CN202353034U - Semiconductor refrigerating and cooling device of sealing type power distribution cabinet - Google Patents

Semiconductor refrigerating and cooling device of sealing type power distribution cabinet Download PDF

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Publication number
CN202353034U
CN202353034U CN2011204670112U CN201120467011U CN202353034U CN 202353034 U CN202353034 U CN 202353034U CN 2011204670112 U CN2011204670112 U CN 2011204670112U CN 201120467011 U CN201120467011 U CN 201120467011U CN 202353034 U CN202353034 U CN 202353034U
Authority
CN
China
Prior art keywords
power distribution
distribution cabinet
rack
heat
cabinet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011204670112U
Other languages
Chinese (zh)
Inventor
陶峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHAANXI TONGLI ELECTRIC CO Ltd
Original Assignee
SHAANXI TONGLI ELECTRIC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHAANXI TONGLI ELECTRIC CO Ltd filed Critical SHAANXI TONGLI ELECTRIC CO Ltd
Priority to CN2011204670112U priority Critical patent/CN202353034U/en
Application granted granted Critical
Publication of CN202353034U publication Critical patent/CN202353034U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a semiconductor refrigerating and cooling device of a sealing type power distribution cabinet, which comprises a cabinet, wherein cabinet supporting plates are arranged in the cabinet, a semiconductor cooler is arranged on a cabinet casing between the cabinet supporting plates, a cabinet axial flow fan is mounted on the top of the cabinet, cooling fins with good cooling effects are assembled at a cooling end of a semiconductor refrigerator, and the axial flow fan blows the cooling fins to accelerate the cooling speed to decrease the temperature. The device has the advantages of being simple in structure, good in cooling effects and the like.

Description

A kind of semiconductor refrigeration radiating device of sealed type power distribution cabinet
Technical field
The utility model belongs to sealed type power distribution cabinet structure field, is specifically related to a kind of semiconductor refrigeration radiating device of sealed type power distribution cabinet.
Background technology
In the high-low voltage electric power distribution cabinet field,, and the existence of a large amount of leads is arranged because the interior of power distribution cabinet installed a large amount of connectors and various electronic devices and components; Cause the total resistance value of power distribution cabinet very high, therefore directly cause high-low voltage electric power distribution cabinet in work, promptly under the situation of conduction, can distribute great amount of heat; Temperature in the power distribution cabinet is improved suddenly, and again because the electronic devices and components and the connector of power distribution cabinet inside are very high to the dustproof requirement of power distribution cabinet, so power distribution cabinet all adopts sealed type; Reduce dust and get in the power distribution cabinet, the discharge power distribution cabinet that the heat of the generation in the high-low voltage electric power distribution cabinet is difficult to, existing heat dissipating method nowadays commonly used are in rack, to adorn powerful axial flow blower at, frame; And offer louvre, and the wind that axial flow blower is blown out forms air-cooled circulation, and the heat that high-low voltage electric power distribution cabinet is inner blows out body fast; Reach the effect of heat radiation; But adopt this radiating mode, shortcoming is obvious: first has destroyed the sealing of high-low voltage electric power distribution cabinet, makes the dust dust; Also have the dust of static electrification to get in the power distribution cabinet through blower fan and louvre; Through the circulation of blower fan attached to various electronic devices and components, connector or lead on, directly influenced the insulating properties of power distribution cabinet, even led to short circuit and cause the accident; Second shortcoming is that radiating rate is slow, because general high voltage power distributing cabinet body is bigger, in order to keep the sealing of rack as far as possible; The axial flow blower quantity of installing is few, and the louvre bore of cutting is little, and therefore air-cooled circulation receives the rack internal electronic component; Blocking of various baffle tray; Lead forming many air-cooled dead angles, can't dispel the heat, so radiating effect is very poor.
Summary of the invention
In order to overcome the deficiency of above-mentioned prior art, the purpose of the utility model has been to provide a kind of semiconductor refrigeration radiating device of sealed type power distribution cabinet, has characteristics simple in structure, perfect heat-dissipating.
To achieve these goals; The technical scheme that the utility model adopts is: a kind of semiconductor refrigeration radiating device of sealed type power distribution cabinet; Include rack; Be provided with the rack supporting plate in the rack, on the rack casing between the rack supporting plate, be provided with radiator for semiconductor, enclosure top is provided with the rack axial flow blower.
Described rack is provided with Door of communication apparatus cabinet.
Described radiator for semiconductor includes the heat sink end, and the heat sink end links to each other with the fin release end of heat, and the fin release end of heat links to each other with axial flow blower through fin.
The beneficial effect of the utility model is:
In the high-low voltage electric power distribution cabinet both sides, several groups of radiator for semiconductor evenly are installed, the heat of rack inside is absorbed uniformly; Around the semiconductor cooler release end of heat, install the high-performance fin additional, accelerate the speed of semiconductor cooler heat radiation, on fin, install axial flow blower again additional; Accelerate air circulation; Fin is carried out air-cooled, further accelerate the radiating rate of semiconductor cooler, through above cooling measure; Can reach the effect of heat radiation fast, have characteristics simple in structure, good heat dissipation effect.
Description of drawings
Fig. 1 is the utility model structural representation front view.
Fig. 2 is the utility model structural representation left view.
Fig. 3 is the radiator for semiconductor structural representation.
Embodiment
Below in conjunction with accompanying drawing the structural principle and the operation principle of the utility model are done further explain.
Referring to Fig. 1,2,3, a kind of semiconductor refrigeration radiating device of sealed type power distribution cabinet includes rack 3, is provided with rack supporting plate 2 in the rack 3, on 3 casings of the rack between the rack supporting plate 2, is provided with radiator for semiconductor 1, and rack 3 tops are provided with rack axial flow blower 4.
Described rack 3 is provided with Door of communication apparatus cabinet 5.
Described radiator for semiconductor 1 includes heat sink end 7, and heat sink end 7 links to each other with fin release end of heat 6, and fin release end of heat 6 links to each other with axial flow blower 9 through fin 8.
In the high-low voltage electric power distribution cabinet both sides, several groups of radiator for semiconductor 1 evenly are installed, the heat of rack inside is absorbed uniformly; Semiconductor cooler is installed on the shell of body both sides, preferentially selects the reasonable position of air permeability, around semiconductor cooler release end of heat 6, installs high-performance fin 8 additional; Accelerate the speed of semiconductor cooler heat radiation, on fin 8, install axial flow blower 9 again additional, blow; Accelerate air circulation; Fin is carried out air-cooled, further accelerate the radiating rate of semiconductor cooler, through above cooling measure; Can reach the effect of heat radiation fast, the inner heat of high-low voltage electric power distribution cabinet is dispelled the heat through semiconductor cooler heat absorbing end 6, release end of heat 2, fin 3, axial flow blower 4 fast.
Described semiconductor cooler 1 is installed on rack 3 sidewalls; Side-wall hole also is arranged on body 3 sidewall shell of high-low voltage electric power distribution cabinet through encapsulation process uniformly; Can be delivered to engine body exterior by the Btu utilization semiconductor cooler 1 that rack is inner; Enclosure top is installed rack axial flow blower 4, adds the circulation of inner air, and further accelerating derives body with the heat of inside.
Described semiconductor cooler is made up of high-performance fin 8, axial flow blower 9, semiconductor heat-dissipating sheet heat absorbing end 7, semiconductor heat-dissipating sheet release end of heat 6, lead, is the main devices of conduction heat.
Found and the similar effect of Seebeck effect according in 1834 Frenchman's Peltier of Peltier effect; Promptly when electric current is flowed through the contact that two different conductors form; The contact place can produce heat release and heat absorption phenomenon, and heat release or heat absorption size are decided by the size of electric current.
  Qл=л.Iл=aTc
In the formula: Q π is heat release or heat absorption power
π is a proportionality coefficient, is called Peltier coefficient
I is an operating current
A is a thermoelectric power
Tc is the cold junction temperature.
The utility model is exactly that the semiconductor that utilizes your obedient effect to process spreads backing and dispels the heat.
The above; Only be the embodiment of the utility model method; Be not that the utility model is done any restriction, every variation to any simple modification that above embodiment did, structure replaces all still belonging in the protection range of the utility model technological system according to the utility model technical scheme.

