CN205424859U - Adopt semiconductor refrigeration piece and phase change material's LED heat abstractor - Google Patents
Adopt semiconductor refrigeration piece and phase change material's LED heat abstractor Download PDFInfo
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- CN205424859U CN205424859U CN201520966311.3U CN201520966311U CN205424859U CN 205424859 U CN205424859 U CN 205424859U CN 201520966311 U CN201520966311 U CN 201520966311U CN 205424859 U CN205424859 U CN 205424859U
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- semiconductor chilling
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Abstract
The utility model discloses an adopt semiconductor refrigeration piece and phase change material's LED heat abstractor, including LED device, heat conduction base plate, radiating fin, still include semiconductor refrigeration piece, phase change material and radiator fan, the LED device encapsulation is in the heat conduction substrate surface, the semiconductor refrigeration piece is pressed from both sides tightly to be set up between heat conduction base plate and radiating fin, be provided with a plurality of cavity in the radiating fin, the cavity intussuseption is filled with phase change material, radiator fan installs in the radiating fin top. The utility model discloses an adopt semiconductor refrigeration piece and phase change material's LED heat abstractor and method are through combining to utilize powerful refrigerating capacity of semiconductor refrigeration piece and phase change material to have these two kinds of advantages of very big latent heat of phase change to introduce closed loop feedback control, realize carrying out efficient heat dissipation and reliable heat accuse to the LED device.
Description
Technical field:
This utility model relates to a kind of LED heat abstractor, has particularly related to a kind of LED heat abstractor using semiconductor chilling plate and phase-change material.
Background technology:
LED is the solid-state illumination light source made with semiconductor technology, compared with traditional lighting source, there is specular removal, long-life, the clear advantage such as green and energy-conservation, just meeting the demand of resource-efficient and environment friendly society, its large-scale popularization and application will bring huge economic benefit and social benefit.
But, along with the development of LED technology, especially in great power LED wide variety of today, LED from before mW level rise to W level even 100W level.Owing to during LED operation, energy close to 75% can be converted into heat, can its heat produced have become one of main factor having a strong impact on LED performance and life-span, therefore effectively dispel the heat LED component and thermal control has become as and affects the key issue that LED uses on a large scale.
For low power LED, generally LED module is directly mounted in Section Bar Heat Sinks, relies on the air in environment to carry out Natural Heat Convection.But being as the increase of LED range of application, be progressively applied to the occasions such as square, stadium, exhibitions and industrial and mineral, operating power improves constantly, its luminous light product also there are is higher requirement, therefore its heat dispersion is proposed higher requirement.
Utility model content:
The heat dissipation problem that this utility model faces in applying for LED light source, propose a kind of LED heat abstractor using semiconductor chilling plate and phase-change material, by being combined with the powerful refrigerating capacity of semiconductor chilling plate and phase-change material, there is great latent heat of phase change both advantages, and introduce closed loop feedback control circuit, it is achieved LED component is dispelled the heat efficiently and thermal control reliably.
This utility model is achieved through the following technical solutions:
A kind of LED heat abstractor using semiconductor chilling plate and phase-change material, including LED component, heat-conducting substrate, radiating fin, also include semiconductor chilling plate, phase-change material and radiator fan, described LED component is packaged in heat-conducting substrate surface, described semiconductor chilling plate is clamped and is arranged between heat-conducting substrate and radiating fin, being provided with several cavitys in described radiating fin, be filled with phase-change material in cavity, described radiator fan is installed on above radiating fin.
Further, the cold end of described semiconductor chilling plate is close to heat-conducting substrate, radiating fin is close in hot junction, heat conductive silica gel is scribbled between semiconductor chilling plate and heat-conducting substrate, heat-conducting medium is scribbled between semiconductor chilling plate and radiating fin, described heat-conducting medium includes heat conductive silica gel or graphite, plays the purpose that strengthening imports, reduces thermal resistance.
Further, described semiconductor chilling plate is that screws clamp is fixed, resin glue coheres or welds with the connected mode of heat-conducting substrate and radiating fin.
