CN104635139A - Low-temperature performance test system of integrated circuit - Google Patents
Low-temperature performance test system of integrated circuit Download PDFInfo
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- CN104635139A CN104635139A CN201410835788.8A CN201410835788A CN104635139A CN 104635139 A CN104635139 A CN 104635139A CN 201410835788 A CN201410835788 A CN 201410835788A CN 104635139 A CN104635139 A CN 104635139A
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Abstract
The invention discloses a low-temperature performance test system of an integrated circuit. The low-temperature performance test system comprises an integrated circuit test machine, an integrated circuit, heat conduction silica gel, a peltier element, a temperature sensor and a controller; a refrigerating end of the peltier element generates first heat corresponding to current working current, the first heat is transferred to the integrated circuit through the heat conduction silica gel so as to reduce the temperature of the integrated circuit; the temperature sensor measures a temperature value of the heat conduction silica gel according to a preset condition and transmits the temperature value to the controller; the controller increases the working current of the peltier element according to the temperature value and a preset target temperature value until the temperature value is lowered to be equal to the target temperature value; the controller transmits the temperature value to the integrated circuit test machine, and the integrated circuit test machine is used for testing the performance of the integrated circuit when the temperature value is lowered to the target temperature value. By adopting the low-temperature performance test system, the temperature can be rapidly and precisely controlled, so that a test result of the low-temperature performance test for the integrated circuit is more accurate.
Description
Technical field
The present invention relates to technical field of measurement and test, particularly relate to a kind of cryogenic property test macro of integrated circuit.
Background technology
Integrated circuit (Integrated Circuit, IC) is a kind of microelectronic device or parts.Adopt certain technique, together with the elements such as transistor required in a circuit, resistance, electric capacity and inductance and wire interconnects, be produced on a fritter or a few fritter semiconductor wafer or dielectric substrate, be then encapsulated in a shell, become the microstructure with required circuit function.Wherein all elements structurally form a whole, make electronic component stride forward major step towards microminaturization, low-power consumption, intellectuality and high reliability aspect.
The performance of integrated circuit is not unalterable, and temperature is the key factor affecting performance of integrated circuits, and along with the change of temperature, the conductive capability, limiting voltage, limiting current, switching characteristic etc. of integrated circuit all corresponding change can occur.Therefore, in the performance test of integrated circuit, cryogenic property test is an important content, refers to make it work at low ambient temperatures by the temperature of control integration circuit, the performance of testing integrated circuits in this case.At present, when carrying out cryogenic property test to integrated circuit, usually adopt pressure gas refrigeration to produce cold air, by cold air indirectly by Conduction At Low Temperature to the mode of integrated circuit.But the conduction efficiency of this kind of mode is low, error is large, temperature controlled poor accuracy, thus the accuracy causing cryogenic property to be tested is poor, and the air generating device volume of relevant temperature is large, cause cost higher.
Summary of the invention
The invention provides a kind of cryogenic property test macro of integrated circuit, existing mode conduction efficiency be low, error is large to solve, temperature controlled poor accuracy, thus the accuracy causing cryogenic property to be tested is poor, the problem that cost is higher.
In order to solve the problem, the invention discloses a kind of cryogenic property test macro of integrated circuit, comprise: ic tester, integrated circuit, heat conductive silica gel, peltier-element, temperature sensor and controller, described peltier-element comprises refrigeration end and current terminal;
Wherein, described ic tester is connected with described integrated circuit and described controller; Described integrated circuit is connected with described heat conductive silica gel; Described heat conductive silica gel is connected with the refrigeration end of described peltier-element and described temperature sensor respectively; Described controller is connected with the current terminal of described peltier-element and described temperature sensor respectively;
The refrigeration end of described peltier-element produces first heat corresponding with current working current, and described first heat is passed to described integrated circuit by heat conductive silica gel, to reduce the temperature of described integrated circuit;
Described temperature value according to the temperature value of the described heat conductive silica gel of pre-conditioned measurement, and is sent to described controller by described temperature sensor;
Described controller increases the working current of described peltier-element according to described temperature value and the target temperature value preset, until described temperature value be reduced to equal with described target temperature value till;
Described temperature value is sent to described ic tester by described controller, and described ic tester, when described temperature value is reduced to described target temperature value, is tested the performance of described integrated circuit.
Preferably, described peltier-element comprises the peltier-element of plural serial stage.
Preferably, described peltier-element also comprises radiating end;
In the peltier-element of described plural serial stage, the refrigeration end of first order peltier-element is connected with described heat conductive silica gel; Second level peltier-element is connected with the radiating end of upper level peltier-element respectively to the refrigeration end of the peltier-element at different levels in afterbody peltier-element.
Preferably, described system also comprises: heat dissipation equipment;
In the peltier-element of described plural serial stage, the radiating end of afterbody peltier-element is connected with described heat dissipation equipment.
Preferably, in the peltier-element of described plural serial stage, from first order peltier-element to afterbody peltier-element, the area of peltier-element at different levels reduces successively.
Preferably, the area of described first order peltier-element and the area equation of described heat conductive silica gel.
Preferably, described system also comprises: heat dissipation equipment;
Described heat dissipation equipment is connected with the radiating end of described peltier-element, and the second heat that the radiating end of described peltier-element produces is distributed by described heat dissipation equipment, and wherein, described second heat is higher than described first heat.
Preferably, described heat dissipation equipment is also connected with described controller, and described controller adjusts the specific heat load of described heat dissipation equipment according to described temperature value.
Preferably, described system also comprises adiabatic cotton; Described adiabatic cotton is arranged on the periphery of described heat conductive silica gel and described peltier-element.
Preferably, described system also comprises jig, and described jig is arranged on the periphery of described heat conductive silica gel and described peltier-element.
Compared with prior art, the present invention includes following advantage:
In the present invention, the cryogenic property test macro of integrated circuit comprises ic tester, integrated circuit, heat conductive silica gel, peltier-element, temperature sensor and controller, and wherein, ic tester is connected with integrated circuit and controller; Integrated circuit is connected with heat conductive silica gel; Heat conductive silica gel is connected with the refrigeration end of peltier-element and temperature sensor respectively; Controller is connected with the current terminal of peltier-element and temperature sensor respectively.The refrigeration end of peltier-element produces first heat corresponding with current working current, and described first heat is passed to described integrated circuit by heat conductive silica gel, to control the temperature of described integrated circuit, temperature sensor is according to the temperature value of the described heat conductive silica gel of pre-conditioned measurement, and described temperature value is sent to described controller, controller increases the working current of described peltier-element according to described temperature value and the target temperature value preset, until described temperature value be reduced to equal with described target temperature value till, described temperature value is sent to described ic tester by controller, described ic tester is when described temperature value arrives described target temperature value, the performance of described integrated circuit is tested.Peltier-element is used to pass through the working temperature of the direct control integration circuit of heat conductive silica gel in the present invention, indirect for air temperature control is changed over and directly contacts temperature control, thus reach control temperature quickly and accurately, the test result that cryogenic property for integrated circuit is tested is more accurate, test process is easier, and can equipment volume be reduced, reduce costs.
Accompanying drawing explanation
Fig. 1 is the structured flowchart of the cryogenic property test macro of a kind of integrated circuit of the embodiment of the present invention one;
Fig. 2 is the structural representation of the cryogenic property test macro of a kind of integrated circuit of the embodiment of the present invention two;
Fig. 3 is the structural representation of a kind of multistage peltier-element of the embodiment of the present invention two;
Fig. 4 is the schematic diagram that a kind of multistage peltier-element of the embodiment of the present invention two is connected with heat conductive silica gel and heat dissipation equipment respectively;
Fig. 5 is the structural representation of the cryogenic property test macro of the another kind of integrated circuit of the embodiment of the present invention two.
Embodiment
For enabling above-mentioned purpose of the present invention, feature and advantage become apparent more, and below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
Embodiment one
With reference to Fig. 1, show the structured flowchart of the cryogenic property test macro of a kind of integrated circuit of the embodiment of the present invention one.
