CN104035459A - Frequency converter and method for controlling temperature of frequency converter - Google Patents
Frequency converter and method for controlling temperature of frequency converter Download PDFInfo
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- CN104035459A CN104035459A CN201410250636.1A CN201410250636A CN104035459A CN 104035459 A CN104035459 A CN 104035459A CN 201410250636 A CN201410250636 A CN 201410250636A CN 104035459 A CN104035459 A CN 104035459A
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Abstract
The invention discloses a frequency converter which comprises a casing, a mainboard arranged in the casing, a semiconductor refrigeration piece and a first temperature sensor. The semiconductor refrigeration piece comprises a first end adhering to a power device and a second end opposite to the first end. When the semiconductor refrigeration piece performs forward direction electrification, the first end serves as a cold end, the second end serves as a hot end, heat is transferred from the first end to the second end; when the semiconductor refrigeration piece performs reverse electrification, the first end serves as the hot end, the second end serves as the cold end, and the heat is transferred from the second end to the first end. The mainboard controls the semiconductor refrigeration piece to perform forward direction electrification or reverse electrification according to a first temperature obtained through the first temperature sensor and the range of a preset first rated temperature so as to achieve a function of cooling or heating air in the frequency converter and the power device. The invention further discloses a method for controlling the temperature of the frequency converter. The frequency converter has the advantages of being simple in structure and low in cost.
Description
Technical field
The present invention relates to domain of control temperature, relate in particular to the control method of the temperature of frequency converter and described frequency converter.
Background technology
Frequency converter, has the temperature range of normal work, is generally-10 ℃ to 40 ℃.But in actual applications, often can run into comparatively severe environment for use, as lower in region winter temperatures such as north of Chinas, easily exceed the use lowest limit temperature that frequency converter is stipulated; And higher in some industrial site first temperature, often can surpass the use highest threshold temperature that frequency converter is stipulated.
In order to make the work that frequency converter can be normally stable at above-mentioned rugged environment, when high temperature and low temperature, adopt respectively different schemes: during high temperature, conventionally adopt means such as optimizing heat dissipation wind channel, water-cooling, air-conditioning heat dissipation to lower the temperature to frequency converter; When low temperature, conventionally adopt the mode that increases the auxiliary thermal sources such as electric heater in frequency converter inside cavity to heat to frequency converter.These schemes have the following disadvantages:
1, high temperature/low temperature adopts respectively different structures and circuit arrangement, and versatility is bad, and cost is higher;
2, adopt increase electric heater to heat the method for frequency converter, although improved the environment temperature of frequency converter cavity, for IGBT, the IPM module constant power device of held against heat sink, heating effect is not good enough; Meanwhile, electric heating device is installed the restriction that is subject to frequency converter cavity space and structure.
Summary of the invention
Fundamental purpose of the present invention is to provide a kind of frequency converter, is intended to utilize same device and electric-control system to realize the function that the air in frequency converter and power device are heated and dispelled the heat.
For achieving the above object, frequency converter provided by the invention, comprise housing and be arranged at the mainboard in described housing, described mainboard comprises pcb board and the power component that is installed in described pcb board one side, and described frequency converter also comprises semiconductor chilling plate and the first temperature sensor being arranged in described housing; The port that described semiconductor chilling plate and the first temperature sensor are corresponding with described mainboard is electrically connected to;
Described semiconductor chilling plate comprises the first end and second end relative with described first end being attached on described power component, described semiconductor chilling plate is when forward is switched on, described first end is cold junction, and described the second end is hot junction, and heat shifts to the second end from first end; Described semiconductor chilling plate is when reverse energising, and described first end is hot junction, and described the second end is cold junction, and heat shifts to first end from the second end;
The first temperature that described mainboard obtains according to described the first temperature sensor is controlled described semiconductor chilling plate forward energising or reverse energising with the first default rated temperature range, thereby realizes the function that the air in frequency converter and power device are dispelled the heat or heated.
Preferably, described the first temperature sensor be installed in described housing, be positioned at described semiconductor chilling plate towards a side of mainboard to obtain the first temperature of described mainboard present position.