Claims (3)

1. the semiconductor refrigeration radiating device of a sealed type power distribution cabinet; Include rack (3); It is characterized in that; Be provided with rack supporting plate (2) in the rack (3), on rack (3) casing between the rack supporting plate (2), be provided with radiator for semiconductor (1), rack (3) top is provided with rack axial flow blower (4).
2. the semiconductor refrigeration radiating device of a kind of sealed type power distribution cabinet according to claim 1 is characterised in that, described rack (3) is provided with Door of communication apparatus cabinet (5).
3. the semiconductor refrigeration radiating device of a kind of sealed type power distribution cabinet according to claim 1; Be characterised in that; Described radiator for semiconductor (1) includes heat sink end (7); Heat sink end (7) links to each other with fin release end of heat (6), and fin release end of heat (6) links to each other with axial flow blower (9) through fin (8).
CN2011204670112U 2011-11-22 2011-11-22 Semiconductor refrigerating and cooling device of sealing type power distribution cabinet Expired - Fee Related CN202353034U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011204670112U CN202353034U (en) 2011-11-22 2011-11-22 Semiconductor refrigerating and cooling device of sealing type power distribution cabinet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011204670112U CN202353034U (en) 2011-11-22 2011-11-22 Semiconductor refrigerating and cooling device of sealing type power distribution cabinet

Publications (1)

Publication Number Publication Date
CN202353034U true CN202353034U (en) 2012-07-25

Family

ID=46541999

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011204670112U Expired - Fee Related CN202353034U (en) 2011-11-22 2011-11-22 Semiconductor refrigerating and cooling device of sealing type power distribution cabinet

Country Status (1)

Country Link
CN (1) CN202353034U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103872601A (en) * 2012-12-12 2014-06-18 河南省电力公司焦作供电公司 Self-circulation semiconductor refrigeration cooling electric power cabinet
CN106159682A (en) * 2016-08-04 2016-11-23 毛学辉 A kind of power communication case with dedusting cooling function
CN107658729A (en) * 2017-11-09 2018-02-02 肇庆市高新区晓靖科技有限公司 A kind of cooling system for sealed power distribution cabinet

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103872601A (en) * 2012-12-12 2014-06-18 河南省电力公司焦作供电公司 Self-circulation semiconductor refrigeration cooling electric power cabinet
CN103872601B (en) * 2012-12-12 2016-05-04 河南省电力公司焦作供电公司 A kind of self-loopa semiconductor refrigerating cooling electric power cabinet
CN106159682A (en) * 2016-08-04 2016-11-23 毛学辉 A kind of power communication case with dedusting cooling function
CN106159682B (en) * 2016-08-04 2017-09-19 毛学辉 A kind of power communication case with dedusting cooling function
CN107658729A (en) * 2017-11-09 2018-02-02 肇庆市高新区晓靖科技有限公司 A kind of cooling system for sealed power distribution cabinet

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Legal Events

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C14 Grant of patent or utility model
GR01 Patent grant
EXPY Termination of patent right or utility model
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120725

Termination date: 20141122