KR101376841B1 - Substrate inspection apparatus and substrate inspection method - Google Patents

Abstract

assignment

Providing the board | substrate test | inspection apparatus and board | substrate test | inspection method which test wiring of board | substrates, such as a glass substrate used for the electrode plate for liquid crystal displays or a plasma display.

Solution

A first wiring pattern having a first base portion extending from one end of the first linear upper portion and the first linear upper portion, and a second base portion extending from one end of the second linear upper portion and the second linear upper portion; A substrate inspection apparatus for inspecting a substrate in which a plurality of second wiring patterns disposed alternately with one wiring pattern are alternately formed, comprising: signal detecting means for detecting a signal that is physically non-contacted to the wiring pattern to be inspected and applied; A first electrode portion disposed in physical contact with the first base portion of the first wiring pattern, a second electrode portion disposed in physical contact with the second base portion of the second wiring pattern, and a first electrode portion; Phase detection of a predetermined phase is performed based on the reference signal from the power supply means for supplying a reference signal having a predetermined period to the second electrode portion and the detection signal of the signal detection means. The conduction determination and the short circuit determination of the wiring pattern from the first detection means, the second detection means for performing synchronous detection based on the reference signal from the detection signal, and the first result of the first detection means and the second result of the second detection means. It is characterized by performing.

Board inspection apparatus, board inspection method

Description

Substrate inspection device and substrate inspection method {SUBSTRATE INSPECTION APPARATUS AND SUBSTRATE INSPECTION METHOD}

BRIEF DESCRIPTION OF THE DRAWINGS The schematic plan view of the board | substrate to test which is a test | inspection object in the board | substrate inspection apparatus of this invention.

2 is a schematic block diagram showing a relationship between a substrate inspection device and a substrate according to the embodiment of the present invention.

3 is a schematic diagram showing transmission and reception of a signal with a substrate and a substrate inspection apparatus disposed on the substrate.

4 is a schematic diagram showing the electrical positional relationship between the substrate and the substrate inspection apparatus shown in FIG. 3;

5 is a diagram illustrating a step of calculating a phase amount performed by the phase amount calculating means.

Fig. 6 is a diagram showing waveforms of signals calculated from three kinds of wiring patterns calculated by the first detecting means.

FIG. 7 is a diagram showing waveforms of signals calculated from three types of wiring patterns calculated by the second detection means. FIG.

8 is an embodiment in which the first result and the second result are vector displayed.

9 is a flow chart in the case where the substrate inspection apparatus according to the embodiment of the present invention is implemented.

10 is a graph showing a first result and a second result when a plurality of wiring patterns arranged in parallel using the present invention are inspected.

11 is a graph showing a first result and a second result when a plurality of wiring patterns provided in parallel using the present invention are inspected.

12 is a perspective view illustrating an outline of a structure of a plasma display panel.

DESCRIPTION OF THE REFERENCE NUMERALS (S)

1: substrate inspection device

2: signal detection means

31: first detection means

32: second detection means

4: power supply means

51: first electrode portion

52: second electrode portion

6: determination means

61: first determining means

62: second determination means

Technical field

The present invention relates to a substrate inspection apparatus and a substrate inspection method, and more particularly, to a substrate inspection apparatus and a substrate inspection method for inspecting wiring of a substrate such as a glass substrate used for an electrode plate of a plasma display.

Background technology

Conventionally, with the miniaturization of the wiring pattern formed in a printed wiring board, a plasma display panel, a glass substrate for liquid crystal panels, etc., inspection is performed in the state which physically separated a wiring pattern and an inspection probe, or an inspection probe with an insulating film. The board | substrate test | inspection apparatus which inspects the conduction of a wiring pattern using the non-contact inspection probe which prevented a damage to a fine wiring pattern by covering the electrode surface of (for example, refer patent document 1).

In the above-described substrate inspection apparatus, two electrodes covered with an insulating film are used as inspection probes, and one electrode is disposed so as to face one end of the wiring pattern to be inspected, and the other electrode is placed on the other end of the wiring pattern. It arrange | positions so that it may face an edge part, the electrode and wiring pattern are electrostatically couple | bonded by the component of the capacitor formed by the electrode and wiring pattern which mutually oppose the insulating film which covers this electrode. Then, the test signal is injected from the one electrode to the wiring pattern, and the signal is detected at the other end of the wiring pattern from the other electrode, thereby conducting the wiring pattern based on the detected signal level. It is supposed to check.

Moreover, the structure of the plasma display panel which is an example of a board | substrate is shown below. 12 is a perspective view showing an outline of the structure of the plasma display panel. The plasma display panel shown in FIG. 12 includes a front plate 901 and a back plate 902. The front plate 901 is formed of, for example, a bus electrode formed on the surface of a glass substrate 903 by an ITO (Indium Tin Oxide) film 904 and a film such as silver. The wiring 909 which has the 905 is comprised by the glass substrate in which it was formed. In the front plate 901 configured as described above, the wiring 909 exhibits a resistance value of about several ohms in good quality. On the other hand, when only the bus electrode 905 of the wiring 909 is disconnected, the disconnection point is conducted only by the ITO film 904 and exhibits an intermediate level resistance value of about 100 to 10 MΩ.

Since the substrate inspection apparatus as described above injects and detects an inspection signal into the wiring pattern through the capacitance of the capacitor formed by the electrodes and the wiring pattern facing each other, the detected signal level is determined by the wiring pattern and the electrode. The characteristics of the signal level detected change due to the capacitance of the capacitor formed and influenced by error factors such as the distance between the wiring pattern and the electrode and the stray capacitance generated between the wiring pattern and the surroundings. There is this. For this reason, when a substrate such as the front plate 901 is inspected using such a substrate inspection apparatus, if a defect in which the intermediate level resistance value is generated occurs as in the case where only the bus electrode 905 is disconnected, the bus electrode ( Since it is difficult to discriminate the detection signal level due to the disconnection of 905 and the signal level due to the disturbance, it is inconvenient that it is difficult to detect the defect having the intermediate level resistance value.