The cryogenic property test macro of the integrated circuit in the present embodiment can comprise ic tester 101, integrated circuit 102, heat conductive silica gel 103, peltier-element 104, temperature sensor 105 and controller 106.Wherein, described peltier-element can comprise refrigeration end, radiating end and current terminal.The annexation of each assembly above-mentioned is as follows: described ic tester is connected with described integrated circuit and described controller; Described integrated circuit is connected with described heat conductive silica gel; Described heat conductive silica gel is connected with the refrigeration end of described peltier-element and described temperature sensor respectively; Described controller is connected with the current terminal of described peltier-element and described temperature sensor respectively.
Due in the embodiment of the present invention, object will carry out cryogenic property test to integrated circuit, namely, when the temperature of integrated circuit is reduced to target temperature value, the respective performances of testing integrated circuits, the temperature therefore for integrated circuit carries out controlling to be the temperature reducing integrated circuit.
Wherein, can be connected by lead-in wire between controller and the refrigeration end of peltier-element, controller can increase the working current of peltier-element by the current terminal of peltier-element, peltier-element is under the effect of this working current, and refrigeration end wherein will produce first heat corresponding with current working current.Being discussed below of paltie effect: when the loop consisted of different conductors electric current, except the irreversible Joule heat of generation, in the joint of different conductor along with heat absorption, exothermic phenomenon can appear in the difference of direction of current respectively.If electric current flows to the lower one end B of free electron number from one end A that free electron number is higher, then the temperature of B end will raise; Otherwise the temperature of B end will reduce.If electric current flows to conductor 2 by conductor 1, then within the unit interval, joint absorption/liberated heat is directly proportional to the current density by joint.Namely after peltier-element is electrified, the heat of refrigeration end is moved to radiating end, causes the temperature of refrigeration end to reduce, and the end temperature of heat radiation raises.
The refrigeration end of peltier-element can connect (such as contacting with the connection between heat conductive silica gel, certain surface contact by the surface of the refrigeration end of peltier-element and heat conductive silica gel), heat conductive silica gel is high-end guides thermalize compound, there is the advantages such as high thermal conductivity, splendid thermal conductivity, the exhausted property of good electricity, wider serviceability temperature, stronger stability in use, lower denseness and good workability, such as short circuit equivalent risk can be avoided.First heat (i.e. low temperature) corresponding with current working current produced can be passed to heat conductive silica gel (as heat-conducting silica gel sheet) by the refrigeration end of peltier-element, and by heat conductive silica gel, this first heat is passed to described integrated circuit, thus reduce the temperature of integrated circuit.
Connection between heat conductive silica gel with temperature sensor can for contacting connection (such as, temperature sensor is installed to heat conductive silica gel surface), it (is also the temperature of the refrigeration end of Peltier that temperature sensor is used for according to the temperature value of the described heat conductive silica gel of pre-conditioned measurement, also be the temperature of integrated circuit), and described temperature value is sent to described controller.Wherein pre-conditioned can be measure in real time, and also can be measure according to predetermined period, the embodiment of the present invention not be limited this.
Can be connected by lead-in wire between controller and temperature sensor, controller is after the temperature value receiving temperature sensor transmission, the temperature of contemporary integrated circuits can be learnt, and then increase according to described temperature value and the target temperature value preset the working current inputing to described peltier-element, thus after the working current of peltier-element is increased, its refrigeration end produces first heat (namely first heat reduce) corresponding with the working current after increase, and continue this first heat to be passed to integrated circuit by heat conductive silica gel, and then reduce the temperature of integrated circuit, until namely the temperature value temperature value of integrated circuit (also) of heat conductive silica gel be reduced to equal with described target temperature value till.
