CN103855628A - Semiconductor-based power distribution cabinet heat dissipation system - Google Patents
Semiconductor-based power distribution cabinet heat dissipation system Download PDFInfo
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- CN103855628A CN103855628A CN201210506422.7A CN201210506422A CN103855628A CN 103855628 A CN103855628 A CN 103855628A CN 201210506422 A CN201210506422 A CN 201210506422A CN 103855628 A CN103855628 A CN 103855628A
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- heat dissipation
- heat
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- cabinet
- cabinet body
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 28
- 230000017525 heat dissipation Effects 0.000 title abstract 15
- 238000001816 cooling Methods 0.000 claims description 9
- 238000004891 communication Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 5
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
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Abstract
A semiconductor-based power distribution cabinet heat dissipation system comprises a cabinet body; the cabinet body is of a hollow cuboid structure; two sides of the cabinet body are provided with circulating air ducts; air outlets and return air inlets which are communicated with the interior of the cabinet body are respectively formed at upper portions and lower portions of the circulating air ducts; circulating fans are arranged at communicated openings; a semiconductor heat dissipation system is arranged inside the circulating air ducts and specifically comprises semiconductor devices mounted inside side plates of the cabinet body as well as heat dissipation sheets and heat dissipation fans which are mounted outside the side plates of the cabinet body, wherein the heat dissipation fans are mounted outside the heat dissipation sheets; and each semiconductor device comprises a heat absorbing end for absorbing heat inside the air ducts and a heat dissipation end for transferring the heat of the heat absorbing end to the heat dissipation sheets. According to the semiconductor-based power distribution cabinet heat dissipation system of the invention, semiconductors are adopted to perform efficient heat dissipation, which enables a stable and efficient heat dissipation effect; and at the same time, the semiconductor heat dissipation system is mounted inside the circulating air ducts at the two sides of the cabinet body, and therefore, on the one hand, a circulating heat dissipation effect can be enhanced, and on the other hand, the operation of electrical components in the cabinet body will not be affected by the heat dissipation system.
Description
Technical field
The present invention relates to power distribution cabinet, particularly a kind of power distribution cabinet cooling system of based semiconductor.
Background technology
In power distribution cabinet field, due to interior a large amount of connectors and the various electronic devices and components installed of power distribution cabinet, and there is the existence of a large amount of wires, cause the total resistance value of power distribution cabinet very high, therefore directly cause power distribution cabinet in work, the in the situation that of conduction, can distribute a large amount of heats, temperature in power distribution cabinet is improved suddenly, again because electronic devices and components and the connector of power distribution cabinet inside are very high to the dustproof requirement of power distribution cabinet, therefore power distribution cabinet all adopts sealed type, reducing dust enters in power distribution cabinet, will make so the very difficult discharge power distribution cabinet of heat of the generation in high-low voltage electric power distribution cabinet, traditional heat abstractor is all generally that the mode of being combined with louvre by circulating fan is dispelled the heat, and the radiating effect of this radiating mode is more limited, the low-temperature working requirement in can not stable maintenance power distribution cabinet.
Summary of the invention
In order to overcome above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of power distribution cabinet cooling system of based semiconductor, there is feature easy to use simple in structure.
To achieve these goals, the technical solution used in the present invention is:
A power distribution cabinet cooling system for based semiconductor, comprises cabinet, and cabinet is hollow rectangular structure, and the both sides of cabinet are provided with circulation air path, and this circulation air path comprises the air outlet and the return air inlet that offer respectively up and down with cabinet internal communication; The opening part being communicated with is installed circulating fan;
Semiconductor heat-dissipating system is also installed in above-mentioned circulation air path, concrete, comprise the semiconductor device that is installed on side cabinet inside and fin and the radiator fan that is installed on side cabinet outside, radiator fan is installed on the outside of fin; Described semiconductor device comprises heat absorbing end for absorbing heat in air channel and for heat absorbing end heat being passed to the radiating end of fin.
Further: above-mentioned semiconductor heat-dissipating system is arranged three rows from top to bottom uniformly.
Further: above-mentioned semiconductor heat-dissipating system is arranged three row along the Width of side cabinet.
The invention has the beneficial effects as follows:
The present invention is based on semi-conductive power distribution cabinet cooling system, carry out high efficiency and heat radiation by diode mode, its radiating effect stability and high efficiency; Meanwhile, semiconductor heat-dissipating system is installed in the circulation air path of cabinet both sides, has increased on the one hand circulation cooling effect, and cooling system does not affect the operation of electric elements in cabinet on the other hand.
Accompanying drawing explanation
Accompanying drawing is structural representation of the present invention.
Description of reference numerals:
1-circulating fan, 2-radiator fan, 3-fin, 4-semiconductor device, 5-cabinet, 6-circulation air path.
