CN2831423Y - Active radiator of large-scale integrated chip - Google Patents
Active radiator of large-scale integrated chip Download PDFInfo
- Publication number
- CN2831423Y CN2831423Y CN 200520118765 CN200520118765U CN2831423Y CN 2831423 Y CN2831423 Y CN 2831423Y CN 200520118765 CN200520118765 CN 200520118765 CN 200520118765 U CN200520118765 U CN 200520118765U CN 2831423 Y CN2831423 Y CN 2831423Y
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- chip
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- refrigerating unit
- thermoelectric refrigerating
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses an active radiation device for a large-scale integrated chip, which is designed for overcoming the problem and the shortage that as the radiation effect of an active radiation device for a large-scale integrated chip in the existing communication system is poor, the working temperature of the chip is led to be too high. The active radiation device for a large-scale integrated chip of the utility model comprises a heat conducting fin, a thermoelectric refrigerating device, and a temperature-control device which can control the refrigerating intensity of the thermoelectric refrigerating device, wherein one side surface of the heat conducting fin is tightly attached to the outer surface of the chip; the cold end of the thermoelectric refrigerating device is tightly attached on the other side surface corresponding to the heat conducting fin, and is electrically connected with the output terminal of the temperature-control device. The utility model can smartly control the refrigerating intensity of a TEC through the temperature-control device, and the refrigerating efficiency of the TEC can be effectively improved; the utility model can be used for the radiation of a large-scale integrated chip in a communication system.
Description
Technical field
The utility model relates to a kind of heat abstractor, relates in particular to the heat abstractor of large scale integrated chip (LSI chip) in a kind of communication system.
Background technology
For the semiconductor chip of in the communications field, using, always wish that it can work stably in a long term.And temperature is one of key factor that influences chip performance stability and working life.Result of the test shows that under lower working temperature, because the transistor operating time is shorter, interconnected resistance is lower, and the service behaviour of chip is got a promotion.In order to make the chip steady operation, must in time the heat of its generation be arranged by the medium that is in contact with it and shed, to keep in the operating temperature range that the chip active area is in permission, prolong the useful life and the mean time between failures (MTBF) of chip, improve the job stability of chip.
Present communication system more and more trends towards using large scale integrated chip (LSI chip), and the main method of raising chip integration is exactly the more transistor of configuration on chip, improves the arithmetic speed of chip simultaneously, and the heat that brings chip to distribute thus is more and more higher.Development trend along with the miniaturization of communication system volume, adopt traditional fin that is widely used to add heat abstractor---the passive heat abstractor of fan in some occasion, absorb the heat of chip by aluminium or copper fin, make around the airflow passes fin by cooling fan operation again, with heat transferred surrounding air, because this kind structure has only a kind of mode of air cooling, the heat transfer efficiency that adds air is lower, when being difficult to satisfy the large scale integrated chip (LSI chip) steady operation to the requirement of temperature.
Thermoelectric refrigerating unit (TEC, Thermoelectric Cooler) also claims thermoelectric components or thermal power unit, form by semi-conducting material, be the high refrigerator of a kind of small-sized reliability, it utilizes semi-conductive peltier effect, promptly owing to the charge carrier average energy difference that participates in conduction in two kinds of conductors, when charge carrier when the high conductor of energy moves into the low conductor of energy, just discharge unnecessary energy (heat release), on the contrary, then absorb energy (heat absorption) from the external world.Thermoelectric refrigerating unit both can be used for heating and also can be used for cooling, utilized its refrigeration performance here.Concrete operation principle is described as follows, and TEC comprises two potsherds, accompanies some N type and P type semiconductor material knots that are mixed with impurity between the potsherd, and these semi-conducting material knots are connected in series by electrode.When electronics when P type semiconductor passes to N type semiconductor because heat is absorbed and causes an end temperature to descend and other end temperature rises, so just formed the heat transferred of TEC two sides potsherd, one side forms cold junction, another side formation hot junction.Heat by cold junction to direction and the size decision of the transfer rate in hot junction by electrical current.
