CN204406311U - A kind of rapid heat radiation device of hypervelocity chip - Google Patents
A kind of rapid heat radiation device of hypervelocity chip Download PDFInfo
- Publication number
- CN204406311U CN204406311U CN201520014914.3U CN201520014914U CN204406311U CN 204406311 U CN204406311 U CN 204406311U CN 201520014914 U CN201520014914 U CN 201520014914U CN 204406311 U CN204406311 U CN 204406311U
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- China
- Prior art keywords
- chip
- hypervelocity
- silica gel
- heat
- conductive silica
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The utility model belongs to microelectronics technology, is specially a kind of rapid heat radiation device of hypervelocity chip.Rapid heat radiation device comprises the finned radiator, temperature detect switch (TDS), semiconductor chilling plate and the air-cooled radiator that are installed at successively on hypervelocity chip; The utility model be combined with each other Natural Heat Convection, semiconductor chilling plate heat radiation and wind-cooling heat dissipating mode.When hypervelocity chip operation is in low frequency state, chip cooling amount is less, and finned radiator relies on Natural Heat Convection can meet chip cooling requirement; When high-speed chip works in high frequency state, chip cooling amount sharply increases, and temperature detect switch (TDS) opens semiconductor chilling plate and air-cooled radiator, rapidly cooling hypervelocity chip.The utility model solves that current and following hypervelocity chip is difficult to, the technology barrier of quick heat radiating, has efficient, economic, energy-conservation, simple and convenient advantage simultaneously.
Description
Technical field
The utility model belongs to microelectronic manufacturing technology field, is specifically related to a kind of rapid heat radiation device of hypervelocity chip.
Background technology
Along with microelectric technique development, the integrated level of chip constantly increases, and the heat produced during its work also constantly increases.The accumulation of heat will cause chip temperature to raise, and its performance will significantly decline, and therefore there is the node temperature of regulation chip in chip producer.In ordinary numbers circuit, because the power consumption of low-speed circuits is less, under normal radiating condition, the working temperature of chip can not be too high, so need not consider the heat dissipation problem of chip.And in high-speed circuits, hypervelocity chip can instantaneous generation amount of heat, and chip temperature raises rapidly and causes its hydraulic performance decline even to burn.By settling external radiating device on chip cooling face, the temperature of chip must be controlled within the scope of node temperature.
Traditional chip cooling adopts air-cooled radiator.At present, simple air-cooled radiator wants the cooling requirements meeting hypervelocity chip, must improve rotation speed of the fan or increase radiated rib surface area.But being subject to the restriction of equipment volume and applied environment, traditional air-cooled radiator is difficult to the cooling requirements meeting hypervelocity chip.
According to Newton's law of cooling, the radiating efficiency of fluid for radiating heat is proportional to the temperature difference between solid and fluid.Utilize semiconductor chilling plate rapidly heat can be transferred to radiated rib from chip cooling face, improve fin working temperature and and air between the temperature difference, thus under the prerequisite not changing rotation speed of the fan and radiated rib surface area, significantly can improve the radiating efficiency of air-cooled radiator.And it is combined with finned radiator and is controlled unlatching opportunity of semiconductor chilling plate and air-cooled radiator by temperature detect switch (TDS), both can meet the cooling requirements of the hypervelocity chip of low frequency operation, and semi-conductor chip refrigeration end can have been avoided again to condense thus affect the reliability of chip.
Utility model content
The purpose of this utility model is the cooling requirements that can not meet hypervelocity chip for the chip system heat radiation passed, and proposes a kind of rapid heat radiation device of efficient hypervelocity chip.
The utility model proposes a kind of rapid heat radiation device of efficient hypervelocity chip, comprise the finned radiator, temperature detect switch (TDS), semiconductor chilling plate and the air-cooled radiator that are installed at successively on hypervelocity chip.When hypervelocity chip operation is in low frequency state, chip cooling amount is less, and finned radiator can meet chip cooling requirement; When high-speed chip works in high frequency state, chip cooling amount sharply increases, and temperature detect switch (TDS) opens semiconductor chilling plate and air-cooled radiator, thus cools hypervelocity chip rapidly.