Further, the material of described heat-conducting substrate is copper or aluminum.
Further, described phase-change material is to have the single phase-change material of a fusing point or have the multiple phase-change material of multiple fusing point, melting range is 30～90 DEG C, and the fusing point of phase-change material matches with semiconductor chilling plate hot-side temperature, semiconductor chilling plate hot-side temperature is in change procedure, and the multiple phase-change material of described different melting points can absorb heat phase transformation successively.
Further, described semiconductor chilling plate connects the closed control circuit for sensing described heat-conducting substrate central temperature, this closed-loop temperature control circuit is by PID control the operating current that regulates semiconductor chilling plate according to the temperature sensed, guarantee to use most suitable operating current to make LED component operating temperature less than higher limit, i.e. pass through sensed heat-conducting substrate temperature and automatically adjust semiconductor chilling plate refrigeration and control LED component operating temperature.
Further, described radiator fan connects the described closed control circuit for sensing described heat-conducting substrate central temperature, this closed-loop temperature control circuit is controlled by temperature detect switch (TDS), when sensing that heat-conducting substrate central temperature exceedes higher limit, opens radiator fan, increase the heat-sinking capability of device, when heat-conducting substrate central temperature reduces to below higher limit again, close radiator fan, both added the heat-sinking capability of device, can be automatically switched off when temperature is suitable again, energy-saving and environmental protection.
Compared with prior art, the beneficial effects of the utility model are:
(1) due to semiconductor chilling plate simple in construction, volume compact, without mobile parts so that whole heat abstractor volume is little, compact conformation.Cooling piece cold junction temperature is controlled, can accurately control the operating temperature of LED, it is ensured that temperature during LED operation is not higher than setting value all the time,
(2) owing to filling the phase-change material with superpower heat storage capacity in radiating fin, improve the heat storage capacity of whole radiating fin, in conjunction with the utilization of radiator fan, be possible not only to ensure the normal work of LED, extend the heat radiation time, and effectively reduce the volume of radiator.
Accompanying drawing illustrates:
Fig. 1 is the signal schematic diagram of this utility model embodiment.
Fig. 2 is the closed control circuit principle schematic of this utility model embodiment.
Shown in figure it is: 1-LED device；2-heat-conducting substrate；3-semiconductor chilling plate；4-phase-change material；5-radiating fin；6-radiator fan.
Detailed description of the invention:
With embodiment, detailed description of the invention of the present utility model is described in further detail below in conjunction with the accompanying drawings, but embodiment of the present utility model is not limited to this.
As depicted in figs. 1 and 2, a kind of LED heat abstractor using semiconductor chilling plate and phase-change material, including LED component 1, heat-conducting substrate 2, radiating fin 5, semiconductor chilling plate 3, phase-change material 4 and radiator fan 6, described LED component 1 is packaged in heat-conducting substrate 2 surface, the material of described heat-conducting substrate 2 is copper or aluminum, described semiconductor chilling plate 3 is clamped and is arranged between heat-conducting substrate 2 and radiating fin 5, it is provided with several cavitys in described radiating fin 5, being filled with phase-change material 4 in cavity, described radiator fan 6 is installed on above radiating fin 5.
Specifically, the cold end of described semiconductor chilling plate 3 is close to heat-conducting substrate 2, radiating fin 5 is close in hot junction, heat conductive silica gel is scribbled between semiconductor chilling plate 3 and heat-conducting substrate 2, heat-conducting medium is scribbled between semiconductor chilling plate 3 and radiating fin 5, described heat-conducting medium includes heat conductive silica gel or graphite, plays the purpose that strengthening imports, reduces thermal resistance.
Described semiconductor chilling plate 3 is that screws clamp is fixed, resin glue coheres or welds with the connected mode of heat-conducting substrate 2 and radiating fin 5.