The temperature of the embodiment of the present invention controls to adopt closed loop feedback system, the working temperature of integrated circuit is recorded by temperature sensor, by increasing the working current of peltier-element, dynamic realtime reduces the temperature of integrated circuit, reaches the object of stability contorting Integrated Circuit Temperature.In order to improve temperature controlled precision, resolution can be selected in the embodiment of the present invention to be the temperature sensor of 0.5 DEG C, certainly, according to the different requirements to control accuracy, the temperature sensor of other arbitrary resolutions can also be selected, resolution more high control precision is higher, and the embodiment of the present invention is not limited this.
In one preferred embodiment of the invention, when the temperature of integrated circuit is controlled, ensure that the amplitude that the temperature of integrated circuit reduces at every turn can not be too large, to avoid because larger change (amplitude of reduction is larger) occurs temperature, considerable influence is produced to the performance of integrated circuit.Therefore can pre-set temperature control curve, this curve is the curve of the corresponding relation describing temperature and time, and the temperature such as arranging reduction per minute is how many, and controller can adjust according to the working current of this temperature lowering curve to peltier-element.
When increasing the working current of peltier-element on the basis of the working current in current peltier-element, the first heat that the refrigeration end of this peltier-element produces reduces on the basis of current first heat; Otherwise when reducing the working current of peltier-element on the basis of the working current in current peltier-element, the first heat that the refrigeration end of this peltier-element produces raises on the basis of current first heat.When the working current amplitude of variation of peltier-element is larger, the amplitude of variation of the first heat of the refrigeration end generation of this peltier-element is also larger, otherwise, when peltier-element working current amplitude of variation more hour, the amplitude of variation of the first heat that the refrigeration end of this peltier-element produces is also less.
Therefore, in the embodiment of the present invention, first a target temperature value can be set, namely need the desired value temperature of integrated circuit be reduced to, therefore this target temperature value is less than the current temperature value of the heat conductive silica gel that is in course of adjustment (temperature value that also namely integrated circuit is current).Therefore, the process that controller increases the working current of peltier-element according to the temperature value of heat conductive silica gel and the target temperature value preset can be: if described temperature value (i.e. the current temperature value of temperature sensor measurement) is greater than target temperature value, then increase the working current of peltier-element according to the temperature control curve preset; If described temperature value equals target temperature value, then without the need to increasing the working current of peltier-element.After the working current increasing peltier-element, the first heat that the refrigeration end of peltier-element produces also will reduce, therefore temperature sensor also can continue the temperature (being also the temperature of integrated circuit) detecting heat conductive silica gel, and temperature value is sent to controller, controller continues the working current according to this temperature value adjustment peltier-element, namely whole adjustment process is a circulation, until the temperature value of integrated circuit be reduced to equal with described target temperature value till.
Such as, temperature control curve is set to change per minute 5 DEG C, and as the working current change x of peltier-element, the time that reaching temperature variation 5 DEG C needs is 2 minutes, as the working current change y of peltier-element, the time that reaching temperature variation 5 DEG C needs is 1 minute.Therefore, when controller receives the temperature value of temperature sensor transmission, if need to reduce by 5 DEG C on the basis of current temperature value, then the working current of adjustment peltier-element makes it increase y by controller, to ensure that the temperature of integrated circuit after 1 minute can reduce by 5 DEG C, thus the requirement of satisfied temperature controlling curve.
In the embodiment of the present invention, ic tester as described in corresponding running parameter (as temperature value) can also be sent to by controller, described ic tester is when described temperature value is reduced to described target temperature value, the performance of described integrated circuit is tested, also be, when the temperature value of integrated circuit is reduced to the target temperature value of requirement, ic tester starts to test the performance of integrated circuit, i.e. the cryogenic property of testing integrated circuits.
The low-temperature working performance of integrated circuit is mainly divided into two aspects, and be on the one hand the correctness of function, qualified product should normally use at an established temperature, should not occur functionality errors, as started, logical mistake etc.; Be the reliability of integrated circuit on the other hand, have the concept of a time, the ability that assessment integrated circuit works long hours at low temperatures.For active device, according to the test condition preset, use the program preset, the function of checking to-be-measured integrated circuit; For passive device, by loading default input signal, measure the output signal of to-be-measured integrated circuit, whether qualified according to the performance of design specification determination integrated circuit.Wherein, active device refers to have independently computing, processing power, the integrated circuit that do not need external devices namely to can work independently, such as CPU (Central Processing Unit, CPU (central processing unit)), MCU (Micro Control Unit, micro-control unit) etc.; Passive device refers to itself does not have processing power or output signal, needs to load certain test condition just workable integrated circuit, such as Flash (flash memory) etc.
