 5b is a reception sensor electrode 11b in the reception sensor. The numerical values of these pitches are appropriately set in consideration of the size of the sensor electrode, the wiring width of the circuit pattern formed on the inspection substrate 1, the distance between the wirings, and the like.

  In FIG. 6, when the pair of transmission sensor electrode 11a and reception sensor electrode 11b scan and move in a direction (Y-axis direction) crossing above each position calibration wiring, the sensor electrode 11 is obtained from each position calibration wiring. A calibration detection signal is shown. In FIG. 6, when this scanning movement is performed, the highest detection value P1 or P1 ′ is obtained from the position calibration wiring that the sensor electrodes 11a and 11b are closest to. In the example shown in FIG. 6, the detected value P1 is the highest detected value at the center position Xc between the detection signals P2 and P3 by the reference lines 23 and 24, that is, the linear position calibration wiring L1. That is, the transmission sensor electrode 11a and the reception sensor electrode 11b having no positional deviation in the Y-axis direction can obtain the highest detection value from the position calibration wiring L1 (central straight line) shown in FIG.

  On the other hand, when there is a positional deviation between the sensor electrodes 11, for example, as shown in FIG. 6, if the wiring that obtains the highest detection value P1 ′ is the position calibration wiring L2 shown in FIG. Since the transmission sensor electrode 11a and the reception sensor electrode 11b have simultaneously passed over the position calibration wiring L2, it can be determined that the positional deviation between the sensor electrodes is about 30 μm. Similarly, for example, if the detected value P1 'is the position calibration wiring L5 shown in FIG. 4B, it can be seen that the positional deviation between the transmission sensor electrode 11a and the reception sensor electrode 11b is about 120 μm.

  From the above, it can be determined that the two sensor electrodes 11 have passed almost simultaneously above the position calibration wiring that has output a detection value that becomes a peak among the calibration detection signals obtained from the respective position calibration wirings. Therefore, the distance due to the level difference of the position calibration wiring can be regarded as the distance caused by the positional deviation between the transmission sensor electrode 11a and the reception sensor electrode 11b. By setting this distance to “0”, the positions of the transmission sensor electrode 11a and the reception sensor electrode 11b are calibrated and arranged linearly along the X-axis direction. In this calibration, it is only necessary to move the other sensor sensor 11a or the reception sensor electrode 11b as a reference and move the other sensor electrode 11a closer.

  The circuit pattern inspection apparatus equipped with the sensor electrode position calibration jig according to the present embodiment is an apparatus in which two inspection sensor electrodes (transmission sensor 5a and reception sensor 5b) for performing inspection are both moved in a non-contact manner. However, the present invention is not limited to this. The sensor electrode position calibration jig of the present embodiment can be similarly applied to a circuit pattern inspection apparatus configured such that one of the sensors contacts the circuit pattern and the other sensor moves in a non-contact manner. it can. Further, the number of sensor electrodes for inspection of the circuit pattern inspection apparatus is not limited to two, and even if two or more sensor electrodes are provided, they can be similarly applied as long as they are rubbed in pairs.

  As described above, each wiring of the circuit pattern parallel to the X-axis direction formed on the inspection substrate to be mounted and the transmission by the position calibration of the sensor electrode using the sensor electrode position calibration jig of the present invention, and transmission The detection directions by the sensor electrode 11a and the reception sensor electrode 11b can be matched.

It is a figure which shows the conceptual structural example of the circuit pattern inspection apparatus using the jig | tool for sensor electrode position calibration which concerns on this invention. It is a figure which shows the structural example of the board | substrate for a calibration which concerns on embodiment (sensor electrode position calibration jig | tool). It is a figure which shows the wiring for position calibration formed on the board | substrate for calibration. It is a figure for demonstrating the position shift detection in the wiring for position calibration. It is a figure for demonstrating the position shift detection of the sensor electrode using the board | substrate for a calibration. It is a figure which shows the detection signal by the wiring for position calibration.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Glass substrate (inspection board | substrate) for display panels, 2 ... Stage, 3 ... Circuit pattern, 4 ... Inspection part, 5 ... Sensor part, 5a ... Transmission sensor, 5b ... Reception sensor, 6 ... Conveyance part, 7 ... Control processing , 8 ... input unit, 9 ... display unit, 10 ... adsorption mechanism, 11 ... sensor electrode, 11a ... transmission sensor electrode, 11b ... reception sensor electrode, 13, 15 ... linear slider, 14 ... gantry, 21 ... calibration substrate (Sensor electrode position calibration jig), 22 ... position calibration wiring, 23, 24 ... reference line, 23a, 24a ... power feeding side line portion, 23b, 24b ... power receiving side line portion.

Claims (4)

A sensor unit comprising a pair of a transmission sensor and a reception sensor in which at least one of the transmission and reception of the inspection signal is non-contact in a circuit pattern inspection apparatus that performs inspection by transmitting and receiving inspection signals to and from both ends of the circuit pattern formed on the inspection substrate Used to calibrate
An application-side wiring portion facing the transmission sensor on the side to which a signal for position calibration is applied is formed symmetrically about a straight line formed at the center on the calibration substrate, and reception facing the reception sensor A plurality of position calibration wirings that are arranged at different pitches with the side wiring parts, and have a step in the connection part between the application side wiring part and the receiving side wiring part;
A straight reference line formed on both outer sides of the position calibration wiring;
Consists of
While applying a signal for position calibration from the transmission sensor to the application side wiring portion, the sensor unit is moved across the position calibration wiring and selected from signal data detected from the reception side wiring portion. A sensor part position calibration jig for a circuit pattern inspection apparatus, wherein a positional deviation between the transmission sensor and the reception sensor corresponding to the step in the position calibration wiring is calibrated. Provided such that the pitch between the receiving side wiring parts is narrower than the pitch between the application side wiring parts,
2. The sensor part position calibration jig of the circuit pattern inspection apparatus according to claim 1, wherein the step is formed so as to spread outward from the straight line position calibration wiring arranged in the center. 3. The reference line is composed of wiring in which two different line widths are connected,
2. The circuit pattern according to claim 1, wherein a line width facing the sensor on the side to which the signal for position calibration is applied is formed wider than a line width facing the sensor on the receiving side. Jig for position calibration of sensor part of inspection equipment.   2. The sensor position calibration jig of the circuit pattern inspection apparatus according to claim 1, wherein the sensor section calibration jig is fixed on a stage on which the inspection board of the circuit pattern inspection apparatus is mounted. Ingredients.

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