Preferably, described frequency converter also comprises is located at the second temperature sensor that interior and corresponding with the described mainboard port of described housing is electrically connected to, and described the second temperature sensor is located at the surface of described power component;
The first temperature that described mainboard obtains according to described the first temperature sensor, the second temperature that described the second temperature sensor obtains, the first default rated temperature range are controlled described semiconductor chilling plate forward energising or reverse energising with the second default rated temperature range.
Preferably, described mainboard comprises current regulating circuit, and described current regulating circuit is electrically connected to described semiconductor chilling plate, to regulate the electric current of the semiconductor chilling plate of flowing through.
Preferably, described frequency converter also comprises the heating radiator of being located in described housing, described heating radiator comprises a base plate and a plurality of fin, the one side of described base plate is connected with the second end of described semiconductor chilling plate, and described a plurality of fins are connected with the another side of the described semiconductor chilling plate dorsad of described base plate; Described housing is provided with a plurality of air holes near the cross-ventilation described heating radiator.
Preferably, described heating radiator also comprises the fan that the port corresponding with described mainboard is electrically connected to, and described fan is arranged on described heat radiator fin side.
The present invention further provides a kind of control method of temperature of above-mentioned frequency converter, the step of described control method comprises:
Described mainboard obtains the first temperature in housing by the first temperature sensor;
Described mainboard is controlled the energising of semiconductor chilling plate forward or reverse energising according to described the first temperature and the first default rated temperature range, so that the first temperature is positioned at described rated temperature range.
Preferably, the step of described control method also comprises:
Described mainboard obtains second temperature on power component surface by the second temperature sensor being electrically connected to its corresponding ports;
The first temperature that described mainboard obtains according to described the first temperature sensor, the second temperature that described the second temperature sensor obtains, the first default rated temperature range are controlled described semiconductor chilling plate forward energising or reverse energising with the second default rated temperature range, thereby realize the function that the air in frequency converter and power device are dispelled the heat or heated.
Preferably, the first temperature that described mainboard obtains according to described the first temperature sensor, the second temperature that described the second temperature sensor obtains, default the first rated temperature range specifically comprise with the step that the second default rated temperature range is controlled described semiconductor chilling plate forward energising or reverse energising:
When described the first temperature of obtaining lower than the minimum of the first rated temperature range or described the second temperature of obtaining the minimum lower than the second rated temperature range, described mainboard is controlled the reverse energising of described semiconductor chilling plate, the first end of semiconductor chilling plate is hot junction, produces heat the air in frequency converter and power device are heated;
When described the first temperature of obtaining is higher than the mxm. of the first rated temperature range or described the second temperature of obtaining during higher than the mxm. of the second rated temperature range, described mainboard is controlled described semiconductor chilling plate forward energising, the first end of semiconductor chilling plate is cold junction, absorbs heat dispelling the heat to the air in frequency converter and power device.
Preferably, the first temperature that described mainboard obtains according to described the first temperature sensor, the second temperature that described the second temperature sensor obtains, default the first rated temperature range specifically also comprise with the step that the second default rated temperature range is controlled described semiconductor chilling plate forward energising or reverse energising:
Outside described the first temperature is positioned at the scope of the first rated temperature or described the second temperature be positioned at outside the scope of the second rated temperature, current regulating circuit in described mainboard is controlled described semiconductor chilling plate and is worked under current state, make the first end of semiconductor chilling plate improve rapidly or reduce temperature, thereby shorten the time that regulates temperature;
When described the first temperature is positioned at the scope of the first rated temperature and the scope that described the second temperature is positioned at the second rated temperature, current regulating circuit in described mainboard is controlled described semiconductor chilling plate and is worked or quit work under little current status, so that the first temperature is positioned at the scope of the first rated temperature and the scope that described the second temperature is positioned at the second rated temperature all the time all the time.
Frequency converter provided by the present invention, heats to frequency converter when the low temperature by semiconductor chilling plate, when high temperature, to frequency converter, dispels the heat, and effectively increases the environment for use temperature range of frequency converter, improves environmental suitability and the reliability of frequency converter; Above-mentioned frequency converter only uses the circuit of controlling semiconductor chilling plate in semiconductor chilling plate and mainboard can under varying environment, realize respectively heating and two kinds of functions of cooling, therefore with respect to existing frequency converter, above-mentioned frequency converter has the simple in structure and low effect of cost.