Below, by once two concrete examples, the cryogenic property test process to integrated circuit is described:
Start-up time in example one, test for low temperature-40 DEG C of situations
The condition of work that MCU demand fulfillment is harsh, design objective regulation working temperature be-40 DEG C ~ 105 DEG C, and this test phase needs to assess integrated circuit start-up time at low ambient temperatures.
Test process:
1, the PCB at to-be-measured integrated circuit place is fixed to detection clamp.
2, according to the temperature control curve preset, cool to-40 DEG C from laboratory temperature (+25 DEG C), maintain one minute.Concrete temperature-fall period is with reference to above-mentioned associated description.
3, power supply is opened, use the signal of oscillograph seizure VCC pin (power supply input) (embodying the signal of power supply input) and RST pin (during as output simultaneously, be used to indicate the duty of chip, be 0 when power supply does not reach normal, power supply is 1 after reaching normal value) signal (embody export signal).
4, measure the time delays between the signal of VCC pin and the signal of RST pin, determine start-up time.
5, power supply is closed.
6, keep-40 DEG C of low temperature one minute, repeat step 3.
7, to same integrated circuit repeated test repeatedly (as 8 times), the sample size of General Requirements test is multiple (as being no less than 10).
8, set up distribution plan start-up time of "-40 DEG C of low temperature " according to test case, according to design specification and the measurement standard of integrated circuit, determine whether function meets the demands.
Reliability in example two, test for low temperature-40 DEG C of situations
The condition of work that MCU demand fulfillment is harsh, design objective regulation working temperature be-40 DEG C ~ 105 DEG C, and this test phase needs the reliability of assessment volume production integrated circuit when low temperature environment work 1000 hours.
Test process:
1, the PCB at to-be-measured integrated circuit place is fixed to detection clamp.
2, according to the temperature control curve preset, cool to-40 DEG C from laboratory temperature (+25 DEG C), maintain one minute.Concrete temperature-fall period is with reference to above-mentioned associated description.
3, under the low temperature of-40 DEG C, use test procedure, ensure that to-be-measured integrated circuit is operated in dynamic mode.
4, the test point (such as integrated circuit often work 200 constantly little) preset, returns to room temperature (+25 DEG C), utilizes the performance of ic tester testing integrated circuits.
5, return step 2 circulation and perform step 2 ~ step 4, until net cycle time is stop test after 1000 hours at low temperatures.
6, to same integrated circuit repeated test repeatedly (as 8 times), the sample size of General Requirements test is multiple (as being no less than 10).
7, set up the job failure time distribution map of "-40 DEG C of low temperature " according to test case, according to design specification and the measurement standard of integrated circuit, determine the reliability of integrated circuit.
Peltier-element is used to pass through the working temperature of the direct control integration circuit of heat conductive silica gel in the embodiment of the present invention, indirect for air temperature control is changed over and directly contacts temperature control, thus reach control temperature quickly and accurately, the test result that cryogenic property for integrated circuit is tested is more accurate, test process is easier, and can equipment volume be reduced, reduce costs.
Embodiment two
With reference to Fig. 2, show the structural representation of the cryogenic property test macro of a kind of integrated circuit of the embodiment of the present invention two.
In Fig. 2, the cryogenic property test macro of integrated circuit can comprise: ic tester 201, integrated circuit 202, heat conductive silica gel 203, peltier-element 204, temperature sensor 205, controller 206 and heat dissipation equipment 207.Wherein, integrated circuit is installed on PCB (Printed Circuit Board, printed circuit board is important electronic unit, is the supporter of electronic devices and components, is the carrier of electronic devices and components electrical connection).Peltier-element comprises refrigeration end, radiating end and current terminal.The annexation of each assembly above-mentioned is as follows: described integrated circuit is connected with described heat conductive silica gel; Described heat conductive silica gel is connected with the refrigeration end of described peltier-element and described temperature sensor respectively; Described controller is connected with the current terminal of described peltier-element and described temperature sensor respectively; Described heat dissipation equipment is connected with the radiating end of described peltier-element and described controller respectively.
The cryogenic property test macro of the integrated circuit shown in Fig. 2, relative to the system shown in above-mentioned Fig. 1, adds heat dissipation equipment, and this heat dissipation equipment can be heating radiator, radiator fan etc.Heat dissipation equipment is connected with the radiating end of peltier-element, and the second heat that the radiating end of peltier-element produces can be distributed by heat dissipation equipment, thus realizes the quick heat radiating of radiating end, ensures that peltier-element can long-time running.Wherein, the second heat is higher than the first heat, and namely the temperature of radiating end is higher than the temperature of refrigeration end.
Heat dissipation equipment can also be connected with controller (such as being connected by lead-in wire), controller is after the temperature value receiving temperature sensor transmission, according to the specific heat load of this temperature value adjustment heat dissipation equipment (as adjusted the rotating speed etc. of radiator fan), thus radiating rate can also be controlled.According to the associated description of above-described embodiment one, when increasing the working current of peltier-element on the basis of the working current in current peltier-element, the temperature that the refrigeration end of this peltier-element produces reduces on the basis of Current Temperatures, and the heat that now radiating end produces raises on the basis of current heat; Otherwise, when reducing the working current of peltier-element on the basis of the working current in current peltier-element, the temperature that the refrigeration end of this peltier-element produces raises on the basis of Current Temperatures, and the heat that now radiating end produces reduces on the basis of current heat.
Therefore, controller according to the process of the specific heat load of temperature value adjustment heat dissipation equipment can be: if described temperature value (i.e. the current temperature value of temperature sensor measurement) is greater than target temperature value, then increase the specific heat load of heat dissipation equipment; If described temperature value (i.e. the current temperature value of temperature sensor measurement) is less than target temperature value, then reduce the specific heat load of heat dissipation equipment; If described temperature value equals target temperature value, then without the need to adjusting the specific heat load of heat dissipation equipment.Controller, when receiving temperature value at every turn, can adjust accordingly the specific heat load of heat dissipation equipment.
For the related description of remaining component, with reference to the associated description of above-described embodiment one, the embodiment of the present invention is discussed no longer in detail at this.Therefore, the function of this embodiment middle controller at least can comprise following four kinds: carry out working current control to peltier-element, specific heat load control is carried out to heat dissipation equipment, temperature reading is carried out to temperature sensor, running parameter (as temperature value) is sent to ic tester.
In one preferred embodiment of the invention, above-mentioned peltier-element comprises the peltier-element of plural serial stage.As shown in Figure 3, be the structural representation of a kind of multistage peltier-element of the embodiment of the present invention two.As shown in Figure 3, in the peltier-element of described plural serial stage, second level peltier-element is connected with the radiating end of upper level peltier-element respectively to the refrigeration end of the peltier-element at different levels in afterbody peltier-element, namely the radiating end of first order peltier-element is connected with the refrigeration end of second level peltier-element, the radiating end of second level peltier-element is connected with the refrigeration end of third level peltier-element, by that analogy, the radiating end of penultimate stage peltier-element is connected with the refrigeration end of afterbody peltier-element.In the embodiment of the present invention, the area of peltier-element at different levels can be equal.Preferably, in order to save the area of peltier-element, in the peltier-element of described plural serial stage, from first order peltier-element to afterbody peltier-element, the area of peltier-element at different levels reduces successively, for the difference of the area of two-stage peltier-element, the embodiment of the present invention is not limited.Certainly, it can also be the area equation (being such as the first area) of wherein part peltier-element, area equation (be such as second area, second area is less than the first area) of remainder peltier-element etc., the embodiment of the present invention is not limited this.It should be noted that, merely illustrate first order peltier-element and second level peltier-element in Fig. 3, suspension points " ... " represents the peltier-element of residue rank.
