CN204761938U - Electronic equipment constant temperature system - Google Patents
Electronic equipment constant temperature system Download PDFInfo
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- CN204761938U CN204761938U CN201520425407.9U CN201520425407U CN204761938U CN 204761938 U CN204761938 U CN 204761938U CN 201520425407 U CN201520425407 U CN 201520425407U CN 204761938 U CN204761938 U CN 204761938U
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- electronic equipment
- radiator
- micro
- semiconductor chilling
- constant temperature
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Abstract
The utility model discloses an electronic equipment constant temperature system, including electronic equipment, be equipped with temperature and humidity sensor in the electronic equipment, this system still includes and corresponds semiconductor refrigeration piece, microflute way soaking board and the radiator of being connected with electronic equipment, the refrigeration face and the electronic equipment contact of semiconductor refrigeration piece, the face of heating and the microflute of semiconductor refrigeration piece say that the evaporation zone of soaking board contacts, the microflute says that the condensation segment of soaking board and radiator surface contact, be connected with on the radiator and discharge the fan in the air with the heat, this system still include with electronic equipment in the control panel that links to each other of temperature and humidity sensor, semiconductor refrigeration piece and fan. Electronic equipment establishes to one or more, corresponds the semiconductor refrigeration piece, microflute way soaking board and the radiator that link to each other with arbitrary electronic equipment and constitutes the cooling cooperation to electronic equipment. The utility model discloses compact structure, small -size lightweight, effectual assurance is provided for waterproof and electromagnetic shield.
Description
Technical field
The utility model belongs to instrument inner electronic equipment thermal design technical field, is specifically related to a kind of electronic equipment constant temperature system.
Background technology
Thermal design and Thermal Design of Electronic Equipments, electronic devices and components in electronic equipment generally have serviceability temperature scope, and electronic devices and components generally have certain hear rate (caloric value), if do not taken measures, ambient temperature in electronic equipment will exceed the temperature range that electronic devices and components are allowed, there will be hydraulic performance decline after exceeding electronic devices and components temperature range or can not work until the serious consequence such as to burn, if and ambient temperature is too low, electronic devices and components also can not work, and thermal design will solve too low, the too high problem of above-mentioned electronic equipment environment temperature exactly.Mainly for the situation that electronic devices and components working temperature is too high in prior art, the Thermal design adopted has nature cooling, forced air cooling, liquid cooling, heat pipe etc., but because the electronic module in instrument is more, and meter electronics is towards miniaturized, lightness development, the increase of volumetric power density must be caused, make traditional heat-dissipating method can not meet the miniaturization of instrument field and lightness requirement, Electromagnetic Shield on Electronic Equipments and waterproof requirement can not be met simultaneously.
Therefore, those skilled in the art need badly provide a kind of compact conformation, miniaturization and, the electronic equipment constant temperature system of giving security for waterproof and electromagnetic shielding.
Utility model content
The utility model in order to overcome above-mentioned the deficiencies in the prior art, devise a kind of compact conformation, miniaturization and, the electronic equipment constant temperature system of giving security for waterproof and electromagnetic shielding.
For achieving the above object, the utility model have employed following technical scheme:
A kind of electronic equipment constant temperature system, comprise electronic equipment, Temperature Humidity Sensor is provided with in described electronic equipment, this system also comprises the semiconductor chilling plate that connect corresponding to electronic equipment, micro-channel soaking plate and radiator, the chill surface of described semiconductor chilling plate contacts with electronic equipment, the face that heats of described semiconductor chilling plate contacts with the evaporation section of micro-channel soaking plate, the condensation segment of described micro-channel soaking plate contacts with spreader surface, adiabatic section is provided with between described evaporation section and condensation segment, described radiator is connected with heat dissipation to the fan in air, this system also comprises the control board be electrically connected with Temperature Humidity Sensor, semiconductor chilling plate and fan in electronic equipment, and described control board is connected with host computer.
Preferably, described electronic equipment is set to one or more, and the semiconductor chilling plate, micro-channel soaking plate and the radiator that are connected corresponding to arbitrary electronic equipment forms and coordinate the cooling of electronic equipment.
Preferably, when electronic equipment is set to multiple, described radiator can be used as the common heatsink that multiple electronic equipment shares.
Further, described radiator is set to gilled radiator.
Preferably, the evaporation section in the middle of described micro-channel soaking plate, adiabatic section and condensation segment are connected successively forms the hanging shape structure of being convenient to dispel the heat.
Preferably, the condensation segment of described micro-channel soaking plate is also provided with Temperature Humidity Sensor, and described Temperature Humidity Sensor is connected with control board.
The beneficial effects of the utility model are:
1), the utility model adopt micro-channel soaking plate (plane heat pipe) and semiconductor chilling plate (TEC) combination design, meet instrument field electronic equipment compact constant temp. heating design requirement.