Accompanying drawing explanation
Fig. 1 is the cross-sectional schematic of frequency converter one embodiment of the present invention;
Fig. 2 is the process flow diagram of the first embodiment of control method of the temperature of frequency converter of the present invention;
Fig. 3 is the process flow diagram of the second embodiment of control method of the temperature of frequency converter of the present invention;
Fig. 4 is the detail flowchart of the control method shown in Fig. 3.
The realization of the object of the invention, functional characteristics and advantage, in connection with embodiment, are described further with reference to accompanying drawing.
Embodiment
Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
The invention provides a kind of frequency converter, with reference to Fig. 1, in one embodiment, this frequency converter comprises housing 1 and is arranged at the mainboard 2 in described housing 1, and described mainboard 2 comprises pcb board 21 and is installed in the power component 22 of described pcb board 21 1 sides.Described frequency converter also comprises semiconductor chilling plate 3 and the first temperature sensor 4 being arranged in described housing 1; The port that described semiconductor chilling plate 3 is corresponding with described mainboard 2 with the first temperature sensor 4 is connected.
Described semiconductor chilling plate 3 comprises the first end 31 and second end 32 relative with described first end 31 being attached on described power component.Described semiconductor chilling plate 3 is when forward is switched on, and described first end 31 is cold junction, and described the second end 32 is hot junction, and heat shifts to the second end 32 from first end 31; Described semiconductor chilling plate 3 is when reverse energising, and described first end 31 is hot junction, and described the second end 32 is cold junction, and heat shifts to first end 31 from the second end 32.
The first temperature that described mainboard 2 obtains according to described the first temperature sensor 4 is controlled described semiconductor chilling plate 3 forwards energising or reverse energisings with the first default rated temperature range, thereby realizes the function that the air in frequency converter and power device are dispelled the heat or heated.
Above-mentioned frequency converter can heat to frequency converter by semiconductor chilling plate 3 when low temperature, when high temperature, to frequency converter, dispels the heat, and effectively increases the environment for use temperature range of frequency converter, improves environmental suitability and the reliability of frequency converter; With respect to existing frequency converter, above-mentioned frequency converter only uses the circuit of semiconductor chilling plate 3 and the interior control semiconductor chilling plate 3 of mainboard 2 can under varying environment, realize respectively heating and two kinds of functions of cooling, thereby more economical.
Particularly, the power component 22 of frequency converter can be the larger semiconductor devices of thermal value such as intelligent power module, power factor correction module PFC, IGBT, rectifier bridge stack UR.
In above-mentioned frequency converter, can also between power component 22 and semiconductor chilling plate 3, smear heat conductive silica gel, can also between semiconductor chilling plate 3 and heating radiator 6, be coated with heat conductive silica gel, to increase heat transfer effect.
In above-mentioned frequency converter, described the first temperature sensor 4 is installed in described housing 1 and is positioned at described semiconductor chilling plate 3 towards a side of mainboard 2, and the first temperature that now the first temperature sensor 4 obtains and the temperature of described mainboard 2 environment of living in are more approaching.Particularly, due to the refrigeration of semiconductor chilling plate 3 with heat as the transfer of heat between its first end 31 and the second end 32, therefore, the interior temperature near its first end 31 of the housing 1 of frequency converter and be inverse change near its second end 32.Therefore, the first temperature sensor 4 of above-mentioned frequency converter is located at semiconductor chilling plate 3 towards a side of mainboard 2, after work a period of time, also can obtain comparatively exactly the environment temperature of mainboard 2 present positions.
