CN206042655U - Electronic equipment's heat conduction structure and supervisory equipment - Google Patents
Electronic equipment's heat conduction structure and supervisory equipment Download PDFInfo
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- CN206042655U CN206042655U CN201621041790.9U CN201621041790U CN206042655U CN 206042655 U CN206042655 U CN 206042655U CN 201621041790 U CN201621041790 U CN 201621041790U CN 206042655 U CN206042655 U CN 206042655U
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- heating
- heat conduction
- master chip
- heater
- phase change
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Abstract
The utility model relates to an electronic equipment field especially relates to an electronic equipment's heat conduction structure and supervisory equipment, include: casing and being located the inside printed circuit board PCB of casing, set up in the last main chip of PCB, do heating device, phase transition heat -transfer device and the heating control device of the heating of main chip, the heating control device, with heating device ferroelectric phase uses together in control heating device's the circular telegram condition when detecting the temperature and be less than first threshold value, makes the heating device circular telegram, the phase transition heat -transfer device, with the inner wall fixed connection of casing and with the heating device contact, the inside phase change material that fills of phase transition heat -transfer device, phase change material's solidifying point temperature is higher than first threshold value so that loose outside heating device reduction when the heating is thermal. The utility model provides a low, the extravagant more problem of energy of the heating efficiency of electronic equipment cold -starting in -process chip among the prior art.
Description
Technical field
The utility model is related to electronic device field, more particularly to a kind of electronic equipment conductive structure and monitoring set
It is standby.
Background technology
The operating temperature of electronic chip typically at -10 DEG C to 80 DEG C, the integrated level more and more higher of chip, the thing followed is
Under working condition, the temperature of chip is also constantly raised, and causes the performance of chip drastically to decline.On the other hand, it is applied to Chinese north
During the extremely cold areas such as side, Northern Europe, North America, the environment temperature of equipment is too low, and the equipment of being easily caused normally cannot start.
At present, basic scheme is device interior device to be heated up by heater.In low-temperature heat, mainly
The electronic device of device interior is heated, typically by heating film heating PCB (Printed Circuit Board,
Printed circuit board) so that chip temperature is raised, or firing equipment inner air further raises the temperature of electronic device.
In prior art, in low-temperature heat, the response time for heating the intensification of PCB core piece is long, heat for the heat-transfer device of equipment
Amount is easily distributed, and the efficiency of heating surface is relatively low；The energy loss of firing equipment inner air is larger or even cannot meet the need of cold-starting
Ask, the efficiency of heating is lower.
Utility model content
The utility model provides the conductive structure and monitoring device of a kind of electronic equipment, solves electricity in prior art
The problem that the efficiency of heating surface is low, energy that is wasting is more of sub- equipment cold-starting process chips.
The utility model method includes：
The conductive structure of a kind of electronic equipment, including：
Housing and the printing board PCB positioned at the enclosure interior, the master chip being arranged on the PCB, for described
Heater, heat conduction with phase change device and heating control apparatus that master chip is heated；
The heating control apparatus, are electrically connected for controlling the energization situation of the heater with the heater,
When temperature is detected less than first threshold, the heater is made to be powered；
The heat conduction with phase change device, be fixedly connected with the inwall of the housing and with the heating means touch, the phase
Become and fill phase-change material inside heat-transfer device, the freezing point temperature of the phase-change material be higher than the first threshold so that it is described plus
Thermal reduces the outer of heat and dissipates in heating.
Optionally, the heating control apparatus, are additionally operable to：
When temperature is detected higher than Second Threshold, the heater stop is made to be powered；
The phase-change material is liquid condition or gaseous state when temperature is more than three threshold values so as to by the master chip
Heat be transmitted to hull outside；
The Second Threshold is more than the first threshold, and the 3rd threshold value is more than or equal to the Second Threshold.
Optionally, the heater is heating film, and the heating film is arranged at the master chip away from the PCB
One side on, and be located between the master chip and the heat conduction with phase change device.
Optionally, the heat conduction with phase change device be a concave structure, two ends and the housing of the heat conduction with phase change device
Inwall connection, the bottom surface of the heat conduction with phase change device is contacted with the master chip.