In the utility model, micro-channel soaking plate (plane heat pipe) is a profile is thin plate, and the micro-channel plane heat pipe of internal independence some equidistant independent operatings side by side, has larger than conventional heat pipe surface area, the plurality of advantages such as heat exchange efficiency is high.Micro-channel soaking plate utilizes sweat cooling, makes the heat pipe two ends temperature difference very large, heat is conducted fast.Micro-channel soaking plate inside is pumped into 10
-3pa negative pressure state, be filled with suitable liquid (being generally filled with water, ethylene glycol etc.), this boiling point of liquid is low, and micro-channel soaking plate start-up temperature is low.Micro-channel soaking plate has lightweight, the advantage such as conductive coefficient is high (can reach 10000W/mk), uniform temperature good (± 2 DEG C).
Micro-channel soaking plate basic functional principle as shown in Figure 1, micro-channel soaking plate one end is evaporation section, the other end is condensation segment, and when micro-channel soaking plate one end is heated, the liquid in capillary evaporates rapidly, steam flows to the other end under slight pressure difference, and releases heat, regelation becomes liquid, and liquid flows back to evaporation section along porous material by the effect of capillary force again, circulation like this is more than, and heat reaches the other end by micro-channel soaking plate one end.Change the conduction of conventional heat pipe line, heat can conduct continuously and come.
In the utility model, semiconductor chilling plate TEC does not have moving component, does not use cold-producing medium, reliability high, noiselessness, friction during operation, without wearing and tearing, has that structure is simple, volume is little, start the outstanding advantages such as fast.
The basic functional principle of semiconductor chilling plate is as follows: when the loop that direct current is consisted of two kinds of different electric conducting materials, node produces neither endothermic nor exothermic phenomenon, and be peltier effect, the peltier effect of semi-conducting material is more obvious.As shown in Figure 2, when the sense of current is N → P, the motion dorsad of joint is left in free electron in N type semiconductor and the hole in P type semiconductor, the energy that absorbs of electron-hole pair is produced much larger than the free electron of new life and hole by thermal discharge during joint in joint, need, from external world's heat absorption, to produce refrigeration, be together in series on circuit to thermocouple some, be in parallel in heat transfer, just form thermoelectric cooling heap.Be thermoelectric refrigerating unit after thermoelectric cooling heap is connected with cold drawing, radiator, by being cold junction above after energising shown in Fig. 2, lower end is hot junction.By various heat transfer means such as heat exchangers, constantly dispelled the heat in the hot junction of thermoelectric pile and keep certain temperature, the cold junction of thermoelectric pile is to operational environment absorbing and cooling temperature.Utilize the cold junction of thermoelectric refrigerating unit (TEC) and receive path box body to fit, hot junction connects heat-exchange device, by thermoelectric refrigerating effect, when ambient temperature is too high, freezes to receive path box body.When ambient temperature is too low, also by upset power supply polarity, makes the reverse work of TEC, reach the effect of heating.
The utility model comprises the semiconductor chilling plate, micro-channel soaking plate and the radiator that connect corresponding to electronic equipment, wherein, the chill surface of semiconductor chilling plate contacts with electronic equipment, the face that heats of semiconductor chilling plate contacts with the evaporation section of micro-channel soaking plate, the condensation segment of micro-channel soaking plate contacts with spreader surface, radiator is connected with by heat dissipation to the fan in air; Native system also comprises the control board be connected with Temperature Humidity Sensor, semiconductor chilling plate and fan in electronic equipment.
In the utility model when electronic device works, first control board gathers the humiture in electronic equipment, when electronic equipment temperature exceedes the temperature of program setting, control board controls semiconductor chilling plate (TEC) and starts working, TEC heats after surface temperature reaches evaporating temperature, micro-channel soaking plate is started working, the heat in the face that heats of TEC is exported on radiator, heat is exchanged in outside atmosphere by fan on a heat sink, the heat finally realizing electronic equipment imports in air, the design bag of micro-channel soaking plate and semiconductor chilling plate ensure that compact conformation and the miniaturization and of this constant temperature system.
It needs to be noted: the utility model is only protected by above-mentioned physical unit and connected the device or physical platform that the circuit between each physical unit forms, and does not relate to software section wherein.
2), the utility model is owing to have employed semiconductor chilling plate (TEC), constant-temperature precision reaches ± and 0.1 DEG C, ensure that the accurate of temperature detection, be particularly useful for the large-scale precision electronic instrument higher to electronic instrument operating temperature requirements, there is good practicality.
3), the utility model due to compact conformation, be beneficial to formation closed system, have and to dispel the heat better capability of electromagnetic shielding than tradition ventilation, have than the better rainproof water resistance of tradition ventilation heat radiation simultaneously.
4) the micro-channel soaking plate, in the utility model has certain Bending Processing characteristic, can be processed into the shape of needs, enormously simplify the design difficulty of system structure design and heat dissipation wind channel; And owing to adopting single radiator as common heatsink, alleviate the weight of constant temperature system, size, save material and cost; According to the thermal design requirement of electronic device module, the micro-channel soaking plate of different size specification can be installed, enhance the general applicability of this system.
5), the utility model regulates the steady temperature of electronic equipment by regulation control plate, and pass through the temperature of the Temperature Humidity Sensor detected electrons equipment in electronic equipment, whether freeze and the control of TEC voltage to make the corresponding TEC that changes to TEC, finally make the quantity of heat production of the refrigerating capacity of TEC and electronic equipment equal, make electronic equipment reach steady temperature, effectively ensure that the accuracy of this system works.
Accompanying drawing explanation
Fig. 1 is micro-channel soaking plate basic functional principle figure.
Fig. 2 is semiconductor chilling plate basic functional principle figure.
Fig. 3 is structural representation of the present utility model.
In figure, the implication of label symbol is as follows:
1-electronic equipment 2-semiconductor chilling plate 3-micro-channel soaking plate
30-evaporation section 31-adiabatic section 32-condensation segment 4-radiator
5-fan 6-Temperature Humidity Sensor 7-control board 8-host computer
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
As shown in Figure 3, a kind of electronic equipment constant temperature system, comprise electronic equipment 1, Temperature Humidity Sensor 6 is provided with in described electronic equipment 1, this system also comprises the semiconductor chilling plate 2, micro-channel soaking plate 3 and the radiator 4 that connect corresponding to electronic equipment 1, the chill surface of described semiconductor chilling plate 2 contacts with electronic equipment 1, the face that heats of described semiconductor chilling plate 2 contacts with the evaporation section 30 of micro-channel soaking plate 3, condensation segment 32 and radiator 4 surface contact of described micro-channel soaking plate 3, described radiator 4 is connected with heat dissipation to the fan 5 in air; This system also comprises the control board 7 be electrically connected with Temperature Humidity Sensor 6, semiconductor chilling plate 2 and fan 5 in electronic equipment 1, and described control board 7 is connected with host computer 8.
Described electronic equipment 1 is set to one or more, and the semiconductor chilling plate 2, micro-channel soaking plate 3 and the radiator 4 that are connected corresponding to arbitrary electronic equipment 1 forms and coordinate the cooling of electronic equipment 1.Wherein, when electronic equipment 1 is set to multiple, the common heatsink that described radiator 4 shares as multiple electronic equipment.
Described radiator 4 is set to gilled radiator.
Adiabatic section 31 in the middle of described micro-channel soaking plate 3 adopts the unsettled setting being convenient to form cramped construction.
The condensation segment 32 of described micro-channel soaking plate 3 is also provided with Temperature Humidity Sensor 6, and described Temperature Humidity Sensor 6 is connected with control board 7.The condensation segment 32 of being derived heat by control board 7 pairs of micro-channel soaking plate 3 carries out temperature-humidity monitoring, feeds back to the host computer 8 on control board 7, thus controls the rotating speed of fan 5, effectively adjust heat dissipation capacity.
Be further described in detail below in conjunction with the course of work of accompanying drawing to this device.
After micro-channel soaking plate 3 is processed into actual needs shape, the evaporation section 30 of micro-channel soaking plate 3 is heated face with semiconductor chilling plate 2 contact, semiconductor chilling plate 2 and electronic equipment 1 surface contact, by the condensation end 32 of micro-channel soaking plate 3 and radiator 4 surface contact, the adiabatic section 31 between micro-channel soaking plate 3 condensation segment 32 and evaporation section 30 is unsettled.
When electronic equipment 1 works, first control board 7 gathers the humiture in electronic equipment 1, when electronic equipment 1 temperature exceedes the temperature of program setting, control board 7 controls semiconductor chilling plate 2 and starts working, semiconductor chilling plate 2 heats after surface temperature reaches evaporating temperature, micro-channel soaking plate 3 is started working, heat semiconductor chilling plate 2 being heated face exports on radiator 4, heat is exchanged in outside atmosphere by fan 5 on radiator 4, and the heat finally realizing electronic equipment 1 imports in air; Whether control board 7 freezes and the voltage of semiconductor chilling plate 2 by changing semiconductor chilling plate 2, finally makes the quantity of heat production of the refrigerating capacity of semiconductor chilling plate 2 and electronic equipment 1 equal, finally makes electronic equipment 1 temperature constant in host computer 8 programmed values.