As shown in Figure 4, be the schematic diagram that a kind of multistage peltier-element of the embodiment of the present invention two is connected with heat conductive silica gel and heat dissipation equipment respectively.As shown in Figure 4, this multistage peltier-element comprises first order peltier-element (Level 1), second level peltier-element (Level 2) and third level peltier-element (Level3), the refrigeration end of first order peltier-element (Level 1) is connected with described heat conductive silica gel, and the radiating end of afterbody peltier-element (Level 3) is connected with described heat dissipation equipment (heat radiator namely in Fig. 4).Preferably, the wherein area of first order peltier-element and the area equation of heat conductive silica gel.It should be noted that, Fig. 4 comprises 3 grades for multistage peltier-element to be described, and the multistage peltier-element do not represented in the present embodiment is defined as and comprises 3 grades.
With reference to Fig. 5, show the structural representation of the cryogenic property test macro of the another kind of integrated circuit of the embodiment of the present invention two.
In Fig. 5, the cryogenic property test macro of integrated circuit can comprise: integrated circuit 202, heat conductive silica gel 203, peltier-element 204, temperature sensor 205, controller 206, heat dissipation equipment 207, adiabatic cotton 208 and jig 209, wherein, integrated circuit is installed on PCB.Fig. 5 adds adiabatic cotton 208 and jig 209 on the basis of Fig. 2, it should be noted that, also comprises in ic tester 201 as shown in Figure 2 and controller 205, Fig. 5 not shown in this system.For wherein ic tester, integrated circuit, heat conductive silica gel, peltier-element, temperature sensor, annexation between controller and heat dissipation equipment with reference to the above-mentioned related description for Fig. 2, the embodiment of the present invention is discussed no longer in detail at this.
Wherein, adiabatic cotton is arranged on the periphery of described heat conductive silica gel and described peltier-element, for heat insulation, ensures temperature stabilization.As shown in Figure 5, can arrange adiabatic cotton in the periphery of two sides, left and right of heat conductive silica gel and peltier-element, certainly the periphery of any side of heat conductive silica gel and peltier-element can also arrange adiabatic cotton, the embodiment of the present invention is not limited this.
Jig is arranged on the periphery of described heat conductive silica gel and described peltier-element, for fixing control module (heat conductive silica gel, peltier-element, heat dissipation equipment), ensures to control module and integrated circuit reliable contacts.As shown in Figure 5, can arrange jig in the periphery at four angles of heat conductive silica gel and peltier-element, certainly can also arrange in other optional positions and open, as long as can reach the fixing effect controlling module, the embodiment of the present invention is not limited this.
In the embodiment of the present invention, use peltier-element by the working temperature of the direct control integration circuit of heat conductive silica gel, indirect for air temperature control is changed over and directly contacts temperature control, thus reach control temperature quickly and accurately, the test result that cryogenic property for integrated circuit is tested is more accurate, test process is easier, and can reduce equipment volume, reduces costs.Further, adopt the mode of multistage peltier-element, weight of equipment be light, volume is little, can not external dust be brought, because multistage peltier-element is a kind of shaped solid state heat pumps, thus its Maintenance free, noiselessness, shock resistance and anti-vibration ability strong.
Each embodiment in this instructions all adopts the mode of going forward one by one to describe, and what each embodiment stressed is the difference with other embodiments, between each embodiment identical similar part mutually see.
The present invention can describe in the general context of computer executable instructions, such as program module.Usually, program module comprises the routine, program, object, assembly, data structure etc. that perform particular task or realize particular abstract data type.Also can put into practice the present invention in a distributed computing environment, in these distributed computing environment, be executed the task by the remote processing devices be connected by communication network.In a distributed computing environment, program module can be arranged in the local and remote computer-readable storage medium comprising memory device.