Volume is little because TEC has, and refrigerating speed is fast, and is easy to use, and the control flexible characteristic is used it for chip cooling, under the situation that particularly the large scale integrated chip (LSI chip) caloric value is big in communication system, heat-dissipating space is little, has good effect.
The utility model content
The purpose of this utility model is that the passive heat abstractor radiating effect of large scale integrated chip (LSI chip) in the solution existing communication system is poor, cause the too high existing problem and shortage of chip operation temperature, provide a kind of efficient, fast, control the active heat abstractor of large scale integrated chip (LSI chip) flexibly.
For addressing the above problem, the utility model adopts following technical scheme: the active heat abstractor of this large scale integrated chip (LSI chip) comprises conducting strip, the Temperature-controlled appliance of thermoelectric refrigerating unit and may command thermoelectric refrigerating unit refrigeration intensity; One side of described conducting strip fits tightly in chip outer surface; Described thermoelectric refrigerating unit cold junction fits tightly on the relative another side of described conducting strip, and is electrically connected with the output of described Temperature-controlled appliance.
Adopt said structure, Temperature-controlled appliance is monitored the surface temperature of chip in real time by detected temperature signal; When chip temperature is higher, strengthen the refrigeration intensity of TEC, reduce the chip surface temperature rapidly; After the chip surface temperature descends, reduce the refrigeration intensity of TEC, guarantee that chip can work under suitable stable temperature, this shows, can control the refrigeration intensity of TEC neatly by Temperature-controlled appliance the utility model, effectively improved the refrigerating efficiency of TEC.
Description of drawings
Fig. 1 is the structural representation of the active heat abstractor of the utility model large scale integrated chip (LSI chip);
Fig. 2 is the electrical block diagram of Temperature-controlled appliance shown in Figure 1.
Embodiment
Below in conjunction with accompanying drawing, further specify technical characterictic of the present utility model and function characteristics, purpose is that the utility model can be described better, but is not to be used for limiting protection range of the present utility model.
Referring to Fig. 1, the active heat abstractor of the utility model large scale integrated chip (LSI chip) comprises aluminium or copper conducting strip 1, the Temperature-controlled appliance 3 of thermoelectric refrigerating unit 2 and may command thermoelectric refrigerating unit 2 refrigeration intensity; One side of described conducting strip 1 fits tightly in chip 4 outer surfaces by heat-conducting glue, and the temperature conduction that makes chip 4 outer surfaces is to conducting strip 1, and for increasing area of dissipation raising radiating efficiency, the area of section of described conducting strip 1 is greater than the area of section of chip 4; Described thermoelectric refrigerating unit 2 cold junctions fit tightly on the relative another side of described conducting strip 1, and are electrically connected with the output of described Temperature-controlled appliance 3.
For playing better radiating effect, this device also comprises and fitting tightly in the aluminium of thermoelectric refrigerating unit 2 hot junction outer surfaces or copper interdigitated electrode structure fin 5 and the fan 6 that is arranged at fin 5 peripheries.By the rotation of this fan 6, quicken fin 5 surrounding airs and flow, heat is discharged by air.
Described fin 5 is bonded in thermoelectric refrigerating unit 2 hot junction outer surfaces by heat-conducting glue, and improves radiating efficiency for increasing area of dissipation, and the area of section of described fin 5 is greater than the area of section in thermoelectric refrigerating unit 2 hot junctions.
Referring to Fig. 1 and Fig. 2, described Temperature-controlled appliance 3 comprises temperature collection circuit, the chip for driving of controller and the thermoelectric refrigerating unit 2 that is electrically connected with controller by the D/A change-over circuit; Described temperature collection circuit comprises the temperature sensing circuit that is arranged at conducting strip 1 temperature inside measuring component 7 and is electrically connected with this temperature-measuring element 7, and the detection analog signal of described temperature sensing circuit inputs to controller by penetrating with circuit and A/D change-over circuit; Described controller adopts programmable logic device (PLD, Programmable Logic Device) or field programmable gate array (FPGA, Field Programmable Gate Array); The output of the chip for driving of described thermoelectric refrigerating unit 2 is electrically connected with thermoelectric refrigerating unit 2.
Described temperature-measuring element 7 adopts thermistor or thermocouple.
Described temperature sensing circuit is the constant-current source testing circuit.
The chip for driving of described thermoelectric refrigerating unit 2 adopts special-purpose power drive chip, as ADN8830, DRV591 etc.
Below in conjunction with Fig. 2, specify as follows to the operation principle of the active heat abstractor of the utility model large scale integrated chip (LSI chip):
The circuit that Temperature-controlled appliance is formed by thermistor and constant-current source is finished the temperature acquisition function, owing to the resistance of the thermistor variations in temperature along with environment of living in changes, by constant-current source thermistor is encouraged, make the thermistor two ends produce voltage difference, this voltage difference inputs to PLD through penetrating with circuit and A/D change-over circuit; PLD is as the main control unit of Temperature-controlled appliance, the temperature signal of gathering is carried out low-pass filtering, be that the chip normal working temperature compares with it with the set temperature value that writes PLD by embedded type CPU in the communication system then, and TEC is exported control signal through control algolithm, thus the surface temperature of chip is monitored in real time; When chip temperature is higher, strengthen the refrigeration intensity of TEC, reduce the chip surface temperature rapidly; After the chip surface temperature descends, reduce the refrigeration intensity of TEC, guarantee that chip can work under suitable stable temperature, this shows, can control the refrigeration intensity of TEC neatly by Temperature-controlled appliance, effectively improved the refrigerating efficiency of TEC.
The TEC drive signal of PLD output transfers to special-purpose TEC power drive chip behind the D/A change-over circuit, outbound course is certain, the electric current of variable size, drive TEC the heat on the conducting strip is passed to thermoelectric refrigerating unit 2 hot junctions fast from thermoelectric refrigerating unit 2 cold junctions apace, be passed to again on the fin in thermoelectric refrigerating unit 2 hot junctions, and then the heat dissipation of fin gone out by fan air-supply.
Above-mentioned embodiment is illustrated the utility model with preferred embodiment, but the example of this visualization of just lifting for the ease of understanding should not be considered to be the restriction to the utility model scope.Equally, according to the description of the technical solution of the utility model and preferred embodiment thereof, can make various possible being equal to and change or replacement, and all these changes or replacement all should belong to the protection range of the utility model claim.
Claims (8)
1. the active heat abstractor of a large scale integrated chip (LSI chip) is characterized in that, this device comprises conducting strip, the Temperature-controlled appliance of thermoelectric refrigerating unit and may command thermoelectric refrigerating unit refrigeration intensity; One side of described conducting strip fits tightly in chip outer surface; Described thermoelectric refrigerating unit cold junction fits tightly on the relative another side of described conducting strip, and is electrically connected with the output of described Temperature-controlled appliance.
2. the active heat abstractor of large scale integrated chip (LSI chip) as claimed in claim 1 is characterized in that, this device also comprises and fitting tightly in the fin of thermoelectric refrigerating unit hot junction outer surface and the fan that is arranged at the fin periphery.
3. the active heat abstractor of large scale integrated chip (LSI chip) as claimed in claim 1 or 2 is characterized in that, described Temperature-controlled appliance comprises temperature collection circuit, the chip for driving of controller and the thermoelectric refrigerating unit that is electrically connected with controller by the D/A change-over circuit; Described temperature collection circuit comprises the temperature sensing circuit that is arranged at conducting strip temperature inside measuring component and is electrically connected with this temperature-measuring element, and the detection analog signal of described temperature sensing circuit inputs to controller by the A/D change-over circuit; Described controller adopts programmable logic device or field programmable gate array; The output of the chip for driving of described thermoelectric refrigerating unit is electrically connected with thermoelectric refrigerating unit.
4. the active heat abstractor of large scale integrated chip (LSI chip) as claimed in claim 3 is characterized in that, described temperature sensing circuit is the constant-current source testing circuit.
5. the active heat abstractor of large scale integrated chip (LSI chip) as claimed in claim 3 is characterized in that, described temperature-measuring element adopts thermistor or thermocouple.
6. the active heat abstractor of large scale integrated chip (LSI chip) as claimed in claim 1 is characterized in that, the adhesive that described conducting strip is made by Heat Conduction Material is bonded in chip outer surface, and the area of section of described conducting strip is greater than the area of section of chip.
7. the active heat abstractor of large scale integrated chip (LSI chip) as claimed in claim 2, it is characterized in that, the adhesive that described fin is made by Heat Conduction Material is bonded in thermoelectric refrigerating unit hot junction outer surface, and the area of section of described fin is greater than the area of section in thermoelectric refrigerating unit hot junction.
8. as the active heat abstractor of claim 2 or 7 described large scale integrated chip (LSI chip)s, it is characterized in that described fin is an interdigitated electrode structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520118765 CN2831423Y (en) | 2005-09-13 | 2005-09-13 | Active radiator of large-scale integrated chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520118765 CN2831423Y (en) | 2005-09-13 | 2005-09-13 | Active radiator of large-scale integrated chip |
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| Publication Number | Publication Date |
|---|---|
| CN2831423Y true CN2831423Y (en) | 2006-10-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200520118765 Expired - Lifetime CN2831423Y (en) | 2005-09-13 | 2005-09-13 | Active radiator of large-scale integrated chip |
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| CN (1) | CN2831423Y (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102647893A (en) * | 2012-05-17 | 2012-08-22 | 吉林大学 | Longitudinal cascade type integrated constant temperature radiator module |
| CN103137577A (en) * | 2011-12-01 | 2013-06-05 | 三星电子株式会社 | Thermoelectric cooling packages and thermal management methods thereof |
| CN101584097B (en) * | 2006-11-10 | 2013-08-14 | 德雷格医疗系统股份有限公司 | Portable device cooling system |
| CN103385700A (en) * | 2013-08-02 | 2013-11-13 | 王卫东 | High-precision rapid self-calibration wireless electronic thermometer |
| CN103887339A (en) * | 2012-12-19 | 2014-06-25 | 中兴通讯股份有限公司 | Transistor, transistor heat radiation structure and transistor production method |
| CN104635139A (en) * | 2014-12-26 | 2015-05-20 | 北京兆易创新科技股份有限公司 | Low-temperature performance test system of integrated circuit |
| CN104679059A (en) * | 2014-12-26 | 2015-06-03 | 北京兆易创新科技股份有限公司 | Temperature control system of integrated circuit |
| CN104697327A (en) * | 2013-12-09 | 2015-06-10 | 中冶长天国际工程有限责任公司 | Wireless temperature measurement system for rotary kiln |
| CN105050371A (en) * | 2015-09-02 | 2015-11-11 | 电子科技大学 | High-heat-flux electronic equipment hot spot removing device |
| CN109545950A (en) * | 2018-11-29 | 2019-03-29 | 内蒙古工业大学 | Thermoelectric radiating device and its cooling system |
| CN109673132A (en) * | 2018-12-11 | 2019-04-23 | 无锡睿勤科技有限公司 | A kind of heat dissipating method and device |
| CN110581113A (en) * | 2018-06-11 | 2019-12-17 | Oppo广东移动通信有限公司 | central processing unit assembly and heat dissipation control method thereof, electronic equipment and mobile phone |
| CN111124003A (en) * | 2019-10-09 | 2020-05-08 | 珠海格力电器股份有限公司 | Cooling system and method for power module and computer readable storage medium |
| CN111488010A (en) * | 2020-04-16 | 2020-08-04 | 深圳见炬科技有限公司 | Large-heat high-heat-flow-density heat transfer and dissipation method based on high-dimensional thermoelectricity |
| CN113302759A (en) * | 2018-12-12 | 2021-08-24 | 美光科技公司 | Dual thermoelectric assembly apparatus with heat transfer assembly |