In order to solve such a problem, patent document 2 arrange | positions the feed probe and the detection probe which are arrange | positioned at the one end of a wiring electrically non-contactingly with the wiring, and are electrically non-contact with the wiring at the other end of a wiring. An apparatus in which opposed feeding probes are arranged has been proposed.

In this apparatus, a 1 MHz sine wave test signal is applied to a power supply probe, the voltage generated by the detection probe is detected, and the quality of the wiring is determined based on the detected phase of the voltage. By such an apparatus, the influence of the distance change between the wiring and the inspection probe can be reduced, and the above problem can be solved.

However, in recent years, as further refinement | miniaturization of the wiring pattern of a board | substrate progresses, in the board | substrate test | inspection apparatus described in patent document 2, the malfunction occurs when the short circuit test | inspection is performed. As the wiring pattern of the substrate becomes finer, the width of the wiring pattern itself becomes narrower and the interval between the wiring patterns becomes narrower, so that the feeding or detecting of the wiring pattern desired by the power feeding probe or the detection probe is performed. Has a difficult problem.

For this reason, even if the board | substrate with which refinement | miniaturization advanced, the board | substrate test | inspection apparatus which can test the conduction of a wiring pattern, a short circuit, etc. correctly is needed.

Moreover, in the board | substrate test | inspection apparatus described in this patent document 2, since a different test | inspection process is detected by providing different test electrodes, respectively, conduction of a wiring pattern and a short circuit between wiring patterns, the required test time becomes long or complicated. There is a problem that requires or requires configuration.

Patent Document 1: Japanese Patent Application Laid-Open No. 11-133090

Patent Document 2: Japanese Patent Application Laid-Open No. 2005-241614

SUMMARY OF THE INVENTION The present invention has been made in view of such a situation, and even when a substrate having a plurality of fine wiring patterns without a complicated structure can be accurately inspected for conduction of a wiring pattern or a short circuit between the wiring patterns, conduction inspection and Provided are a substrate inspection apparatus and method capable of simultaneously inspecting a short circuit inspection.

Means for solving the problem

The invention according to claim 1 extends from a first wiring pattern having a first linear upper portion and a first base portion extending from one end of the first linear upper portion, and a second linear upper portion and one end of the second linear upper portion. A substrate inspection apparatus for inspecting a substrate having a second base portion provided and alternately formed with a plurality of second wiring patterns disposed at opposite positions to the first wiring pattern, and physically attached to one wiring pattern to be inspected. Signal detecting means for detecting a signal applied to the wiring pattern while being disposed in a non-contact manner, a first electrode portion arranged to be in physical contact with the first base portion of the first wiring pattern, and the second wiring pattern. Supplying a reference signal having a predetermined period to the second electrode portion disposed in physical contact with the second base portion, and to the first electrode portion and the second electrode portion; From the first means, the first detection means for performing phase detection of a predetermined phase based on the reference signal from the detection signal detected by the signal detection means, and the detection signal detected by the signal detection means, the reference signal Conduction determination and short-circuit determination of the wiring pattern to be inspected from the second detection means for performing synchronous detection based on the second detection means, the first result from the first detection means, and the second result from the second detection means. And a judging means for performing, wherein the judging means includes first judging means for making conduction determination of the wiring pattern from the first result, and second judging means for making a short circuit determination of the wiring pattern from the second result. The first determination means includes a wiring pattern of the inspection target obtained as the first result by phase detection by the first detection means. Based on the signal related to the wiring pattern of the good product as a reference, the amount of phase shift between the signal preset as the first result is calculated, and the conduction determination of the wiring pattern to be inspected is determined based on the amount of phase shift. It provides the board | substrate inspection apparatus characterized by the above-mentioned.

The invention according to claim 2, wherein the first determining means calculates the resistance value of the wiring pattern to be inspected based on the calculated amount of phase shift, and based on the calculated resistance value. The board | substrate test | inspection apparatus characterized by conduction determination of the wiring pattern of a test object is provided.
The invention according to claim 3, wherein the predetermined phase used in the first detection means is calculated by phase amount calculation means for calculating phase amounts of the reference signal and the detection signal. A substrate inspection apparatus is provided.
The invention according to claim 4, wherein the phase amount detecting means digitizes a positive analog value larger than the reference of the reference signal or a negative analog value smaller than the reference, and the reference of the detection signal. It provides a substrate inspection apparatus characterized by digitizing a larger positive analog value or a negative analog value smaller than a reference, and giving as a predetermined phase a difference between a phase obtained by an exclusive OR of the digitized reference signal and the digitized detection signal. do.

delete

delete

The invention according to claim 5, wherein the second judging means includes a signal relating to a wiring pattern of a test target obtained as the second result by synchronous detection by the second detecting means, and a reference. The board | substrate test | inspection apparatus characterized by calculating the output value difference of the signal preset as said 2nd result on the basis of the wiring pattern of the good goods which become into, and making a short circuit determination of the wiring pattern of a test object based on the output value difference. To provide.
The invention according to claim 6, wherein the shift amount of the phase calculated by the first determination means and the output value difference calculated by the second determination means are respectively determined by the display means. The board | substrate test | inspection apparatus provided by the vector representation which makes xy-axis is provided.