Wherein, hypervelocity chip cooling face uniform application has heat conductive silica gel, and finned radiator is placed on heat conductive silica gel, and with heat conductive silica gel close contact; In the middle part of finned radiator, heat conduction platform uniform application has heat conductive silica gel, and temperature detect switch (TDS) and semiconductor chilling plate refrigeration end are placed on this heat conductive silica gel, and temperature detect switch (TDS) and semiconductor chilling plate and heat conductive silica gel close contact; Have heat conductive silica gel at semiconductor chilling plate radiating end uniform application, air-cooled radiator is placed on this heat conductive silica gel, and air-cooled radiator and heat conductive silica gel close contact; Semiconductor chilling plate is in parallel with air-cooled radiator accesses temperature detect switch (TDS) output terminal, temperature detect switch (TDS) input end access external stabilized power.
During use, whole device is fixed on circuit board below hypervelocity chip or device housings with screw, makes to combine closely between whole heat abstractor all parts, to ensure good radiating effect.
In the utility model, described heat conductive silica gel is the high-performance heat conductive silica gel (coefficient of heat conductivity is greater than 5W/m-k) containing metallic particles.
In the utility model, described finned radiator, its material is the material such as copper, aluminium, graphite that heat conductivility is good.Having in the middle part of it can the heat conduction platform of holding semiconductor cooling piece and attemperating unit.
In the utility model, the refrigeration part material of described semiconductor chilling plate is the Commercial semiconductors cooling piece of PbTe, SiGe, GeTe and II-V race, II-VI race, V-VI compounds of group, and its refrigeration work consumption is greater than 50W.
In the utility model, described temperature detect switch (TDS) is the temperature detect switch (TDS)s such as liquid expansion type open in usual, gas absorption formula or expansion of metal formula, and its closed temperature is 50 DEG C.
In the utility model, described air-cooled radiator should have fin, and material is the material such as copper, aluminium, graphite that heat conductivility is good.Rotation speed of the fan is greater than 2000RPM.
The utility model has the advantage of the hypervelocity chip under utilizing semiconductor chilling plate to cool rapidly high-frequency work state, and the heat of absorption is passed to air-cooled radiator rapidly, improve the working temperature of air-cooled radiator, thus significantly improve the work efficiency of air-cooled radiator, solve the realistic problem that traditional heat-dissipating method can not do the requirement of sufficient hypervelocity chip cooling.And this method controls semiconductor chilling plate and air-cooled radiator by temperature detect switch (TDS) only opens when hypervelocity chip high-frequency work, thus solves the too low problem causing disclosing of semiconductor chilling plate refrigeration cold junction temperature, and time saved the energy.
Accompanying drawing explanation
Fig. 1 is the rapid heat radiation device schematic diagram (sectional view) of hypervelocity chip of the present utility model.
Fig. 2 is the rapid heat radiation device schematic diagram (vertical view) of hypervelocity chip of the present utility model.
The enforcement figure that Fig. 3 utilizes the utility model device to dispel the heat for computer CPU.
Number in the figure: 1 is power lead, 2 is temperature detect switch (TDS), and 3 is heat conductive silica gel, and 4 is semiconductor chilling plate, and 5 is finned radiator, and 6 is air-cooled radiator.7 is the utility model heat abstractor, and 8 is stabilized voltage supply, and 9 is computer main board, and 10 is central processing unit (CPU).
Embodiment
Hereafter composition graphs is shown in reference example and more specifically describes the utility model, and the utility model provides preferred embodiment, but should not be considered to be only limitted to embodiment set forth herein.
The rapid heat radiation device that the present embodiment sets forth the efficient hypervelocity chip provided by the utility model is applied to the specific implementation process of central processing unit (CPU) heat radiation.Semiconductor chilling plate involved by the present embodiment and air-cooled radiator rated voltage are 12V.Embodiment is as follows:
1, respectively that central processing unit (CPU) radiating surface, finned radiator thermal interface, semiconductor chilling plate chill surface and radiating surface, the process of air-cooled radiator thermal interface is clean with alcohol;
2, by heat conductive silica gel uniform application heat conduction platform in the middle part of finned radiator, respectively temperature detect switch (TDS) and semiconductor chilling plate refrigeration end are placed on heat conductive silica gel, and guarantee temperature detect switch (TDS) and semiconductor chilling plate and heat conductive silica gel close contact;
3, by heat conductive silica gel uniform application in semiconductor chilling plate radiating end, and by air-cooled radiator as on heat conductive silica gel, guarantee air-cooled radiator and heat conductive silica gel close contact;
4, with screw, whole device is fixed on computer motherboard, makes to combine closely between whole heat abstractor all parts, thus ensure good radiating effect;
5, semiconductor chilling plate is in parallel with air-cooled radiator accesses temperature detect switch (TDS) output terminal, temperature detect switch (TDS) input end access computing machine 12V stabilized voltage supply.