Embodiment
Below in conjunction with drawings and Examples, the present invention is carried out to more detailed explanation.
As shown in the figure, the present invention is based on semi-conductive power distribution cabinet cooling system, comprise cabinet 5, cabinet 5 is hollow rectangular structure, the both sides of cabinet 5 are provided with circulation air path 6, and this circulation air path 6 comprises the air outlet and the return air inlet that offer respectively up and down with cabinet internal communication; The opening part being communicated with is installed circulating fan 1;
In above-mentioned circulation air path 6, semiconductor heat-dissipating system is also installed, concrete, comprise the semiconductor device 4 that is installed on side cabinet inside and fin 3 and the radiator fan 2 that is installed on side cabinet outside, radiator fan 2 is installed on the outside of fin 3; Described semiconductor device 4 comprises heat absorbing end for absorbing heat in air channel and for heat absorbing end heat being passed to the radiating end of fin 3.
Above-mentioned semiconductor heat-dissipating system is arranged three rows from top to bottom uniformly.
Above-mentioned semiconductor heat-dissipating system is arranged three row along the Width of side cabinet.
By reference to the accompanying drawings the preferred embodiment for the present invention is explained in detail above, but the invention is not restricted to above-mentioned execution mode, in the ken possessing those of ordinary skills, can also under the prerequisite that does not depart from aim of the present invention, make a variety of changes.
Do not depart from the spirit and scope of the present invention and can make many other changes and remodeling.Should be appreciated that and the invention is not restricted to specific execution mode, scope of the present invention is defined by the following claims.
Claims (1)
1. the power distribution cabinet cooling system of a based semiconductor, comprise cabinet, cabinet is hollow rectangular structure, it is characterized in that: the both sides of cabinet are provided with circulation air path, and this circulation air path comprises the air outlet and the return air inlet that offer respectively up and down with cabinet internal communication; The opening part being communicated with is installed circulating fan;
Semiconductor heat-dissipating system is also installed in above-mentioned circulation air path, concrete, comprise the semiconductor device that is installed on side cabinet inside and fin and the radiator fan that is installed on side cabinet outside, radiator fan is installed on the outside of fin; Described semiconductor device comprises heat absorbing end for absorbing heat in air channel and for heat absorbing end heat being passed to the radiating end of fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210506422.7A CN103855628A (en) | 2012-11-29 | 2012-11-29 | Semiconductor-based power distribution cabinet heat dissipation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210506422.7A CN103855628A (en) | 2012-11-29 | 2012-11-29 | Semiconductor-based power distribution cabinet heat dissipation system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103855628A true CN103855628A (en) | 2014-06-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210506422.7A Pending CN103855628A (en) | 2012-11-29 | 2012-11-29 | Semiconductor-based power distribution cabinet heat dissipation system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103855628A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104617503A (en) * | 2015-02-05 | 2015-05-13 | 愈先梅 | High-voltage power distribution cabinet |
| CN104617505A (en) * | 2015-02-05 | 2015-05-13 | 愈先梅 | Power distribution cabinet of high-voltage distribution system |
| CN104617497A (en) * | 2015-02-05 | 2015-05-13 | 愈先梅 | High-voltage power distribution cabinet |
| CN106793719A (en) * | 2017-03-29 | 2017-05-31 | 贵州大学 | A kind of regulator cubicle for intercepting external heat and quick heat radiating |
| CN107548534A (en) * | 2015-04-10 | 2018-01-05 | 里塔尔有限责任两合公司 | With switch cubicle group and the control box arrangement for being incorporated into cooling device therein |
| CN107658729A (en) * | 2017-11-09 | 2018-02-02 | 肇庆市高新区晓靖科技有限公司 | A kind of cooling system for sealed power distribution cabinet |
-
2012
- 2012-11-29 CN CN201210506422.7A patent/CN103855628A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104617503A (en) * | 2015-02-05 | 2015-05-13 | 愈先梅 | High-voltage power distribution cabinet |
| CN104617505A (en) * | 2015-02-05 | 2015-05-13 | 愈先梅 | Power distribution cabinet of high-voltage distribution system |
| CN104617497A (en) * | 2015-02-05 | 2015-05-13 | 愈先梅 | High-voltage power distribution cabinet |
| CN107548534A (en) * | 2015-04-10 | 2018-01-05 | 里塔尔有限责任两合公司 | With switch cubicle group and the control box arrangement for being incorporated into cooling device therein |
| CN106793719A (en) * | 2017-03-29 | 2017-05-31 | 贵州大学 | A kind of regulator cubicle for intercepting external heat and quick heat radiating |
| CN107658729A (en) * | 2017-11-09 | 2018-02-02 | 肇庆市高新区晓靖科技有限公司 | A kind of cooling system for sealed power distribution cabinet |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140611 |