delete

The invention according to claim 7, wherein the conduction determination of the first determination means and the short circuit determination of the second determination means are simultaneously processed.
The invention according to claim 8, wherein the signal detecting means moves in a direction perpendicular to the major axis direction of the first wiring pattern and the second wiring pattern. It provides a board | substrate inspection apparatus characterized by the above-mentioned.
The invention according to claim 9 extends from a first wiring pattern having a first linear upper portion and a first base portion extending from one end of the first linear upper portion, and a second linear upper portion and one end of the second linear upper portion. A substrate inspection apparatus for inspecting a substrate having a second base portion provided and alternately formed of a plurality of second wiring patterns disposed at opposite positions to the first wiring pattern, and physically attached to one wiring pattern to be inspected. A signal detecting means for detecting a signal applied to the wiring pattern while being disposed in a non-contact manner, a first electrode portion which is arranged in physical contact with the first base portion of the first wiring pattern, and the second wiring pattern Supplying a reference signal having a predetermined period to the second electrode portion disposed in physical contact with the second base portion, and the first electrode portion and the second electrode portion. From the power supply means, the detection signal detected by the signal detection means, the first detection means for performing phase detection of a predetermined phase based on the reference signal, and the detection signal detected by the signal detection means, the reference signal Conduction determination and short circuit determination of the wiring pattern to be inspected from the second detection means for performing synchronous detection based on the second detection means, the first result from the first detection means, and the second result from the second detection means. And a judging means for performing, wherein the judging means includes first judging means for making conduction determination of the wiring pattern from the first result, and second judging means for making a short circuit determination of the wiring pattern from the second result. The second determination means is a wiring loss of the inspection target obtained as the second result by synchronous detection by the second detection means. Calculating an output value difference between the signal related to the signal and the signal pattern preset as the second result based on the wiring pattern of the good product as a reference, and performing a short circuit determination of the wiring pattern to be inspected based on the output value difference A substrate inspection apparatus is provided.
The invention according to claim 10 extends from a first wiring pattern having a first linear upper portion and a first base portion extending from one end of the first linear upper portion, and a second linear upper portion and one end of the second linear upper portion. A substrate inspection method for inspecting a substrate having a second base portion provided and alternately formed of a plurality of second wiring patterns disposed at opposite positions to the first wiring pattern, wherein the plurality of first base portions are in physical contact with the plurality of first base portions. To arrange a first electrode part, and physically contact the plurality of second base parts to arrange a second electrode part, supply a reference signal having a predetermined period to the first electrode part and the second electrode part, and inspect The signal detection means, which is physically disposed in a non-contact manner on one wiring pattern to be detected, detects the signal applied to the wiring pattern and checks the signal. From the detection signal detected by the means, phase detection of a predetermined phase is calculated on the basis of the reference signal by the first detection means, and the reference by the second detection means from the detection signal detected by the signal detection means. A synchronous detection is calculated on the basis of the signal, conduction determination and short circuit determination of the wiring pattern are made from the first result in the first detection means and the second result in the second detection means, and based on the first result. In the conduction determination, the first result is preset as the first result based on a signal relating to a wiring pattern of the inspection target obtained as the first result by phase detection by the first detection means and a wiring pattern of a good product as a reference. Calculate the amount of phase shift with respect to the signal to be used, and conduct conduction determination of the wiring pattern to be inspected based on the amount of phase shift. It provides a substrate inspection method according to claim.
The invention according to claim 11 extends from a first wiring pattern having a first linear upper portion and a first base portion extending from one end of the first linear upper portion, and a second linear upper portion and one end of the second linear upper portion. A substrate inspection method for inspecting a substrate having a second base portion provided and alternately formed of a plurality of second wiring patterns disposed at opposite positions to the first wiring pattern, wherein the plurality of first base portions are in physical contact with the plurality of first base portions. To arrange a first electrode part, and physically contact the plurality of second base parts to arrange a second electrode part, supply a reference signal having a predetermined period to the first electrode part and the second electrode part, and inspect The signal detection means, which is physically disposed in a non-contact manner on one wiring pattern to be detected, detects the signal applied to the wiring pattern and checks the signal. From the detection signal detected by the means, phase detection of a predetermined phase is calculated on the basis of the reference signal by the first detection means, and the reference by the second detection means from the detection signal detected by the signal detection means. A synchronous detection is calculated on the basis of the signal, conduction determination and short circuit determination of the wiring pattern are made from the first result in the first detection means and the second result in the second detection means, and based on the second result. In the short-circuit determination, the second result is preset as the second result based on a signal relating to the wiring pattern of the inspection target obtained as the second result by the synchronous detection by the second detection means, and the wiring pattern of the good product as a reference. The output value difference with the signal to be used is calculated, and a short circuit determination of the wiring pattern to be inspected is performed based on the output value difference. Provide a substrate inspection method.

delete

By providing these inventions, all the above problems are solved.

Carrying out the invention  Best form for

BEST MODE FOR CARRYING OUT THE INVENTION The best mode for carrying out the present invention will be described.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic plan view of the board | substrate to test which is a test | inspection object in the board | substrate inspection apparatus of this invention.

1 is a glass substrate used as a front plate of a plasma display panel, for example.

As for the wiring pattern 8 which this board | substrate has, the 1st wiring pattern 81 and the 2nd wiring pattern 82 are alternately arranged in parallel.

This first wiring pattern 81 has a first linear portion 811 and a first base portion 812. The first linear upper portion 811 is formed in a straight line. This first linear top portion 811 corresponds to a bus electrode of a plasma display made of silver or the like. On one side of the first linear upper portion 811, a first transparent electrode 813 formed of indium tin oxide (ITO) or the like is formed.

The first base portion 812 extends from one end of the first linear upper portion 811 and is formed as a so-called tape automated bonding (TAB).

The second wiring pattern 82 has a second linear top portion 821 and a second base portion 822. The second linear upper portion 821 is formed in a straight line. The second linear top portion 821 corresponds to the bus electrode of the plasma display made of silver or the like similarly to the first linear top portion 811. The second linear top portion 821 is disposed to be parallel to the first linear top portion 811. On one side of the second linear upper portion 821, a second transparent electrode 823 is formed of indium tin oxide (ITO) or the like. Since this 2nd transparent electrode 823 is arrange | positioned so that the 2nd linear top part 821 and the 1st linear top part 811 may be parallel, it will be arrange | positioned so that it may become parallel with the 1st transparent electrode 813. FIG.

Similarly to the first base portion 812, the second base portion 822 extends from one end of the second linear upper portion 821, and functions as a so-called tape automated bonding (TAB).

As shown in FIG. 1, this second base portion 822 extends to the side (right side of the drawing) opposite to the side where the first base portion 812 is disposed. For this reason, the 1st wiring pattern 81 and the 2nd wiring pattern 82 are the 1st linear upper part 811 (or 1st transparent electrode 813), and the 2nd linear upper part 821 (or 2nd transparent) Electrodes 823 are disposed in parallel with each other.

The first transparent electrode 813 and the second transparent electrode 823 are disposed inside the first linear upper portion 811 and the second linear upper portion 821 so as to face each other, and are formed as a pair of transparent electrode pairs. .

In this FIG. 1, the first base portion 812 of the first wiring pattern 81 is disposed on the left side of the page, and the second base portion 822 of the second wiring pattern 82 is disposed on the right side of the page. It is.

In addition, a third wiring pattern (not shown) may be disposed between the first wiring pattern 81 and the second wiring pattern 82 described above. This 3rd wiring pattern is a linear pattern arrange | positioned in parallel with the 1st linear top part 811 and the 2nd linear top part 821, and has a light shielding function. This third wiring pattern is formed of an insulator, and does not affect the conduction determination and the short circuit determination of the first wiring pattern 81 and the second wiring pattern 82.

FIG. 2 is a schematic block diagram showing the relationship between the substrate inspection apparatus and the substrate according to the embodiment of the present invention, and FIG. 3 is a schematic diagram showing transmission and reception of signals with the substrate and the substrate inspection apparatus disposed on the substrate, FIG. 4 is a schematic diagram showing the electrical positional relationship between the substrate and the substrate inspection apparatus shown in FIG. 3. In FIG. 4, the wiring pattern is shown with the oblique line, the code | symbol 100 has shown the glass substrate, and the code | symbol 11 has shown the mounting base for mounting the board | substrate which the board | substrate inspection apparatus 1 has.

The board | substrate test | inspection apparatus 1 of one Embodiment concerning this invention is the signal detection means 2, the test signal calculation means 3, the power supply means 4, the electrode part 5, the determination means 6, a display. It has a means (7).

The basic principle of the board | substrate test | inspection apparatus 1 of this invention is to apply the reference signal to the wiring pattern 8 used as a test object by the power supply means 4, and to apply this wiring pattern by the signal detection means 2 to it. By calculating (detecting) the change in phase based on the detected detection signal, the conduction determination and the short circuit determination of the wiring pattern 8 to be inspected are performed.

In addition, although the wiring pattern is shown by the minimum number of wiring patterns required for description in the accompanying drawing, in fact, many wiring is formed and the inspection is performed by selecting these wirings sequentially. In addition, the wiring pattern of the test object represented by this specification has indicated any one wiring pattern of the 1st wiring pattern 81 or the 2nd wiring pattern 82.

The signal detection means 2 detects the signal which flows through the wiring pattern (1st wiring pattern 81 or 2nd wiring pattern 82) used as a test object.

This signal detection means 2 has the 1st measuring part 21 and the 1st signal measuring part 23. As shown in FIG.

As shown in FIG. 4, this 1st measuring part 21 has a predetermined space | interval with respect to one end of a wiring pattern, and is arrange | positioned so that it may oppose noncontact. For this reason, this 1st measuring part 21 forms the capacitance C1 with respect to a wiring pattern. The signal is transmitted to the signal measuring unit 23 through the capacitance C1.

This predetermined interval is preferably set to 0.1 to 0.5 mm. This predetermined interval is preferably set in the above range because the first measuring unit 21 must form one wiring pattern and the capacitance C1. In addition, since the electric field from the wiring pattern is spread with the spread of about 30 degrees from the wiring pattern, the first measuring unit 21 has a predetermined interval (height) not affected by the electric field of the adjacent wiring pattern. You need to have

This signal detection means 2 may have the 2nd measuring part 22, the 2nd signal measuring part 24, and the 3rd signal measuring part 25, as shown in FIG. 3 or FIG. .

The signal detecting means 2 is provided with the 2nd measuring part 22, the 2nd signal measuring part 24, and the 3rd signal measuring part 25, by the opposing position of the 1st measuring part 21. This is because the signal can be detected, and the signal can be detected more accurately by using the difference between the first measuring unit 21 and the second measuring unit 22.

In addition, the structure of the 2nd measuring part 22 is substantially the same as the structure of the 1st measuring part 21, and differs that a position arrange | positioned is a position which opposes the position where the 1st measuring part 21 is arrange | positioned. (See Figure 2).

As shown in FIG. 3, the 1st measuring part 21 and the 2nd measuring part 22 are the linear part of the wiring pattern 8 (the 1st wiring pattern 81 or the 2nd wiring pattern 82). It is formed so as to move in a direction perpendicular to the first linear upper portion 811 or the second linear upper portion 821.

In this way, the detection signal measured by the first measuring unit 21 is alternately detected from the first wiring pattern 81 and the second wiring pattern 82, so that the signal can be continuously detected. Because.

The 1st and 2nd measuring parts 21 and 22 can use a feed pad, and although it has a circular shape in plan view in FIG. 3, it is not specifically limited, What is necessary is just to be able to measure a test signal reliably.

In addition, these 1st and 2nd measuring parts 21 and 22 move at a predetermined speed in the direction which is substantially orthogonal to the some wiring pattern (direction of the arrow of FIG. 3) as demonstrated above. For this reason, the 1st and 2nd measuring parts 21 and 22 can detect the signal of a wiring pattern at predetermined intervals, and can detect a signal continuously from a some wiring pattern.

An amplifier for amplifying the magnitude of the signal measured by the first measuring unit 21 and the second measuring unit 22 may be provided.

The first to third signal measuring units 23, 24 and 25 measure the signals from the first measuring unit 21 and the second measuring unit 22. These signal measuring units use an AC voltmeter.

The signal measuring unit 23 detects signals from the first measuring unit 21 and the second measuring unit 22. The signal detected by the signal measuring unit 23 is transmitted to the test signal calculating means 3 described later.

The 2nd signal measuring part 24 and the 3rd signal measuring part 25 are grounded in order to set the reference electric potential, and can respectively measure the electric potential of the wiring pattern from a reference electric potential.

In the present description, three signal measuring units are provided for convenience, but the number is not limited as long as the potential of the wiring pattern can be measured, but at least the signals of the first measuring unit 21 and the first measuring unit 21 are measured. The present invention can be implemented by providing a first signal measuring unit 23 for the purpose.

It is preferable that the quantity measuring part of this signal detection means 2 has a positioning part (not shown) for specifying the position of itself on the glass substrate 100. FIG.

This is because by having this positioning section, when conduction and / or short-circuit inspection described later can be specified, from which wiring pattern the defect was detected when the defect was detected.

Although this positioning part can have the said function by calculating the moving distance of xy using a speedometer or a current measuring system, if it is a function which can determine the position of the 1st and 2nd measuring parts 21 and 22, it will not specifically limit. Do not.

The electrode portion 5 is used to apply (supply) a signal to a plurality of wiring patterns. This electrode part 5 is equipped with the 1st electrode part 51 and the 2nd electrode part 52. As shown in FIG.

The first electrode part 51 is disposed in physical contact with the first base part 812 of the first wiring pattern 81. The first electrode portion 51 receives a signal from the power supply means 4 described later. The first electrode portion 51 is in physical contact with the plurality of wiring patterns and directly applies a signal.

In FIG. 3, although the 1st electrode part 51 is arrange | positioned so that the surface of the some 1st base part 812 may be covered, if a electrical contact can flow through physical contact with the wiring pattern used as a test object, a connection method will It is not specifically limited.

The second electrode portion 52 is disposed in physical contact with the second base portion 822 of the second wiring pattern 82. The second electrode portion 52 receives a signal from the power supply means 4. The second electrode portion 52 is in physical contact with the wiring pattern and directly applies a signal.

In FIG. 3, although the second electrode portion 52 is connected to one end of the plurality of second base portions 822, the connection method is particularly limited as long as electricity can flow through physical contact with the wiring pattern to be inspected. It doesn't work.

The power supply means 4 supplies a signal (current or voltage) for inspection to the wiring pattern to be inspected. In the substrate inspection apparatus 1 of the present invention, by applying a plurality of signals having a certain period to the wiring pattern, the conduction of the wiring pattern to be inspected is detected by detecting the signal level (output) appearing on the wiring pattern. Check for shorts.

The power supply means 4 supplies the reference signal f1 having a predetermined period to the first electrode portion 51 and the second electrode portion 52. For this reason, the power supply means 4 is arrange | positioned so that it may be connected in series between the 1st electrode part 51 and the 2nd electrode part 52, as shown in FIG. The power supply means 4 supplies a signal to the closed circuit by the first electrode portion 51, the first wiring pattern 81, the second wiring pattern 82, and the second electrode portion 52. .

The signal supplied by the power supply means 4 supplies a 1 MHz sine wave signal, but is not particularly limited as long as the signal has a constant period.

As shown in FIG. 3, the power supply means 4 may be comprised with two power supply parts which apply an AC signal, respectively. By providing two power feeding units in this way, the output level can be adjusted so that the same impedance is loaded on the wiring pattern (first wiring pattern 81 or second wiring pattern 82) to be inspected.

The inspection signal calculation means 3 calculates the conduction determination and the short circuit determination of the wiring pattern to be inspected from the detection signal from the signal detection means 2 and the reference signal supplied by the power supply means 4. Is done.

The test signal calculating means 3 has a first detecting means 31 and a second detecting means 32.

The first detection means 31 performs phase detection of a predetermined phase on the basis of the reference signal supplied from the power supply means 4 from the detection signal detected by the signal detection means 2, and the first calculated result is obtained. 1 The result is transmitted to the first judging means 61 of the judging means 6 described later.

The predetermined phase set in the first detection means 31 may be set to 90 degrees in advance. By being set to 90 degrees in advance, the 1st detection means 31 detects 90 degrees with respect to a reference signal.

Although the predetermined phase of the 1st detection means 31 may be set to 90 degrees as mentioned above, in order to make a more stable and accurate determination, the phase amount calculation means 33 which calculates the phase of a reference signal and a detection signal. It is desirable to provide.

If the phase amount calculating means 33 can calculate the phases of the reference signal and the detection signal, the method is not particularly limited, but the phase amount calculating means 33 can calculate the phases in the following order.

First, the phase amount calculating means 33 receives the phase of the reference signal from the power supply means 4 (see FIG. 5A). The phase amount calculating means 33 digitizes the analog value output from the change of the reference signal as a positive value (value larger than the reference value) (see FIG. 5 (b)).

Next, the phase amount calculating means 33 receives the detection signal detected from the signal detecting means 2 (see FIG. 5C). Then, the phase amount calculating means 33 digitizes the analog value outputted as a positive value from the change in the test signal (see FIG. 5 (d)).

In addition, in the above description, the analog value output from the positive of the reference signal and the detection signal is digitized to calculate the change position, but an analog value (value smaller than the reference) output negatively may be used.

Subsequently, the exclusive value of the digitized reference signal (Fig. 5 (b)) and the digitized detection signal (Fig. 5 (d)) gives an output value as shown in Fig. 5 (e). It becomes possible. At this time, as shown in Fig. 5E, the phase difference θ (phase shift amount) is calculated as an output value. By using the difference θ of the phase as a predetermined phase, detection can be carried out by transferring the detection signal by the phase amount θ, which makes it possible to detect more stably and accurately. In particular, by digital conversion in this way, it is possible to calculate stable and accurate as compared with the case of using an analog value.

In addition, the said method shows one Example at the time of using a non-exclusive logical sum, and if it is a method which can calculate phase amount (theta), you may use another method.

When the phase amount calculating means 33 calculates the phase amount θ, it is sent to the first detecting means 31 described above and used as a predetermined phase.

The second detection means 32 synchronizes the reference signal with the in-phase detection based on the reference signal supplied from the power supply means 4 from the detection signal detected by the signal detection means 2. ), And the second result calculated as a result is transmitted to the second determination means 62 of the determination means 6 described later.

The judging means 6 determines the conduction and short circuit of the wiring pattern to be inspected from the first result calculated by the first detection means 31 and the second result calculated by the second detection means 32. Is done.

This judging means 6 is equipped with the 1st judging means 61 and the 2nd judging means 62, and these two judging means make conduction determination and a short circuit determination, respectively.

The 1st determination means 61 performs the conduction determination of the wiring pattern 8 of a test object based on the 1st result which is the calculation result from the 1st detection means 31 mentioned above. The conduction determination method performed by the first determination means 61 is performed by comparing the first result with the state (good conduction result) at the time of good conduction of the wiring pattern 8.