Optionally, inside the heat conduction with phase change device it is capillary wick structure.
Optionally, Heat Conduction Material is provided between the heat conduction with phase change device and the heater.
Optionally, the heater covers the central area of the master chip, and the Heat Conduction Material contacts the main core
The fringe region of piece.
Optionally, the Heat Conduction Material is thermal conductive silicon rubber cushion.
A kind of monitoring device, includes above-mentioned conductive structure inside the monitoring device.
The conductive structure that the utility model embodiment is provided, sets gradually master chip, heating dress on the PCB in housing
Put, heat conduction with phase change device and heating control apparatus.Wherein, heater is used to heat for master chip, and is filled by computer heating control
Put, control the energization situation of heater.Specially when heating control apparatus detect temperature less than first threshold, i.e. master chip
Temperature it is too low, when generally equipment just starts, to heater be powered, now electric current produce heat by heater biography
To on master chip, raise master chip temperature.Heat conduction with phase change device, is fixedly connected with the inwall of the housing, and is added with described
Thermal is contacted.Phase-change material is filled with inside heat conduction with phase change device, the freezing point temperature of the phase-change material is higher than first threshold.
So, in device cold-starting, the phase-change material filled inside heat conduction with phase change device is solid state, and heat transfer property is low, suppression
Heat conduction processed, has intercepted the transmission of heater and the heat of device external so that heater is conducted to heat conduction with phase change device
Heat is difficult to distribute, it is ensured that the heat that most of heater is produced is conducted to master chip, increased master chip intensification
Efficiency, reduce the loss of energy.
Description of the drawings
For the technical scheme being illustrated more clearly that in the utility model embodiment, below will be to needed for embodiment description
Accompanying drawing to be used is briefly introduced, it should be apparent that, drawings in the following description are only some enforcements of the present utility model
Example, for one of ordinary skill in the art, without having to pay creative labor, can be with attached according to these
Figure obtains other accompanying drawings.
Fig. 1 is the structural representation of conductive structure in the utility model embodiment one；
Fig. 2 is the structural representation of conductive structure in the utility model embodiment two；
Fig. 3 is a kind of structural representation of conductive structure in prior art；
Fig. 4 is the structural representation of conductive structure in the utility model embodiment three.
Specific embodiment
In order that the purpose of this utility model, technical scheme and advantage are clearer, below in conjunction with accompanying drawing to this practicality
It is new to be described in further detail, it is clear that described embodiment is only the utility model some embodiments, rather than
Whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making creative work
Under the premise of all other embodiment for being obtained, belong to the scope of the utility model protection.
For convenience's sake, specific terminology used in below illustrating, and this is not restricted.Word
"left", "right", "up" and "down" represent the direction in the accompanying drawing of reference.Word " inside " and " outside " refer respectively to towards with
And the geometric center of the object and its specified portions away from description.Term include the word that the above specifically refers to, its derivative with
And the similar word for introducing.
Conductive structure in the utility model embodiment can be applied in the inside of electronic equipment such as monitoring device, due to
Monitoring device is mostly in outdoor application, then in cold winter, especially in north of China, the extremely cold area such as Northern Europe North America,
Outdoor temperature is extremely low, and monitoring device normally cannot start.Inside the video camera of monitoring device, the utility model embodiment is set
In conductive structure, can in the state of monitoring device cold-starting firing equipment master chip, it is ensured that monitoring device is just
Often work, moreover it is possible to after device interior temperature is raised, outwards radiate.
As shown in figure 1, the conductive structure of a kind of electronic equipment provided for the utility model embodiment one, including：Housing 1
And the PCB2 inside the housing 1, the master chip 3 being arranged on the PCB2, the heating dress for heating for master chip 3
4, heat conduction with phase change device 5 and heating control apparatus are put, wherein, heating control apparatus are not shown in the diagram.
The heating control apparatus, are electrically connected with the heater 4, for controlling the energization situation of heater 4, when
When detecting temperature less than first threshold, heater 4 is made to be powered；
The heat conduction with phase change device 5, is fixedly connected with the inwall of the housing 1 and is contacted with the heater 4, described
Fill phase-change material inside heat conduction with phase change device 5, the freezing point temperature of the phase-change material is higher than the first threshold so that institute
State heater 4 and the outer scattered of heat is reduced in heating.