Further, above-mentioned frequency converter also comprises to be located in described housing 1 and the second temperature sensor 5 of the port electrical connection corresponding with described mainboard 2, described the second temperature sensor 5 is located at the surface of described power component 22, thereby makes mainboard 2 can obtain more accurately second temperature on power component surface on it.In the present embodiment, the second temperature sensor 5 is located at the edge of described semiconductor chilling plate 3 and described power component 22 surface of contact.Particularly, in hot transfer law, heat is delivered to from the higher place of heat the place that heat is lower, and the transmission of this heat needs the regular hour.Therefore in real work, because power component 22 power consumptions are larger, temperature rises very fast, the first temperature that therefore the first temperature sensor 4 obtains, the real-time temperature that can not reflect power component 22, there will be power component 22 when needs are lowered the temperature and is not lowered the temperature.By the second temperature sensor 5, can obtain timely the surface temperature of power component 22, thereby avoid power component 22 excess Temperatures and damage.And the temperature that frequency converter can not normally start or the reason of steady operation is above-mentioned power component 22 is conventionally positioned at outside the rated temperature of its demarcation, therefore above-mentioned frequency converter can be controlled more accurately semiconductor chilling plate 3 work after the second temperature that obtains power component 22 surfaces.
Particularly, the first temperature that described mainboard 2 obtains according to described the first temperature sensor 4, the second temperature that described the second temperature sensor 5 obtains, the first default rated temperature range are controlled described semiconductor chilling plate 3 forwards energising or reverse energisings with the second default rated temperature range, thereby realize the function that the air in frequency converter and power device 22 are dispelled the heat or heated.Within wherein the second rated temperature range is positioned at the rated temperature of demarcation of described power component 22.And the first rated temperature range can be according to the difference of the first temperature sensor 4 residing positions and frequency converter is demarcated relatively nominal operation environment temperature makes the appropriate adjustments.
Particularly, the surface temperature that records described power component 22 when described the second temperature sensor 5 is during higher than the mxm. of the second rated temperature range, described semiconductor chilling plate 3 is forward energising under the control of described mainboard 2, described first end 31 is cold junction, absorption heat dispels the heat to the air in frequency converter and power device, makes its cooling; The surface temperature that records described power component 22 when described the second temperature sensor 5 is during lower than the minimum of described the second rated temperature range, the reverse energising under the control of described mainboard 2 of described semiconductor chilling plate 3, described first end 31 is hot junction, produce heat the air in frequency converter and power device 22 are heated, make its intensification.
Further, described mainboard 2 comprises current regulating circuit, and described current regulating circuit is electrically connected to described semiconductor chilling plate 3, to regulate the size of current of the semiconductor chilling plate 3 of flowing through, reaches and regulates heating or the effect of heat radiation and the object of speed.Above-mentioned frequency converter, on the one hand, can outside the first temperature is positioned at the first rated temperature range or when the second temperature is positioned at outside the second rated temperature range, strengthen electric current, semiconductor chilling plate 3 is worked under current state, make its first end 31 improve rapidly or reduce temperature, thereby shorten the time that regulates temperature.On the other hand, when the first temperature is positioned at when the first rated temperature range and the second temperature are positioned at the second rated temperature range, reduces electric current or open circuit, make semiconductor chilling plate 3 work or quit work under low current condition, make the first temperature remain in the first rated temperature range and the second temperature remains in the second rated temperature range, thereby make the efficiency of above-mentioned frequency converter higher, work more stable.
Further, described frequency converter also comprises heating radiator 6, described heating radiator 6 comprises a base plate 61 and a plurality of fin 62, the one side of described base plate 61 is connected with the second end 32 of described semiconductor chilling plate 3, and described a plurality of fins 62 are connected with the another side of described semiconductor chilling plate 3 dorsad of described base plate 61; Described housing 1 is provided with a plurality of air holes 11 near the cross-ventilation described heating radiator 6.Heating radiator 6 can increase the second end 32 of described semiconductor chilling plate 3 and the contact area of air, thereby accelerates neither endothermic nor exothermic from air.Certainly, in other embodiments, can be also the heat radiator that is provided with heronsbill type heat radiator or other shapes; Or employing water-cooling radiating structure.