At this time, the first judging means 61 compares the first result with the good conduction result, and if it is roughly the same, it is determined that the wiring pattern is good conduction (good quality), and if it is greatly different, the wiring pattern is poor conduction (defective product). Is determined.

In addition, in the comparison performed by the first determination means 61, the amount / defect of the wiring pattern can be adjusted by adjusting the difference amount between the good conduction result and the first result.

As described above, the first determination means 61 compares the first result with the good conduction result and performs the conduction judgment. However, since the first result is detected and calculated in a predetermined phase based on the reference signal, conduction is conducted. By conducting a comparison between a good result and a phase, conduction determination can be performed more correctly.

6 shows waveforms of signals calculated from three types of wiring patterns calculated by the first detection means. In FIG. 6, the first result of the good wiring pattern which is a good conduction result is shown by the waveform S1, and the 1st result of the bad (partly separated) wiring pattern is shown by the waveform S2 and a complete disconnection (complete defect). The first result of the wiring pattern is denoted by waveform S3.

As shown in Fig. 6, the larger the resistance value of the defect is, the larger the phase difference from the waveform S1 of the good conduction result is, and the phase amounts a1 and phase, respectively, from the wiring patterns of the good products as reference. The quantity (a2) is divided into two.

For this reason, the first determination means 61 calculates the phase shift between the good conduction result and the first result of the first detection means 31, and conducts the conduction determination from this phase amount, while the phase amount is determined. By the size of, it is possible to determine how much resistance value the wiring pattern to be inspected has. Since the resistance value of each wiring pattern can be calculated, conduction determination can also be made based on this resistance value.

The second determination means 62 performs a short circuit determination of the wiring pattern 8 to be inspected based on the second result which is the calculation result from the second detection means 32 described above. The method of short circuit determination performed by the second determination means 62 is performed by comparing the second result with the state (short circuit result) without short circuit of the wiring pattern.

At this time, the second judging means 62 compares the second result with the short-circuit result, and if it is roughly the same, determines that there is no short circuit of the wiring pattern 8 (good quality). It is judged as (defective goods).

In addition, in the comparison performed by the second determination means 62, the amount / defect of the wiring pattern can be adjusted by adjusting the amount of difference between the short-circuit result and the second result.

As described above, the second determination means 62 compares the second result with the short-circuit result and performs the short-circuit determination. However, since the second result is synchronously detected based on the reference signal, the short-circuit result and output By performing the comparison, short circuit determination can be performed more accurately.

7 shows waveforms of signals calculated from three types of wiring patterns calculated by the second detection means. In this FIG. 7, the 2nd result of the good wiring pattern which is a short-circuit result is shown by the waveform T1, the 2nd result of the wiring pattern which has a short circuit is shown by the waveform T2, and the 2nd result of the wiring pattern which has another short circuit is shown. 2 The result is shown by the waveform T3.

As shown in FIG. 7, the output value is smaller than the state of the short circuit according to the state having a short circuit. For example, in FIG. 7, the wiring pattern of the short-circuit result (good quality) has the output b1. However, in the two wiring patterns T2 and T3 having a short circuit, the output is small to b2 and b3. It is.

For this reason, the 2nd determination means 62 can perform a short circuit determination from this output difference by calculating the output difference of a no short circuit result and a 2nd result of the 2nd detection means 32. As shown in FIG.

The determination result of the 1st determination means 61 and the 2nd determination means 62 is transmitted to the display means 7 mentioned later, respectively.

Here, since each determination is computed by a separate calculation process, the 1st determination means 61 and the 2nd determination means 62 can perform a parallel process (parallel process) of each process. In this way, the inspection time can be shortened by processing the first and second determination means 61 and 62 separately.

The 1st detection means 31 and the 2nd detection means 32 can also be expressed with the vector which makes x-y axis | shaft with respect to the wiring pattern 8, respectively. In this case, as shown in FIG. 8, conduction determination and short circuit determination can also be performed by comparing with the vector in the case of good quality products. For example, in FIG. 8, the arrow Z represents a reference vector (vector in the case of good quality), and the vector of the arrow Z1 has almost zero phase amount, so that the conduction inspection is not a problem, but the output is small. You can determine that you have a short circuit problem. Further, since the vector of the arrow Z2 has a large phase amount and differs from the reference, it can be determined that there is a conduction problem.

By vector display in this way, it is possible to visually confirm the conduction judgment and the short circuit decision.

The display means 7 displays the determination result of the 1st determination means 61 or the 2nd determination means 62. As shown in FIG. This display means 7 can use display apparatuses, such as what is called a liquid crystal display.

The above is description of the structure of the board | substrate inspection apparatus 1 of one Embodiment which concerns on this invention.

Next, operation | movement of the board | substrate inspection apparatus 1 of one Embodiment concerning invention is demonstrated.

9 shows a flowchart in the case where the substrate inspection apparatus according to the embodiment of the present invention is implemented.

First, the glass substrate 100 is placed on the mounting table 11 of the substrate inspection apparatus 1, and the substrate 100 is prepared to be inspected (S1).

At this time, the first electrode portion 51 is physically brought into contact with the plurality of first base portions 812, and the second electrode portion 52 is brought into physical contact with the plurality of second base portions 822. do.

Moreover, the wiring pattern 8 which consists of the 1st wiring pattern 81 and the 2nd wiring pattern 82 is formed in the board | substrate 100, and the information about the shape and arrangement | positioning interval of this wiring pattern 8 is provided. Are stored in memory. Since such information is stored in the storage device, it is possible to specify which wiring pattern the detection signal detected by the signal detecting means 2 is from which wiring pattern.

When the substrate 100 is prepared, the reference signal applied by the power supply means 5 is set.

When the test preparation is completed, the signal detecting means 2 moves the predetermined position of the wiring pattern 8 (S2).

At this time, as shown in FIG. 3, the 1st measuring part 21 of the signal detection means 2 is the vicinity of the 1st base part 812 of the 1st linear upper part 811, and the 2nd linear upper part 821. As shown in FIG. It is arrange | positioned so that the tip top of) may move alternately. And the signal applied to each wiring pattern 8 (1st wiring pattern 81 or 2nd wiring pattern 82) is detected.