The conductive structure that the utility model embodiment is provided, sets gradually master chip 3, heating dress on the PCB2 in housing
Put 4, heat conduction with phase change device 5.Wherein, heater 4 is used to heat for master chip 3, and by heating control apparatus, control heating
The energization situation of device 4.Specially when heating control apparatus detect temperature mistake of the temperature less than first threshold, i.e. master chip 3
It is low, when generally equipment just starts, it is powered to heater 4, the heat that now electric current is produced passes to main core by heater 4
On piece 3, raise 3 temperature of master chip.Heat conduction with phase change device 5, is fixedly connected with the inwall of the housing 1, and with the heating
Device 4 is contacted.Phase-change material is filled with inside heat conduction with phase change device 5, the freezing point temperature of the phase-change material is higher than first threshold.
So, in device cold-starting, the phase-change material filled inside heat conduction with phase change device 5 is solid state, and heat transfer property is low, suppression
Heat conduction processed, has intercepted the transmission of heater 4 and the heat of device external so that heater 4 is conducted to heat conduction with phase change device 5
Heat be difficult to distribute, it is ensured that most of heater 4 produce heat conduct to master chip 3, increased master chip 3
The efficiency of intensification, reduces the loss of energy.
On the other hand, the conductive structure that the utility model embodiment is provided, can not only add in the state of cold-starting
The master chip 3 of hot equipment, moreover it is possible to after device interior temperature is raised, outwards radiate.
The heating control apparatus, are additionally operable to, when temperature is detected higher than Second Threshold, stop the heater 4
It is powered；
The phase-change material is liquid or gaseous state when temperature is more than three threshold values so as to by the heat of the master chip 3
Amount is transmitted to outside housing 1；
The Second Threshold is more than the first threshold, and the 3rd threshold value is more than or equal to the Second Threshold.
Phase-change material refers to and varies with temperature and change state of matter and can provide the material of latent heat.Transformation physical property
Process is referred to as phase transition process, and at this moment phase-change material will absorb or discharge substantial amounts of latent heat.Modal phase-change material is water, when
During as little as 0 DEG C of temperature, water is changed into solid-state (icing) from liquid, and when temperature is higher than 0 DEG C, water is changed into liquid (dissolving) from solid-state.
Thermal energy is released in freezing process, and substantial amounts of thermal energy is absorbed in course of dissolution.
Specifically, after equipment cold-starting, the constant temperature of master chip 3 is raised, when heating control apparatus detect temperature
When degree is higher than Second Threshold, Second Threshold here is more than first threshold, and hereafter master chip 3 then stops to heating without the need for heating
Device 4 is powered.The phase-change material filled inside heat conduction with phase change device 5, is liquid condition or gas when temperature is more than three threshold values
Body state, as phase-change material is being changed into liquid condition from solid state, or even when continuing to be changed into gaseous state, need to absorb a large amount of
Heat, can take away the heat on master chip 3, and the mobile performance of liquid or gas is high, internal heat can be passed through shell
Body 1 is distributed to outside.So, in equipment continuous firing so that internal temperature is constantly raised, after having exceeded the 3rd threshold value, phase
Become material equipment high efficiency can be radiated, it is ensured that the radiating of equipment during high temperature.Therefore, the heat conduction in the utility model embodiment
Device, you can master chip 3 is heated when temperature is too low, it is ensured that the normal startup of electronic equipment, again can be in device interior temperature mistake
Outwards radiate when high, taken into account the function of high-efficiency heating and radiating, overcome the limitation of prior art.
Heat conduction with phase change device in the utility model embodiment is metal material, and internal is capillary wick structure, in hair
Phase-change material is filled with thin liquid-sucking core, can such as be water.When device interior temperature is raised, the structure of capillary wick can
So that phase-change material rapidly goes to liquid condition or gaseous state by solid state.And the phase transformation material of liquid condition or gaseous state
Material, can be back to passage evaporator section required for, and vapour-liquid interface from condensation segment using capillary wick as condensate liquid
On surface capillary hole produce capillary suction force condensate liquid can be helped to flow back.As such, it is possible to overcome gravity direction to lead phase transformation
The impact of thermal heat transfer property.Additionally, liquid or gas mobility strengthen, also increase heat conduction with phase change device it is good dissipate
Hot property.