| CN113412046A (en) * | 2021-06-28 | 2021-09-17 | 山东浪潮科学研究院有限公司 | Anti-interference shielding device and method |
-
2005
- 2005-09-13 CN CN 200520118765 patent/CN2831423Y/en not_active Expired - Lifetime
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101584097B (en) * | 2006-11-10 | 2013-08-14 | 德雷格医疗系统股份有限公司 | Portable device cooling system |
| US9671141B2 (en) | 2011-12-01 | 2017-06-06 | Samsung Electronics Co., Ltd. | Thermoelectric cooling packages and thermal management methods thereof |
| CN103137577A (en) * | 2011-12-01 | 2013-06-05 | 三星电子株式会社 | Thermoelectric cooling packages and thermal management methods thereof |
| JP2013118381A (en) * | 2011-12-01 | 2013-06-13 | Samsung Electronics Co Ltd | Method for controlling temperature of device, electrothermal cooling package, and portable mobile device |
| US10658266B2 (en) | 2011-12-01 | 2020-05-19 | Samsung Electronics Co., Ltd. | Thermoelectric cooling packages and thermal management methods thereof |
| CN103137577B (en) * | 2011-12-01 | 2017-07-21 | 三星电子株式会社 | Thermoelectric-cooled packaging part and its thermal management algorithm |
| CN102647893A (en) * | 2012-05-17 | 2012-08-22 | 吉林大学 | Longitudinal cascade type integrated constant temperature radiator module |
| CN103887339A (en) * | 2012-12-19 | 2014-06-25 | 中兴通讯股份有限公司 | Transistor, transistor heat radiation structure and transistor production method |
| CN103385700A (en) * | 2013-08-02 | 2013-11-13 | 王卫东 | High-precision rapid self-calibration wireless electronic thermometer |
| CN104697327A (en) * | 2013-12-09 | 2015-06-10 | 中冶长天国际工程有限责任公司 | Wireless temperature measurement system for rotary kiln |
| CN104679059A (en) * | 2014-12-26 | 2015-06-03 | 北京兆易创新科技股份有限公司 | Temperature control system of integrated circuit |
| CN104635139A (en) * | 2014-12-26 | 2015-05-20 | 北京兆易创新科技股份有限公司 | Low-temperature performance test system of integrated circuit |
| CN105050371A (en) * | 2015-09-02 | 2015-11-11 | 电子科技大学 | High-heat-flux electronic equipment hot spot removing device |
| CN110581113A (en) * | 2018-06-11 | 2019-12-17 | Oppo广东移动通信有限公司 | central processing unit assembly and heat dissipation control method thereof, electronic equipment and mobile phone |
| CN109545950A (en) * | 2018-11-29 | 2019-03-29 | 内蒙古工业大学 | Thermoelectric radiating device and its cooling system |
| CN109673132A (en) * | 2018-12-11 | 2019-04-23 | 无锡睿勤科技有限公司 | A kind of heat dissipating method and device |
| CN113302759A (en) * | 2018-12-12 | 2021-08-24 | 美光科技公司 | Dual thermoelectric assembly apparatus with heat transfer assembly |
| CN111124003A (en) * | 2019-10-09 | 2020-05-08 | 珠海格力电器股份有限公司 | Cooling system and method for power module and computer readable storage medium |
| CN111488010A (en) * | 2020-04-16 | 2020-08-04 | 深圳见炬科技有限公司 | Large-heat high-heat-flow-density heat transfer and dissipation method based on high-dimensional thermoelectricity |
| CN111488010B (en) * | 2020-04-16 | 2021-02-26 | 深圳见炬科技有限公司 | Large-heat high-heat-flow-density heat transfer and dissipation method based on high-dimensional thermoelectricity |
| WO2021209006A1 (en) * | 2020-04-16 | 2021-10-21 | 深圳见炬科技有限公司 | High-dimensional thermoelectrics-based great-heat and high-heat-flow-density heat transfer and heat dissipation method |
| CN113412046A (en) * | 2021-06-28 | 2021-09-17 | 山东浪潮科学研究院有限公司 | Anti-interference shielding device and method |
| CN113412046B (en) * | 2021-06-28 | 2022-11-29 | 山东浪潮科学研究院有限公司 | Anti-interference shielding device and method |
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Legal Events
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20061025 |
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| EXPY | Termination of patent right or utility model |