Those skilled in the art understand, existing heat radiation and heating system are divided in the frequency converter being arranged, its cooling system generally includes radiating fin, because radiating fin is passive heat radiation, therefore when existing heating system heats frequency converter, the heat that radiating fin will produce electric heater is discharged, and causes heating effect poor.And above-mentioned frequency converter, when 3 pairs of power devices 22 of semiconductor chilling plate heat, semiconductor chilling plate 3 shifts the heat of the second end 32 to first end 31, thereby heats to power device 22, heating radiator 6 is lowered the temperature simultaneously; The temperature in fin 62 places of heating radiator 6 will be lower than its residing environment temperature, and now, heating radiator 6 will absorb heat from absorbing the external world, and the second end 32 that is passed to semiconductor chilling plate 3 is to improve the temperature of the second end 32.Through above-mentioned analysis, can draw, with respect to existing heat radiation and heating system, divide the frequency converter being arranged, the heating efficiency of above-mentioned frequency converter is higher and structure is simpler.
Further, described heating radiator 6 also comprises the fan 7 that the port corresponding with described mainboard 2 is electrically connected to, and to accelerate the heat transmission between heating radiator 6 and air, described fan 7 is arranged on described heating radiator 6 side of described pcb board 21 dorsad.
The present invention also provides the control method for the temperature of above-mentioned frequency converter, please refer to Fig. 2, and in one embodiment, described control method comprises step:
The first temperature that step S10, described mainboard 2 obtain in described housing 1 by the first temperature sensor 4;
Step S11, described mainboard 2 are controlled semiconductor chilling plate 3 forward energising or reverse energisings according to described the first temperature and the first default rated temperature range, so that the first temperature is positioned at described rated temperature range.
In above-mentioned control method, by temperature sensor, the first temperature in frequency converter shell 1 can be known, thereby heating or heat radiation can be judged whether to need; When needs heating or heat radiation, only need to control semiconductor chilling plate 3 forwards or reverse energising and can realize the air in frequency converter shell 1 and transducer power device are heated or dispelled the heat, so that the first temperature is positioned at rated temperature range.
Please refer to Fig. 3, in the second embodiment of frequency converter temperature-controlled process of the present invention, the step of described control method comprises:
The first temperature that step S21, described mainboard 2 obtain in described housing 1 by the first temperature sensor 4;
Step S22, described mainboard 2 obtain second temperature on power component 22 surfaces by the second temperature sensor 5.
The first temperature that step S23, described mainboard 2 obtain according to described the first temperature sensor 4, the second temperature that described the second temperature sensor 5 obtains, the first default rated temperature range are controlled described semiconductor chilling plate 3 forward energising or reverse energisings with the second default rated temperature range.
By the second temperature sensor 5, can obtain the temperature on power component 22 surfaces, thus can condition comparatively accurate and that semiconductor chilling plate 3 is opened in judgement timely.Particularly, the temperature on the cavity temperature in housing and power component 22 surfaces normally has the temperature difference.For example, when not working, when sun direct projection and temperature higher time, the cavity temperature in frequency converter shell may be higher than the temperature on power component 22 surfaces; In work, because power component 22 is in heating, the cavity temperature in frequency converter shell conventionally can be lower than the temperature on power component 22 surfaces.
Please refer to Fig. 4, particularly, the first temperature that described mainboard 2 obtains according to described the first temperature sensor 4, the second temperature that described the second temperature sensor 5 obtains, default the first rated temperature range and the second default rated temperature range are controlled the step S23 of described semiconductor chilling plate 3 forwards energisings or reverse energising, specifically comprise:
Step S241, when described the first temperature of obtaining lower than the minimum of the first rated temperature range or described in the second temperature of obtaining during lower than the minimum of the second rated temperature range, described mainboard 2 is controlled the reverse energising of described semiconductor chilling plate 3.
Step S242, when described the first temperature of obtaining is higher than the mxm. of the first rated temperature range or described the second temperature of obtaining during higher than the mxm. of the second rated temperature range, described mainboard 2 is controlled described semiconductor chilling plate 3 forwards energisings.
Please again referring to Fig. 4, further, the first temperature that described mainboard 2 obtains according to described the first temperature sensor 4, the second temperature that described the second temperature sensor 5 obtains, default the first rated temperature range and the second default rated temperature range are controlled the step S23 of described semiconductor chilling plate 3 forwards energisings or reverse energising, also comprise:
Step S251, be positioned at outside the first rated temperature range and when described the second temperature is positioned at outside the second rated temperature range when described the first temperature, current regulating circuit in described mainboard 2 is controlled described semiconductor chilling plate 3 and is worked under current state, so that the first temperature and the second temperature are drawn close to the first rated temperature range and second nominal working range of its correspondence fast.