As described above, the difference from the first measuring unit 21 may be used as the detection signal using the second measuring unit 22.

When the first measuring unit 21 detects a signal from each wiring pattern, the detection signal and the reference signal are transmitted to the inspection signal calculating means, and a signal for conduction determination and short circuit determination is calculated (S3).

First, the phase amount calculation means 33 calculates the phase amount (S4).

At this time, the phase amount calculating means 33 digitally converts the reference signal and the detection signal, respectively, as described above, and calculates the phase shift (phase amount) using this converted value.

The phase amount calculated by the phase amount calculating means 33 is sent to the first detection means 31.

The first detection means 31 sets the phase amount calculated by the phase amount calculation means 33 as a predetermined phase based on the reference signal, and detects the phase of the predetermined phase (phase detection that is ideal for the phase). (S5).

The first detection means 31 transmits the first result calculated by the detection to the first determination means 61.

The first determination means 61 calculates the phase difference by comparing the first result with the good conduction result. Then, the first determination means 61 makes a conduction determination based on this phase difference (S6).

At this time, as shown in Fig. 6, both of the conduction defects can be determined according to the shift amount (phase amount) of the phase from the reference signal, and the resistance value is calculated according to the shift amount.

In the above description, the case where the predetermined phase is calculated by the phase amount calculating means 33 has been described. However, the first detecting means 31 may be set so that the reference signal is detected 90 degrees with the predetermined phase being 90 degrees in advance. .

In addition, while conduction determination is performed on the wiring pattern to be inspected, a short circuit determination on the wiring pattern is also performed.

The second detection means 32 of the test signal calculation means 3 performs synchronous detection of the test signal based on the reference signal (S7).

At this time, the second result is calculated by the synchronous detection of the second detection means 32. This second result is transmitted to the second determination means 62.

The second determination means 62 calculates the output difference by comparing the second result with the short-circuit result. Then, the second judging means 62 makes a short circuit judgment based on this output difference (S8).

At this time, as shown in FIG. 7, it is possible to determine the presence or absence of a short circuit in response to the difference in the output from the reference signal.

10 and 11 show graphs of a first result and a second result when a plurality of wiring patterns arranged in parallel using the present invention are examined. 10 and 11 show the first result, and the lower part shows the second result.

In the regions A and B in the graph shown in FIG. 10, the first result is in a protruding state, and it is possible to detect that the wiring pattern at this place is causing poor conduction.

In the region C in the graph shown in FIG. 11, the output of the second result is small (amplitude is small), and it can be detected that a short circuit exists.

In addition, in the poor conduction point of FIG. 10, it is also possible to set so that the resistance value of a wiring pattern may be calculated by calculating these protrusion amounts.

According to the inventions of claims 1 and 9, it is possible to apply a reference signal to the wiring pattern to be inspected and to conduct a conduction determination and a short circuit determination from a detection signal detected from the wiring pattern to be inspected. Thus, conduction and short circuit can be determined by one application signal.

Moreover, since the said determination means has the 1st determination means which performs the conduction determination of the said wiring pattern from the said 1st result, and the 2nd determination means which performs the short circuit determination of the said wiring pattern from the said 2nd result, it is the conduction determination and Short circuit determination can be performed as a process of a separate process.

delete

According to the invention of claim 3, since the predetermined phase used in the first detection means is calculated by phase amount calculation means for calculating phase amounts of the reference signal and the detection signal, short circuit determination is performed. For a predetermined phase, a stable and accurate phase of the reference signal and the detection signal can be calculated.

delete

Therefore, when performing phase detection using a predetermined phase, a stable and accurate calculation result can be obtained.

According to the invention of claim 1, since the conduction determination performed by the first determining means is determined in comparison with the first result and the good result of the wiring pattern set in advance, it is compared with the output result in the case of good quality. It is possible to determine the defectiveness of the conduction of the wiring pattern.
According to the invention as set forth in claim 9, since the short circuit determination performed by the second determination means is determined in comparison with the second result and the good result of the wiring pattern set in advance, The presence or absence of a short circuit of the wiring pattern can be determined.

According to the invention of claim 7, since the conduction determination of the first determination means and the short circuit determination of the second determination means are processed at the same time, the conduction determination and the short circuit determination are simultaneously processed for one wiring pattern. It becomes possible to do this, and it becomes possible to shorten the tact required for inspection of a board | substrate.

delete

According to the invention of claim 8, since the signal detecting means moves in a direction perpendicular to the major axis direction of the first wiring pattern and the second wiring pattern, a plurality of first and second wiring patterns are formed. The conduction determination and the short circuit determination can be performed continuously.

According to the invention of Claims 10 and 11, it is possible to apply a reference signal to the wiring pattern to be inspected and to conduct a conduction determination and a short circuit determination from a detection signal detected from the wiring pattern to be inspected. Thus, conduction and short circuit can be determined by one application signal.

For this reason, it does not require a complicated structure and enables the conduction of a wiring pattern and the test | inspection of a short circuit with a simple structure.

Claims (11)