Finally, also it should be noted that, in this article, the such as relational terms of first and second grades and so on is only used for an entity or operation to separate with another entity or operational zone, and not necessarily requires or imply the relation that there is any this reality between these entities or operation or sequentially.And, term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability, thus make to comprise the process of a series of key element, method, commodity or equipment and not only comprise those key elements, but also comprise other key elements clearly do not listed, or also comprise by the intrinsic key element of this process, method, commodity or equipment.When not more restrictions, the key element limited by statement " comprising ... ", and be not precluded within process, method, commodity or the equipment comprising described key element and also there is other identical element.
Above to the cryogenic property test macro of a kind of integrated circuit provided by the present invention, be described in detail, apply specific case herein to set forth principle of the present invention and embodiment, the explanation of above embodiment just understands method of the present invention and core concept thereof for helping; Meanwhile, for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (10)
1. a cryogenic property test macro for integrated circuit, it is characterized in that, comprising: ic tester, integrated circuit, heat conductive silica gel, peltier-element, temperature sensor and controller, described peltier-element comprises refrigeration end and current terminal;
Wherein, described ic tester is connected with described integrated circuit and described controller; Described integrated circuit is connected with described heat conductive silica gel; Described heat conductive silica gel is connected with the refrigeration end of described peltier-element and described temperature sensor respectively; Described controller is connected with the current terminal of described peltier-element and described temperature sensor respectively;
The refrigeration end of described peltier-element produces first heat corresponding with current working current, and described first heat is passed to described integrated circuit by heat conductive silica gel, to reduce the temperature of described integrated circuit;
Described temperature value according to the temperature value of the described heat conductive silica gel of pre-conditioned measurement, and is sent to described controller by described temperature sensor;
Described controller increases the working current of described peltier-element according to described temperature value and the target temperature value preset, until described temperature value be reduced to equal with described target temperature value till;
Described temperature value is sent to described ic tester by described controller, and described ic tester, when described temperature value is reduced to described target temperature value, is tested the performance of described integrated circuit.
2. system according to claim 1, is characterized in that, described peltier-element comprises the peltier-element of plural serial stage.
3. system according to claim 2, is characterized in that, described peltier-element also comprises radiating end;
In the peltier-element of described plural serial stage, the refrigeration end of first order peltier-element is connected with described heat conductive silica gel; Second level peltier-element is connected with the radiating end of upper level peltier-element respectively to the refrigeration end of the peltier-element at different levels in afterbody peltier-element.
4. system according to claim 3, is characterized in that, described system also comprises: heat dissipation equipment;
In the peltier-element of described plural serial stage, the radiating end of afterbody peltier-element is connected with described heat dissipation equipment.
5. system according to claim 2, is characterized in that,
In the peltier-element of described plural serial stage, from first order peltier-element to afterbody peltier-element, the area of peltier-element at different levels reduces successively.
6. system according to claim 5, is characterized in that, the area of described first order peltier-element and the area equation of described heat conductive silica gel.
7. system according to claim 1, is characterized in that, described system also comprises: heat dissipation equipment;
Described heat dissipation equipment is connected with the radiating end of described peltier-element, and the second heat that the radiating end of described peltier-element produces is distributed by described heat dissipation equipment, and wherein, described second heat is higher than described first heat.
8. system according to claim 7, is characterized in that, described heat dissipation equipment is also connected with described controller, and described controller adjusts the specific heat load of described heat dissipation equipment according to described temperature value.
9. system according to claim 1, is characterized in that, described system also comprises adiabatic cotton; Described adiabatic cotton is arranged on the periphery of described heat conductive silica gel and described peltier-element.
10. system according to claim 1, is characterized in that, described system also comprises jig, and described jig is arranged on the periphery of described heat conductive silica gel and described peltier-element.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410835788.8A CN104635139A (en) | 2014-12-26 | 2014-12-26 | Low-temperature performance test system of integrated circuit |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410835788.8A CN104635139A (en) | 2014-12-26 | 2014-12-26 | Low-temperature performance test system of integrated circuit |
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| CN201410835788.8A Pending CN104635139A (en) | 2014-12-26 | 2014-12-26 | Low-temperature performance test system of integrated circuit |
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