On the contrary, if the humiture in electronic equipment 1 is lower than the temperature of host computer 8 program setting, regulates semiconductor chilling plate 2 to overturn power supply polarity, make the reverse work of semiconductor chilling plate 2, reach the effect of heating.
As Fig. 3 is provided with two electronic equipments 1, should be noted that, for the utility model being provided with multiple electronic equipment 1, the operation principle of arbitrary electronic equipment 1 is all identical, and multiple electronic equipment 1 is when not common heatsink, multiple radiator can form inner circulating air air channel, then drains in outer air environment; And can require that different (heat, maximum temperature, uniform temperature) selects the micro-channel soaking plate 3 of the semiconductor chilling plate 2 of different refrigerating capacity, different size, heat conduction power, filling liquid according to electronic equipment 1 thermal design when reality uses, also can increase according to the quantity of electronic equipment 1 and reduce the quantity of micro-channel soaking plate 3 and semiconductor chilling plate 2.Described electronic equipment 1 also can be set to other accepting device.
Claims (6)
1. an electronic equipment constant temperature system, comprise electronic equipment (1), Temperature Humidity Sensor (6) is provided with in described electronic equipment (1), it is characterized in that: this system also comprises the semiconductor chilling plate (2) that connect corresponding to electronic equipment (1), micro-channel soaking plate (3) and radiator (4), the chill surface of described semiconductor chilling plate (2) contacts with electronic equipment (1), the face that heats of described semiconductor chilling plate (2) contacts with the evaporation section (30) of micro-channel soaking plate (3), condensation segment (32) and radiator (4) surface contact of described micro-channel soaking plate (3), adiabatic section (31) is provided with between described evaporation section (30) and condensation segment (32), described radiator (4) is connected with by heat dissipation to the fan (5) in air, this system also comprises the control board (7) be electrically connected with electronic equipment (1) interior Temperature Humidity Sensor (6), semiconductor chilling plate (2) and fan (5), and described control board (7) is connected with host computer (8).
2. a kind of electronic equipment constant temperature system according to claim 1, it is characterized in that: described electronic equipment (1) is set to one or more, the semiconductor chilling plate (2), micro-channel soaking plate (3) and the radiator (4) that are connected corresponding to arbitrary electronic equipment (1) forms and coordinates the cooling of electronic equipment (1).
3. a kind of electronic equipment constant temperature system according to claim 1, is characterized in that: when electronic equipment (1) is set to multiple, and described radiator (4) is set to the common heatsink that multiple electronic equipment shares.
4. a kind of electronic equipment constant temperature system according to claim 3, is characterized in that: described radiator (4) is set to gilled radiator.
5. a kind of electronic equipment constant temperature system according to claim 1, is characterized in that: the evaporation section (30) in the middle of described micro-channel soaking plate (3), adiabatic section (31) and condensation segment (32) are connected successively forms the hanging shape structure of being convenient to dispel the heat.
6. a kind of electronic equipment constant temperature system according to claim 1, it is characterized in that: the condensation segment (32) of described micro-channel soaking plate (3) is also provided with Temperature Humidity Sensor (6), and described Temperature Humidity Sensor (6) is connected with control board (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520425407.9U CN204761938U (en) | 2015-06-18 | 2015-06-18 | Electronic equipment constant temperature system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520425407.9U CN204761938U (en) | 2015-06-18 | 2015-06-18 | Electronic equipment constant temperature system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204761938U true CN204761938U (en) | 2015-11-11 |
Family
ID=54476599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520425407.9U Expired - Fee Related CN204761938U (en) | 2015-06-18 | 2015-06-18 | Electronic equipment constant temperature system |
Country Status (1)
| Country | Link |
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| CN (1) | CN204761938U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109301368A (en) * | 2018-10-18 | 2019-02-01 | 瞿志刚 | New-energy electric vehicle battery integrated thermal management system and control method |
| CN109508052A (en) * | 2018-11-22 | 2019-03-22 | 北京中热信息科技有限公司 | A kind of liquid cooling source air-conditioning system |
| CN112285452A (en) * | 2020-09-10 | 2021-01-29 | 河北工业大学 | Device and method for measuring low-temperature characteristics of electrical parameters |
-
2015
- 2015-06-18 CN CN201520425407.9U patent/CN204761938U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109301368A (en) * | 2018-10-18 | 2019-02-01 | 瞿志刚 | New-energy electric vehicle battery integrated thermal management system and control method |
| CN109508052A (en) * | 2018-11-22 | 2019-03-22 | 北京中热信息科技有限公司 | A kind of liquid cooling source air-conditioning system |
| CN112285452A (en) * | 2020-09-10 | 2021-01-29 | 河北工业大学 | Device and method for measuring low-temperature characteristics of electrical parameters |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151111 Termination date: 20210618 |