Further, in the utility model embodiment two, heat conduction with phase change device 5 is a concave structure, as shown in Fig. 2 this
Structure can be better adapted to the installation of equipment.The two ends of the heat conduction with phase change device 5 are connected with the inwall of the housing 1, institute
The bottom surface for stating heat conduction with phase change device 5 is contacted with the heater 4.So, when temperature is higher, heat conduction with phase change device 5 can be with
Directly by the heat transfer on master chip 3 to housing 1, and heat is distributed by housing 1, it is ensured that master chip 3
Radiating.
Due to there is heat conduction with phase change device 5 to hinder the outer of heater temperature to dissipate under low-temperature condition, the utility model is implemented
Example can be arranged on heater 4 on master chip 3, directly heat master chip 3.
Now, the heater 4 is heating film, and its thickness is less than 1mm, generally 0.3mm.Heating film is from high
The thin-film material of thermal conductivity factor, such as copper film, which is less in the thermal conduction resistance of thickness direction, in order to heat and can radiate.It is described
Heating film is arranged in one side of the master chip 3 away from the PCB2, and is located at the master chip 3 and the heat conduction with phase change
Between device 5.
In prior art, due to master chip 3 and PCB2, to be that master chip 3 is located at compared to PCB2 in device interior outside
Position, as shown in Figure 3.In order to the heat for preventing heater 4 outwards dissipates, heater 4 is provided in PCB2 and is located remotely from
In the one side of master chip 3.By heating PCB2, master chip 3 is indirectly delivered heat to, raises the temperature of master chip 3.This
Sample one, the response time of heating are longer, and heat-energy losses are big.In the utility model embodiment, due to there is heat conduction with phase change device 5
Suppress 4 heat of heater outwards to transmit, therefore heating film can be arranged on master chip 3, directly heat master chip 3,
The effect that master chip 3 is rapidly heated is reached, the loss of heat is reduced.
Further, Heat Conduction Material 6 is additionally provided between the heat conduction with phase change device 5 and the heater 4, such as Fig. 4
It is shown.In the utility model embodiment three, the heater 4 covers the central area of the master chip 3, the Heat Conduction Material
6 fringe regions for contacting the master chip 3, it is heat conductive silica gel that the Heat Conduction Material is selected, and as the material of silica gel is more soft, is
10 to 30 or so hardness of ShoreOO, can be filled between the contact surface between heat conduction with phase change device 5 and master chip 3 well
Air is extruded contact surface by gap, because air can seriously hinder transmission of the heat between contact surface.Also, led by arranging
Hot silica gel material, not only can be truly realized the directly contact in face and face, can also eliminate the tolerance shadow between two contact surfaces
Ring.
Although having been described for preferred embodiment of the present utility model, those skilled in the art once know substantially
Creative concept, then can make other change and modification to these embodiments.So, claims are intended to be construed to bag
Include preferred embodiment and fall into the had altered of the utility model scope and change.
Obviously, those skilled in the art can carry out various changes and modification without deviating from this practicality to the utility model
New spirit and scope.So, if it is of the present utility model these modification and modification belong to the utility model claim and
Within the scope of its equivalent technologies, then the utility model is also intended to comprising these changes and modification.
Claims (9)
1. the conductive structure of a kind of electronic equipment, it is characterised in that include：Housing and the printed circuit positioned at the enclosure interior
Plate PCB, the master chip being arranged on the PCB, the heater for master chip heating, heat conduction with phase change device and heating control
Device processed；
The heating control apparatus, are electrically connected for controlling the energization situation of the heater with the heater, work as inspection
When measuring temperature less than first threshold, the heater is made to be powered；
The heat conduction with phase change device, be fixedly connected with the inwall of the housing and with the heating means touch, the phase transformation leads
Fill phase-change material inside thermal, the freezing point temperature of the phase-change material is higher than the first threshold so that heating dress
Put and the outer scattered of heat is reduced in heating.