Step S252, when described the first temperature is positioned at the first rated temperature range and described the second temperature and is positioned at the second rated temperature range, current regulating circuit in described mainboard 2 is controlled described semiconductor chilling plate 3 and is worked or quit work under little current status, so that the first temperature is positioned at the scope of the first rated temperature and the scope that described the second temperature is positioned at the second rated temperature all the time all the time.
Above-mentioned control method, on the one hand, can outside the first temperature is positioned at the first rated temperature range or when the second temperature is positioned at outside the second rated temperature range, strengthen electric current, semiconductor chilling plate 3 is worked under current state, thereby shorten the time that regulates temperature.On the other hand, when the first temperature is positioned at when the first rated temperature range and the second temperature are positioned at the second rated temperature range, reduces electric current or open circuit, make semiconductor chilling plate under little current status, work or quit work for 3 years, make the first temperature remain in the first rated temperature range or the second temperature remains in the second rated temperature range, thereby made to use the efficiency of frequency converter of above-mentioned control method higher, worked more stable.
Certainly, in other embodiments, temperature sensor also can adopt one or three, four or more, and the actual temperature that current regulating circuit in mainboard obtains at these temperature sensors reduces electric current or opens circuit while being all positioned at its corresponding rated temperature range; Otherwise increasing electric current.
These are only the preferred embodiments of the present invention; not thereby limit the scope of the claims of the present invention; every equivalent structure or conversion of equivalent flow process that utilizes instructions of the present invention and accompanying drawing content to do; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (10)
1. a frequency converter, comprise housing and be arranged at the mainboard in described housing, described mainboard comprises pcb board and the power component that is installed in described pcb board one side, it is characterized in that, described frequency converter also comprises semiconductor chilling plate and the first temperature sensor being arranged in described housing; The port that described semiconductor chilling plate and the first temperature sensor are corresponding with described mainboard is electrically connected to;
Described semiconductor chilling plate comprises the first end and second end relative with described first end being attached on described power component, described semiconductor chilling plate is when forward is switched on, described first end is cold junction, and described the second end is hot junction, and heat shifts to the second end from first end; Described semiconductor chilling plate is when reverse energising, and described first end is hot junction, and described the second end is cold junction, and heat shifts to first end from the second end;
The first temperature that described mainboard obtains according to described the first temperature sensor is controlled described semiconductor chilling plate forward energising or reverse energising with the first default rated temperature range.
2. frequency converter as claimed in claim 1, is characterized in that, described the first temperature sensor be installed in described housing, be positioned at described semiconductor chilling plate towards a side of mainboard to obtain the first temperature of described mainboard present position.
3. frequency converter as claimed in claim 2, is characterized in that, described frequency converter also comprises is located at the second temperature sensor that interior and corresponding with the described mainboard port of described housing is electrically connected to, and described the second temperature sensor is located at the surface of described power component;
The first temperature that described mainboard obtains according to described the first temperature sensor, the second temperature that described the second temperature sensor obtains, the first default rated temperature range are controlled described semiconductor chilling plate forward energising or reverse energising with the second default rated temperature range.
4. frequency converter as claimed in claim 1, is characterized in that, described mainboard comprises current regulating circuit, and described current regulating circuit is electrically connected to described semiconductor chilling plate, to regulate the electric current of the semiconductor chilling plate of flowing through.
5. the frequency converter as described in claim 1 to 4 any one, it is characterized in that, described frequency converter also comprises the heating radiator of being located in described housing, described heating radiator comprises a base plate and a plurality of fin, the one side of described base plate is connected with the second end of described semiconductor chilling plate, and described a plurality of fins are connected with the another side of the described semiconductor chilling plate dorsad of described base plate; Described housing is provided with a plurality of air holes near the cross-ventilation described heating radiator.
6. frequency converter as claimed in claim 5, is characterized in that, described heating radiator also comprises the fan that the port corresponding with described mainboard is electrically connected to, and described fan is arranged on the fin side of described heating radiator.