Described phase-change material 4 is to have the single phase-change material of a fusing point or have the multiple phase-change material of multiple fusing point, melting range is 30～90 DEG C, and the fusing point of phase-change material matches with semiconductor chilling plate 3 hot-side temperature, semiconductor chilling plate 3 hot-side temperature is in change procedure, and the multiple phase-change material of described different melting points can absorb heat phase transformation successively.
Described semiconductor chilling plate 3 connects the closed control circuit for sensing described heat-conducting substrate 2 central temperature, this closed-loop temperature control circuit is by PID control the operating current that regulates semiconductor chilling plate 3 according to the temperature sensed, guarantee to use most suitable operating current to make LED component 1 operating temperature less than higher limit, i.e. pass through sensed heat-conducting substrate temperature and automatically adjust semiconductor chilling plate 3 refrigeration and control LED component 1 operating temperature.
Described radiator fan 6 connects described for sensing the closed control circuit of described heat-conducting substrate 2 central temperature, this closed-loop temperature control circuit is controlled by PID, when sensing that heat-conducting substrate 2 central temperature exceedes higher limit, open radiator fan 6, increase the heat-sinking capability of device, when heat-conducting substrate 2 central temperature reduces to below higher limit again, close radiator fan 6, both added the heat-sinking capability of device, and can be automatically switched off when temperature is suitable again, energy-saving and environmental protection.
Operation principle of the present utility model and process are as follows:
This utility model utilizes semiconductor chilling plate 3 to cool down LED component 1 and thermal control；At radiating fin 5 several cavitys of internal shaping, one or more fusing points are selected substantially to mate the phase-change material 4 of operating temperature in semiconductor chilling plate 3 hot junction, and after these one or more phase-change materials 4 are filled into cavity, cavity is sealed, these one or more phase-change materials 4 absorb and stores a part of heat that when semiconductor chilling plate 3 works, hot junction produces, the heat that this one or more phase-change material 4 that dissipate after semiconductor chilling plate 3 quits work absorbs；Another part heat that when convection current conductive semiconductor cooling piece 3 works, hot junction produces.At radiating fin 5 radiator fan installed above 6, when the free convection heat transfer only relying on radiating fin 6 can not realize the thermal control purpose to LED component 1, radiator fan 6 is utilized to carry out Forced Convection Heat Transfer.As shown in Figure 2, described semiconductor chilling plate 3 is connected to the closed control circuit for sensing described heat-conducting substrate 2 central temperature, this closed-loop temperature control circuit is by PID control the operating current that regulates semiconductor chilling plate according to the temperature sensed, it is ensured that use most suitable operating current to make LED component operating temperature less than higher limit.Described radiator fan 6 is connected to the closed control circuit for sensing described heat-conducting substrate 2 central temperature, this closed-loop temperature control circuit is controlled by temperature detect switch (TDS), when sensing that heat-conducting substrate 2 central temperature exceedes higher limit, open radiator fan 6, increase the convection heat transfer' heat-transfer by convection of device, when heat-conducting substrate 2 central temperature reduces to below higher limit again, close radiator fan 6.
Above-described embodiment of the present utility model is only for clearly demonstrating this utility model example, and is not the restriction to embodiment of the present utility model.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here without also cannot all of embodiment be given exhaustive.All any amendment, equivalent and improvement etc. made within spirit of the present utility model and principle, within should be included in this utility model scope of the claims.
Claims (7)
1. the LED heat abstractor using semiconductor chilling plate and phase-change material, including LED component (1), heat-conducting substrate (2), radiating fin (5), it is characterized in that: also include semiconductor chilling plate (3), phase-change material (4) and radiator fan (6), described LED component (1) is packaged in heat-conducting substrate (2) surface, described semiconductor chilling plate (3) is clamped and is arranged between heat-conducting substrate (2) and radiating fin (5), described radiating fin is provided with several cavitys in (5), phase-change material (4) it is filled with in cavity, described radiator fan (6) is installed on radiating fin (5) top.
Employing semiconductor chilling plate the most according to claim 1 and the LED heat abstractor of phase-change material, it is characterized in that: the cold end of described semiconductor chilling plate (3) is close to heat-conducting substrate (2), radiating fin (5) is close in hot junction, heat conductive silica gel is scribbled between semiconductor chilling plate (3) and heat-conducting substrate (2), scribbling heat-conducting medium between semiconductor chilling plate (3) and radiating fin (5), described heat-conducting medium includes heat conductive silica gel or graphite.
Employing semiconductor chilling plate the most according to claim 1 and the LED heat abstractor of phase-change material, it is characterised in that: described semiconductor chilling plate (3) is that screws clamp is fixed, resin glue coheres or welds with the connected mode of heat-conducting substrate (2) and radiating fin (5).
Employing semiconductor chilling plate the most according to claim 1 and the LED heat abstractor of phase-change material, it is characterised in that: the material of described heat-conducting substrate (2) is copper or aluminum.
Employing semiconductor chilling plate the most according to claim 1 and the LED heat abstractor of phase-change material, it is characterized in that: described phase-change material (4) is the single phase-change material with a fusing point, melting range is 30 ~ 90 DEG C, and the fusing point of phase-change material matches with semiconductor chilling plate (3) hot-side temperature.
6. according to the employing semiconductor chilling plate described in any one in claim 1 to 5 and the LED heat abstractor of phase-change material, it is characterized in that: described semiconductor chilling plate (3) connects the closed control circuit for sensing described heat-conducting substrate (2) central temperature, this closed-loop temperature control circuit is by PID control the operating current that regulates semiconductor chilling plate (3) according to the temperature sensed, it is ensured that use most suitable operating current to make LED component (1) operating temperature less than higher limit.
Employing semiconductor chilling plate the most according to claim 6 and the LED heat abstractor of phase-change material, it is characterized in that: described in described radiator fan (6) connection, be used for sensing the closed control circuit of described heat-conducting substrate (2) central temperature, this closed-loop temperature control circuit is controlled by temperature detect switch (TDS), when sensing that heat-conducting substrate (2) central temperature exceedes higher limit, open radiator fan (6), increase the heat-sinking capability of device, when heat-conducting substrate (2) central temperature reduces to below higher limit again, close radiator fan (6).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520748424 | 2015-09-23 | ||
| CN2015207484246 | 2015-09-23 |
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| Publication Number | Publication Date |
|---|---|
| CN205424859U true CN205424859U (en) | 2016-08-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520966311.3U Expired - Fee Related CN205424859U (en) | 2015-09-23 | 2015-11-27 | Adopt semiconductor refrigeration piece and phase change material's LED heat abstractor |
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| CN (1) | CN205424859U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105351899A (en) * | 2015-09-23 | 2016-02-24 | 华南理工大学 | LED heat-dissipating device adopting semiconductor refrigerating plate and phase change materials |
| CN108728046A (en) * | 2018-05-18 | 2018-11-02 | 苏州矽美科导热科技有限公司 | A kind of heat conduction heat accumulation composite material and preparation method, heat conduction heat accumulation radiator |
| CN109168304A (en) * | 2018-10-25 | 2019-01-08 | 海鹰企业集团有限责任公司 | A kind of underwater tubular electronic compartment radiator |
-
2015
- 2015-11-27 CN CN201520966311.3U patent/CN205424859U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105351899A (en) * | 2015-09-23 | 2016-02-24 | 华南理工大学 | LED heat-dissipating device adopting semiconductor refrigerating plate and phase change materials |
| CN108728046A (en) * | 2018-05-18 | 2018-11-02 | 苏州矽美科导热科技有限公司 | A kind of heat conduction heat accumulation composite material and preparation method, heat conduction heat accumulation radiator |
| CN109168304A (en) * | 2018-10-25 | 2019-01-08 | 海鹰企业集团有限责任公司 | A kind of underwater tubular electronic compartment radiator |
| CN109168304B (en) * | 2018-10-25 | 2023-10-27 | 海鹰企业集团有限责任公司 | Heat abstractor for cylindrical electronic cabin under water |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160803 Termination date: 20211127 |