2. conductive structure as claimed in claim 1, it is characterised in that the heating control apparatus, is additionally operable to：
When temperature is detected higher than Second Threshold, the heater stop is made to be powered；
The phase-change material is liquid condition or gaseous state when temperature is more than three threshold values so as to by the heat of the master chip
Amount is transmitted to hull outside；
The Second Threshold is more than the first threshold, and the 3rd threshold value is more than or equal to the Second Threshold.
3. conductive structure as claimed in claim 1, it is characterised in that the heater is heating film, the heating is thin
Film is arranged in one side of the master chip away from the PCB, and is located between the master chip and the heat conduction with phase change device.
4. conductive structure as claimed in claim 1, it is characterised in that the heat conduction with phase change device is a concave structure, described
The two ends of heat conduction with phase change device are connected with the inwall of the housing, and bottom surface and the master chip of the heat conduction with phase change device connect
Touch.
5. the conductive structure as described in any one of Claims 1-4, it is characterised in that be hair inside the heat conduction with phase change device
Thin liquid sucting core structure.
6. the conductive structure as described in any one of Claims 1-4, it is characterised in that the heat conduction with phase change device with it is described plus
Heat Conduction Material is provided between thermal.
7. conductive structure as claimed in claim 6, it is characterised in that the heater covers the center of the master chip
Domain, the Heat Conduction Material contact the fringe region of the master chip.
8. conductive structure as claimed in claim 6, it is characterised in that the Heat Conduction Material is thermal conductive silicon rubber cushion.
9. a kind of monitoring device, it is characterised in that include inside the monitoring device as described in any one of claim 1 to 8
Conductive structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621041790.9U CN206042655U (en) | 2016-09-02 | 2016-09-02 | Electronic equipment's heat conduction structure and supervisory equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621041790.9U CN206042655U (en) | 2016-09-02 | 2016-09-02 | Electronic equipment's heat conduction structure and supervisory equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206042655U true CN206042655U (en) | 2017-03-22 |
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ID=58299472
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621041790.9U Active CN206042655U (en) | 2016-09-02 | 2016-09-02 | Electronic equipment's heat conduction structure and supervisory equipment |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107426951A (en) * | 2017-07-26 | 2017-12-01 | 合肥联宝信息技术有限公司 | Heat exchange mechanisms and electronic equipment |
| CN108598301A (en) * | 2017-12-29 | 2018-09-28 | 北京国能电池科技有限公司 | Battery case |
| CN108990370A (en) * | 2017-06-05 | 2018-12-11 | 阿拉伯联合酋长国大学 | Radiator |
| CN110850910A (en) * | 2018-08-20 | 2020-02-28 | 浙江宇视科技有限公司 | Heating control method and device and electronic equipment |
| CN110994969A (en) * | 2019-12-23 | 2020-04-10 | 浙江日风电气股份有限公司 | Wind power converter and low-temperature starting method thereof |
-
2016
- 2016-09-02 CN CN201621041790.9U patent/CN206042655U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108990370A (en) * | 2017-06-05 | 2018-12-11 | 阿拉伯联合酋长国大学 | Radiator |
| CN108990370B (en) * | 2017-06-05 | 2020-08-11 | 阿拉伯联合酋长国大学 | Heat radiator |
| CN107426951A (en) * | 2017-07-26 | 2017-12-01 | 合肥联宝信息技术有限公司 | Heat exchange mechanisms and electronic equipment |
| CN108598301A (en) * | 2017-12-29 | 2018-09-28 | 北京国能电池科技有限公司 | Battery case |
| CN110850910A (en) * | 2018-08-20 | 2020-02-28 | 浙江宇视科技有限公司 | Heating control method and device and electronic equipment |
| CN110994969A (en) * | 2019-12-23 | 2020-04-10 | 浙江日风电气股份有限公司 | Wind power converter and low-temperature starting method thereof |
| CN110994969B (en) * | 2019-12-23 | 2021-01-22 | 浙江日风电气股份有限公司 | Wind power converter and low-temperature starting method thereof |
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| GR01 | Patent grant |