7. a control method for the temperature of frequency converter, is characterized in that, described frequency converter is frequency converter claimed in claim 1, and the step of described control method comprises:
Described mainboard obtains the first temperature in housing by the first temperature sensor;
Described mainboard is controlled the energising of semiconductor chilling plate forward or reverse energising according to described the first temperature and the first default rated temperature range, so that the first temperature is positioned at described the first rated temperature range.
8. control method as claimed in claim 7, is characterized in that, the step of described control method also comprises:
Described mainboard obtains second temperature on power component surface by the second temperature sensor being electrically connected to its corresponding ports;
The first temperature that described mainboard obtains according to described the first temperature sensor, the second temperature that described the second temperature sensor obtains, the first default rated temperature range are controlled described semiconductor chilling plate forward energising or reverse energising with the second default rated temperature range, so that the first temperature and the second temperature lay respectively in described first rated temperature range and the second temperature range of its correspondence.
9. control method as claimed in claim 8, it is characterized in that, the first temperature that described mainboard obtains according to described the first temperature sensor, the second temperature that described the second temperature sensor obtains, default the first rated temperature range specifically comprise with the step that the second default rated temperature range is controlled described semiconductor chilling plate forward energising or reverse energising:
When described the first temperature of obtaining lower than the minimum of the first rated temperature range or described the second temperature of obtaining the minimum lower than the second rated temperature range, described mainboard is controlled the reverse energising of described semiconductor chilling plate;
When described the first temperature of obtaining is higher than the mxm. of the first rated temperature range or described the second temperature of obtaining during higher than the mxm. of the second rated temperature range, described mainboard is controlled described semiconductor chilling plate forward energising.
10. control method as claimed in claim 9, it is characterized in that, the first temperature that described mainboard obtains according to described the first temperature sensor, the second temperature that described the second temperature sensor obtains, default the first rated temperature range specifically also comprise with the step that the second default rated temperature range is controlled described semiconductor chilling plate forward energising or reverse energising:
Outside described the first temperature is positioned at the scope of the first rated temperature or described the second temperature be positioned at outside the scope of the second rated temperature, the current regulating circuit in described mainboard is controlled described semiconductor chilling plate and is worked under current state;
When described the first temperature is positioned at the scope of the first rated temperature and the scope that described the second temperature is positioned at the second rated temperature, current regulating circuit in described mainboard is controlled described semiconductor chilling plate and is worked or quit work under little current status, so that the first temperature is positioned at the scope of the first rated temperature and the scope that described the second temperature is positioned at the second rated temperature all the time all the time.
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| CN106211703A (en) * | 2015-04-30 | 2016-12-07 | 佛山市顺德区美的电热电器制造有限公司 | The heat abstractor of power device and the cooling control method of power device |
| CN107454799A (en) * | 2017-07-31 | 2017-12-08 | 阳泉煤业（集团）有限责任公司 | Improve the method for power module of converter heat dispersion using semiconductor heat electrical effect |
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| CN107454799A (en) * | 2017-07-31 | 2017-12-08 | 阳泉煤业（集团）有限责任公司 | Improve the method for power module of converter heat dispersion using semiconductor heat electrical effect |
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| CN111509952A (en) * | 2020-04-24 | 2020-08-07 | 江苏哈哈社信息科技有限公司 | Intelligent switching power supply |
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| CN112152426A (en) * | 2020-09-09 | 2020-12-29 | 淮南万泰电子股份有限公司 | Frequency converter with intracavity environment detection function and working method thereof |
| CN112152426B (en) * | 2020-09-09 | 2023-07-28 | 淮南万泰电子股份有限公司 | Frequency converter with intra-cavity environment detection function and working method thereof |
| CN112965586A (en) * | 2021-03-05 | 2021-06-15 | 山东英信计算机技术有限公司 | Temperature control method, system and device of edge server and edge server |
| CN112902494A (en) * | 2021-03-30 | 2021-06-04 | 联想(北京)有限公司 | Control method and electronic device |
| CN114326851A (en) * | 2021-11-17 | 2022-04-12 | 苏州浪潮智能科技有限公司 | Edge intelligent temperature control method and system based on TEC |
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