And a first wiring pattern having a first linear portion and a first base portion extending from one end of the first linear portion, and a second base portion extending from a second linear portion and one end of the second linear portion. A substrate inspection apparatus for inspecting a substrate in which a plurality of second wiring patterns disposed at positions opposite to the first wiring pattern are alternately formed. Signal detection means for physically contacting one wiring pattern to be inspected and detecting a signal applied to the wiring pattern; A first electrode part disposed in physical contact with the first base part of the first wiring pattern; A second electrode part disposed in physical contact with the second base part of the second wiring pattern; Power supply means for supplying a reference signal having a predetermined period to the first electrode portion and the second electrode portion; First detection means for performing phase detection of a predetermined phase based on the reference signal from the detection signal detected by the signal detection means; Second detection means for performing synchronous detection based on the reference signal from the detection signal detected by the signal detection means; Determination means for conducting a conduction determination and a short circuit determination of one wiring pattern to be the inspection target from the first result in the first detection means and the second result in the second detection means; Wherein the determination means determines, First determination means for performing conduction determination of the wiring pattern from the first result; Second determination means for performing a short circuit determination of the wiring pattern from the second result; The said 1st determination means is previously made as said 1st result based on the signal concerning the wiring pattern of the inspection object obtained as said 1st result by phase detection by said 1st detection means, and the wiring pattern of the good goods used as a reference. The board | substrate test | inspection apparatus characterized by calculating the amount of shift | offset | difference of phase with a signal to be set, and conducting determination of the wiring pattern of a test object based on the amount of shift | offset | difference of the phase. The method according to claim 1, The said 1st determination means calculates the resistance value of the wiring pattern of a test object based on the calculated shift amount of the phase, and performs the conduction determination of the wiring pattern of a test object based on the calculated resistance value. Inspection device. The method according to claim 1, And said predetermined phase used in said first detection means is calculated by phase amount calculation means for calculating phase amounts of said reference signal and said detection signal. The method of claim 3, The phase amount detecting means digitizes the positive analog value larger than the reference of the reference signal or the negative analog value smaller than the reference, and digitizes the positive analog value larger than the reference of the detection signal or the negative analog value smaller than the reference. And a phase difference obtained by an exclusive logical sum of the digitized reference signal and the digitized detection signal as the predetermined phase. The method according to claim 1, The said second determination means is previously made as said 2nd result based on the signal concerning the wiring pattern of the inspection object obtained as said 2nd result by the synchronous detection by the said 2nd detection means, and the wiring pattern of the good goods used as a reference | standard. The board | substrate test | inspection apparatus characterized by calculating the output value difference of the signal set, and performing a short circuit determination of the wiring pattern of a test object based on the output value difference. 6. The method of claim 5, The difference in amount of the phase calculated by the first judging means and the difference in the output values calculated by the second judging means are displayed by a vector representation in which each display unit has an xy axis. Inspection device. The method according to claim 1, The conduction determination of the first determination means and the short circuit determination of the second determination means are simultaneously processed. The method according to any one of claims 1 to 7, And said signal detecting means moves in a direction perpendicular to the major axis direction of said first wiring pattern and said second wiring pattern. And a first wiring pattern having a first linear portion and a first base portion extending from one end of the first linear portion, and a second base portion extending from a second linear portion and one end of the second linear portion. A substrate inspection apparatus for inspecting a substrate in which a plurality of second wiring patterns disposed at positions opposite to the first wiring pattern are alternately formed. Signal detection means for physically contacting one wiring pattern to be inspected and detecting a signal applied to the wiring pattern; A first electrode part disposed in physical contact with the first base part of the first wiring pattern; A second electrode part disposed in physical contact with the second base part of the second wiring pattern; Power supply means for supplying a reference signal having a predetermined period to the first electrode portion and the second electrode portion; First detection means for performing phase detection of a predetermined phase based on the reference signal from the detection signal detected by the signal detection means; Second detection means for performing synchronous detection based on the reference signal from the detection signal detected by the signal detection means; Determination means for conducting a conduction determination and a short circuit determination of one wiring pattern to be the inspection target from the first result in the first detection means and the second result in the second detection means; Wherein the determination means determines, First determination means for performing conduction determination of the wiring pattern from the first result; It has a 2nd determination means which performs the short circuit determination of the said wiring pattern from a said 2nd result, The said second determination means is previously made as said 2nd result based on the signal concerning the wiring pattern of the inspection object obtained as said 2nd result by the synchronous detection by the said 2nd detection means, and the wiring pattern of the good goods used as a reference | standard. The board | substrate test | inspection apparatus characterized by calculating the output value difference with the signal set, and performing a short circuit determination of the wiring pattern of a test object based on the output value difference. And a first wiring pattern having a first linear portion and a first base portion extending from one end of the first linear portion, and a second base portion extending from a second linear portion and one end of the second linear portion. A substrate inspection method for inspecting a substrate in which a plurality of second wiring patterns alternately disposed at opposite positions to the first wiring pattern are formed. A first electrode part is disposed in physical contact with the plurality of first base parts, A second electrode part is disposed in physical contact with the plurality of second base parts, Supplying a reference signal having a predetermined period to the first electrode portion and the second electrode portion, The signal applied to the wiring pattern is detected by signal detection means physically disposed in a non-contact manner on one wiring pattern to be inspected, From the detection signal detected by the said signal detection means, phase detection of a predetermined phase is calculated by a 1st detection means based on the said reference signal, From the detection signal detected by the signal detection means, a synchronous detection is calculated by the second detection means based on the reference signal, The conduction determination and the short circuit determination of the wiring pattern are made from the first result in the first detection means and the second result in the second detection means, In the conduction determination based on the first result, the signal is determined based on a signal relating to a wiring pattern to be inspected as the first result by phase detection by the first detection means and a wiring pattern of a good product as a reference. The board | substrate test | inspection method characterized by calculating the deviation amount of the phase with a signal preset as a 1st result, and making the conduction determination of the wiring pattern of a test object based on the deviation amount of the phase. And a first wiring pattern having a first linear portion and a first base portion extending from one end of the first linear portion, and a second base portion extending from a second linear portion and one end of the second linear portion. A substrate inspection method for inspecting a substrate in which a plurality of second wiring patterns alternately disposed at opposite positions to the first wiring pattern are formed. A first electrode part is disposed in physical contact with the plurality of first base parts, A second electrode part is disposed in physical contact with the plurality of second base parts, Supplying a reference signal having a predetermined period to the first electrode portion and the second electrode portion, The signal applied to the wiring pattern is detected by signal detection means physically disposed in a non-contact manner on one wiring pattern to be inspected, From the detection signal detected by the said signal detection means, phase detection of a predetermined phase is calculated by a 1st detection means based on the said reference signal, From the detection signal detected by the signal detection means, a synchronous detection is calculated by the second detection means based on the reference signal, The conduction determination and the short circuit determination of the wiring pattern are made from the first result in the first detection means and the second result in the second detection means, On the basis of the second result, in the short circuit determination, based on the signal concerning the wiring pattern of the inspection object obtained as the second result by the synchronous detection by the second detection means, and the wiring pattern of the good product as a reference. A substrate inspection method comprising calculating an output value difference from a signal preset as a second result and performing a short circuit determination of the wiring pattern to be inspected based on the output value difference.

Images