Claims (5)
1. a rapid heat radiation device for hypervelocity chip, is characterized in that comprising the finned radiator, temperature detect switch (TDS), semiconductor chilling plate and the air-cooled radiator that are installed at successively on hypervelocity chip; Wherein:
Hypervelocity chip cooling face uniform application has heat conductive silica gel, and finned radiator is placed on heat conductive silica gel, and with heat conductive silica gel close contact; Have heat conduction platform in the middle part of finned radiator, on this heat conduction platform, uniform application has heat conductive silica gel, and temperature detect switch (TDS) and semiconductor chilling plate refrigeration end are placed on this heat conductive silica gel, and temperature detect switch (TDS) and semiconductor chilling plate and heat conductive silica gel close contact; Have heat conductive silica gel at semiconductor chilling plate radiating end uniform application, air-cooled radiator is placed on this heat conductive silica gel, and air-cooled radiator and heat conductive silica gel close contact; Semiconductor chilling plate is in parallel with air-cooled radiator accesses temperature detect switch (TDS) output terminal, temperature detect switch (TDS) input end access external stabilized power.
2. the rapid heat radiation device of hypervelocity chip according to claim 1, it is characterized in that described heat conductive silica gel is the high-performance heat conductive silica gel containing metallic particles, its coefficient of heat conductivity is greater than 5W/m-k.
3. the rapid heat radiation device of hypervelocity chip according to claim 1, is characterized in that described finned radiator, and its material is copper, aluminium or the graphite that heat conductivility is good, and having in the middle part of it can the heat conduction platform of holding semiconductor cooling piece and attemperating unit.
4. the rapid heat radiation device of hypervelocity chip according to claim 1, it is characterized in that described temperature detect switch (TDS) is liquid expansion type open in usual, gas absorption formula or expansion of metal formula temperature detect switch (TDS), its closed temperature is 50 DEG C.
5. the rapid heat radiation device of hypervelocity chip according to claim 1, is characterized in that described air-cooled radiator has fin, and material is copper, aluminium or the graphite that heat conductivility is good, and rotation speed of the fan is greater than 2000RPM.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520014914.3U CN204406311U (en) | 2015-01-10 | 2015-01-10 | A kind of rapid heat radiation device of hypervelocity chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520014914.3U CN204406311U (en) | 2015-01-10 | 2015-01-10 | A kind of rapid heat radiation device of hypervelocity chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204406311U true CN204406311U (en) | 2015-06-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520014914.3U Expired - Fee Related CN204406311U (en) | 2015-01-10 | 2015-01-10 | A kind of rapid heat radiation device of hypervelocity chip |
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| CN (1) | CN204406311U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107289545A (en) * | 2017-07-14 | 2017-10-24 | 珠海格力电器股份有限公司 | Radiator, air-conditioner outdoor unit and air conditioner |
| CN107517570A (en) * | 2017-09-04 | 2017-12-26 | 国网浙江杭州市余杭区供电公司 | A kind of heat dissipating method of heat abstractor for communication equipment |
| CN114879781A (en) * | 2022-06-23 | 2022-08-09 | 中国联合网络通信集团有限公司 | Temperature control method, device and storage medium |
-
2015
- 2015-01-10 CN CN201520014914.3U patent/CN204406311U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107289545A (en) * | 2017-07-14 | 2017-10-24 | 珠海格力电器股份有限公司 | Radiator, air-conditioner outdoor unit and air conditioner |
| CN107289545B (en) * | 2017-07-14 | 2023-08-25 | 珠海格力电器股份有限公司 | Radiator, air conditioner outdoor unit and air conditioner |
| CN107517570A (en) * | 2017-09-04 | 2017-12-26 | 国网浙江杭州市余杭区供电公司 | A kind of heat dissipating method of heat abstractor for communication equipment |
| CN107517570B (en) * | 2017-09-04 | 2020-05-22 | 国网浙江杭州市余杭区供电公司 | Heat dissipation method of heat dissipation device for communication equipment |
| CN114879781A (en) * | 2022-06-23 | 2022-08-09 | 中国联合网络通信集团有限公司 | Temperature control method, device and storage medium |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150617 Termination date: 20190110 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |